CN102140661B - 电镀装置 - Google Patents
电镀装置 Download PDFInfo
- Publication number
- CN102140661B CN102140661B CN2010103009090A CN201010300909A CN102140661B CN 102140661 B CN102140661 B CN 102140661B CN 2010103009090 A CN2010103009090 A CN 2010103009090A CN 201010300909 A CN201010300909 A CN 201010300909A CN 102140661 B CN102140661 B CN 102140661B
- Authority
- CN
- China
- Prior art keywords
- wheel
- plating tank
- electroplanting device
- positive plate
- parent metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000009713 electroplating Methods 0.000 title abstract description 22
- 238000007747 plating Methods 0.000 claims description 87
- 229910052751 metal Inorganic materials 0.000 claims description 74
- 239000002184 metal Substances 0.000 claims description 74
- 230000004888 barrier function Effects 0.000 claims description 31
- 239000007788 liquid Substances 0.000 claims description 27
- 150000002500 ions Chemical class 0.000 claims description 20
- 230000000153 supplemental effect Effects 0.000 claims description 15
- 150000001768 cations Chemical class 0.000 claims description 14
- 230000005540 biological transmission Effects 0.000 claims description 9
- 238000003756 stirring Methods 0.000 claims description 9
- 235000008733 Citrus aurantifolia Nutrition 0.000 claims description 8
- 235000011941 Tilia x europaea Nutrition 0.000 claims description 8
- 238000001802 infusion Methods 0.000 claims description 8
- 239000004571 lime Substances 0.000 claims description 8
- 230000005611 electricity Effects 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 abstract description 7
- 238000000034 method Methods 0.000 description 17
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 229910001431 copper ion Inorganic materials 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 229910021645 metal ion Inorganic materials 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 238000006722 reduction reaction Methods 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 210000005056 cell body Anatomy 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
- C25D17/12—Shape or form
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
- C25D7/0621—In horizontal cells
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Automation & Control Theory (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Description
Claims (12)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010103009090A CN102140661B (zh) | 2010-01-29 | 2010-01-29 | 电镀装置 |
US12/906,124 US20110186423A1 (en) | 2010-01-29 | 2010-10-17 | Electroplating apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010103009090A CN102140661B (zh) | 2010-01-29 | 2010-01-29 | 电镀装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102140661A CN102140661A (zh) | 2011-08-03 |
CN102140661B true CN102140661B (zh) | 2012-08-22 |
Family
ID=44340671
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010103009090A Expired - Fee Related CN102140661B (zh) | 2010-01-29 | 2010-01-29 | 电镀装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US20110186423A1 (zh) |
CN (1) | CN102140661B (zh) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102373496B (zh) * | 2011-11-04 | 2015-04-01 | 符士正 | 一种模具电镀的电极及其工艺 |
WO2013117269A1 (en) * | 2012-02-06 | 2013-08-15 | Nv Bekaert Sa | Multi-wire plating line at various levels |
CN102776552B (zh) * | 2012-08-02 | 2015-12-16 | 梅县金象铜箔有限公司 | 黑化铜箔补充铜离子时的自动控制工艺及其使用设备 |
GB2518387B (en) | 2013-09-19 | 2017-07-12 | Dst Innovations Ltd | Electronic circuit production |
CN103603025A (zh) * | 2013-12-02 | 2014-02-26 | 昆山亿诚化工容器有限公司 | 一种金属卷材的电镀装置 |
CN103741185B (zh) * | 2013-12-12 | 2017-01-04 | 深圳首创新能源股份有限公司 | 制备cigs吸收层的电镀生产线 |
CN104032344B (zh) * | 2014-06-23 | 2017-02-01 | 浙江纺织服装职业技术学院 | 一种镀银纱线的氯化银连续电镀设备 |
CN105603494A (zh) * | 2016-01-27 | 2016-05-25 | 南通彩都新能源科技有限公司 | 一种电泳沉积系统及制备锂离子电池硅基负极材料的方法 |
CN106591910B (zh) * | 2017-01-21 | 2019-01-22 | 山东建筑大学 | 邦迪管用钢带电镀方法 |
CN106591908A (zh) * | 2017-01-21 | 2017-04-26 | 山东建筑大学 | 一种邦迪管用钢带电镀槽 |
CN106884197B (zh) * | 2017-01-21 | 2019-01-22 | 山东建筑大学 | 一种邦迪管用电镀槽 |
CN106591927B (zh) * | 2017-01-21 | 2019-01-22 | 山东建筑大学 | 一种邦迪管用钢带电镀工艺槽 |
CN106702449A (zh) * | 2017-01-21 | 2017-05-24 | 山东建筑大学 | 邦迪管用钢带电镀工艺 |
CN108660501B (zh) * | 2017-03-31 | 2024-02-27 | 可能可特科技(深圳)有限公司 | 一种基于fpc电镀的电镀槽 |
CN108693178A (zh) * | 2018-05-15 | 2018-10-23 | 珠海倍力高科科技有限公司 | 一种化学铜分析控制装置 |
CN110172686A (zh) * | 2019-05-06 | 2019-08-27 | 深圳市启沛实业有限公司 | 一种连续镀化学镍工艺 |
CN114717623A (zh) * | 2022-02-07 | 2022-07-08 | 昆山鑫美源电子科技有限公司 | 一种导电薄膜生产设备和生产方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2495660Y (zh) * | 2000-10-30 | 2002-06-19 | 沈京沙 | 连续生产发泡镍的电镀槽 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3567595A (en) * | 1967-09-25 | 1971-03-02 | Circuit Foil Corp | Electrolytic plating method |
US5478457A (en) * | 1988-10-06 | 1995-12-26 | Catteeuw; Mario | Apparatus for the continuous electrolytic treatment of wire-shaped objects |
US6454918B1 (en) * | 1999-03-23 | 2002-09-24 | Electroplating Engineers Of Japan Limited | Cup type plating apparatus |
US6322673B1 (en) * | 1999-12-18 | 2001-11-27 | Electroplating Technologies, Ltd. | Apparatus for electrochemical treatment of a continuous web |
US20040000491A1 (en) * | 2002-06-28 | 2004-01-01 | Applied Materials, Inc. | Electroplating cell with copper acid correction module for substrate interconnect formation |
-
2010
- 2010-01-29 CN CN2010103009090A patent/CN102140661B/zh not_active Expired - Fee Related
- 2010-10-17 US US12/906,124 patent/US20110186423A1/en not_active Abandoned
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2495660Y (zh) * | 2000-10-30 | 2002-06-19 | 沈京沙 | 连续生产发泡镍的电镀槽 |
Non-Patent Citations (1)
Title |
---|
JP特开2007-126118A 2007.06.28 |
Also Published As
Publication number | Publication date |
---|---|
CN102140661A (zh) | 2011-08-03 |
US20110186423A1 (en) | 2011-08-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C53 | Correction of patent of invention or patent application | ||
CB02 | Change of applicant information |
Address after: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Applicant after: Fuku Precision Components (Shenzhen) Co., Ltd. Co-applicant after: Zhending Technology Co., Ltd. Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Applicant before: Fuku Precision Components (Shenzhen) Co., Ltd. Co-applicant before: Honsentech Co., Ltd. |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120822 Termination date: 20160129 |
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EXPY | Termination of patent right or utility model |