CN103157717B - The cutting process of Far infrared electric heating air conditioner euthermic chip substrate - Google Patents
The cutting process of Far infrared electric heating air conditioner euthermic chip substrate Download PDFInfo
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- CN103157717B CN103157717B CN201110413511.2A CN201110413511A CN103157717B CN 103157717 B CN103157717 B CN 103157717B CN 201110413511 A CN201110413511 A CN 201110413511A CN 103157717 B CN103157717 B CN 103157717B
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Abstract
The present invention relates to the cutting process of a kind of Far infrared electric heating air conditioner euthermic chip substrate, described processing step is: cut out the wafer body (1) being sized larger than actual demand size；And process hole, location (1.1) and conductive hole (1.2) respectively at the two ends of wafer body (1), and hole, location (1.1) is positioned at the outer end of conductive hole (1.2)。The cutting process of Far infrared electric heating air conditioner euthermic chip substrate of the present invention, working (machining) efficiency is high and presentation quality is good。
Description
Technical field
The present invention relates to a kind of cutting process, especially relate to the cutting process of a kind of Far infrared electric heating air conditioner euthermic chip substrate。
Background technology
At present, people generally needed to use air-conditioning to carry out heating in room heating in winter, particularly in northern area, every household needs to pass into heating installation with resisting cold, and annual each household flower expense in heating is just up to thousands of units, and heating installation is to use coal heating to produce steam in addition, use fossil fuel not only contaminated environment, it is unfavorable for energy-conserving and environment-protective, and in the transmitting procedure of heating installation, it is easy to produce more loss。Be developed miscellaneous heating mode for this, wherein, Far-infrared Heating mode not only has heating function because of it, and has physical therapy efficacy and receive the extensive concern of people；Conventional Far-infrared Heating structure is for being simply coated with electrically conductive ink and composition euthermic chip on substrate, and it is applied to individual's physical therapy without being implanted to field of air conditioning more, Far-infrared Heating structure in the fabrication process more simultaneously adopts manual operation, particularly in for be coated with electrically conductive ink substrate cut in process, it mostly is manual chopper crush-cutting, so that production efficiency is low, the low and consistent property of product yields is poor；And in common artificial technique, in order to improve production efficiency as much as possible, always the size of substrate is cut into required size, and on substrate, only processes the conductive hole of necessity, the presentation quality of product substrate circumferential side frame cannot be carried out cutting shaping so that follow-up, thus can be affected。
Summary of the invention
It is an object of the invention to overcome above-mentioned deficiency, it is provided that the cutting process of the Far infrared electric heating air conditioner euthermic chip substrate that a kind of working (machining) efficiency is high and presentation quality is good。
The object of the present invention is achieved like this: the cutting process of a kind of Far infrared electric heating air conditioner euthermic chip substrate, and described processing step is:
Cut out the wafer body being sized larger than actual demand size；And process hole, location and conductive hole respectively at the two ends of wafer body, and hole, location is positioned at the outer end of conductive hole；
