CN103779477A - 一种led - Google Patents

一种led Download PDF

Info

Publication number
CN103779477A
CN103779477A CN201310245403.8A CN201310245403A CN103779477A CN 103779477 A CN103779477 A CN 103779477A CN 201310245403 A CN201310245403 A CN 201310245403A CN 103779477 A CN103779477 A CN 103779477A
Authority
CN
China
Prior art keywords
led
radiating
radiating substrate
adhesive layer
heat dispersion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201310245403.8A
Other languages
English (en)
Inventor
刘万庆
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SUZHOU HENGRONG ENERGY-SAVING TECHNOLOGY INSTALLATION ENGINEERING Co Ltd
Original Assignee
SUZHOU HENGRONG ENERGY-SAVING TECHNOLOGY INSTALLATION ENGINEERING Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SUZHOU HENGRONG ENERGY-SAVING TECHNOLOGY INSTALLATION ENGINEERING Co Ltd filed Critical SUZHOU HENGRONG ENERGY-SAVING TECHNOLOGY INSTALLATION ENGINEERING Co Ltd
Priority to CN201310245403.8A priority Critical patent/CN103779477A/zh
Publication of CN103779477A publication Critical patent/CN103779477A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

本发明LED，包括LED芯片、散热基片、外层封胶层、荧光粉胶层，所述散热基片为圆弧形，散热基片中部设置有芯片基座，LED芯片安装在芯片基座之上，荧光粉胶层涂在LED芯片之上，外层封胶层位于荧光粉胶层外部，LED芯片的正负极连接导线,散热基片下部连接有多个散热片，所述散热片底部设置有多个散热通道。作为优化，散热基片为铜板。散热基片内侧涂有反射层。本发明LED在具有弧形的散热基片，以及散热基片连接有多个散热片。散热片底部设置有多个散热通道。散热基片内侧涂有反射层。有助于LED的散热，同时弧形设计的散热基片有助于提高LED发光效果。

Description

一种LED
技术领域
本发明涉及LED照明领域，特别涉及一种LED封装结构。
背景技术
LED（ Light Emitting Diode ；发光二极管）是一种能够将电能转化为可见光的固态的半导体器件，具有寿命长、能耗低等优点，随着LED 技术的发展，LED 光源的性能也越来越好，一般来说，LED灯工作是否稳定，品质好坏，与灯体本身散热至关重要，目前市场上的高亮度LED灯的散热，常常采用自然散热，效果并不理想。此外，现有的LED 封装结构中主流的LED 封装为蓝光LED 芯片加入黄色荧光粉形成白光，这种方式封装的白光LED 存在出现光斑和光效低的问题，这两者情况都严重影响到LED 的应用范围和实际使用效果。
发明内容
本发明的目的是针对现有技术的不足，提供一种具有良好的散热性能，以及发光效果的LED， 为达到上述目的，本发明的技术方案是：一种LED，包括LED芯片、散热基片、外层封胶层、荧光粉胶层，所述散热基片为圆弧形，散热基片中部设置有芯片基座，LED芯片安装在芯片基座之上，荧光粉胶层涂在LED芯片之上，外层封胶层位于荧光粉胶层外部， LED芯片的正负极连接导线,散热基片下部连接有多个散热片，所述散热片底部设置有多个散热通道。
作为优化，散热基片为铜板。散热基片内侧涂有反射层。
本发明LED在具有弧形的散热基片，以及散热基片连接有多个散热片。散热片底部设置有多个散热通道。散热基片内侧涂有反射层。有助于LED的散热，同时弧形设计的散热基片有助于提高LED发光效果。
附图说明
图1为本发明一种LED结构示意图。
具体实施方式
下面给出的实施例拟对本发明作进一步说明，但不能理解为是对本发明保护范围的限制，本领域技术人员根据本发明内容对本发明的一些非本质的改进和调整，仍属于本发明的保护范围。
如图1所示，LED，包括LED芯片1、散热基片2、外层封胶层3、荧光粉胶层4，散热基片2为圆弧形，散热基片2中部设置有芯片基座5，LED芯片1安装在芯片基座5之上，荧光粉胶层4涂在LED芯片1之上，外层封胶层3位于荧光粉胶层4外部， LED芯片1的正负极连接导线6。,散热基片2下部连接有多个散热片7，所述散热片7底部设置有多个散热通道8。
散热基片2为铜板。散热基片2内侧涂有反射层。

