CN103855144B - LED filament and light-emitting device - Google Patents
LED filament and light-emitting device Download PDFInfo
- Publication number
- CN103855144B CN103855144B CN201410005196.3A CN201410005196A CN103855144B CN 103855144 B CN103855144 B CN 103855144B CN 201410005196 A CN201410005196 A CN 201410005196A CN 103855144 B CN103855144 B CN 103855144B
- Authority
- CN
- China
- Prior art keywords
- tablet
- metal tablet
- upper metal
- light
- led filament
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- Illuminated Signs And Luminous Advertising (AREA)
- Led Device Packages (AREA)
Abstract
The present invention is applicable to lighting technical field, provide a kind of LED filament and light-emitting device, described LED filament includes multiple upper metal tablet, and lower metal tablet between two adjacent upper metal tablet between parallel with described upper metal tablet, it is fixedly arranged on the LED chip of described lower metal tablet and is allowed to sequentially connect into holistic perspex with lower metal tablet in order to fixing described upper metal tablet, light-emitting window is formed between adjacent upper metal tablet, the width b of described light-emitting window is more than or equal to length c of twice LED chip, length c less than or equal to octuple LED chip, distance a between the lower surface of described upper metal tablet and the upper surface of lower metal tablet is more than 0.05mm.The light part that the most described LED chip sends directly penetrates from top, another part passes through perspex the lower surface reflection through upper metal tablet, penetrate from bottom, and then realize all-round stereo luminous, thus the problem solving to there is dark space bottom the LED filament be made up of metal basal board.
Description
Technical field
The invention belongs to lighting technical field, particularly relate to a kind of LED filament and light-emitting device.
Background technology
At present, LED filament substrate mainly has crystalline ceramics, glass, perspex, metal basal board etc..Its
In, transparency carrier (such as pottery, glass) light transmission is good, can realize all-round angle easily luminous, but due to
It is expensive, makes complexity, and thermal conductivity is low, suffers from limiting in using.And metal basal board price is low
Honest and clean, thermal conductivity is high, but due to light tight, often has dark space at base plate bottom.
Summary of the invention
The purpose of the embodiment of the present invention is to provide a kind of LED filament, it is intended to solution is made up of metal basal board
The problem that there is dark space bottom LED filament.
The embodiment of the present invention is achieved in that a kind of LED filament, including multiple upper metal tablets and institute
State that metal tablet is parallel and lower metal tablet between two adjacent upper metal tablets, be fixedly arranged on institute
State the LED chip of lower metal tablet and be allowed to depend on lower metal tablet in order to fixing described upper metal tablet
Sequence connects into holistic perspex, forms light-emitting window between adjacent upper metal tablet, described light-emitting window
Width b length c more than or equal to twice LED chip, length c less than or equal to octuple LED chip, institute
State distance a between the lower surface of metal tablet and the upper surface of lower metal tablet more than 0.05mm.
The another object of the embodiment of the present invention is to provide a kind of light-emitting device, and described light-emitting device uses above-mentioned
LED filament.
The embodiment of the present invention, by design bimetallic tablet, is fixedly connected by perspex between metal tablet, shape
Becoming upper and lower stereochemical structure, LED chip is fixedly arranged on lower metal tablet, is formed out between adjacent upper metal tablet
Light mouth, the width of this light-emitting window is more than or equal to the length of twice LED chip, less than or equal to octuple LED core
The length of sheet, and make the distance between the lower surface of described upper metal tablet and the upper surface of lower metal tablet be more than
0.05mm.The light part that the most described LED chip sends directly penetrates from top, and another part passes through
Perspex also reflects through the lower surface of upper metal tablet, penetrates from bottom, and then realizes all-round stereo luminous,
Thus the problem solving to there is dark space bottom the LED filament be made up of metal basal board.Thus, this LED
Silk can be used for various light-emitting device, and illuminating effect is splendid.
Accompanying drawing explanation
Fig. 1 is the structural representation of the LED filament that the embodiment of the present invention provides；
Fig. 2 is the top view of Fig. 1.
