CN103374202A - Epoxy resin composite material, film and circuit board - Google Patents
Epoxy resin composite material, film and circuit board Download PDFInfo
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- CN103374202A CN103374202A CN2012101197709A CN201210119770A CN103374202A CN 103374202 A CN103374202 A CN 103374202A CN 2012101197709 A CN2012101197709 A CN 2012101197709A CN 201210119770 A CN201210119770 A CN 201210119770A CN 103374202 A CN103374202 A CN 103374202A
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Abstract
The invention relates to an epoxy resin composite material which comprises epoxy resin, acidyl terminated dimeric acid modified polyester and barium titanate. The mass percent of the barium titanate accounting for the epoxy resin composite material is 18.252% to 22.308%. The change of dielectric constant of the epoxy resin composite material is between 22 and 27.5. The viscosity of the epoxy resin composite material is 50000 centipoises to 100000 centipoises. The epoxy resin composite material provided by the invention has high dielectric constant and good flexibility, and can be taken as a flexible film with high dielectric constant of a flexible circuit board. The invention further relates to the film made from the epoxy resin composite material and the circuit board with the film.
Description
Technical field
The present invention relates to technical field of composite materials, relate in particular to a kind of have flexibility and have high-k epoxy resin composite material, the film of being made by this epoxy resin composite material, and the circuit substrate made with this film.
Background technology
Along with the development of science and technology, microminiature mobile phone, hand-held calculator and electronic vehicle product etc. are all had higher requirement to miniaturization, the lightness of product.In order to adapt to this demand, the circuit level in the electronic product improves constantly, and the pattern of printed wiring is increasingly densification also, and the conductor width of circuit, conductor separation, clear size of opening etc. are also thereupon increasingly tiny.Therefore, flexible printed circuit board (Flexible Printed Circuit, write a Chinese character in simplified form FPC, also claim soft board, flexible circuit board or flexible electric circuit board), toughness frivolous with it and pliability, circuit can fine property etc. premium properties and substitute gradually rigid circuit board or circuit card module, be applied to more and more be electrically connected between all kinds of electronic components.
At present, the dielectric coefficient of the common high molecular polymer that is used for film bonding between the multilayer circuit board is lower, thereby so that the specific inductivity of film is also lower, the insulativity of film is also relatively poor.Along with the constantly attenuation of flexibility seal circuit card, the relatively poor film of insulativity easily forms path between two line layers that need not to be communicated with of circuit card, thereby the electronic component that easily will need not to be communicated with is communicated with, and then has influence on the normal operation of each electronic component on the circuit card.In addition, high molecular polymer mostly is mechanically resistant material, easily embrittlement, and difficulty is applicable to flexible printed circuit board.
Summary of the invention
Therefore, be necessary to provide a kind of have flexibility and have high-k epoxy resin composite material, the film of being made by this epoxy resin composite material, and with the circuit substrate of this film acquisition.
Below will a kind of epoxy resin composite material, film and circuit substrate be described with embodiment.
A kind of epoxy resin composite material, it comprises dimer acid modified polyester and the barium titanate of Resins, epoxy, acidic group end-blocking.Described barium titanate shared mass percent in described epoxy resin composite material is 18.252% to 22.308%.The change in dielectric constant interval of described epoxy resin composite material is between 22 to 27.5.The viscosity of described epoxy resin composite material is 50000 centipoise to 100000 centipoises.
A kind of epoxy resin composite material, its dimer acid modified polyester, barium titanate, stiffening agent, solvent, catalyzer and defoamer by Resins, epoxy, acidic group end-blocking forms.Described Resins, epoxy shared mass percent in described epoxy resin composite material is 9.126% to 11.154%.The dimer acid modified polyester of described acidic group end-blocking shared mass percent in described epoxy resin composite material is 6.84% to 7.76%.Described barium titanate shared mass percent in described epoxy resin composite material is 18.252% to 22.308%.The change in dielectric constant interval of described epoxy resin composite material is between 22 to 27.5.The viscosity of described epoxy resin composite material is 50000 centipoise to 100000 centipoises.
