CN103062728A - Large-power light-emitting diode (LED) heat dissipation mechanism - Google Patents
Large-power light-emitting diode (LED) heat dissipation mechanism Download PDFInfo
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- CN103062728A CN103062728A CN2011103200839A CN201110320083A CN103062728A CN 103062728 A CN103062728 A CN 103062728A CN 2011103200839 A CN2011103200839 A CN 2011103200839A CN 201110320083 A CN201110320083 A CN 201110320083A CN 103062728 A CN103062728 A CN 103062728A
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Abstract
The invention provides a large-power light-emitting diode (LED) heat dissipation mechanism comprising an evaporator, two guide pipes, an air convection heat dissipation condenser and water, wherein the evaporator is connected with the condenser through the two guide pipes, and the bottom of the evaporator is an insulated and heat-conductive LED substrate. The heat dissipation mechanism provides a low-cost solution which is light in weight, simple and reliable in structure and high in heat-conductive and heat dissipation efficiency for large-power LED application, particularly integrated large-power LED application.
Description
Technical field
The invention belongs to the heat dissipation technology field, relate in particular to great power LED and use; As: the radiating treatment technology that street lamp, car headlight etc. are used.
Background technology
LED is as new high-efficiency environment friendly light source, to substitute very soon existing incandescent lamp and gas luminescence lamp, become one of following principal light source, present stage, the energy that LED is converted into light output only accounts for 30% of input energy, 70% is converted into heat, and the heat of chip is mainly distributed in the mode of heat transmission; Heat dissipation problem is that can LED efficiently and one of the key of steady operation, good heat dissipation, and chip temperature is low, and luminous efficiency is high, and is more reliable and more stable, and the life-span is long; Otherwise then opposite.Especially integrated high power LED is used, and be the main development direction that following LED uses, but integrated LED power is large, and thermal source is concentrated, and the heat radiation difficulty is larger, and the present stage practical application is few; Heat dispersion works the very important effect of doing to life-span and the luminous efficiency of LED lamp.The implementation of LED heat radiation mainly is heat to be delivered to the interface with large tracts of land ingress of air by heat-conduction medium; The heat transmission medium thermal resistance is less, and the heat transfer area of dissipation is larger, and the heat-delivery surface air-flow is more unobstructed, and radiating effect is better.Existing heat sink conception mainly contains following several modes.
Pure conduction heat transfer, frame mode is: the LED substrate is close to conduction heat transfer by conduction oil and radiator, radiator is delivered to the cross-ventilation radiating surface with the heat of chip transmission by radiator, dissipation of heat is arrived aerial by cross-ventilation again, reach radiating effect, the LED substrate conducts heat by heat radiation oil and radiator material heat-conductive characteristic to the heat of air, this mode is simple in structure, but be limited by thermal conductivity and effective heat transfer area and the distance limit of heat-conduction medium, because chip area is little, the effective heat transfer area of chip to substrate to radiator is little, and radiating effect is poor, weight is large, the chip temperature rise.
Another kind of adopting heat pipes for heat transfer, frame mode is: heat pipe evaporator is close to by conduction heat transfer to heat pipe by conduction oil and LED substrate, heat pipe evaporator is to the evaporation of the heating liquid in evaporimeter gasification, gas flows to condenser and condenser heat exchange in heat pipe, condenser and cross-ventilation radiator arrive the cross-ventilation radiator by conduction heat transfer, arrive dissipation of heat aerial by cross-ventilation again or the surperficial direct and air heat-exchange convection current of heat pipe, reach radiating effect.Characteristics are that the heat-transfer capability of heat pipe is strong, and are lightweight; But the heat pipe cost is high, overall thermal conductivity can be subjected between substrate and radiating tube large in conjunction with heat transfer medium conduction oil or welding material performance, thickness and bubble control technogenic influence, because of conduction oil and welding material thermal resistance larger, thicker thermal resistance is larger, if bubble is arranged, reduces heat transfer area, strengthen thermal resistance, heat pipe evaporator and substrate efficiently radiates heat area are limited by substrate, and the whole capacity of heat transmission is limited, affects the integral heat sink effect.
