CN103531701A - Light emitting diode package and method of manufacturing the same - Google Patents
Light emitting diode package and method of manufacturing the same Download PDFInfo
- Publication number
- CN103531701A CN103531701A CN201210430093.2A CN201210430093A CN103531701A CN 103531701 A CN103531701 A CN 103531701A CN 201210430093 A CN201210430093 A CN 201210430093A CN 103531701 A CN103531701 A CN 103531701A
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- Prior art keywords
- led encapsulation
- dome
- reflector
- encapsulation body
- netted framework
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- 238000004806 packaging method and process Methods 0.000 claims abstract description 50
- 238000005538 encapsulation Methods 0.000 claims description 62
- 239000004033 plastic Substances 0.000 claims description 56
- 239000000463 material Substances 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 17
- 239000013078 crystal Substances 0.000 claims description 8
- 239000004568 cement Substances 0.000 claims description 6
- 230000002285 radioactive effect Effects 0.000 claims description 5
- 239000003292 glue Substances 0.000 abstract description 5
- 238000004020 luminiscence type Methods 0.000 description 12
- 238000005516 engineering process Methods 0.000 description 7
- 230000003287 optical effect Effects 0.000 description 5
- 230000005484 gravity Effects 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 230000002650 habitual effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Led Device Packages (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Planar Illumination Modules (AREA)
Abstract
The invention discloses a light emitting diode package and a manufacturing method thereof. The LED package comprises a conductive support, a reflective cup, an LED chip and a lens. The reflecting cup coats the conductive support, and a sunken opening exposing part of the surface of the conductive support is formed in the die bonding area. The light emitting diode chip is arranged on the surface of the conductive support in the concave opening. The lens is arranged above the concave opening and fixed on the surface of the reflecting cup, wherein the lens is composed of a dome-shaped net frame body and packaging glue filled in the dome-shaped net frame body.
Description
Technical field
The present invention is relevant a kind of LED encapsulation body.
Background technology
Light-emitting diode (Light-Emitting Diode, LED) is a kind of semiconductor element.Early stage mostly using light-emitting diode as indicator light or the light-emitting component of display panel, but make rapid progress along with making the technology of light-emitting diode, be widely used in lighting apparatus in recent years.In addition, when light fixture utilizes light-emitting diode and light guide plate luminous, compare with conventional bulb light source, there is the advantages such as efficiency is high, the life-span long, not fragile.
Generally speaking, light-emitting diode (LED) module comprises luminescence chip and lens, and lens are covered in luminescence chip.Wherein, the material of lens can be for having the packaging plastic of fluorescent material.The characteristics of luminescence (for example direction of light) because the function of lens is to promote the optical efficiency of luminescence chip or changes luminescence chip therefore need be solidified into packaging plastic the required shape of lens when making lens.The mode of making lens has two, and a kind of mode is to utilize molding (molding) technology that packaging plastic is solidified between the groove of mould and the substrate of carrying luminescence chip.Another kind of mode is to utilize dispensing technology packaging plastic to be inserted in the rack groove of carrying luminescence chip, afterwards curing molding again.
Yet, adopt dispensing technology to make its packaging plastic of light-emitting diode (LED) module because gravity factor can only form the surface of plane conventionally in the groove of support, therefore can make the light total reflection probability of luminescence chip increase, optical efficiency is limited to some extent.
Summary of the invention
A technical scheme of the present invention is a kind of LED encapsulation body.
According to an embodiment of the present invention, a kind of LED encapsulation body comprises conducting bracket, reflector, light-emitting diode chip for backlight unit and lens.Reflector coated with conductive support, and in crystal bonding area, (die bond region) forms an exposed portions serve conducting bracket depression in the surface opening.Light-emitting diode chip for backlight unit is arranged at the conducting bracket surface in recessed openings.Lens are arranged at recessed openings top, and are fixed on reflector surface, and wherein lens are by the netted framework of a dome, and the packaging plastic that fills in the netted framework of dome forms.
In an embodiment of the present invention, wherein the netted framework of above-mentioned dome is by a plurality of ring frames and a plurality of rod member is interlaced forms.