A kind of film, it comprises release substrate layer and the epoxy resin composite material layer of applying.Described epoxy resin composite material layer is made through overbaking by epoxy resin composite material.Described epoxy resin composite material comprises dimer acid modified polyester and the barium titanate of Resins, epoxy, acidic group end-blocking.Described barium titanate shared mass percent in described epoxy resin composite material is 18.252% to 22.308%.The change in dielectric constant interval of described epoxy resin composite material is between 22 to 27.5.The viscosity of described epoxy resin composite material is 50000 centipoise to 100000 centipoises.
A kind of circuit substrate, it comprises the first flexible parent metal, the second flexible parent metal and fits in epoxy resin composite material layer between described the first flexible parent metal and the second flexible parent metal.Described epoxy resin composite material layer is made through overbaking and pressing by epoxy resin composite material.Described epoxy resin composite material comprises dimer acid modified polyester and the barium titanate of Resins, epoxy, acidic group end-blocking.Described barium titanate shared mass percent in described epoxy resin composite material is 18.252% to 22.308%.The change in dielectric constant interval of described epoxy resin composite material is between 22 to 27.5.The viscosity of described epoxy resin composite material is 50000 centipoise to 100000 centipoises.
Than prior art, Uniform Dispersion has barium titanate in the middle of the epoxy resin composite material that the technical program provides, and has high-k.The described Resins, epoxy that comprises in the described epoxy resin composite material and the dimer acid modified polyester of acidic group end-blocking have good flexibility and tack.Thereby the film condensation material of high-k that described epoxy resin composite material can be used as the flexibility of flexible PCB uses.
Description of drawings
Fig. 1 is the schema of the epoxy resin composite material making method that provides of first embodiment of the invention.
Fig. 2 is the diagrammatic cross-section of the film that provides of second embodiment of the invention.
Fig. 3 is the making method schema of the film among Fig. 2.
Fig. 4 is the diagrammatic cross-section of the circuit substrate that provides of third embodiment of the invention.
Fig. 5 is the sectional view of the first flexible parent metal of providing of third embodiment of the invention.
The sectional view of the film of Fig. 6 is the removal that provides of third embodiment of the invention release sealing coat.
Fig. 7 is the sectional view after the epoxy resin composite material layer contraposition with the film among Fig. 6 that third embodiment of the invention provides is stacked in the first insulation layer of the first flexible parent metal among Fig. 5.
Fig. 8 is the sectional view of the second flexible parent metal of providing of third embodiment of the invention.
Fig. 9 is the sectional view after the second insulation layer contraposition with the second flexible parent metal among Fig. 8 that third embodiment of the invention provides is stacked in epoxy resin composite material layer among Fig. 7.
The main element nomenclature
| |
10 |
| |
11 |
| The epoxy resin |
12 |
| |
13 |
| The |
110 |
| The |
130 |
| |
120 |
| |
121 |
| |
200 |
| The first |
201 |
| The second |
203 |
| The epoxy resin |
205 |
| The first |
2011 |
| The |
2013 |
| The second |
2031 |
| The |
2033 |
Following embodiment further specifies the present invention in connection with above-mentioned accompanying drawing.
Embodiment
The epoxy resin composite material that the technical program is provided below in conjunction with embodiment, the film of being made by this epoxy resin composite material, and further describe in detail with the circuit substrate of this film acquisition.
The first embodiment of the invention case provides a kind of epoxy resin composite material.The viscosity of described epoxy resin composite material is 50000 centipoise to 100000 centipoises.Described epoxy resin composite material mainly by the first colloid, the second colloid, stiffening agent, and catalyzer form.
Described the first colloid comprises Resins, epoxy, solvent and defoamer.
Described Resins, epoxy can be bisphenol A type epoxy resin.The mass percent of described Resins, epoxy in described epoxy resin composite material is about 9.126% to 11.154%, is preferably 10.14%.
Described solvent is dipropylene glycol monomethyl ether (Dipropylene Glycol Monomethyl Ether), and the content of described solvent in described epoxy resin composite material is about 54.738% to 66.902%, is preferably 60.82%.This solvent is used for dissolving described Resins, epoxy, to form uniform liquid dispersed system.