Above-mentioned steps adopts cutting mould once to cut molding, described cutting mould includes mould on cutting mould counterdie and cutting mould, described cutting mould counterdie includes cutting mould lower mould bottom plate, described cutting mould lower mould bottom plate is provided with cutting mould counterdie guide pillar and cutting mould counterdie template, the template face of described cutting mould counterdie template is the step surface being made up of cutting mould bottom punch tangent plane and cutting mould counterdie joint face, described cutting mould bottom punch tangent plane is lower than cutting mould counterdie joint face, the two ends, left and right of described cutting mould bottom punch tangent plane are respectively arranged with two cutting mould counterdie punchings, described cutting mould lower mould bottom plate is provided with cutting mould counterdie limited block, described cutting mould counterdie limited block is positioned at by cutting mould bottom punch tangent plane, on described cutting mould, mould includes baffle plate on cutting mould, described cutting mould is provided with on baffle plate the cutting mould upper die guide sleeve corresponding with cutting mould counterdie guide pillar, described cutting mould is provided with on baffle plate mould template on the cutting mould corresponding with cutting mould counterdie template, and mould template is arranged on cutting mould on baffle plate by mould elastic supporting member for supporting optical member on cutting mould on cutting mould, on described cutting mould, the template face of mould template is the step surface being made up of mould joint face on cutting mould upper punch tangent plane and cutting mould, described cutting mould upper punch tangent plane is higher than mould joint face on cutting mould, the two ends of described cutting mould upper punch tangent plane and cutting mould counterdie punching opposite position place are provided with cutting mould upper punch head。
Compared with prior art, the invention has the beneficial effects as follows:
Due to the fact that the size being sized larger than actual demand of wafer body, thus finally unnecessary rim charge can be cut off so that the substrate's appearance of the actual size obtained is clean and tidy；And utilizing cutting mould one-shot forming, working (machining) efficiency is higher。
Accompanying drawing explanation
Fig. 1 is the structural representation of the substrate that the cutting process of Far infrared electric heating air conditioner euthermic chip substrate of the present invention processes。
Fig. 2 be Far infrared electric heating air conditioner euthermic chip substrate of the present invention cutting process in the structural representation of cutting mould counterdie。
Fig. 3 be Far infrared electric heating air conditioner euthermic chip substrate of the present invention cutting process in the structural representation of mould on cutting mould。
Fig. 4 be Far infrared electric heating air conditioner euthermic chip substrate of the present invention cutting process in the A of Fig. 3 to schematic diagram。
Wherein:
Wafer body 1, location hole 1.1, conductive hole 1.2；
Mould 1012 on cutting mould counterdie 1011, cutting mould；
Cutting mould lower mould bottom plate 1011.1, cutting mould counterdie guide pillar 1011.2, cutting mould counterdie template 1011.3, cutting mould counterdie limited block 1011.4, cutting mould counterdie punching 1011.5；
Cutting mould bottom punch tangent plane 1011.3.1, cutting mould counterdie joint face 1011.3.2；
Mould elastic supporting member for supporting optical member 1012.4, cutting mould upper punch head 1012.5 on mould template 1012.3, cutting mould on baffle plate 1012.1, cutting mould upper die guide sleeve 1012.2, cutting mould on cutting mould；
Mould joint face 1012.3.2 on cutting mould upper punch tangent plane 1012.3.1, cutting mould。
Detailed description of the invention
Referring to Fig. 1 ~ 4, the cutting process of a kind of Far infrared electric heating air conditioner euthermic chip substrate that the present invention relates to, described processing step is:
Cut out the wafer body 1 being sized larger than actual demand size；And process hole 1.1, location and conductive hole 1.2 respectively at the two ends of wafer body 1, and hole 1.1, location is positioned at the outer end (as shown in Figure 1) of conductive hole 1.2；Due to the size being sized larger than actual demand of wafer body 1, thus finally unnecessary rim charge can be cut off so that the substrate's appearance of the actual size obtained is clean and tidy；