Detailed description of the invention
In order to make the purpose of the present invention, technical scheme and advantage clearer, below in conjunction with accompanying drawing and reality
Execute example, the present invention is further elaborated.Only should be appreciated that specific embodiment described herein
Only in order to explain the present invention, it is not intended to limit the present invention.
The embodiment of the present invention, by design bimetallic tablet, is fixedly connected by perspex between metal tablet, shape
Becoming upper and lower stereochemical structure, LED chip is fixedly arranged on lower metal tablet, is formed out between adjacent upper metal tablet
Light mouth, the width of this light-emitting window is more than or equal to the length of twice LED chip, less than or equal to octuple LED core
The length of sheet, and make the distance between the lower surface of described upper metal tablet and the upper surface of lower metal tablet be more than
0.05mm.The light part that the most described LED chip sends directly penetrates from top, and another part passes through
Perspex also reflects through the lower surface of upper metal tablet, penetrates from bottom, and then realizes all-round stereo luminous,
Thus the problem solving to there is dark space bottom the LED filament be made up of metal basal board.
Below in conjunction with specific embodiment, the realization of the present invention is described in detail.
As shown in Figure 1, 2, the embodiment of the present invention provide LED filament include multiple upper metal tablet 1,
And lower metal tablet 2 between two adjacent upper metal tablet 1 between parallel with described upper metal tablet 1,
It is fixedly arranged on the LED chip 3 of described lower metal tablet 2 and in order to fixing described upper metal tablet 1 and lower gold
Belong to tablet 2 to be allowed to sequentially connect into holistic perspex 4, formed out between adjacent upper metal tablet 1
Light mouth, the width b of described light-emitting window is more than or equal to length c of twice LED chip, less than or equal to octuple LED
Length c(of chip i.e. 2c≤b≤8c), the lower surface of described upper metal tablet 1 and lower metal tablet 2
Distance a between upper surface is more than 0.05mm.So that this LED filament forms upper and lower stereochemical structure,
The light part that described LED chip 3 sends directly penetrates from top, and another part passes through described perspex
4 and reflect through upper metal tablet 2 lower surface, penetrate from bottom, do not exist dark bottom this sample LED filament
District, it is achieved all-round (360 °) are stereo luminous.
As preferably, the upper surface of described upper metal tablet 1 and lower metal tablet 2 be all coated with nickel film, silverskin,
Palladium film or gold film, to strengthen die bond bonding wire firmness.It is of course also possible at upper metal tablet 1 and lower metal
Tablet 2 all surface plated with nickel film, silverskin, palladium film or gold film, to promote the light extraction efficiency of this LED filament.
The upper surface of described upper metal tablet 1 sets two welding zones 5, and described perspex 4 is reserved with and reveals for two welding zones 5
The shelves mouth gone out, described LED chip 3 accesses two welding zones 5 with the wire 6 of external electrical interconnection through this grade of mouth.
This sample LED filament achieves thermoelectricity and separates, and beneficially LED chip 3 is dispelled the heat.
Described in the embodiment of the present invention, the thickness of upper metal tablet 1 and lower metal tablet 2 is
0.1mm～0.5mm, and width is fitted more than or equal to the 2/3 of respective thickness, the LED filament size thus made
In, highly versatile.The side of described upper metal tablet 1 and lower metal tablet 2 is inclined-plane, and described
Perspex 4 covers, and connects upper metal tablet 1 and lower metal tablet 2 strengthening described perspex 4
Firmness.Certainly, in described upper metal tablet 1, the multiple hole of lower metal tablet 2 molding, the most permissible
Strengthen described perspex 4 and be adhered to the dynamics of metal tablet.Additionally, the side 11 of described upper metal tablet
Projected area in the side 21 of lower metal tablet is more than or equal to the area of the side 21 of lower metal tablet
2/3.The side 21 of the described lower metal tablet projected area in the side 11 of upper metal tablet 1 is more than or equal to
The 3/4 of the area of the side 11 of upper metal tablet.So it is beneficial to more light and is projected to metal tablet 1
Lower surface, and then make this LED filament three-dimensional (360 °) luminous uniformly.