Described defoamer is used for eliminating the foam of above-mentioned liquid dispersed system, and the mass percent of described defoamer in epoxy resin composite material is about 0.459% to 0.561%, is preferably 0.51%.Described defoamer can be commercially available silane coupling agent A-187.
Described the second colloid comprises the dimer acid modified polyester of barium titanate and acidic group end-blocking.
Described barium titanate is the inorganics with high-k, and it is used for improving the specific inductivity of described epoxy resin composite material.The mass percent of described barium titanate in described epoxy resin composite material is about 18.252% to 22.308%, is preferably 20.28%.How many dielectric properties that can obtain according to actual needs matrix material of the content of metatitanic acid quilt are determined in the described matrix material.
The dimer acid modified polyester of described acidic group end-blocking is provided by UNIQEMA company, and its mass percent in described epoxy resin composite material is about 6.84% to 7.76%, is preferably 7.6%.
Described stiffening agent is polyamide-based hardener for epoxy resin, is used for described matrix material is played sclerization.In the present embodiment, the TOHMIDE 225-X that the stiffening agent of employing provides for three synthetic limited-liability company.Described stiffening agent is about 0.423% to 0.517% in the shared mass percent of described epoxy resin composite material, is preferably 0.47%.
Described catalyzer is 2-heptadecyl imidazoles (2-heptadecylimidazole).Described catalyzer shared quality percentage composition in described epoxy resin composite material is about 0.172% to 0.198%, is preferably 0.18%.
In the epoxy resin composite material of the preferred embodiment that the technical program provides, the quality percentage composition of described Resins, epoxy is about 10.14%, the quality percentage composition of the dimer acid modified polyester of described acidic group end-blocking is about 7.06%, the quality percentage composition of described barium titanate is about 20.28%, the quality percentage composition of stiffening agent is about 0.47%, the quality percentage composition of catalyzer is about 0.18%, the quality percentage composition of solvent is about 60.82%, and the quality percentage composition of defoamer is about 0.51%.
See also Fig. 1, the making method of described epoxy resin composite material comprises the steps:
The first step, blending epoxy, solvent and defoamer are to obtain the first colloid.Particularly, at first, Resins, epoxy is dissolved in solvent at normal temperatures, dipropylene glycol monomethyl ether for example is to obtain solution; Secondly, defoamer is added described solution, and stir about 3 hours to 4 hours, is preferably 3.5 hours, eliminating the bubble in the described solution, and so that described Resins, epoxy, solvent and defoamer dissolve fully, thereby obtain described the first colloid.In the present embodiment, the Resins, epoxy of employing is bisphenol A type epoxy resin.Certainly, the Resins, epoxy of employing is not limited to the bisphenol A type epoxy resin that present embodiment provides, and it also can be the Resins, epoxy of other types.
Second step, the dimer acid modified polyester that barium titanate is added the acidic group end-blocking stirs, to obtain the second colloid.Particularly, barium titanate is added in the dimer acid modified polyester of acidic group end-blocking and stir about 3 hours to 3.5 hours, be preferably 3 hours, to obtain the second colloid.
In the 3rd step, described stiffening agent, catalyzer, the first colloid and the second colloid are mixed and grinding distribution, thereby obtain epoxy resin composite material.
In the present embodiment, adopt three drum-type grinding distribution machines that described the first colloid, the second colloid, stiffening agent and catalyzer are carried out grinding distribution.Above-mentioned the first colloid, the second colloid, stiffening agent and catalyzer are devoted in the three drum-type grinding distribution machines according to above-mentioned content separately, start three drum-type grinding distribution machines to carry out grinding distribution, thereby so that the solid uniform ingredients is scattered in the liquid component in above-mentioned each composition, thereby form finely dispersed epoxy resin composite material.In the present embodiment, in above-mentioned each composition, the quality percentage composition of described Resins, epoxy is about 10.14%, the quality percentage composition of the dimer acid modified polyester of described acidic group end-blocking is about 7.06%, the quality percentage composition of described barium titanate is about 20.28%, the quality percentage composition of stiffening agent is about 0.47%, the quality percentage composition of catalyzer is about 0.18%, and the quality percentage composition of solvent is about 60.82%, and the quality percentage composition of defoamer is about 0.51%.