Also having a kind of is to utilize high heat capacity transparency liquid flowing heat transfer, frame mode is: led chip is put in the heat-conducting liquid bottom, and liquid is heated the floating that expands, and forms convection current and takes heat to the cross-ventilation radiator, by cross-ventilation dissipation of heat is arrived in the air again, reach radiating effect.This scheme heat conductivility is unclear, needs special material, uses in South Korean venture at present.
In sum, existing heat sink conception, subject matter is: 1. can not be with the substrate heat of the large heat of small size with low cost, reliable low thermal resistance is delivered to the air heat-delivery surface; 2. radiator is inhomogeneous greatly because of the structural limitations thermograde, radiator effectively utilize area little.The poor weight of some radiating effects is large, and some processing costs are high, and heat dispersion is affected greatly by material and technology controlling and process, and heat-sinking capability is limited; Affect that LED is many-sided to be applied.
Summary of the invention
The object of the present invention is to provide a kind of cooling mechanism, solving in the existing LED heat dissipation technology can not be with the substrate heat of the large heat of small size with low cost, and reliable low thermal resistance is delivered to the problem of air heat-delivery surface.
The present invention realizes like this, a kind of great power LED cooling mechanism, it is characterized in that, described mechanism comprises an evaporimeter, two conduits, cross-ventilation heat radiation condenser and water, described evaporimeter links to each other with condenser by two conduits, and base of evaporator is made of insulating heat-conductive LED substrate.
Described mechanism, as shown in Figure 1, the hot air vents at evaporimeter top, the air intake that is communicated with condenser overhead by heating pipe, a plurality of ostium incurrenses of base of evaporator, by the apopore of cross current condenser bottom, evaporimeter and condenser form seal cavity, and the condenser bottom is higher than the evaporimeter top.
Water filling or other low boiling, high heat of gasification material in the described mechanism; Guarantee that the 3-8mm depth of water is arranged at the condenser bottom.
Described mechanism, closed system vacuumizes, and reaches the certain vacuum degree, air pressure＜50mmHg.
Described mechanism, the structure of evaporimeter as shown in Figure 1, the bottom surface is to make container bottom with the LED substrate, and top is that plastic cement or other material forming are the cavity between the inner chamber height 3mm-8mm, and three on top is low on the cavity, the heating pipe gas outlet is in the top, upper shell adds the sealing rubber ring with the substrate joint portion, and a plurality of water filling apertures are in evaporator vessel cavity side bottom and paste the LED substrate, and water injects from base of evaporator water filling aperture, avoid gas to enter, affect water filling; Water filling port and venthole are in respectively the container two ends.Evaporimeter upper body material requirements: heatproof〉70 degree, voltage endurance capability〉0.2MPa, air-tightness is good; Container is done the bottom surface with the LED substrate, and evaporimeter is with LED luminous component one, small volume and less weight, and cost is low, is easy to make assembling.
Described mechanism, cross-ventilation heat radiation design of condenser becomes structure shown in Figure 2, and the cross-ventilation radiating wing is made hollow by the very thin Heat Conduction Material of housing, and the heat-dissipating fin space is communicated with air intake, and air intake is near heat radiation condenser cavity top; The flow heat dissipation condenser is not limited to shape shown in Figure 2, can make any required area, possesses the arbitrary shape of desirable strength, and formation and extraneous air and internal water steam have very large contact area and well-ventilated's structure.Steam by heating pipe from the heat radiation condenser the top enter the condenser cavity, liquefy at the condenser inner surface, vapour pressure reduces, steam flows to the condenser shell inner surface under condenser shell inner surface and air intake differential pressure action, case temperature is lower, and surperficial air pressure is lower, and the steam vapour amount that stream reaches is larger, whole heat radiation condenser surface temperature is even, and it is very little that temperature differs; Heat radiation device efficiently radiates heat area, the heat radiation performance.
Described mechanism, the conduit that is connected between evaporimeter and condenser, according to the heat radiation power requirement, power more major diameter is larger; Heating pipe is selected internal diameter D＞=0.006* √ (WT/ Pv √ H), and wherein W is heat radiation power, and T is absolute temperature, and Pv is air pressure, and H is that the liquid level of evaporimeter and condenser is poor; Water pipe is selected internal diameter r＞=0.0000754 √ (W/√ H), heatproof〉70 degree, compressive resistance〉the anticorrosive anti-aging flexible pipe of 0.2MPa, cost is low.