Whole process utilizes cutting mould once to cut molding, referring to Fig. 2 ~ 4, described cutting mould includes mould 1012 on cutting mould counterdie 1011 and cutting mould, described cutting mould counterdie 1011 includes cutting mould lower mould bottom plate 1011.1, described cutting mould lower mould bottom plate 1011.1 is provided with cutting mould counterdie guide pillar 1011.2 and cutting mould counterdie template 1011.3, the template face of described cutting mould counterdie template 1011.3 is the step surface being made up of cutting mould bottom punch tangent plane 1011.3.1 and cutting mould counterdie joint face 1011.3.2, described cutting mould bottom punch tangent plane 1011.3.1 is lower than cutting mould counterdie joint face 1011.3.2, the two ends, left and right of described cutting mould bottom punch tangent plane 1011.3.1 are respectively arranged with two cutting mould counterdie punchings 1011.5, described cutting mould lower mould bottom plate 1011.1 is provided with cutting mould counterdie limited block 1011.4, described cutting mould counterdie limited block 1011.4 is positioned at by cutting mould bottom punch tangent plane 1011.3.1, on described cutting mould, mould 1012 includes baffle plate 1012.1 on cutting mould, described cutting mould is provided with on baffle plate 1012.1 the cutting mould upper die guide sleeve 1012.2 corresponding with cutting mould counterdie guide pillar 1011.2, described cutting mould is provided with on baffle plate 1012.1 mould template 1012.3 on the cutting mould corresponding with cutting mould counterdie template 1011.3, and mould template 1012.3 is arranged on cutting mould on baffle plate 1012.1 by mould elastic supporting member for supporting optical member 1012.4 on cutting mould on cutting mould, on described cutting mould, the template face of mould template 1012.3 is the step surface being made up of mould joint face 1012.3.2 on cutting mould upper punch tangent plane 1012.3.1 and cutting mould, described cutting mould upper punch tangent plane 1012.3.1 is higher than mould joint face 1012.3.2 on cutting mould, the two ends of described cutting mould upper punch tangent plane 1012.3.1 and cutting mould counterdie punching 1011.5 opposite position place are provided with cutting mould upper punch head 1012.5；When cutting, cutting mould counterdie 1011 is contained on press after being located by connecting mutually with cutting mould upper die guide sleeve 1012.2 by cutting mould counterdie guide pillar 1011.2 with mould on cutting mould 1012, glass-fiber-plate is entered cutting mould bottom punch tangent plane 1011.3.1 via cutting mould counterdie joint face 1011.3.2, subsequent start-up press, on cutting mould, mould is pressed for 1012 times, step surface is utilized to be cut off by glass-fiber-plate, and gone out hole 1.1, location and conductive hole 1.2 on the substrate 1 by cutting mould upper punch head 1012.5 simultaneously, finally, on cutting mould mould 1012 under the drive of press on move, now, on cutting mould, the defective material swept away time die-cut is unloaded under the elastic force effect of mould elastic supporting member for supporting optical member 1012.4 by mould template 1012.3 on cutting mould。
Claims (1)
1. a cutting process for Far infrared electric heating air conditioner euthermic chip substrate, is characterized by: described processing step is:
Cut out the wafer body (1) being sized larger than actual demand size；And process hole, location (1.1) and conductive hole (1.2) respectively at the two ends of wafer body (1), and hole, location (1.1) is positioned at the outer end of conductive hole (1.2)；
Above-mentioned steps adopts cutting mould once to cut molding, described cutting mould includes mould (1012) on cutting mould counterdie (1011) and cutting mould, described cutting mould counterdie (1011) includes cutting mould lower mould bottom plate (1011.1), described cutting mould lower mould bottom plate (1011.1) is provided with cutting mould counterdie guide pillar (1011.2) and cutting mould counterdie template (1011.3), the template face of described cutting mould counterdie template (1011.3) is the step surface being made up of cutting mould bottom punch tangent plane (1011.3.1) and cutting mould counterdie joint face (1011.3.2), described cutting mould bottom punch tangent plane (1011.3.1) is lower than cutting mould counterdie joint face (1011.3.2), the two ends, left and right of described cutting mould bottom punch tangent plane (1011.3.1) are respectively arranged with two cutting moulds counterdie punching (1011.5), described cutting