In an embodiment of the present invention, wherein above-mentioned ring frame is arranged in a parallel, and rod member is from the top of the netted framework of dome, to be radioactive ray to arrange, and is individually fixed on ring frame.
In an embodiment of the present invention, wherein the width of above-mentioned each ring frame and each rod member is between between 0.1mm to 1mm.
In an embodiment of the present invention, wherein above-mentioned ring frame and rod member are light-permeable.
In an embodiment of the present invention, wherein the material of above-mentioned ring frame and rod member comprises rubber or plastic cement.
In an embodiment of the present invention, wherein above-mentioned ring frame, the material of rod member are identical with the material of packaging plastic.
In an embodiment of the present invention, wherein above-mentioned LED encapsulation body also comprises retaining element and is arranged on the netted framework of dome and ring frame reflector butt, and the netted framework of dome is fixed on reflector.
In an embodiment of the present invention, wherein above-mentioned packaging plastic is also filled the recessed openings of reflector, and covering luminousing diode chip.
The manufacture method that a technical scheme of the present invention is a kind of LED encapsulation body.
According to an embodiment of the present invention, a kind of manufacture method of LED encapsulation body, its step comprises:
Provide the reflector that is coated with conducting bracket, and reflector forms exposed portions serve conducting bracket depression in the surface opening in crystal bonding area.
The conducting bracket surface of light-emitting diode chip for backlight unit in recessed openings is set.
The netted framework of dome is set in recessed openings top, and is fixed on reflector surface, packaging plastic is filled in to the netted framework of dome surface, form lens.
In an embodiment of the present invention, wherein above-mentioned recessed openings and light-emitting diode chip for backlight unit also packed glue cover.
In an embodiment of the present invention, wherein the manufacture method of above-mentioned LED encapsulation body also comprises and imposes a baking program, and packaging plastic is cured.
In an embodiment of the present invention, wherein the netted framework of above-mentioned dome is by a plurality of ring frames and a plurality of rod member is interlaced forms.
In an embodiment of the present invention, wherein above-mentioned ring frame is arranged in a parallel, and rod member is from the top of the netted framework of dome, to be radioactive ray to arrange, and is individually fixed on ring frame.
In an embodiment of the present invention, wherein the width of above-mentioned each ring frame and each rod member is between between 0.1mm to 1mm.
In an embodiment of the present invention, wherein above-mentioned ring frame and rod member are light-permeable.
In an embodiment of the present invention, wherein the material of above-mentioned ring frame and rod member comprises rubber or plastic cement.
In an embodiment of the present invention, wherein above-mentioned ring frame, the material of rod member are identical with the material of packaging plastic.
In an embodiment of the present invention, wherein the netted framework of above-mentioned dome is the retaining element being arranged on the ring frame of itself and reflector butt with, is fixed on reflector.
In the above-mentioned execution mode of the present invention, because packaging plastic, the netted framework of dome and reflector can interconnect by adhesion strength, cohesive force and the gravity of packaging plastic, so lens can be consisted of the netted framework of dome and the packaging plastic that fills in the netted framework of dome.Such design, LED encapsulation body just can be formed in the surface of reflector and be had the plane lens of shape (for example curved surface) in addition by dispensing technology.Thus, when light-emitting diode chip for backlight unit is luminous, because total reflection probability increases, can promotes the optical efficiency of LED encapsulation body and improve the characteristics of luminescence.
Accompanying drawing explanation
Fig. 1 illustrates the profile of LED encapsulation body according to an embodiment of the present invention;
The exploded view when LED encapsulation body that Fig. 2 illustrates Fig. 1 is made;
The profile when LED encapsulation body that Fig. 3 illustrates Fig. 1 is made;
Fig. 4 illustrates the profile of LED encapsulation body according to an embodiment of the present invention;
Fig. 5 illustrates the profile of LED encapsulation body according to an embodiment of the present invention;
The profile when LED encapsulation body that Fig. 6 illustrates Fig. 5 is made;
Fig. 7 illustrates the flow chart of the manufacture method of LED encapsulation body according to an embodiment of the present invention.