Described mechanism, evaporimeter utilizes the LED substrate to make base plate, reduces heat-transfer path, reduces thermal resistance, and the heat radiation reliability reduces cost; Utilize under low pressure low-temperature boiling of water, reduce the cooling system operating temperature; Utilize the heat of gasification of water very large, the characteristic that the steam heat transfer resistance is very low is delivered to air heat radiation condenser inner surface with LED substrate heat; Utilize conduction heat transfer ability=material thermal conductivity * cross-sectional area/thickness, and the cross-ventilation area of dissipation is larger, air-flow is more unobstructed, the characteristic that radiating effect is better, and the heat radiation ability reduces the thermal conductivity factor requirement, and mitigation system weight reduces system cost.
The present invention overcomes the deficiencies in the prior art, simplifies heat transfer path, and the decrease substrate is to the thermal resistance on heat loss through convection surface, promote heat conductivility and reliability, reduced cooling system weight and cost, the heat transfer body material thermal conductivity requires low, good heat dissipation effect, simple for assembly process reliable; Light source separates with heat radiation, uses more flexibly, and heating pipe and water pipe adopt sebific duct, reduce system cost; Evaporimeter is connected by sebific duct with condenser, thermal source separates with the cross-ventilation radiator, in the situation that guarantee two container relative altitudes, install more flexible, allow the application of LED can satisfy high-power demand, and can expand to headlight for vehicles etc. has larger restriction to light source volume and weight application.
Description of drawings
Fig. 1 is the mechanism map of heat sink conception of the present invention.
Fig. 2 is the heat radiation condensator schematic diagram of heat sink conception of the present invention.
The specific embodiment
In order to make purpose of the present invention, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that implementation example described herein only in order to explain the present invention, is not intended to limit the present invention.
Enforcement of the present invention is to utilize the LED substrate to make the evaporimeter base plate, reduces heat-transfer path, reduces thermal resistance, promotes reliability; Utilize the aqueous vapor heat-transmission very large, mobile strong, the characteristic that the steam heat transfer resistance is very low is delivered to the thin heat radiation condenser inner surface of large tracts of land shell with the large heat of small size, reduces the heat sink material heat conductivility and requires the keeping system low thermal resistance.Utilize the characteristic of under low pressure boiling point reduction of water, take sealing fluid, headroom, and vacuumize, reduce air pressure, reduce water boiling point, reduce operating temperature.
As shown in Figure 1, shown in mechanism by the hot air vents of heating pipe with the evaporimeter top, the hole on condenser top is communicated with, and is communicated with by the hole of a plurality of apertures bottom condenser of water pipe with base of evaporator, evaporimeter and condenser form seal cavity, and the condenser bottom is higher than the evaporimeter top.Normal temperature 25 degree conditions, the described mechanism that connects is arrived approximately 3-5 mm deep water level of maintenance condenser bottom by the aspirating hole dress water of heat radiation condenser first, vacuumize by the aspirating hole on the heat radiation condenser, make the air pressure＜50mmHg in mechanism's sealing system, seal aspirating hole with sealing-plug at last.
During LED work, the LED heat is delivered to the water of substrate surface in the evaporimeter by encapsulating material and substrate, the water of substrate surface and substrate heat exchange, water is heated gasification, substrate is lowered the temperature simultaneously, steam upwards flows under buoyancy, compile through the evaporimeter top, pressure rises enters condenser through heating pipe under the effect of evaporimeter and condenser draught head, the steam that enters in the condenser contacts heat-shift with the interior table of condenser, liquefaction is condensed into the globule, with the heat transferred condenser shell, the globule is dirty compiling under Action of Gravity Field, enters base of evaporator through water pipe simultaneously; Table air pressure reduces in the condenser simultaneously, and heating pipe steam continues to flow and shows in condenser, and system's automatic cycle is delivered to the condensation air convector radiator with the substrate heat; The cross-ventilation radiator forms cross-ventilation and dissipation of heat is arrived aerial by hot with surperficial air exchange.