Generally, first pass through the methods such as machining, or chemical etching, respectively the upper and lower metal tablet of molding
1,2, then upper and lower metal tablet 1,2 is required to put into molding in mould according to design simultaneously transparent
Plastic cement 4 part, and then the position of fixing upper and lower metal tablet 1,2.Described perspex 4 can be heat
Plasticity or thermosets, such as silica gel, epoxy resin, nylon etc., it is desirable to light transmittance > 10%.
The foregoing is only presently preferred embodiments of the present invention, not in order to limit the present invention, all at this
Any amendment, equivalent and the improvement etc. made within bright spirit and principle, should be included in the present invention
Protection domain within.
Claims (6)
1. a LED filament, it is characterised in that include multiple upper metal tablet and described upper metal charge
Sheet is parallel and lower metal tablet between two adjacent upper metal tablets, is fixedly arranged on described lower metal charge
The LED chip of sheet and be allowed to sequentially connect into one with lower metal tablet in order to fixing described upper metal tablet
Overall perspex, forms light-emitting window between adjacent upper metal tablet, the width b of described light-emitting window is more than
Length c equal to twice LED chip, the length less than or equal to octuple LED chip, described upper metal charge
Distance a between the lower surface of sheet and the upper surface of lower metal tablet is more than 0.05mm.
2. LED filament as claimed in claim 1, it is characterised in that described upper metal tablet and lower gold
The upper surface belonging to tablet is all coated with nickel film, silverskin, palladium film or gold film.
3. LED filament as claimed in claim 1 or 2, it is characterised in that described upper metal tablet
Upper surface sets two welding zones, and described perspex is reserved with the shelves mouth exposed for two welding zones, described LED chip with
The wire of external electrical interconnection accesses two welding zones through shelves mouth.
4. LED filament as claimed in claim 3, it is characterised in that described upper metal tablet and lower gold
The thickness belonging to tablet is 0.1mm～0.5mm, and width is more than or equal to the 2/3 of respective thickness.
5. LED filament as claimed in claim 4, it is characterised in that described upper metal tablet and lower gold
The side belonging to tablet is inclined-plane, and is covered by described perspex.
6. a light-emitting device, it is characterised in that described light-emitting device uses as arbitrary in Claims 1 to 5
LED filament described in Xiang.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410005196.3A CN103855144B (en) | 2014-01-06 | 2014-01-06 | LED filament and light-emitting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410005196.3A CN103855144B (en) | 2014-01-06 | 2014-01-06 | LED filament and light-emitting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103855144A CN103855144A (en) | 2014-06-11 |
| CN103855144B true CN103855144B (en) | 2016-08-17 |
Family
ID=50862599
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410005196.3A Expired - Fee Related CN103855144B (en) | 2014-01-06 | 2014-01-06 | LED filament and light-emitting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103855144B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202142578U (en) * | 2011-06-22 | 2012-02-08 | 郑州光维新电子有限公司 | High power LED lamp silver based bonding wire packaging structure |
| CN103489995A (en) * | 2013-10-16 | 2014-01-01 | 福州圆点光电技术有限公司 | Flexible LED (light-emitting diode) light source filament |
| CN203733835U (en) * | 2014-01-06 | 2014-07-23 | 深圳市瑞丰光电子股份有限公司 | LED filament and light-emitting device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5374140B2 (en) * | 2008-12-22 | 2013-12-25 | 株式会社小糸製作所 | Vehicle lamp |
-
2014
- 2014-01-06 CN CN201410005196.3A patent/CN103855144B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202142578U (en) * | 2011-06-22 | 2012-02-08 | 郑州光维新电子有限公司 | High power LED lamp silver based bonding wire packaging structure |
| CN103489995A (en) * | 2013-10-16 | 2014-01-01 | 福州圆点光电技术有限公司 | Flexible LED (light-emitting diode) light source filament |
| CN203733835U (en) * | 2014-01-06 | 2014-07-23 | 深圳市瑞丰光电子股份有限公司 | LED filament and light-emitting device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103855144A (en) | 2014-06-11 |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160817 Termination date: 20180106 |
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| CF01 | Termination of patent right due to non-payment of annual fee |