CN103220876A - Flexible printed circuit board structure - Google Patents
Flexible printed circuit board structure Download PDFInfo
- Publication number
- CN103220876A CN103220876A CN2013101510153A CN201310151015A CN103220876A CN 103220876 A CN103220876 A CN 103220876A CN 2013101510153 A CN2013101510153 A CN 2013101510153A CN 201310151015 A CN201310151015 A CN 201310151015A CN 103220876 A CN103220876 A CN 103220876A
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- glue
- line
- plate structure
- circuit plate
- flexible circuit
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- Structure Of Printed Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
A flexible printed circuit board structure comprises a conductive metal layer and an adhesive layer, wherein the conductive metal layer directly adheres to one side of the adhesive layer. The flexible printed circuit board structure does not comprise base materials so that the thickness of the flexible printed circuit board is reduced. According to a manufacturing process of the flexible printed circuit board, the conductive metal layer directly adheres to one side of the adhesive layer, utilization of the base materials is removed, and therefore the thickness of the flexible printed circuit board is reduced.
Description
Technical field
The present invention relates to electronic circuit field, particularly a kind of flexible circuit plate structure that does not have matrix structure.
Background technology
Flexible PCB (Flexible Printed Circuit, hereinafter replace) with FPC, be with polyimides (PI), polyester (PET) or PEN films such as (PEN) are that base material is made a kind ofly has height reliability, an excellent flexible printed circuit.It is called for short soft board or FPC, has distribution density height, lightweight advantage, therefore is widely used in the every field.
Present flexible circuit plate structure has two kinds of principal modes:
As shown in Figure 1, a kind ofly form, between conductive metal layer 1 and base material 3, have glue-line 2 that both are bonded together by conductive metal layer 1 and base material 3.At the another side of base material 3, can paste common pressure sensitive adhesive 4.On conductive metal layer, can brush printing ink or coverlay protective layer 5 with the protection conductive metal layer.
As shown in Figure 2, another kind is made up of conductive metal layer 1 and base material 3, does not have glue between conductive metal layer 1 and base material 3.At the another side of base material 3, can paste common pressure sensitive adhesive 4.On conductive metal layer 1, can brush printing ink or coverlay protective layer 5 with the protection conductive metal layer.
The major defect of the said goods is, under the more and more thinner background of current electronic product, because the conductive metal layer of FPC is arranged on the base material, thereby makes that the FPC cost is higher and FPC is overall thicker, can't satisfy the demand of electronic product with rapid changepl. never-ending changes and improvements.Therefore, market in urgent need is thinner, and flexible circuit plate structure with low cost substitutes traditional flexible PCB.
Summary of the invention
The present invention is directed to the prior art above shortcomings, provide a kind of flexible circuit plate structure that does not have base material, the advantage that more existing flexible PCB is thinner, cost is lower.
The present invention is achieved through the following technical solutions:
A kind of flexible circuit plate structure comprises: conductive metal layer and glue-line, and the direct glue of conductive metal layer is attached to a side of glue-line;
Wherein, the flexible circuit plate structure does not comprise base material, to reduce thickness.
Preferable, glue-line is a hot-setting adhesive.
Preferable, also comprising pressure-sensitive adhesive layer, glue is attached to the opposite side of glue-line.
Preferable, glue-line is for crossing the pressure sensitive adhesive of etching, plating, welding resistance technology.
Preferable, base material comprises polyimides or polyester film.
The present invention provides a kind of manufacture craft of flexible PCB in addition, has removed the use base material from, the advantage that more existing flexible PCB is thinner, cost is lower
A kind of manufacture craft of flexible PCB comprises: the direct glue of conductive metal layer is attached to a side of glue-line, has removed the use base material from, to reduce thickness.
Preferable, glue-line is a hot-setting adhesive, is solidifying the attached normal follow-up manufacturing process of flexible PCB of carrying out of glue.
Preferable, glue-line is for crossing the pressure-sensitive adhesive layer of etching, plating, welding resistance technology, the attached normal follow-up manufacturing process of flexible PCB of carrying out of glue.
Description of drawings
Shown in Figure 1 is a kind of existing flexible circuit plate structure;
Shown in Figure 2 is another kind of existing flexible circuit plate structure;
Shown in Figure 3 is a kind of flexible circuit plate structure that the embodiment of the invention one provides;
Shown in Figure 4 is a kind of flexible circuit plate structure that the embodiment of the invention two provides.
Embodiment
Below with reference to accompanying drawing of the present invention; technical scheme in the embodiment of the invention is carried out clear, complete description and discussion; obviously; as described herein only is a part of example of the present invention; it is not whole examples; based on the embodiment among the present invention, the every other embodiment that those of ordinary skills are obtained under the prerequisite of not making creative work belongs to protection scope of the present invention.
For the ease of understanding, be that example is further explained explanation below in conjunction with accompanying drawing with several specific embodiments, and each embodiment does not constitute the qualification to the embodiment of the invention to the embodiment of the invention.
Embodiment one:
A kind of flexible circuit plate structure that does not have base material comprises: conductive metal layer 1 and glue-line 2, conductive metal layer 1 direct glue is attached to a side of glue-line 2.