Because sealing system is evacuated, the boiling point of water reduces with the reduction of air pressure in the evaporimeter, accelerate the gasification of water in the evaporimeter under the low temperature, the heat of gasification of water is very large, in the time of 50 degrees centigrade, the heat of gasification of water is 40kJ/Kg approximately, and amount of heat is taken away in the rapid gasification of substrate surface water, and substrate keeps near the low-temperature working of water boiling point; Heat is delivered in the condenser by the steam low-resistance, and system's capacity of heat transmission is directly proportional with the flow that unit interval steam is passed to condenser.System gas forces down when initial, and water boiling point is low in the evaporimeter, and pressure reduction is little, and gas flow is little, and the heat radiation condenser temperature is low, and heat-sinking capability is very little; The interior gathering along with steam of evaporimeter, the evaporimeter pressure rises, the poor increasing of liquid level, air velocity is accelerated, and heat-transfer capability is strengthened; Heat radiation condenser heat accumulation, temperature rises, and heat-sinking capability strengthens, the condenser pressure rises of dispelling the heat simultaneously, boiling point rises; Along with the heat radiation condenser temperature rises, when heat radiation reached balance with heat transfer, heat radiation condenser air pressure was constant, temperature stabilization, and evaporimeter and condenser pressure reduction are constant, and the boiling point of water no longer rises in the evaporimeter; Loses heat power=transmitted power W=unit interval steam flow * 40KJ/Kg; The amount of vaporization of unit interval steam flow=unit interval water, the amount of vaporization * 40KJ/Kg=substrate heat transfer power of transmitted power W=unit interval water, heat-transfer capability and heat transfer distances are irrelevant; The density * 9.8m/s of air pressure in the evaporimeter=condenser air pressure+water
2* liquid level is poor in evaporimeter and the condenser, liquid level is poor very little in evaporimeter and the heat radiation condenser, and the draught head of formation is very little with respect to absolute pressure, therefore, in the evaporimeter in the boiling point of water and the heat radiation condenser liquefaction point temperature difference of steam very little, can be considered identical; Therefore, this system by substrate surface to the heat-transfer capability of cross-ventilation heat radiation condenser device surface heat transfer ability=cross-ventilation heat radiation condenser shell=case material thermal conductivity factor * internal surface area/thickness.Because cross-ventilation heat radiation condenser shell heat-conducting area is very large, distance from the inner surface to outer surface is short, and the capacity of heat transmission is very strong, and table is very little to the appearance temperature difference in the heat radiation condenser.So substrate and water engaging surface and the heat radiation condenser surface temperature difference are very little, reach the low-resistance heat-transfer effect.
Another major function of heat radiation condenser is with the heat of moisture vapor transfer, by heat radiation condenser outer surface and the extraneous air heat exchange that contacts, to be dispersed in the air; During work, the air of condenser shell outer surface is heated expansion, upwards flows, and condenser shell surface air pressure reduces, and ambient air flows to the condenser shell outer surface under differential pressure action, and housing is lowered the temperature; Mainly by air heat-delivery surface size and the decision of airflow on surface speed, area is larger for the heat-sinking capability of air heat radiation condenser, and air-flow is more unobstructed, and radiating effect is better; Air velocity is relevant with difference in air temperature with heat spreader structures and shell temperature, and structure is identical, and in the environment facies situation together, shell temperature is higher, and air velocity is faster, and heat-sinking capability is stronger; Described structure, the steam of heat enters heat radiation condenser cavity by heating pipe from the top of heat radiation condenser, steam is under heat radiation condenser shell inner surface and entrance differential pressure action, flow to heat radiation condenser shell inner surface, case temperature is lower, and superficial vapor is pressed lower, and is larger apart from the dirty steam vapour amount that reaches of same case, whole heat radiation condenser surface temperature differs very little, and is very little with the substrate water surface temperature difference; Under equal area of dissipation, heat radiation device efficiently radiates heat area, heat radiation performance; If heat radiation condenser area of dissipation is enough, can make in the evaporimeter boiling point of water keep enough low boiling point, substrate evaporating surface temperature is controlled near the interior water temperature of container, effectively reduces the substrate operating temperature.
