CN102094188B - A showerhead assembly for vacuum processing apparatus - Google Patents

A showerhead assembly for vacuum processing apparatus Download PDF

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Publication number
CN102094188B
CN102094188B CN201010624484.9A CN201010624484A CN102094188B CN 102094188 B CN102094188 B CN 102094188B CN 201010624484 A CN201010624484 A CN 201010624484A CN 102094188 B CN102094188 B CN 102094188B
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China
Prior art keywords
shower plate
backboard
vacuum chamber
fastening assembly
plug
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Active
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CN201010624484.9A
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Chinese (zh)
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CN102094188A (en
Inventor
W·T·布洛尼甘
M·A·伦塔
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KLA Corp
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Orbotech LT Solar LLC
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Publication of CN102094188A publication Critical patent/CN102094188A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
    • H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45563—Gas nozzles
    • C23C16/45565—Shower nozzles
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32733—Means for moving the material to be treated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
    • H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
    • H01L21/02271—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
    • H01L21/02274—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition in the presence of a plasma [PECVD]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3065—Plasma etching; Reactive-ion etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49947—Assembling or joining by applying separate fastener
    • Y10T29/49948—Multipart cooperating fastener [e.g., bolt and nut]

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Quality & Reliability (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
  • Measuring Or Testing Involving Enzymes Or Micro-Organisms (AREA)
  • Automatic Analysis And Handling Materials Therefor (AREA)
  • Apparatus Associated With Microorganisms And Enzymes (AREA)

Abstract

Vacuum processing chambers having provisions for thermal expansion and contraction. Specific embodiments provide a plasma processing chamber having a showerhead that enables thermal expansion and contraction without imparting structural stress on the chamber body and without breaking any vacuum seal.