[main element symbol description]
100: LED encapsulation body 110: conducting bracket
120: reflector 122: crystal bonding area
124: depression opens 130: light-emitting diode chip for backlight unit
132: wire 140: lens
142: the netted framework 144 of dome: packaging plastic
146: ring frame 148: rod member
150: retaining element 200: point gum machine
D: direction W1: width
W2: width S 1: step
S2: step S3: step
Embodiment
Below will disclose a plurality of execution mode of the present invention with accompanying drawing, as clearly stated, the details in many practices will be explained in the following description.Yet, should be appreciated that, the details in these practices does not apply to limit the present invention.That is to say, in part execution mode of the present invention, the details in these practices is non-essential.In addition,, for the purpose of simplifying accompanying drawing, some known habitual structures and element illustrate the mode simply to illustrate in the accompanying drawings.
Fig. 1 illustrates the profile of LED encapsulation body 100 according to an embodiment of the present invention.As shown in the figure, LED encapsulation body 100 comprises conducting bracket 110, reflector 120, light-emitting diode chip for backlight unit 130 and lens 140.Wherein, reflector 120 coated with conductive supports 110, and in crystal bonding area, (diebond region) 122 forms exposed portions serve conducting bracket 110 depression in the surface openings 124.Light-emitting diode chip for backlight unit 130 is arranged at depression and opens conducting bracket 110 surfaces in 124.Lens 140 are arranged at depression and open 124 tops, and are fixed on reflector 120 surfaces.In addition, lens 140 are consisted of the netted framework 142 of a dome and the packaging plastic 144 that fills in the netted framework 142 of dome.In the present embodiment, packaging plastic 144, except inserting the netted framework 142 of dome, is also filled the depression of reflector 120 and is opened 124, and covering luminousing diode chip 130.Yet in other embodiments, packaging plastic 144 can only be inserted the netted framework 142 of dome and not insert in the recessed openings 124 of reflector 120, not with restriction the present invention.
In addition, light-emitting diode chip for backlight unit 130 can be blue light-emitting diode, and by wire 132, is electrically connected at the both positive and negative polarity of conducting bracket 110, makes light-emitting diode chip for backlight unit 130 can receive electric power and luminous.The packaging plastic 144 of inserting the netted framework 142 of dome can be for having the packaging plastic of yellow fluorescent powder.Thus, when light-emitting diode chip for backlight unit 130 is luminous, user can see white light from LED encapsulation body 100, but light-emitting diode chip for backlight unit 130 also can adopt different kinds from packaging plastic 144, according to designer's demand, determines.In the present embodiment, LED encapsulation body 100 is plastic cement crystal grain carrying encapsulation (Plastic Leaded Chip Carrier; PLCC) LED encapsulation body is the light-emitting device of low-power (for example 0.066W to 5W).
In the following description, the manufacturing process of the Structure and luminescence diode package 100 of the netted framework 142 of dome will be described in detail.
The exploded view when LED encapsulation body 100 that Fig. 2 illustrates Fig. 1 is made.As shown in the figure, the netted framework 142 of dome is not yet fixed on the surface of reflector 120.Packaging plastic 144 (seeing Fig. 1) is also not yet inserted in the recessed openings 124 of the netted framework 142 of dome and reflector 120.In the present embodiment, the netted framework 142 of dome is to consist of with a plurality of rod members 148 are interlaced a plurality of ring frames 146, and ring frame 146 is arranged in a parallel.148 of rod members are from the top of the netted framework 142 of dome, to be radioactive ray to arrange, and are individually fixed on ring frame 146.In addition, each ring width W 1 of frame 146 and width W 2 of each rod member 148 can be respectively between between 0.1mm to 1mm, but not as limit.
When the netted framework 142 of dome is assembled in reflector 120, need first the netted framework 142 of dome to be roughly aligned in to the recessed openings 124 of reflector 120, then with direction D, the netted framework 142 of dome is fixed on reflector 120 surfaces.Wherein, between the netted framework 142 of dome and reflector 120, can, by being connected to each other such as locking, adhesion, welding or the mode such as sandwiched, according to designer's demand, determine.