Structural material forms, and based on described evaporimeter principle, under the vacuum, the boiling point of water is low, and the evaporator operation temperature is low, and container casing material heatproof requires low; Because of the requirement of vacuum, container casing need possess carrying〉1 atmospheric intensity, can select the container of the certain cavity thickness of plastic material injection mo(u)lding; For guaranteeing sealing property, plastic casing adds the sealing rubber ring with the substrate joint portion.The container interior bottom surface size is identical with the LED size of substrate, and height is between 3mm-8mm, and evaporimeter is with LED luminous component one.
The structural material of air heat radiation condenser forms, table is to the appearance capacity of heat transmission=material thermal conductivity * internal surface area/thickness in the condenser, because of surface area large, distance from the inwall to the outer surface is short, the material of condenser wall selects flexibility very large, can select the less material of thermal conductivity factor, also can obtain the very strong capacity of heat transmission; Because of the requirement of vacuum, container casing need possess carrying〉1 atmospheric intensity; Based on above-mentioned requirements, the case material of air heat radiation condenser, the stronger housing of intensity can be thinner, and thermal conductivity factor can be less, decrease air heat radiation condenser cost and weight; If condenser inner surface 0.06m2, as with containing the wrought iron of 05% carbon, thermal conductivity factor 33W/m*K, wall thickness 0.5mm, the * 0.06/0.0005=3960w/K of the capacity of heat transmission=(33W/m*K) then is considerably beyond with the air heat-sinking capability of homalographic approximately: 600cm
2/ 30cm
2/ w=20w; If the selection of material thermal conductivity factor〉0.4 W/m*K, shell body thickness＜=1mm, material thermal conductivity can be ignored to the integral heat sink performance impact;
Described mechanism steam flows to air heat radiation condenser through heating pipe under the differential pressure action of tracheae two ends; If unit interval steam flow M, pipe two ends draught head P=0.9
WaterThe tangent plane of g*H, hot gas pipe range L, heating pipe amasss S, water-vapour density
Gas, g=9.8m/s, H be that liquid level in evaporimeter and tracheae and the heat radiation condenser is poor; If v is the steam air velocity; Then:
Unit interval steam flow: M=
Gas* S*v;
The stressed F ≈ PS=0.9 of steam in the heating pipe
WaterH S g
FL=mv then
2/ 2=0.9
GasSL v
2/ 2 0.9
WaterH g ≈
Gasv
2/ 2
By upper release: v=√ [1.8g* (H
Water/
Gas)] ≈ 420 √ H
Relation according to water density and air pressure and temperature:
Gas=P
v/ (R
vT), P
vBe steam pressure, R
v=461.5J/kg*k, k are absolute temperature;
Unit interval steam flow: M=
Gas* S*v
If needing heat radiation power be W, then: W=M*40000J/Kg
Heating pipe sectional area S=M R
vT/ P
v* 420 √ H
Keep the water level in the evaporimeter, need the inflow of guarantor unit's time water to equate M=with the steam outflow
Water* S
Water* v
Water, v
Water=√ 0.2gh, then S
Water=M/[
Water√ 0.2g H]
If need to transmit the 30W heat, when reaching balance, the boiling point of water＜50 degree centigrade check in corresponding pressure 12330Pa, then:
Gas=12330/ (461.5*323) kg/m
3=0.0827 kg/m
3
Water/
Gas10000, M=0.0827kg/m then
3* S*420 √ H; According to W=M*40KJ/Kg, then: if M=30/40000=7.5e-4Kg/s gets H=10cm S=6.416e-5, according to S=3.14R
2, R=4.62mm.
Water pipe inside radius r=√ (S
Water/ 3.14)=and √ 7.5e-4/ (3.14*e3 √ 0.2gH), r=0.735mm then, desirable 1mm..
Be preferred embodiment of the present invention, not in order to limiting the present invention, all any modifications of doing within the spirit and principles in the present invention, be equal to and replace and improvement etc., all should be included within protection scope of the present invention.