mould lower mould bottom plate (1011.1) is provided with cutting mould counterdie limited block (1011.4), it is other that described cutting mould counterdie limited block (1011.4) is positioned at cutting mould bottom punch tangent plane (1011.3.1), on described cutting mould, mould (1012) includes baffle plate on cutting mould (1012.1), described cutting mould is provided with on baffle plate (1012.1) the cutting mould upper die guide sleeve (1012.2) corresponding with cutting mould counterdie guide pillar (1011.2), described cutting mould is provided with on baffle plate (1012.1) mould template (1012.3) on the cutting mould corresponding with cutting mould counterdie template (1011.3), and mould template (1012.3) is arranged on cutting mould on baffle plate (1012.1) by mould elastic supporting member for supporting optical member (1012.4) on cutting mould on cutting mould, on described cutting mould, the template face of mould template (1012.3) is the step surface being made up of mould joint face (1012.3.2) on cutting mould upper punch tangent plane (1012.3.1) and cutting mould, described cutting mould upper punch tangent plane (1012.3.1) is higher than mould joint face (1012.3.2) on cutting mould, the two ends of described cutting mould upper punch tangent plane (1012.3.1) and cutting mould counterdie punching (1011.5) opposite position place are provided with cutting mould upper punch head (1012.5)。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110413511.2A CN103157717B (en) | 2011-12-10 | 2011-12-10 | The cutting process of Far infrared electric heating air conditioner euthermic chip substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110413511.2A CN103157717B (en) | 2011-12-10 | 2011-12-10 | The cutting process of Far infrared electric heating air conditioner euthermic chip substrate |
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| Publication Number | Publication Date |
|---|---|
| CN103157717A CN103157717A (en) | 2013-06-19 |
| CN103157717B true CN103157717B (en) | 2016-06-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201110413511.2A Active CN103157717B (en) | 2011-12-10 | 2011-12-10 | The cutting process of Far infrared electric heating air conditioner euthermic chip substrate |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04105898A (en) * | 1990-08-28 | 1992-04-07 | Ibiden Co Ltd | Cutter for electronic circuit substrate |
| CN1181500A (en) * | 1996-10-30 | 1998-05-13 | 株式会社村田制作所 | Pyroelectric infrared sensor device |
| CN101733324A (en) * | 2009-12-17 | 2010-06-16 | 苏州均华精密机械有限公司 | Punching die of long-slotted holes of integrated circuit boards |
| CN101863127A (en) * | 2003-01-17 | 2010-10-20 | 松下电器产业株式会社 | The manufacture method of substrate and the manufacturing installation of substrate |
-
2011
- 2011-12-10 CN CN201110413511.2A patent/CN103157717B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04105898A (en) * | 1990-08-28 | 1992-04-07 | Ibiden Co Ltd | Cutter for electronic circuit substrate |
| CN1181500A (en) * | 1996-10-30 | 1998-05-13 | 株式会社村田制作所 | Pyroelectric infrared sensor device |
| CN101863127A (en) * | 2003-01-17 | 2010-10-20 | 松下电器产业株式会社 | The manufacture method of substrate and the manufacturing installation of substrate |
| CN101733324A (en) * | 2009-12-17 | 2010-06-16 | 苏州均华精密机械有限公司 | Punching die of long-slotted holes of integrated circuit boards |
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| Publication number | Publication date |
|---|---|
| CN103157717A (en) | 2013-06-19 |
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Effective date of registration: 20160601 Address after: Zhu Tang Zhen Zhu Huang Lu 98 No. 214415 Jiangsu city of Jiangyin Province Applicant after: Jiangyin Wenchang Intelligent Electromechanical Research Institution Co.,Ltd. Address before: Zhu Tang Zhen Zhu Huang Lu 98 No. 214415 Jiangsu city of Wuxi province Jiangyin City Applicant before: Jiangyin Linken Technology Co.,Ltd. |
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Effective date of registration: 20230630 Address after: No. 997, Huicheng Avenue, Huishan District, Wuxi City, Jiangsu Province, 214181 Patentee after: Yilufa Intelligent Technology (Jiangsu) Co.,Ltd. Address before: No. 98, Zhuhuang Road, Zhutang Town, Jiangyin City, Jiangsu Province, 214415 Patentee before: Jiangyin Wenchang Intelligent Electromechanical Research Institution Co.,Ltd. |