The profile when LED encapsulation body 100 that Fig. 3 illustrates Fig. 1 is made.When the netted framework 142 of dome is fixed on after reflector 120, can packaging plastic 144 be filled in to the netted framework of dome 142 surfaces by point gum machine 200, more particularly, packaging plastic 144 can be inserted the recessed openings 124 of the netted framework 142 of dome and reflector 120 by the hollow out region between ring frame 146 and rod member 148, recessed openings 124 and the packed glue 144 of light-emitting diode chip for backlight unit 130 are covered.When packaging plastic 144, insert after the netted framework 142 of dome, the baking program that can impose heats packaging plastic 144, and packaging plastic 144 is cured.Thus, just can obtain the lens 140 of LED encapsulation body 100, as shown in Figure 1.
Get back to Fig. 1, the netted framework 142 of packaging plastic 144, dome can interconnect by adhesion strength, cohesive force and the gravity of packaging plastic 144 with reflector 120, so lens 140 are consisted of the netted framework 142 of dome and the packaging plastic 144 that fills in the netted framework 142 of dome.Such design, LED encapsulation body 100 just can be formed in the surface of reflector 120 and be had the plane lens 140 of shape (for example curved surface) in addition by dispensing technology.When light-emitting diode chip for backlight unit 130 is luminous, because light total reflection probability increases, can promotes the optical efficiency of LED encapsulation body 100 and improve the characteristics of luminescence.
In addition, for avoiding the part light that light-emitting diode chip for backlight unit 130 sends to be covered and cause optical efficiency to reduce by the netted framework 142 of dome, ring frame 146 and rod member 148 can be designed to light-permeable, and for instance, the material of ring frame 146 and rod member 148 can comprise rubber or the plastic cement of light-permeable.Again for example, ring frame 146 can be identical with the material of packaging plastic 144 with the material of rod member 148, makes LED encapsulation body 100 have the characteristics of luminescence comparatively uniformly.Thus, when light-emitting diode chip for backlight unit 130 is luminous, light just can be by packaging plastic 144 and the netted framework 142 of dome.
Fig. 4 illustrates the profile of LED encapsulation body 100 according to an embodiment of the present invention.LED encapsulation body 100 comprises conducting bracket 110, reflector 120, light-emitting diode chip for backlight unit 130 and lens 140.Place different from the embodiment described above is that LED encapsulation body 100 also comprises retaining element 150 and is arranged on the netted framework 142 of dome and ring frames 146 reflector 120 butts, and the netted framework 142 of dome can be fixed on reflector 120.In the present embodiment, retaining element 150 is screw, but not as limit.
Should be appreciated that, the element of having narrated in the above-described embodiment and element annexation will it is no longer repeated.In the following description, by narration different types LED encapsulation body 100, close first chat bright.
Fig. 5 illustrates the profile of LED encapsulation body 100 according to an embodiment of the present invention.LED encapsulation body 100 comprises conducting bracket 110, reflector 120, light-emitting diode chip for backlight unit 130 and lens 140.Place different from the embodiment described above is that LED encapsulation body 100 is for chip on board encapsulation (Chip On Board; COB) LED encapsulation body, has a plurality of light-emitting diode chip for backlight unit 130, is the light-emitting device of high power (for example 10W to 20W).
The profile when LED encapsulation body 100 that Fig. 6 illustrates Fig. 5 is made.Similarly, when the netted framework 142 of dome is fixed on after reflector 120, can packaging plastic 144 be filled in to the netted framework of dome 142 surfaces by point gum machine 200, recessed openings 124 and the packed glue 144 of light-emitting diode chip for backlight unit 130 are covered.When packaging plastic 144, insert after the netted framework 142 of dome, the baking program that can impose heats packaging plastic 144, and packaging plastic 144 is cured.Thus, just can obtain the lens 140 of LED encapsulation body 100, as shown in Figure 5.