For obtain different high-ks epoxy resin composite material, the consumption of barium titanate is controlled in the time of can feeding intake by change.The mass percent that accounts for matrix material when barium titanate is between 18.252% to 22.308%, and the change in dielectric constant interval of epoxy resin composite material is between 22 to 27.5.Wherein, the content of barium titanate is larger in the epoxy resin composite material, and the specific inductivity of epoxy resin composite material is higher.
Epoxy resin composite material by described method making, its specific inductivity is between 22 to 27.5, for having the epoxy resin composite material of high-k, and barium titanate is scattered in the dimer acid modified polyester of Resins, epoxy and described acidic group end-blocking, thereby be 50000 centipoise to 100000 centipoises so that have the viscosity of the described epoxy resin composite material of barium titanate, that is, described epoxy resin composite material not only has higher specific inductivity, and has preferably flexibility and tack.
Uniform Dispersion has barium titanate in the middle of the epoxy resin composite material that the technical program provides, and has high-k.The described Resins, epoxy that described epoxy resin composite material comprises and the dimer acid modified polyester of acidic group end-blocking have good flexibility and tack.Thereby the film condensation material of high-k that described epoxy resin composite material can be used as the flexibility of flexible PCB uses.The epoxy resin composite material making method that the technical program provides can be scattered in barium titanate the dimer acid modified polyester of described Resins, epoxy and acidic group end-blocking uniformly, and have simple to operate, the advantage that is easy to realize.
See also Fig. 2, the film 10 that second embodiment of the invention provides, it comprises release substrate layer 11, epoxy resin composite material layer 12 and the release sealing coat 13 that stacks gradually.
Described release substrate layer 11 is used for carrier bar epoxy resin composite material layer 12.Release substrate layer 11 can be the PET release film, and namely its base material is PET, is coated with the materials such as silicone oil on one or two relative surfaces of base material and forms the single or double release surface.Described release surface can be clung epoxy resin composite material layer 12 formed thereon, but is easy to make release substrate layer 11 to separate with epoxy resin composite material layer 12.In the present embodiment, release substrate layer 11 adopts single face PET release film, and it has the first release surface 110.The PET release film that the material of release substrate layer 11 is not limited to provide in the present embodiment, it also can have for other material of release surface, such as separate-type paper etc.Described separate-type paper can be silicone oil paper or leaching membrane paper.
Described release sealing coat 13 is for the protection of epoxy resin composite material layer 12.When the film 10 of producing did not need transportation or preserves for a long time, film 10 also can not comprise release sealing coat 13.The material of release sealing coat 13 can with the material of release substrate layer 11 just as, namely it can be the PET release film, it also can have for other material of release surface, such as various separate-type paper etc.Release sealing coat 13 has the second release surface 130, the second release surface 130 is in contact with one another with epoxy resin composite material layer 12, thereby transport or storage process in, mutual when stacking when multifilm 10, release sealing coat 13 can be isolated the film 10 that is in contact with one another to avoid inter-adhesive.And release substrate layer 11 and release sealing coat 13 also can so that epoxy resin composite material layer 12 is isolated from the outside, prevent epoxy resin composite material the layer 12 contaminated or moisture absorption in transportation and storage process.
Described epoxy resin composite material layer 12 is used for playing insulation and cohesive action.The thickness of epoxy resin composite material layer 12 can be set according to actual needs.Epoxy resin composite material layer 12 is arranged between the second release surface 130 of the first release surface 110 of release substrate layer 11 and release sealing coat 13.Epoxy resin composite material layer 12 has relative first surface 120 and second surface 121.Described first surface 120 contacts with described release substrate layer 11.Described second surface 121 contacts with described release sealing coat 13.Described epoxy resin composite material layer 12 is made through overbaking by the epoxy resin composite material that the first embodiment provides.Described epoxy resin composite material layer 12 mainly is comprised of dimer acid modified polyester, barium titanate, stiffening agent, catalyzer, solvent and the defoamer of Resins, epoxy, acidic group end-blocking, and preferably is in semi-cured state.
See also Fig. 3, the making method of above-mentioned film 10 comprises the steps:
The first step provides release substrate layer 11, and it has the first release surface 110.In the present embodiment, release substrate layer 11 is the PET release film.
