CN103429043A - Cooling device combination - Google Patents
Cooling device combination Download PDFInfo
- Publication number
- CN103429043A CN103429043A CN2012101475367A CN201210147536A CN103429043A CN 103429043 A CN103429043 A CN 103429043A CN 2012101475367 A CN2012101475367 A CN 2012101475367A CN 201210147536 A CN201210147536 A CN 201210147536A CN 103429043 A CN103429043 A CN 103429043A
- Authority
- CN
- China
- Prior art keywords
- heat pipe
- backboard
- combination
- radiating device
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a cooling device combination which is used for cooling an electronic element on a circuit board. The cooling device combination comprises a cooling module in thermal connection with the electronic element and a fixing device used for fixing the cooling module to the circuit board, wherein the cooling module comprises a heat pipe which comprises an evaporating section and a condensing section, the fixing device comprises a back plate, a plurality of buckling pins extend from the periphery of the back plate, an accommodating space is formed by the bucking pins, the shape of the accommodating space is matched with the shape of the outer edge of the evaporating section of the heat pipe so that the evaporating section of the heat pipe can be accommodated in the accommodating space, the back plate is in thermal contact with the evaporating section of the heat pipe, and the evaporating section of the heat pipe is in direct contact with the electronic element on the circuit board.
Description
Technical field
The present invention relates to a kind of combination of radiating device.
Background technology
Along with developing rapidly of computer industry, the heat that the heat-generating electronic elements such as micro-chip processor produce is more and more many, for these dissipation of heats being gone out to ensure the normal operation of electronic component, industry is sticked heat abstractor so that heat-generating electronic elements is dispelled the heat on electronic component.
This kind of heat abstractor generally comprised a heat pipe and with the hot linked radiating fin group of this heat pipe.In the process of assembling heat abstractor, industry is many to be welded in heat pipe on one metallic plate, the width of this metallic plate is greater than the width of this heat pipe, thereby, by shell fragment being set respectively to force on metallic plate on the both sides outside this metallic plate is positioned at this heat pipe, metallic plate is contacted with heat-generating electronic elements.The underrun that metallic plate exceeds heat pipe section arrange wheat draw (mylar) with prevent with circuit board on other electronic component short circuits.During work, the heat energy that heat-generating electronic elements produces, first be passed to metallic plate and be passed to heat pipe again, and then by with the hot linked radiating fin group of heat pipe, heat being passed in ambient air.Yet the caloric requirement that heat-generating electronic elements sends is passed on heat pipe by metallic plate, thereby cause radiating efficiency lower.
Summary of the invention
In view of this, be necessary to provide a kind of combination of radiating device with better cooling efficiency.
A kind of combination of radiating device, be used for the electronic element radiating on circuit board, this combination of radiating device comprises one with the heat radiation module of electronic component thermo-contact and this heat radiation module is fixed in to the fixture on circuit board, this heat radiation module comprises a heat pipe, this heat pipe includes an evaporation section and a condensation segment, described fixture comprises a backboard, the periphery of this backboard is extended with some pin of buckleing, these some button pin form a receiving space, the outer rim of the shape of this receiving space and the evaporation section of this heat pipe adapts for accommodating the evaporation section of this heat pipe, the evaporation section thermo-contact of this backboard and this heat pipe, the evaporation section of this heat pipe directly contacts with the electronic component on circuit board.
Combination of radiating device provided by the invention is equipped with a fixture, this fixture comprises a backboard, and the periphery of backboard is extended with the pin of buckleing that the outer rim of the evaporation section of some and heat pipe adapts, the button pin of this fixture is fastened on the lateral margin of heat pipe, and heat pipe is fixed on the circuit board of carrying heat-generating electronic elements, and compress this heat pipe so that this heat pipe directly contacts with the electronic component on circuit board by backboard, thereby can make heat pipe directly absorb the heat that heat-generating electronic elements sends, and then conduct on the radiating fin group, finally be dispersed in ambient air, so, improved the radiating efficiency of combination of radiating device.
The accompanying drawing explanation
The three-dimensional assembly diagram of the combination of radiating device that Fig. 1 provides for embodiment of the present invention.
The three-dimensional exploded view that Fig. 2 is combination of radiating device in Fig. 1.
The inverted view that Fig. 3 is fixture in Fig. 1.
