CN102294543B - Method for observing transparent melt layer in material laser-cutting process - Google Patents
Method for observing transparent melt layer in material laser-cutting process Download PDFInfo
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- CN102294543B CN102294543B CN201110169436.XA CN201110169436A CN102294543B CN 102294543 B CN102294543 B CN 102294543B CN 201110169436 A CN201110169436 A CN 201110169436A CN 102294543 B CN102294543 B CN 102294543B
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Abstract
The invention relates to a method for observing a transparent melt layer in a material laser-cutting process, belonging to the field of material processing. The devices used in the method provided by the invention comprise a laser device used for indicating a visual light wave band, an attenuation mirror, a beam expanding and collimating system, a diaphragm, a wedge-shaped piece composed of a material to be cut, a spacer and a transparent material, a beam expanding mirror, a light screen, a high-speed video camera capable of shooting more than 1000 frames per second and a synchronizer. The wedge-shaped piece is fixed to a machine tool, while the other devices are fixed to a platform; laser light emitted by the laser device used for indication irradiates onto the section of the material to be cut through adjustment; the laser light penetrates through the beam expanding mirror in a reflected light direction and the light screen is used for receiving interference fringes; and the synchronizer causes the high-speed video camera to shoot the light screen when cutting is started; and the interference fringes reflecting the formation and the morphological change of the melt layer are recorded; therefore, observation on the transparent melt layer during laser cutting is realized. The method provided by the invention can be directly applied to the existing laser cutting equipment, and is capable of observing the change of the melt layer during cutting online, and also simple to assemble and disassemble.
Description
Technical field
The present invention relates to a kind of method of observing the transparent melting layer of laser cutting, belong to material processing field.
Background technology
Due to advantages such as processing high speed, non-stress contacts, laser is widely used among the cutting of various materials now.Along with the development of this technology, more and more higher to the requirement of joint-cutting quality, especially in fine cut field.In laser cutting process, the formation of melting layer and changing for the improvement of tangent plane pattern, the reduction of tangent plane roughness and even integral cutting quality have direct influence, if can be in cutting process Real Time Observation to formation and the variable condition of melting layer, for optimizing cutting technique, improving cut quality will have very great meaning.Using high-speed camera is one of conventional means of observing at present laser cutting process, but due in laser cutting process, joint-cutting is too narrow and small, and the consolidation layer that cannot directly observe joint-cutting inside changes.Therefore the method can only be taken the indirect analysis modes such as slag in cutting process splashes, plasmoid mostly by observation, obtains cutting process information, cannot directly reflect formation and the variation of melting layer in cutting.In addition, several pieces of bibliographical informations use the direct observation of high-speed camera to joint-cutting melting layer in metal material laser cutting, its major way has two kinds, a kind of is to observe along cut direction, shooting direction is aimed at joint-cutting, the consolidation layer of observing cutting forward position changes.As the paper that the people such as Arata deliver on Transactions of JWRI periodical, observe by this method the forming process of cutting forward position melted material in mild steel cutting process.Another kind cuts the edge of material exactly, observes the variation of tangent plane melting layer.As the people such as Fushimi at Proceedings of SPIE, deliver paper in, they use high-speed camera to pass through optical filtering and directly observe the pattern of steel plate tangent plane and change.In addition, the people such as Yudin P.V. are published in Proceedings of SPIE and place clear glass by the low-temperature alloy edge of materials to be cut, and the mode of smearing vacuum oil in the middle of material to be cut and glass, the pattern that uses high-speed camera to observe tangent plane melting layer changes.This mode can effectively reduce to swash reflection of light and slag splashes for the impact of high-speed camera, and can adjust by outside light filling the brightness in the visual field.The method that this tangent plane is observed the variation of tangent plane pattern can provide more clearly visual angle, observes melt substance from being melted to the whole process of solidifying, and the production process of cutting striped.
But for nonmetallic materials, the particularly laser cutting of organic non-metal material such as pottery, monocrystalline, the method is also inapplicable.Because the melting layer of such material or its material itself are transparent, use direct observational techniques such as comprising high-speed camera to be difficult to observe formation and the pattern of melting layer in cutting process and change.Therefore for such properties of materials, find a kind of simple in structure, the scope of application is wide, and easily on existing laser cutting device, set up and dismantle, the method that directly in Real Time Observation laser cutting process, the pattern of melting layer changes is very necessary to improve the control of joint-cutting quality.The solution of this problem, by the laser high-quality cutting to inorganic/organic materials such as pottery, monocrystalline, macromolecules, especially fine cut has great importance.