Fig. 7 illustrates the flow chart of the manufacture method of LED encapsulation body according to an embodiment of the present invention.As shown in the figure, first, in step S1, provide the reflector that is coated with conducting bracket, and reflector forms exposed portions serve conducting bracket depression in the surface opening in crystal bonding area.Then in step S2, the conducting bracket surface of light-emitting diode chip for backlight unit in recessed openings is set.In step S3, the netted framework of dome is set in recessed openings top, and is fixed on reflector surface afterwards, packaging plastic is filled in to the netted framework of dome surface, form lens.
Wherein, recessed openings and light-emitting diode chip for backlight unit also can cover by packed glue.The netted framework of dome is the retaining element being arranged on the ring frame of itself and reflector butt, is fixed on reflector.
In addition, the manufacture method of LED encapsulation body also can comprise and imposes a baking program, and packaging plastic is cured.
The above-mentioned execution mode of the present invention and prior art are compared, and have the following advantages:
(1) lens are consisted of the netted framework of dome and the packaging plastic that fills in the netted framework of dome, so the surface configuration of lens can be decided by the netted framework of the dome of making in advance.
(2) the ring frame of the netted framework of dome and the material of rod member can be identical with the material of packaging plastic, and when imposing a baking program in the netted framework of dome and packaging plastic, the netted framework of dome can be closely combined with packaging plastic.
(3) what the ring frame of the netted framework of dome and rod member can be for printing opacities, therefore when light-emitting diode chip for backlight unit is luminous, encircle the light that frame and rod member can shaded portions.
Although the present invention discloses as above with execution mode; so it is not in order to limit the present invention; anyly be familiar with this skill person; without departing from the spirit and scope of the present invention; when being used for a variety of modifications and variations, so the scope that protection scope of the present invention ought define depending on appending claims is as the criterion.
Claims (19)
1. a LED encapsulation body, its feature is being, is comprising:
One conducting bracket;
One reflector, coated this conducting bracket, and in crystal bonding area, form this conducting bracket depression in the surface opening of an exposed portions serve;
One light-emitting diode chip for backlight unit, is arranged at this conducting bracket surface in this recessed openings; And
One lens, are arranged at this recessed openings top, and are fixed on this reflector surface, and wherein these lens are by the netted framework of a dome, and the packaging plastic that fills in the netted framework of this dome forms.
2. LED encapsulation body according to claim 1, is characterized in that, the netted framework of this dome is by a plurality of ring frames and a plurality of rod member is interlaced forms.
3. LED encapsulation body according to claim 2, is characterized in that, described a plurality of ring frames are arranged in a parallel, and described a plurality of rod members are from the top of the netted framework of this dome, to be radioactive ray to arrange, and are individually fixed on described a plurality of ring frame.
4. LED encapsulation body according to claim 3, is characterized in that, the width of each this ring frame and each this rod member is between between 0.1mm to 1mm.
5. LED encapsulation body according to claim 4, is characterized in that, described a plurality of ring frames and described a plurality of rod member are light-permeable.
6. LED encapsulation body according to claim 5, is characterized in that, the material of described a plurality of ring frames and described a plurality of rod members comprises rubber or plastic cement.
7. LED encapsulation body according to claim 2, is characterized in that, described a plurality of ring frames, the material of described a plurality of rod members are identical with the material of this packaging plastic.
8. LED encapsulation body according to claim 2, is characterized in that, also comprises a retaining element, is arranged on this ring frame netted framework of this dome and this reflector butt, and the netted framework of this dome is fixed on this reflector.
9. according to the LED encapsulation body described in any one claim in claim 1 ~ 8, it is characterized in that, this packaging plastic is also filled this recessed openings of this reflector, and covers this light-emitting diode chip for backlight unit.
10. a manufacture method for LED encapsulation body, is characterized in that, its step comprises:
Provide a reflector that is coated with a conducting bracket, and this reflector forms this conducting bracket depression in the surface opening of an exposed portions serve in crystal bonding area;
One light-emitting diode chip for backlight unit this conducting bracket surface in this recessed openings is set; And
The netted framework of one dome is set in this recessed openings top, and is fixed on this reflector surface, packaging plastic is filled in to the netted framework of this dome surface, form lens.