The main element symbol description
| Combination of |
100 |
| The |
10 |
| |
11 |
| |
111 |
| |
112 |
| |
113 |
| The radiating |
12 |
| |
121 |
| |
20 |
| |
21 |
| |
211 |
| |
212 |
| The |
213 |
| Receiving |
214 |
| |
215 |
| |
22 |
| |
221 |
| Connecting hole | 222 |
| Connector | 23 |
| Back-up coat | 24 |
Following embodiment further illustrates the present invention in connection with above-mentioned accompanying drawing.
Embodiment
Please consult Fig. 1 to Fig. 3, it is depicted as the combination of radiating device 100 in the embodiment of the present invention simultaneously, and it comprises the fixture 20 that will dispel the heat a heat radiation module 10 and a module 10 is fixed.Heat radiation module 10 is attached at the surface of heat-generating electronic elements (not shown), the heat absorbed for absorbing heat-generating electronic elements, and then be dispersed in ambient air.
In the present embodiment, heat radiation module 10 comprises a heat pipe 11 and and the hot linked radiating fin group 12 of heat pipe 11.
Radiating fin group 12 by some fin 121 by fasten or welding etc. mode is stacking forms, radiating fin group 12 has an end face 122, the condensation segment 113 of heat pipe 11 is fitted on the end face 122 of radiating fin group 12, thereby forms hot links with radiating fin group 12.
In the present embodiment, stator 22 riveteds are connected in the upper surface 211 of backboard 21.Particularly, backboard 21 is provided with some perforation 215, and the other end that stator 22 is relative with fixing hole 221 is provided with some connecting holes 222, bores a hole 215 and connecting hole 222 is corresponding arranges and pass through some connectors 23 and fix.215 rotations of can boring a hole accordingly on backboard 21 of each stator 22, thus can be more accurately fixing hole 221 by stator 22 heat pipe 11 is fixed on other device.Understandably, the backboard 21 of fixture 20 and stator 22 also can be integrally formed or mode that tie by spiral shell combine.
Please again consult Fig. 2, preferably, can be provided with a back-up coat 24 on the lower surface 212 of backboard 21, so, can make fixture 20 be fixed to more securely the evaporation section 111 of heat pipe 11, reduce fixture 20 front and back slippages that combination of radiating device 100 causes due to vibration in transportation or the risk of disengaging.Back-up coat 24 can form by attaching the modes such as double faced adhesive tape or welding.
Combination of radiating device 100 provided by the invention is equipped with a fixture 20, this fixture 20 comprises a backboard 21 and is formed at the some stators 22 on backboard 21, and the periphery of backboard 21 is extended with that the lateral margin of the evaporation section 111 of some and heat pipe 11 adapts buckles pin 213, the button pin 213 of this fixture 20 is fastened on the periphery of the evaporation section 111 of heat pipe 11, by some stators 22, heat pipe 11 is fixed on the circuit board of carrying heat-generating electronic elements, and by backboard 21, compress this heat pipe 11 evaporation section 111 end face so that this evaporation section 11 directly with the electronic component on circuit board, contact, thereby can make the evaporation section 111 of heat pipe 11 directly absorb the heat that heat-generating electronic elements sends, and then conduct on radiating fin group 12 by linkage section 112 and the condensation segment 113 of heat pipe 11, finally be dispersed in ambient air, so, improved the radiating efficiency of combination of radiating device 100, in addition, fixture 20, owing to not needing to arrange traditional metallic plate, is drawn also and just can be saved for the wheat that prevents short circuit on its bottom surface, simple in structure, and convenient fixing, saved assembly cost.
Be understandable that, the heat pipe 11 in combination of radiating device 100, radiating fin group 12, backboard 21 and stator 22 are not limited to the situation described in the present embodiment, and it can also be the form of other conversion.
Technology contents of the present invention and technical characterstic disclose as above, yet those skilled in the art still may be based on teaching of the present invention and announcements and made all replacement and modifications that does not deviate from spirit of the present invention.Therefore, protection scope of the present invention should be not limited to the content that embodiment discloses, and should comprise various do not deviate from replacement of the present invention and modifications, and is contained by appended claim.