Summary of the invention
The object of this invention is to provide a kind of method of observing the transparent melting layer of laser cutting, its device can pass through simple Assembly And Disassembly, realizes the observation to the production process in transparent melting layer cutting process and pattern variation.
In order to achieve the above object, the invention provides a kind of method of observing the transparent melting layer of laser cutting, it is characterized in that, application as lower device comprise successively: comprise successively laser instrument, beam-expanding collimation system, the wedge consisting of material to be cut, pad and transparent material, optical screen, the record per second above high-speed camera of 1000 frame and sychronisation for having visible light wave range indicates.And place according to Fig. 1 order.
Sychronisation is the device consisting of relay and drive circuit thereof, external power source, and the synchronizing signal of lathe passes to high-speed camera when laser is started to cut, and structural representation is shown in Fig. 2.In addition, can be in indication with adding decay mirror in laser instrument and beam-expanding collimation system, the sharp light intensity of launching with laser instrument in order to adjust indication.
Can between beam-expanding collimation system and wedge, add diaphragm, more uniform part in the laser facula of launching with laser instrument in order to intercepting indication, and adjustment is radiated at the spot size on tangent plane.Can between wedge and optical screen, add beam expanding lens, for expanding the diameter of interference fringe hot spot on optical screen, make it to be more convenient to observe.
Use said apparatus, can in laser cutting process, coordinate the motion of lathe to complete the observation that transparent melting layer forms and pattern changes, basic process be: use material to be cut, transparent material and pad to form wedge, be fixed on lathe; Set cutting path, determine range of observation; The laser that indication is launched with laser instrument carries out beam-expanding collimation, acts in wedge, by debugging light path, obtains interference fringe on optical screen; While controlling cutting beginning by sychronisation, high-speed camera recording interference fringe changes.
Its detailed process is as follows:
1) material to be cut of being close to 3 and transparent material 5 one end margins are filled in to pad 4, make to form between material 3 to be cut and transparent material 53 ' to 15 ' angle, by three's clamping, form wedge 6, see Fig. 3.Wedge 6 is fixed on lathe;
2) laser that indication is launched with laser instrument 1, after decay mirror, by beam-expanding collimation system 2 and diaphragm 11, is irradiated on material 3 tangent planes to be cut hot spot, and in reverberation direction, settles beam expanding lens 12 and optical screen 7.By adjusting light path system, on optical screen 7, obtain interference fringe;
3) treat cutting material 3 and carry out laser cutting, start time control high-speed camera 8 processed take optical screen 7 by sychronisation 9 in cutting, recording interference fringe changes.
Compare with existing document and invention, the beneficial effect of tool of the present invention is:
1, realize the observation to transparent melting layer in laser cutting process, and be equally applicable to the observation analysis to nontransparent melting layer material.
2, can observe online easily formation and the variation of melting layer in cutting process, adjust in real time laser cutting parameter, improve cut quality;
3, installing/dismounting is simple, and laser instrument is not had to type requirement, can be used on existing laser cutting device.
Accompanying drawing explanation:
Fig. 1 is device schematic diagram
Fig. 2 is sychronisation structural representation
Fig. 3 is wedge schematic diagram
Fig. 4 is original tangent plane profile
Fig. 5 is tangent plane profile after optimizing
The specific embodiment
Below in conjunction with accompanying drawing, the invention will be further described:
Wedge consists of three parts: material 3 to be cut, pad 4 and transparent material 5.The similar material 3 to be cut of specification is close together with transparent material 5, at one end fills in pad 4 and three is clamped.Between material 3 to be cut and transparent material 5, having formed one deck wedge-like air layer, the angle of material to be cut 3 and transparent material 5 is 3 ' to 15 '.Material 3 tangent planes to be cut are parallel to cutting Laser output direction and place, and be fixed on lathe, as shown in Figure 3, in figure, the direction of arrow is cut direction.In Fig. 1, except wedge 6 and sychronisation 9, other devices are all fixed in identical platform.The laser that indication is launched with laser instrument 1, first by decay mirror 10, afterwards by beam-expanding collimation system 2, expands the spot diameter of laser and still remains directional light, by diaphragm 11 intercepting hot spot mid portions, is irradiated in wedge 6.The laser that indication is launched with laser instrument 1 is by reflecting to form interference twice on transparent material 5 surfaces with material 3 tangent plane to be cut, and interference fringe, after beam expanding lens 12 is exaggerated, is finally received by optical screen 7.By sychronisation 9, high-speed camera 8 recording interference fringe when cutting starts is changed.By the analysis of later stage to striped, optimize cutting technique, thereby reach the object that improves cutting effect.