Second step provides the epoxy resin composite material in the first embodiment, and described epoxy resin composite material is coated the surface of described release substrate layer 11.
In the present embodiment, adopt slit type coater that the epoxy resin composite material of liquid state is coated the first release surface 110 of release substrate layer 11, to form epoxy resin composite material layer 12.In the present embodiment owing to adopt slit type coater to be coated with, the thickness that can control the epoxy resin composite material layer 12 of formation meet the demands and coating even.Epoxy resin composite material layer 12 has relative first surface 120 and second surface 121.Described first surface 120 contacts with the first release surface 110 of described release substrate layer 11.Described second surface 121 is away from described release substrate layer 11.
In the 3rd step, toast described epoxy resin composite material layer 12, so that the most of solvent evaporates in the described epoxy resin composite material layer 12.In the present embodiment, epoxy resin composite material layer 12 is being carried out in the bake process, the time that baking continues is about 18 to 22 minutes, is preferably 20 minutes, and the temperature that keeps during baking is about 72 degrees centigrade to 88 degrees centigrade, is preferably 80 degrees centigrade.By carrying out baking processing, so that the dipropylene glycol monomethyl ether in the epoxy resin composite material layer 12 volatilizees 99 95 percent to percent, be preferably 98 percent.
Be understandable that the temperature that keeps when the time that baking continues and baking can be determined according to the thickness of the epoxy resin composite material layer 12 of reality.When epoxy resin composite material layer 12 thickness are larger, time proper extension or the temperature processed suitably can be heightened, and when epoxy resin composite material layer 12 thickness hour, suitable shortening of the time of processing or temperature suitably can be reduced, can volatilize to guarantee the most of dipropylene glycol monomethyl ether in the epoxy resin composite material layer 12.
In the 4th step, the described epoxy resin composite material layer 12 after baking is away from the release sealing coat 13 of surface (being second surface 121) applying of described release substrate layer 11.
After this step, can also further cut film 10, film 10 is made into the shape that needs, use with convenient.When the film 10 that making forms is not directly used, film 10 can be positioned under the low temperature environment and store, the temperature of storage can be approximately 5 degrees centigrade.
See also Fig. 4, the circuit substrate 200 that third embodiment of the invention provides, it comprise the first flexible parent metal 201, the second flexible parent metal 203 and fit in the first flexible parent metal 201 and the second flexible parent metal 203 between epoxy resin composite material layer 205.
The first flexible parent metal 201 and the second flexible parent metal 203 can be the single-sided flexible copper-clad plate.The first flexible parent metal 201 comprises the first conductive layer 2011 and first insulation layer 2013 of applying.Described the second flexible parent metal 203 comprises the second conductive layer 2031 and second insulation layer 2033 of applying.
The first conductive layer 2011 and the second conductive layer 2031 all are used to form conductive pattern, to realize transmission and the processing of signal.The most frequently used material of the first conductive layer 2011 and the second conductive layer 2031 is copper and copper alloy, but also can be aluminium, aluminium alloy, silver, silver alloys or other electro-conductive materials.
The first insulation layer 2013 and the second insulation layer 2033 consist of by flexible materials all be used to supporting corresponding conductive layer.The most frequently used material of the first insulation layer 2013 and the second insulation layer 2033 is polyimide (Polyimide, PI), but also can be polyethylene terephthalate glycol (Polyethylene Terephtalate, PET) or PEN (Polyethylene naphthalate, PEN).
Epoxy resin composite material layer 205 is flexible high dielectric material layer, and it is used for bonding the first insulation layer 2013 and the second insulation layer 2033.The epoxy resin composite material that epoxy resin composite material layer 205 adopts the first embodiment to provide is made.Described epoxy resin composite material layer 205 comprises Resins, epoxy, barium titanate, stiffening agent, catalyzer, solvent and the defoamer of the dimer acid modified polyester modification of acidic group end-blocking.Those skilled in the art can certainly understand, and the first flexible parent metal 201 and the second flexible parent metal 203 also can be double face copper, at this moment, and can bond two copper faces of the first flexible parent metal 201 and the second flexible parent metal 203 of epoxy resin composite material layer 205.