Claims (10)
1. a combination of radiating device, be used for the electronic element radiating on circuit board, this combination of radiating device comprises the heat radiation module and this heat radiation module is fixed in to the fixture on circuit board with the electronic component hot link, this heat radiation module comprises a heat pipe, this heat pipe includes an evaporation section and a condensation segment, it is characterized in that: described fixture comprises a backboard, the periphery of this backboard is extended with some pin of buckleing, these some button pin form a receiving space, the lateral margin of the shape of this receiving space and the evaporation section of this heat pipe adapts for accommodating the evaporation section of this heat pipe, this backboard compress this heat pipe evaporation section so that the evaporation section of this heat pipe directly with the electronic component on circuit board, contact.
2. combination of radiating device as claimed in claim 1, it is characterized in that: the cross section of this button pin is the J type.
3. combination of radiating device as claimed in claim 1, it is characterized in that: be provided with a back-up coat between this backboard and this heat pipe, the backboard of this fixture is fixed to the evaporation section of this heat pipe via back-up coat.
4. combination of radiating device as claimed in claim 3, it is characterized in that: this back-up coat is double faced adhesive tape.
5. combination of radiating device as claimed in claim 1, it is characterized in that: this combination of radiating device also includes a radiating fin group, the condensation segment of this heat pipe and this radiating fin group hot link.
6. combination of radiating device as claimed in claim 1, it is characterized in that: described fixture also comprises the some stators that extended to different directions by the same surface of this backboard, the end of this stator is provided with a fixing hole, and this fixing hole is for being fixed to circuit board by a connector run through wherein by stator.
7. combination of radiating device as claimed in claim 6, it is characterized in that: this stator has elasticity.
8. combination of radiating device as claimed in claim 6, it is characterized in that: this stator riveted is connected on this backboard.
9. combination of radiating device as claimed in claim 6, it is characterized in that: this stator and this backboard are integrally formed.
10. a combination of radiating device, for the electronic component on circuit board is dispelled the heat, this combination of radiating device comprises with the heat pipe of electronic component thermo-contact and this heat pipe is fixed in to the fixture on circuit board, it is characterized in that: this fixture comprises a backboard, the some some stators buckleing pin and extended to different directions by the same surface of this backboard that extended to electronic component by the periphery of this backboard, this backboard compresses the end face of this heat pipe, and these some button pin engage the lateral margin of this heat pipe, by this stator is fixed to circuit board, so that this heat pipe directly contacts with the electronic component on circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101475367A CN103429043A (en) | 2012-05-14 | 2012-05-14 | Cooling device combination |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101475367A CN103429043A (en) | 2012-05-14 | 2012-05-14 | Cooling device combination |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103429043A true CN103429043A (en) | 2013-12-04 |
Family
ID=49652964
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012101475367A Pending CN103429043A (en) | 2012-05-14 | 2012-05-14 | Cooling device combination |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103429043A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105526816A (en) * | 2014-09-30 | 2016-04-27 | 富瑞精密组件（昆山）有限公司 | Heat pipe, manufacturing method of heat pipe and radiating device using heat pipe |
| TWI578671B (en) * | 2014-01-10 | 2017-04-11 | 技嘉科技股份有限公司 | Heat sink with heat pipe and manufacturing method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2847818Y (en) * | 2005-12-21 | 2006-12-13 | 禾富热导股份有限公司 | Heat radiator structure |
| CN201608970U (en) * | 2009-10-27 | 2010-10-13 | 鸿富锦精密工业（深圳）有限公司 | Circuit board combination |
| CN202210518U (en) * | 2011-09-07 | 2012-05-02 | 陈世明 | Thin-type heat pipe radiator |
-
2012
- 2012-05-14 CN CN2012101475367A patent/CN103429043A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2847818Y (en) * | 2005-12-21 | 2006-12-13 | 禾富热导股份有限公司 | Heat radiator structure |
| CN201608970U (en) * | 2009-10-27 | 2010-10-13 | 鸿富锦精密工业（深圳）有限公司 | Circuit board combination |
| CN202210518U (en) * | 2011-09-07 | 2012-05-02 | 陈世明 | Thin-type heat pipe radiator |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI578671B (en) * | 2014-01-10 | 2017-04-11 | 技嘉科技股份有限公司 | Heat sink with heat pipe and manufacturing method thereof |
| CN105526816A (en) * | 2014-09-30 | 2016-04-27 | 富瑞精密组件（昆山）有限公司 | Heat pipe, manufacturing method of heat pipe and radiating device using heat pipe |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20131204 |