Description

For the nozzle component of vacuum treatment device
The cross reference of related application
The application to be the U.S.Provisional Serial of filing an application on December 10th, 2009 be 61/285,505 continuation application, and require its right of priority, its full content is incorporated herein by reference by with reform.
Technical field
The present invention relates to vacuum treatment device, such as, for etching or film forming plasma cavity on substrate or other workpiece.
Background technology
The process in vacuum chamber is included in the manufacturing process in the fields such as semi-conductor, flat-panel monitor, solar panel.Such as, vacuum chamber is used for plasma reinforced chemical vapour deposition (PECVD), plasma etching and in order to form film and other techniques various of etching structure on substrate substrate (workpiece) is upper.In this chamber, different gas or by injector or indoor by shower nozzle inflow chamber.In order to realize uniform Cement Composite Treated by Plasma in large chamber, shower nozzle is better than injector.The usual essence of shower nozzle covers the whole top board of chamber, thus make gas volume fifty-fifty in injecting chamber everywhere.
When gas flows into chamber, plasma body utilizes radio frequency or microwave energy are lighted and keep.Heated chamber like this.Further, active heating device heated substrates is used for kinds of processes, which further enhances the heating of chamber.Certainly, when the substrate after process is moved out of chamber, and when untreated substrate is moved into chamber, chamber temp reduces until plasma body is lighted again.The change of this temperature causes the different part of chamber expand and shrink.The part be made up of differing materials expands with different speed and shrinks.Further, the large part in large chamber has sizable expansion.This is for the shower nozzle of large treatment chamber, such as, for the manufacture of those of flat-panel monitor or solar cell, especially true.
Summary of the invention
In order to provide the basic comprehension to aspects more of the present invention and feature, therefore include following summary of the present invention.This summary does not have exhaustive overview the present invention, and its object is not be identify key of the present invention or critical elements especially or describe scope of the present invention equally.Its sole purpose is to propose concepts more of the present invention in a simple form, as the preamble of more detailed description below.
The embodiment provides vacuum chamber, there is the structure for thermal expansion and contraction.Specific embodiments of the present invention provides a kind of vacuum chamber with shower nozzle, and shower nozzle can thermal expansion and contraction and apply structural stress and can not destroy air seal to chamber housing.
According to embodiments of the invention, provide a plasma chamber, wherein nozzle component goes up grappling shower nozzle on one point, allows this shower nozzle to slide on other aspect, to allow thermal expansion and contraction simultaneously.According to other embodiment, do not provide grappling, and while maintenance air seal, this shower nozzle can slide in all directions.
According to embodiments of the invention, a vacuum chamber is provided, comprises: chamber housing; Be connected to the nozzle component of chamber case top part, and nozzle component comprises: the backboard be combined with chamber housing rigidity; There is the perforation shower plate of multiple slotted eye; And multiple fastening assembly, shower plate and backboard are slidably connected by they, thus when keeping air seal between shower plate and backboard, allow shower plate to slide relative to backboard.According to an embodiment, shower plate is combined with backboard rigidity by least one bolt.
According to embodiments of the invention, providing a kind of method for being fixed to by nozzle component in vacuum chamber, comprising: by backboard secure bond in vacuum chamber; Use multiple fastening assembly shower plate of boring a hole to be connected with backboard, thus perforation shower plate and backboard are slidably connected; And, between perforation shower plate and backboard, provide air seal.According to an embodiment, the method comprises at least one position secure bond of perforation shower plate further in backboard.
By the explanation of different embodiment described here, other side of the present invention and feature will become obvious, and it is by within the scope of the present invention that falls into required by appended claims and spirit.
Accompanying drawing explanation
In conjunction with this specification sheets and the accompanying drawing forming the part of this specification sheets exemplifies embodiments of the invention and in order to explain and principle of the present invention is described together with specification sheets.Accompanying drawing is used for the principal character diagrammatically explaining exemplary embodiment.Accompanying drawing had both been not meant to each feature describing practical embodiments, was also not meant to the relative dimensions of Expressive Features, and drew not in scale.
Accompanying drawing 1 is the schematic diagram of the main element of the plasma processing chamber implementing the embodiment of the present invention.
Accompanying drawing 2 is sectional views of an example according to embodiment of the present invention diagram grappling shower nozzle side.
Accompanying drawing 3 is sectional views of an example according to the floating shower nozzle side of embodiment of the present invention diagram.
Accompanying drawing 4 is diagram exploded views according to the relocation mechanism of the embodiment of the present invention.
Accompanying drawing 5 is isometric view of the floating combination of assembling.
Accompanying drawing 6 is bottom front views of cover plate 176, illustrates bottom it.
Figure 7 show slip retention mechanism according to another embodiment of the present invention.
Accompanying drawing 8A and 8B is the bottom elevation view of backboard according to the embodiment of the present invention and shower plate.