Claims (7)
1. a great power LED cooling mechanism is characterized in that, described mechanism comprises an evaporimeter, two conduits, a cross-ventilation heat radiation condenser, described evaporimeter links to each other with condenser by two conduits, and base of evaporator is made of insulating heat-conductive LED substrate.
2. mechanism according to claim 1, as shown in Figure 1, it is characterized in that, the hot air vents at evaporimeter top, the hole that is communicated with condenser overhead by heating pipe, a plurality of apertures of base of evaporator are by the hole of cross current condenser bottom, evaporimeter and cross-ventilation heat radiation condenser form seal cavity, and the condenser bottom is higher than the evaporimeter top.
3. mechanism according to claim 2 is characterized in that, high heat of gasification under described mechanism injected water or other low pressure, low-boiling point liquid material.
4. mechanism according to claim 2 vacuumizes closed system, reaches the certain vacuum degree, air pressure＜50mmHg.
5. mechanism according to claim 2, it is characterized in that, the structure of evaporimeter as shown in Figure 1, make container bottom with the LED substrate, water filling port is in evaporator vessel cavity side bottom and pastes the LED substrate, water injects from the base of evaporator water injection hole, and venthole is in the cavity top, and water filling port and venthole are in respectively the container two ends.
6. mechanism claimed in claim 2 is characterized in that, cross-ventilation heat radiation condenser is the hollow shell structure, as shown in Figure 2, the heat loss through convection wing is made hollow by the very thin Heat Conduction Material of housing, and the heat-dissipating fin space is communicated with air intake, and air intake is in cross-ventilation heat radiation condenser overhead; Be not limited to shape shown in Figure 2, can make any area of dissipation, possess the arbitrary shape of desirable strength, formation and extraneous air and internal water steam have very large contact area and well-ventilated's structure.
7. mechanism according to claim 2 is characterized in that, whole cooling mechanism utilizes the LED substrate to make the evaporimeter base plate, reduces heat-transfer path, reduces thermal resistance, promotes reliability; Utilize the low characteristic of water boiling point under the low pressure, reduce operating temperature, reduce the material thermal resistance requirement; Utilize the very low characteristic of steam heat transfer resistance, LED substrate heat low thermal resistance is delivered to air heat radiation condenser inner surface, the heat that small size is concentrated is delivered on the large tracts of land Heat Conduction Material, reduces the requirement of case material thermal conductivity factor, guarantees heat dispersion.
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| CN2011103200839A CN103062728A (en) | 2011-10-19 | 2011-10-19 | Large-power light-emitting diode (LED) heat dissipation mechanism |
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|---|---|---|---|
| CN2011103200839A CN103062728A (en) | 2011-10-19 | 2011-10-19 | Large-power light-emitting diode (LED) heat dissipation mechanism |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105841121A (en) * | 2016-05-24 | 2016-08-10 | 浩雄电气有限公司 | Bionic nerve cell cooling phase change lamp |
| CN111540715A (en) * | 2020-04-30 | 2020-08-14 | 坎德拉（深圳）科技创新有限公司 | Self-cooling radiator of IGBT (insulated Gate Bipolar transistor) controller |
| CN113225991A (en) * | 2021-04-30 | 2021-08-06 | 深圳市汇川技术股份有限公司 | Heat dissipation device and electronic device |
| WO2024066703A1 (en) * | 2022-09-28 | 2024-04-04 | 华为数字能源技术有限公司 | Heat dissipation system and power apparatus |
-
2011
- 2011-10-19 CN CN2011103200839A patent/CN103062728A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105841121A (en) * | 2016-05-24 | 2016-08-10 | 浩雄电气有限公司 | Bionic nerve cell cooling phase change lamp |
| CN111540715A (en) * | 2020-04-30 | 2020-08-14 | 坎德拉（深圳）科技创新有限公司 | Self-cooling radiator of IGBT (insulated Gate Bipolar transistor) controller |
| CN113225991A (en) * | 2021-04-30 | 2021-08-06 | 深圳市汇川技术股份有限公司 | Heat dissipation device and electronic device |
| WO2024066703A1 (en) * | 2022-09-28 | 2024-04-04 | 华为数字能源技术有限公司 | Heat dissipation system and power apparatus |
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Application publication date: 20130424 |