The manufacture method of 11. LED encapsulation bodies according to claim 10, is characterized in that, this recessed openings and this light-emitting diode chip for backlight unit are also covered by this packaging plastic.
12. according to the manufacture method of the LED encapsulation body described in claim 10 or 11, it is characterized in that, also comprises and imposes a baking program, and this packaging plastic is cured.
The manufacture method of 13. LED encapsulation bodies according to claim 10, is characterized in that, the netted framework of this dome is by a plurality of ring frames and a plurality of rod member is interlaced forms.
The manufacture method of 14. LED encapsulation bodies according to claim 13, it is characterized in that, described a plurality of ring frame is arranged in a parallel, and described a plurality of rod members are from the top of the netted framework of this dome, to be radioactive ray to arrange, and are individually fixed on described a plurality of ring frame.
The manufacture method of 15. LED encapsulation bodies according to claim 14, is characterized in that, the width of each this ring frame and each this rod member is between between 0.1mm to 1mm.
The manufacture method of 16. LED encapsulation bodies according to claim 15, is characterized in that, described a plurality of ring frames and described a plurality of rod member are light-permeable.
The manufacture method of 17. LED encapsulation bodies according to claim 16, is characterized in that, the material of described a plurality of ring frames and described a plurality of rod members comprises rubber or plastic cement.
The manufacture method of 18. LED encapsulation bodies according to claim 13, is characterized in that, described a plurality of ring frames, the material of described a plurality of rod members are identical with the material of this packaging plastic.
The manufacture method of 19. LED encapsulation bodies according to claim 13, is characterized in that, the netted framework of this dome is the retaining element being arranged on this ring frame of itself and this reflector butt with, is fixed on this reflector.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101124446 | 2012-07-06 | ||
| TW101124446A TWI459600B (en) | 2012-07-06 | 2012-07-06 | Light emitting diode package and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103531701A true CN103531701A (en) | 2014-01-22 |
| CN103531701B CN103531701B (en) | 2016-06-08 |
Family
ID=49933541
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210430093.2A Expired - Fee Related CN103531701B (en) | 2012-07-06 | 2012-11-01 | Light emitting diode package and method of manufacturing the same |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103531701B (en) |
| TW (1) | TWI459600B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007088099A (en) * | 2005-09-20 | 2007-04-05 | Matsushita Electric Works Ltd | Luminaire |
| US20100213480A1 (en) * | 2009-02-23 | 2010-08-26 | Samsung Led Co., Ltd. | Lens for light emitting diode package and light emitting diode package having the same |
| CN101877374A (en) * | 2009-04-28 | 2010-11-03 | 上海亮硕光电子科技有限公司 | Process for preparing white-light LED by using fluorescent powder lens |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI360239B (en) * | 2008-03-19 | 2012-03-11 | E Pin Optical Industry Co Ltd | Package structure for light emitting diode |
| GB2488936B (en) * | 2009-12-26 | 2015-03-25 | Achrolux Inc | Uniform film-layered structure that converts the wavelengh of emitted light and method for forming the same |
| US8431942B2 (en) * | 2010-05-07 | 2013-04-30 | Koninklijke Philips Electronics N.V. | LED package with a rounded square lens |
| TWM419229U (en) * | 2011-06-20 | 2011-12-21 | Brightek Optoelectronic Co Ltd | Light emitting diode package structure |
-
2012
- 2012-07-06 TW TW101124446A patent/TWI459600B/en not_active IP Right Cessation
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007088099A (en) * | 2005-09-20 | 2007-04-05 | Matsushita Electric Works Ltd | Luminaire |
| US20100213480A1 (en) * | 2009-02-23 | 2010-08-26 | Samsung Led Co., Ltd. | Lens for light emitting diode package and light emitting diode package having the same |
| CN101877374A (en) * | 2009-04-28 | 2010-11-03 | 上海亮硕光电子科技有限公司 | Process for preparing white-light LED by using fluorescent powder lens |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103531701B (en) | 2016-06-08 |
| TWI459600B (en) | 2014-11-01 |
| TW201403871A (en) | 2014-01-16 |
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