Application example 1:
The Al that is 50mm * 50mm * 1mm to specification
2o
3ceramic substrate, cuts in thickness 1mm direction, observes the variation of cutting path middle position melting layer in cutting process.
Concrete steps:
(1) glass that specification is 50mm * 5mm * 2mm, the burnishing surface that its 50mm * 5mm face is glass, by glass 50mm * 5mm face and ceramic tangent plane, be that 50mm * 1mm face is close together, in its one end, fill in the pad that thickness is 100 μ m afterwards, pottery is 7 with glass angle '.And three is used to jig, and being fixed in the horizontal movement axle Y-axis of laser cutting device, wedge cutting path is parallel with horizontal movement axle X-axis.
(2) laser cutting head of this laser cutting device is fixed in horizontal movement axle X-axis.In this cutting process, cutting path whole process is in the inside of wedge, and pottery and glass interface are near ceramic material one side.Laser cutting head is moved to the initial position of cutting path.The devices such as laser instrument, decay mirror, beam-expanding collimation system, diaphragm, beam expanding lens, optical screen for indication are fixed on the other platform of lathe, by adjusting light path, making diameter is that the laser facula that the indication of 1mm is launched with laser instrument is radiated at the central authorities of material cutting path, and on optical screen, observes interference fringe clearly.
(3) fixing high-speed camera, makes it can photograph interference fringe, high-speed camera frame number is adjusted to 6000 frames per second, and is connected with lathe by sychronisation.When cutting starts, lathe synchronizing signal is transferred to high-speed camera by sychronisation and makes it to start interference fringe to take, and guarantees the synchronism of record.In cutting process, machine tool horizontal kinematic axis Y-axis is motionless, the horizontal movement axle X-axis that is only mounted with laser cutting head moves, therefore in cutting process, it is motionless that light path on material to be cut and platform all keeps, and the laser facula that indication is launched with laser instrument is radiated at the centre position of ceramic cutting path always.
(4), after having cut, the interference fringe that high-speed camera is taken is analyzed.During laser facula that interference fringe is launched with laser instrument by indication at cutting laser, change comparatively violent.Interference fringe light and shade spacing changes still comparatively chaotic afterwards.Through measuring, material tangent plane surface roughness to be cut is 7.282 μ m.
(5) by the concrete analysis to interference fringe, determine the impact of melting layer on tangent plane pattern.By reducing cutting speed and cutting laser output power, and improve the ratio of cutting power output to cutting speed simultaneously, optimize cutting technique parameter, again this material is cut, and use high-speed camera to carry out record to interference fringe.In this cutting process, during hot spot that interference fringe is launched with laser instrument by indication at cutting laser, change still comparatively violently, but interference fringe light and shade spacing changes more consistent compared with last time afterwards.Through measuring, material tangent plane surface roughness to be cut is 3.951 μ m.By the method, to the observation of melting layer in cutting process and analysis, adjust cutting technique, improved cut quality.
Application example 2:
The poly (methyl methacrylate) plate that is 100mm * 50mm * 5mm to specification, cuts in thickness 5mm direction, observes the melting layer variation of cutting 3mm fixed position, rear, forward position in cutting process.
(1) glass that specification is 100mm * 5mm * 2mm, the burnishing surface that its 100mm * 5mm face is glass, by glass 100mm * 5mm face and poly (methyl methacrylate) plate tangent plane, be that 100mm * 5mm face is close together, in its one end, fill in the pad that thickness is 100 μ m afterwards, make the two angle be 3.5 '.And three is used to jig, and being fixed in the horizontal movement axle Y-axis of laser cutting device, wedge cutting path is parallel with horizontal movement axle Y-axis.
(2) laser cutting head of this laser cutting device is fixed in horizontal movement axle X-axis.In this cutting process, cutting path whole process is in the inside of wedge, and poly (methyl methacrylate) plate and glass interface are near poly (methyl methacrylate) plate one side.Laser cutting head is moved to the initial position of cutting path, wedge is inner, apart from edge of materials 5mm.The devices such as laser instrument, decay mirror, beam-expanding collimation system, diaphragm, beam expanding lens, optical screen for indication are fixed on the other platform of lathe, by adjusting light path, making diameter is that the laser facula that the indication of 3mm is launched with laser instrument is radiated at apart from current laser cutting head 3mm, apart from edge of materials 2mm to be cut position, and on optical screen, observe interference fringe clearly.