The making method of foregoing circuit substrate 200 comprises the steps:
See also Fig. 5, the first step provides described the first flexible parent metal 201.The first flexible parent metal 201 comprises the first conductive layer 2011 and the first insulation layer 2013.
See also Fig. 6, second step provides the film 10 in the second embodiment, and release sealing coat 13 is removed from epoxy resin composite material layer 12.
See also Fig. 7, the 3rd step, 12 contraposition of epoxy resin composite material layer are stacked on the first insulation layer 2013, epoxy resin composite material layer 12 is contacted with the first insulation layer 2013.
Before carrying out subsequent step, release substrate layer 11 need to be removed from epoxy resin composite material layer 12.Particularly, can be before 12 contraposition of epoxy resin composite material layer be stacked on the first insulation layer 2013, first release substrate layer 11 is removed from epoxy resin composite material layer 12, also can after 12 contraposition of epoxy resin composite material layer are stacked on the first insulation layer 2013, more release substrate layer 11 be removed from epoxy resin composite material layer 12.
See also Fig. 8 and Fig. 9, in the 4th step, described the second flexible parent metal 203 is provided, and the second flexible parent metal 203 is stacked on the epoxy resin composite material layer 205, so that the second insulation layer 2033 contacts with epoxy resin composite material layer 205.
The 5th step, pressing the first flexible parent metal 201, the second flexible parent metal 203, and epoxy resin composite material layer 12, so that epoxy resin composite material layer 12 solidifies and bond the first insulation layer 2013 and the second insulation layers 2033, thereby the circuit substrate 200(that obtains having epoxy resin composite material layer 205 consults Fig. 4).Epoxy resin composite material layer 205 comprises the Resins, epoxy of the dimer acid modified polyester modification of acidic group end-blocking.
Described curing refers under the condition that temperature is about 150 degrees centigrade to 170 degrees centigrade, the dimer acid modified polyester of the acidic group end-blocking in the epoxy resin composite material layer 12 and Resins, epoxy polymerization reaction take place, generate the Resins, epoxy of the dimer acid modified polyester modification of acidic group end-blocking, be that the carboxyl of end of the dimer acid modified polyester of the epoxy group(ing) of Resins, epoxy end and acidic group end-blocking reacts and generates an ester group, thereby obtain comprising the process of polymkeric substance of repeating unit of the dimer acid modified polyester of Resins, epoxy repeating unit alternately and acidic group end-blocking.
In the present embodiment, when carrying out pressing, pressing-in temp is about 150 degrees centigrade to 170 degrees centigrade, be preferably 160 degrees centigrade, pressing time is about 2.5 hours to 3.5 hours, be preferably 3 hours, thereby so that epoxy resin composite material layer 12 becomes flexible better epoxy resin composite material layer 205.
Particularly, in the pressing process, the dimer acid modified polyester of the acidic group end-blocking in the epoxy resin composite material layer 12 and Resins, epoxy polymerization reaction take place, generate the Resins, epoxy of the dimer acid modified polyester modification of acidic group end-blocking, be that the carboxyl of end of the dimer acid modified polyester of the epoxy group(ing) of Resins, epoxy end and acidic group end-blocking reacts and generates an ester group, thereby obtain comprising the polymkeric substance of repeating unit of the dimer acid modified polyester of Resins, epoxy repeating unit alternately and acidic group end-blocking.Resins, epoxy before the Resins, epoxy of the dimer acid modified polyester modification of described acidic group end-blocking and the polymerization reaction take place not and the dimer acid modified polyester of acidic group end-blocking are compared, and have better flexibility.In addition, under this pressing condition, epoxy resin composite material layer 205 bonding the first insulation layer 2013 and the second insulation layer 2033, thus obtain doing as a whole circuit substrate 200.The technical program is made the circuit substrate obtain, can satisfy among the IPC-TM-650 testing standard about mechanical characteristics, chemical property, physical property and electrical specification.