Wherein, glue-line 2 is a hot-setting adhesive, and hot-setting adhesive is a kind of plastic adhesive, and its physical state changes with temperature change in certain temperature range, and chemical characteristic is constant.Opposite side at glue-line 2 can also comprise pressure-sensitive adhesive layer 4.
Its manufacture craft is: hot-setting adhesive is coated on the conductive metal layer 1, can obtains the used basic material of flexible PCB after the curing.The basic material that obtains is carried out the normal manufacturing process (exposure, development, etching, brush welding resistance printing ink, plating, die-cut etc.) of flexible PCB, can obtain the described flexible PCB of present embodiment.Simultaneously, can enclose common pressure-sensitive adhesive layer 4, be used for fixing flexible PCB at the opposite side of hot-setting adhesive.
Embodiment two:
A kind of flexible circuit plate structure that does not have base material comprises: conductive metal layer 1 and glue-line 2, conductive metal layer 1 direct glue is attached to a side of glue-line 2.
Wherein, glue-line 2 is a pressure-sensitive adhesive layer 4, so just need not once more attached glue, can save cost, reduces the thickness of flexible PCB.Notice, the pressure-sensitive adhesive layer 4 here is the special pressure-sensitive adhesive layer 4 that can cross technologies such as etching, plating, welding resistance, so that avoid damaging in follow-up manufacturing process.
Its manufacture craft is: the pressure-sensitive adhesive layer 4 that can cross technologies such as etching plating welding resistance overlays on the conductive metal layer 1, carry out the normal manufacturing process (exposure, development, etching, brush welding resistance printing ink, plating, die-cut etc.) of flexible PCB again, can obtain the described flexible PCB of present embodiment.
The above; only for the preferable embodiment of the present invention, but protection scope of the present invention do not limit to therewith, anyly is familiar with those skilled in the art in the technical scope that the present invention discloses; the variation that can expect easily or replacement all should be encompassed within protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection range of claim.
Claims (8)
1. a flexible circuit plate structure is characterized in that, comprising: conductive metal layer and glue-line, and the direct glue of described conductive metal layer is attached to a side of described glue-line;
Wherein, described flexible circuit plate structure does not comprise base material, to reduce thickness.
2. flexible circuit plate structure according to claim 1 is characterized in that, described glue-line is a hot-setting adhesive.
3. flexible circuit plate structure according to claim 1 is characterized in that, comprises that also pressure-sensitive adhesive layer, glue are attached to the opposite side of described glue-line.
4. flexible circuit plate structure according to claim 1 is characterized in that, described glue-line is for crossing the pressure sensitive adhesive of flexible PCB technology.
5. flexible circuit plate structure according to claim 1 is characterized in that described base material comprises polyimides, polyester or PEN film.
6. the manufacture craft of a flexible PCB is characterized in that, comprising: the direct glue of conductive metal layer is attached to a side of glue-line, has removed the use base material from, to reduce thickness.
7. flexible circuit plate structure according to claim 6 is characterized in that, described glue-line is a hot-setting adhesive, is solidifying the attached normal follow-up manufacturing process of flexible PCB of carrying out of glue.
8. flexible circuit plate structure according to claim 6 is characterized in that, described glue-line is for crossing the pressure-sensitive adhesive layer of etching, plating, welding resistance technology, the attached normal follow-up manufacturing process of flexible PCB of carrying out of glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013101510153A CN103220876A (en) | 2013-04-27 | 2013-04-27 | Flexible printed circuit board structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013101510153A CN103220876A (en) | 2013-04-27 | 2013-04-27 | Flexible printed circuit board structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103220876A true CN103220876A (en) | 2013-07-24 |
Family
ID=48818161
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013101510153A Pending CN103220876A (en) | 2013-04-27 | 2013-04-27 | Flexible printed circuit board structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103220876A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111798757A (en) * | 2020-07-10 | 2020-10-20 | Tcl华星光电技术有限公司 | Display panel and display device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202190455U (en) * | 2011-07-27 | 2012-04-11 | 同扬光电（江苏）有限公司 | Flexible circuit board |
| CN202192825U (en) * | 2011-06-03 | 2012-04-18 | 夏超华 | Adhesive stopping membrane for hot-pressing technology of flexible printed circuit board |
| CN202759665U (en) * | 2012-06-05 | 2013-02-27 | 江青桃 | Flexible led t5 lamp tube aluminium base circuit board |
-
2013
- 2013-04-27 CN CN2013101510153A patent/CN103220876A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202192825U (en) * | 2011-06-03 | 2012-04-18 | 夏超华 | Adhesive stopping membrane for hot-pressing technology of flexible printed circuit board |
| CN202190455U (en) * | 2011-07-27 | 2012-04-11 | 同扬光电（江苏）有限公司 | Flexible circuit board |
| CN202759665U (en) * | 2012-06-05 | 2013-02-27 | 江青桃 | Flexible led t5 lamp tube aluminium base circuit board |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111798757A (en) * | 2020-07-10 | 2020-10-20 | Tcl华星光电技术有限公司 | Display panel and display device |
| US11930597B2 (en) | 2020-07-10 | 2024-03-12 | Tcl China Star Optoelectronics Technology Co., Ltd. | Display panel and display device having same |
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| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20130724 |