(3) fixing high-speed camera, makes it can photograph interference fringe, high-speed camera frame number is adjusted to 6000 frames per second, and is connected with lathe by sychronisation.When cutting starts, synchronizing signal is transferred to high-speed camera by sychronisation and makes it to start interference fringe to take, and guarantees the synchronism of record.In cutting process, machine tool horizontal kinematic axis X-axis is motionless, only has the horizontal movement axle y-axis shift that loads wedge to move, so in cutting process, it is motionless that light path on laser cutting head and platform all keeps, and the laser facula that indication is launched with laser instrument is radiated at cutting 3mm position, rear, forward position always.
(4), after having cut, the interference fringe that high-speed camera is taken is analyzed.During interference fringe, change violent, time and change littlely, and be obvious periodicity, show that periodic stripe has appearred in material surface, as Fig. 4 is expressed as material surface profile.
(5) by the concrete analysis to interference fringe, determine the impact of melting layer on tangent plane pattern.By reducing laser cutting speed, and improve assist gas pressure, optimize cutting technique parameter, again this material is cut, and use high-speed camera interference fringe to carry out record.In this cutting process, interference fringe changes all less in whole cutting laser process.Through measuring, lucite tangent plane is comparatively smooth, as Fig. 5.By the method, to the observation of melting layer in cutting process and analysis, adjust cutting technique, improved cut quality.
Claims (5)
1. a method of observing the transparent melting layer of laser cutting, it is characterized in that, application as lower device comprise successively: have laser instrument (1) for visible light wave range indication, beam-expanding collimation system (2), by wedge (6), optical screen (7), the record per second above high-speed camera of 1000 frame (8) and the sychronisation (9) of material to be cut (3), pad (4) and transparent material (5) formation;
The method comprises the following steps:
1) at the material to be cut (3) of being close to and transparent material (5) one end margins, fill in pad (4), make between material to be cut (3) and transparent material (5) angle become 3 ' to 15 ', three is clamped, form wedge (6), wedge (6) is fixed on lathe;
2) laser that indication is launched with laser instrument (1), by beam-expanding collimation system (2) and diaphragm (11), is irradiated on material to be cut (3) tangent plane hot spot, and optical screen (7) is set in reverberation direction; By adjusting light path system, on optical screen (7), obtain interference fringe clearly;
3) treat cutting material (3) and carry out laser cutting, by sychronisation (9), in cutting, start time control high-speed camera processed (8) and take the variation of optical screen (7) recording interference fringe.
2. method according to claim 1, it is characterized in that: the device of above-mentioned sychronisation (9) for consisting of relay and drive circuit (13), external power source (14), the synchronizing signal of lathe passes to high-speed camera (8) when laser is started to cut.
3. method according to claim 1, is characterized in that: with in laser instrument (1) and beam-expanding collimation system (2), add decay mirror (10) having visible light wave range indication, in order to adjust, indicate the sharp light intensity of launching with laser instrument.
4. method according to claim 1, it is characterized in that: between beam-expanding collimation system (2) and wedge (6), add diaphragm (11), uniform part in the laser facula of launching with laser instrument in order to intercepting indication, and adjustment is radiated at the spot size on tangent plane.
5. method according to claim 1, is characterized in that: between wedge (6) and optical screen, add beam expanding lens (12), for expanding the diameter of interference fringe hot spot on optical screen.
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| US6768080B2 (en) * | 2001-12-17 | 2004-07-27 | Troitski | Method for production of laser-induced damage images with special characteristics by creating damages of special space shape |
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Patent Citations (5)
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| CN1405554A (en) * | 2002-10-30 | 2003-03-26 | 江苏大学 | Far ultraviolet laser scratch measuring method and device for interface bonding strength |
| CN200962029Y (en) * | 2006-07-21 | 2007-10-17 | 上海大学 | 3D distortion measurement system based on bundle optical fiber |
| CN101403608A (en) * | 2008-11-13 | 2009-04-08 | 哈尔滨工程大学 | Accurate measurement apparatus and method for workpiece surface appearance |
| CN101435698A (en) * | 2008-12-17 | 2009-05-20 | 天津大学 | Method and system for measuring surface appearance of micro-device under transparent encapsulation medium |
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