The circuit substrate that the technical program provides, owing between contiguous two conductive layers, be provided with the epoxy resin composite material layer, has high-k because having finely dispersed barium titanate in the described epoxy resin composite material layer, when two conductive layers of described circuit substrate were made the formation conducting wire, described epoxy resin composite material layer can have preferably insulating property.And the epoxy resin composite material layer has good snappiness, can increase the performance of destroying or force to yield of flexible PCB, and can reduce the production cost of circuit card.
Be understandable that, for the person of ordinary skill of the art, can make other various corresponding changes and distortion by technical conceive according to the present invention, and all these change the protection domain that all should belong to claim of the present invention with distortion.
Claims (13)
1. epoxy resin composite material, it comprises dimer acid modified polyester and the barium titanate of Resins, epoxy, acidic group end-blocking, described barium titanate shared mass percent in described epoxy resin composite material is 18.252% to 22.308%, the change in dielectric constant interval of epoxy resin composite material is between 22 to 27.5, and the viscosity of described epoxy resin composite material is 50000 centipoise to 100000 centipoises.
2. epoxy resin composite material as claimed in claim 1 is characterized in that, described Resins, epoxy shared mass percent in described epoxy resin composite material is 9.126% to 11.154%.
3. epoxy resin composite material as claimed in claim 1 is characterized in that, the dimer acid modified polyester of described acidic group end-blocking shared mass percent in described epoxy resin composite material is 6.84% to 7.76%.
4. epoxy resin composite material as claimed in claim 1 is characterized in that, described epoxy resin composite material matrix material also comprises stiffening agent, solvent, catalyzer and defoamer.
5. epoxy resin composite material as claimed in claim 4, it is characterized in that, described stiffening agent is that the described stiffening agent of polyamide-based hardener for epoxy resin shared quality percentage composition in described epoxy resin composite material is 0.423% to 0.517%, described solvent is dipropylene glycol monomethyl ether, described solvent shared quality percentage composition in described epoxy resin composite material is 54.738% to 66.902%, described catalyzer is 2-heptadecyl imidazoles, described catalyzer shared quality percentage composition in described epoxy resin composite material is 0.172% to 0.198%, described defoamer is the silane coupling agent, and described defoamer shared quality percentage composition in described epoxy resin composite material is 0.459% to 0.561%.
6. epoxy resin composite material, it is by Resins, epoxy, the dimer acid modified polyester of acidic group end-blocking, barium titanate, stiffening agent, solvent, catalyzer and defoamer form, described Resins, epoxy shared mass percent in described epoxy resin composite material is 9.126% to 11.154%, the dimer acid modified polyester of described acidic group end-blocking shared mass percent in described epoxy resin composite material is 6.84% to 7.76%, described barium titanate shared mass percent in described epoxy resin composite material is 18.252% to 22.308%, the change in dielectric constant interval of epoxy resin composite material is between 22 to 27.5, and the viscosity of described epoxy resin composite material is 50000 centipoise to 100000 centipoises.
7. epoxy resin composite material as claimed in claim 6, it is characterized in that, described stiffening agent is polyamide-based hardener for epoxy resin, described stiffening agent shared quality percentage composition in described epoxy resin composite material is 0.423% to 0.517%, described solvent is dipropylene glycol monomethyl ether, described solvent shared quality percentage composition in described epoxy resin composite material is 54.738% to 66.902%, described catalyzer is 2-heptadecyl imidazoles, described catalyzer shared quality percentage composition in described epoxy resin composite material is 0.172% to 0.198%, described defoamer is the silane coupling agent, and described defoamer shared quality percentage composition in described epoxy resin composite material is 0.459% to 0.561%.
8. film, it comprises release substrate layer, it is characterized in that described film also comprises the epoxy resin composite material layer of making through overbaking by by each described epoxy resin composite material among the claim 1-7, described epoxy resin composite material layer fits in described release substrate layer.
9. film as claimed in claim 8, it is characterized in that, described epoxy resin composite material layer by each described epoxy resin composite material among the claim 1-7 at 72 degrees centigrade under 88 degrees centigrade, through making after the baking in 18 minutes to 22 minutes, described epoxy resin composite material layer is in semi-cured state.
10. film as claimed in claim 8 is characterized in that, described film also comprises release sealing coat, and described epoxy resin composite material layer is between described release substrate layer and described release sealing coat.