Claims (3)

1.一种LED，包括LED芯片、散热基片、外层封胶层、荧光粉胶层，其特征在于所述散热基片为圆弧形，散热基片中部设置有芯片基座，LED芯片安装在芯片基座之上，荧光粉胶层涂在LED芯片之上，外层封胶层位于荧光粉胶层外部， LED芯片的正负极连接导线,散热基片下部连接有多个散热片，所述散热片底部设置有多个散热通道。
2.根据权利要求1 所述的LED，其特征在于所述散热基片为铜板。
3.根据权利要求1 所述的LED，其特征在于所述散热基片内侧涂有反射层。
CN201310245403.8A 2013-06-20 2013-06-20 一种led Pending CN103779477A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201310245403.8A CN103779477A (zh) 2013-06-20 2013-06-20 一种led

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310245403.8A CN103779477A (zh) 2013-06-20 2013-06-20 一种led

Publications (1)

Publication Number Publication Date
CN103779477A true CN103779477A (zh) 2014-05-07

Family

ID=50571510

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310245403.8A Pending CN103779477A (zh) 2013-06-20 2013-06-20 一种led

Country Status (1)

Country Link
CN (1) CN103779477A (zh)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100009094U (ko) * 2009-03-09 2010-09-17 이영옥 파워 엘이디 칩(power led chip)을 실장한 메탈 기판
CN102130111A (zh) * 2010-12-24 2011-07-20 郑伟 液体封装的大功率led装置以及led装置的封装方法
CN201994332U (zh) * 2009-10-23 2011-09-28 广东昭信光电科技有限公司 一种集成配光和散热功能的led封装结构
CN202018988U (zh) * 2010-11-28 2011-10-26 晶诚（郑州）科技有限公司 一种高效发光散热的大功率led封装结构
CN102721020A (zh) * 2012-05-23 2012-10-10 无锡市爱尔电子有限公司 充分利用散热空间的led灯具组合式立体散热结构及方法
CN203398152U (zh) * 2013-06-20 2014-01-15 苏州恒荣节能科技安装工程有限公司 一种led

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100009094U (ko) * 2009-03-09 2010-09-17 이영옥 파워 엘이디 칩(power led chip)을 실장한 메탈 기판
CN201994332U (zh) * 2009-10-23 2011-09-28 广东昭信光电科技有限公司 一种集成配光和散热功能的led封装结构
CN202018988U (zh) * 2010-11-28 2011-10-26 晶诚（郑州）科技有限公司 一种高效发光散热的大功率led封装结构
CN102130111A (zh) * 2010-12-24 2011-07-20 郑伟 液体封装的大功率led装置以及led装置的封装方法
CN102721020A (zh) * 2012-05-23 2012-10-10 无锡市爱尔电子有限公司 充分利用散热空间的led灯具组合式立体散热结构及方法
CN203398152U (zh) * 2013-06-20 2014-01-15 苏州恒荣节能科技安装工程有限公司 一种led

Similar Documents

Publication Publication Date Title
CN204664934U (zh) 一种ledcob光引擎
CN205560300U (zh) 封装式led灯
CN203398152U (zh) 一种led
CN206943847U (zh) 一种可快速组装的led灯
CN202888237U (zh) 一种led封装结构
CN203477964U (zh) 一种360度发光的led面光源灯具
CN203560754U (zh) 一种led球泡灯
CN202561588U (zh) 一种节能大功率的led路灯
CN103779477A (zh) 一种led
CN102347324A (zh) 一种新型led集成封装结构
CN207381432U (zh) Led灯珠
CN203398158U (zh) 一种led封装结构
CN203395650U (zh) 一种led灯珠
CN202252993U (zh) 一种led球泡灯
CN202948979U (zh) 高散热效率led封装结构
CN202024127U (zh) 一种led模组
CN203517438U (zh) 一种led集成封装日光灯结构
CN202109276U (zh) 一种新型可调光led球泡灯
CN202927798U (zh) Led球泡灯的高效散热器
CN203036305U (zh) 一种散热式防眩光led灯杯
CN202902051U (zh) 一种led工矿灯
CN202678309U (zh) 大功率led的cob封装结构
CN205979243U (zh) 一种大功率led节能灯
CN205746235U (zh) 大功率led照明灯
CN204289532U (zh) 一种发光二极管贴合散热结构

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20140507