11. circuit substrate, it comprises that the first flexible parent metal and the second flexible parent metal is characterized in that, described circuit substrate also comprises the epoxy resin composite material layer that fits between described the first flexible parent metal and the second flexible parent metal, and described epoxy resin composite material layer is made through overbaking and pressing by each described epoxy resin composite material among the claim 1-7.
12. circuit substrate as claimed in claim 11 is characterized in that, described epoxy resin composite material layer by each described epoxy resin composite material among the claim 1-7 first at 72 degrees centigrade under 88 degrees centigrade, through baking in 18 minutes to 22 minutes; After the baking again 150 degrees centigrade to 170 degree celsius temperature, make through 2.5 hours to 3.5 hours pressing, described epoxy resin composite material is in solid state.
13. circuit substrate as claimed in claim 11, it is characterized in that, described the first flexible parent metal comprises the first insulation layer and first conductive layer of applying, described the second flexible parent metal comprises the second insulation layer and second conductive layer of applying, and described epoxy resin composite material layer is between described the first insulation layer and the second insulation layer.
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| CN2012101197709A CN103374202A (en) | 2012-04-23 | 2012-04-23 | Epoxy resin composite material, film and circuit board |
| TW101114820A TW201343770A (en) | 2012-04-23 | 2012-04-26 | Epoxy resin composite material, adhesive sheet and circuit substrate |
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| CN2012101197709A CN103374202A (en) | 2012-04-23 | 2012-04-23 | Epoxy resin composite material, film and circuit board |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104592924A (en) * | 2015-01-13 | 2015-05-06 | 潮州三环（集团）股份有限公司 | Adhesive composition, adhesive film, adhesive film roll and preparation methods thereof |
| WO2017095332A1 (en) * | 2015-11-30 | 2017-06-08 | Linxens Holding | Method of manufacturing a laminated substrate for smart cards |
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| TW200927806A (en) * | 2007-12-28 | 2009-07-01 | Ind Tech Res Inst | Flexible, low dielectric loss composition and manufacture method thereof |
| CN101747593A (en) * | 2009-11-19 | 2010-06-23 | 哈尔滨工业大学 | Conductive adhesive with barium titanate ceramic powder as conductive filler and preparation method thereof |
| TW201033252A (en) * | 2008-12-25 | 2010-09-16 | Dainippon Ink & Chemicals | Polyimide resin, curable polyimide resin composition and cured article |
| CN102378482A (en) * | 2010-08-27 | 2012-03-14 | 富葵精密组件(深圳)有限公司 | Circuit board substrate and manufacturing method thereof |
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- 2012-04-23 CN CN2012101197709A patent/CN103374202A/en active Pending
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| US6274224B1 (en) * | 1999-02-01 | 2001-08-14 | 3M Innovative Properties Company | Passive electrical article, circuit articles thereof, and circuit articles comprising a passive electrical article |
| CN1908063A (en) * | 2005-08-01 | 2007-02-07 | 财团法人工业技术研究院 | High dielectric organic/inorganic blending material composition with flexibility and high heat endurance and hardening material thereof |
| TW200927806A (en) * | 2007-12-28 | 2009-07-01 | Ind Tech Res Inst | Flexible, low dielectric loss composition and manufacture method thereof |
| TW201033252A (en) * | 2008-12-25 | 2010-09-16 | Dainippon Ink & Chemicals | Polyimide resin, curable polyimide resin composition and cured article |
| CN101747593A (en) * | 2009-11-19 | 2010-06-23 | 哈尔滨工业大学 | Conductive adhesive with barium titanate ceramic powder as conductive filler and preparation method thereof |
| CN102378482A (en) * | 2010-08-27 | 2012-03-14 | 富葵精密组件(深圳)有限公司 | Circuit board substrate and manufacturing method thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104592924A (en) * | 2015-01-13 | 2015-05-06 | 潮州三环（集团）股份有限公司 | Adhesive composition, adhesive film, adhesive film roll and preparation methods thereof |
| WO2017095332A1 (en) * | 2015-11-30 | 2017-06-08 | Linxens Holding | Method of manufacturing a laminated substrate for smart cards |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201343770A (en) | 2013-11-01 |
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Application publication date: 20131030 |