Embodiment
Accompanying drawing 1 is the schematic diagram of the main element of the plasma processing chamber 100 implementing the embodiment of the present invention.Chamber 100 comprises chamber housing 102, is usually made of metal, as aluminium, stainless steel etc.There is provided base 105 to support one or more substrate.Base 105 can support susceptor, chuck and/or well heater.Base can be connected with hoisting appliance 115, thus the position be down to as shown in the figure is by valve 110 mounting substrate, then to be raised to process.At its top, chamber has nozzle component, and it comprises the shower plate 120 being connected to backboard 125.Backboard 125 is fastened on chamber housing 102 hermetically.Gas from gas source 130 is supplied to shower nozzle via conduit 135.Shower plate 120 has a large amount of perforation, thus allows gas to diffuse into chamber.
Accompanying drawing 2 is according to the embodiment of the present invention, and sectional view shower plate 120 position being anchored into an example of backboard 125 is shown.According to embodiments of the invention, shower plate 120 more at least with backboard 125 grappling, thus be sealed to backboard 125 to prevent gas leakage, and it can not be moved relative to backboard 125 at that.This point can be, such as, and an angle of shower plate or the center of shower plate.Figure 2 illustrate the example of grappling on shower plate angle.
On the other hand, according to embodiments of the invention, figure 3 show the example of the slip fastening assembly for be slidably connected shower nozzle and backboard.That is, in this embodiment, at least the diameter opposite side of shower plate 120 is combined with backboard 125 in the mode of floating, thus is sealed to backboard 125, but can slide relative to backboard 125 in that position.By this way, shower plate 120 can expand and shrink, because it is free to slide relative to backboard 125, still keeps revealing between shower plate and backboard to prevent process gas relative to the sealing of backboard 125 simultaneously.
As shown in Figures 2 and 3, O-circle 140 is placed between shower plate 120 and backboard 125, thus provides air seal between shower plate 120 and backboard 125.Tetrafluoroethylene block or liner 145 are also arranged between shower plate 120 and backboard 125, thus maintain very little gap between shower plate 120 and backboard 125, can allow sliding motion between which.In fig 2, use bolt 150 and packing ring 155 that shower plate 120 is bolted to backboard 125 securely.There is provided lid 160 to cover bolt 150.
Figure 3 show slip fastening assembly, its mode for slip during to provide air seal but allow shower plate 120 in thermal expansion and shrink is in conjunction with shower plate 120 and backboard 125.In fig. 2, the hole 152 that shower plate gets out has the diameter being just large enough to hold bolt 150, and for the slip fastening assembly shown in Fig. 3, hole 154 is oval and comprises step 156.Plug-in unit 170 patchhole 154, thus fixedly prop up step 156.This plug-in unit can be made up of pottery or other material.
Accompanying drawing 4 is the exploded views of retention mechanism of sliding according to an embodiment of the invention.As shown in Figure 4, plug-in unit 170 has hole 172, the micro-diameter being greater than bolt 150 of the diameter in hole 172, and is oval.And as shown in Figure 4, plug-in unit 170 comprises bolt 171, therefore it can only with a direction patchhole 154, thus in that position, the major axis of slotted eye 172 is positioned on the expansion direction of shower plate 120.
Sliding panel 173 is provided on plug-in unit 170.Sliding panel 173 has four elliptical apertures 174, and they are also oriented in slip direction.Ball 175 is inserted in each hole.Each ball 175 can move freely in the elliptical aperture 174 of its correspondence.Cover plate 176 is arranged on the assembly of sliding panel 173 and ball 175.Can recognize, this plug-in unit 170, sliding panel 173, ball 175 and cover plate 176 constitute in fact " linearly " ball bearing unit.Two optional packing rings 177,178 are arranged on cover plate 176, and whole assembly is tightened against on backboard 125 by bolt 150.As will be understood, under suitably the tightening of bolt 150, shower plate 120 can be sealed to backboard 150, but also can be expanded by the slip relative to backboard 125.When it happens, due on the direction of turgor movement, the hole 172 provided in plug-in unit 170 is ellipse, so the assembly of shower plate 120 and plug-in unit 170 " movement " on ball 175.In this embodiment, except bolt 150, whole part is made up of pottery, but other materials such as aluminium, anodized aluminum, tetrafluoroethylene etc. may be used for different parts.
Fig. 5 illustrate the complete slip securing gear that bolt 150 inserts packing ring 177/178, cover plate 176, sliding panel 173 and plug-in unit 170 completely.In this complete module insertion aperture 154 shown in Figure 3, and bolt is tightened thus utilizes O-to enclose 140 formation sealings, but allows shower plate 120 in the auxiliary lower slip of tetrafluoroethylene block.
Fig. 6 is the bottom front view of cover plate 176, illustrates on the downside of it.As shown in Figure 6, according to an embodiment, 4 raceways (race) are set in the bottom surface of cover plate, thus Free-rolling on a linear direction can specifying at this raceway of ball 175.
Fig. 7 shows slip retention mechanism according to another embodiment of the invention.Be similar to shown in accompanying drawing 3 and 4 according to the slip retention mechanism of this embodiment, except cancelling ball 175 and can be slided by simple friction.According to an embodiment, cover plate 176 is " movement " on plug-in unit 170, and the upper generation at interface 175 ' of the slip between cover plate 176 and plug-in unit 170.According to another embodiment, the formation cover plate 176 at interface 175 ' and the surface of plug-in unit 170 are processed to reduce to rub and avoid or reduce the particle generation because slip causes.This can complete by such as applying such as tetrafluoroethylene, anodic oxidation etc. from the teeth outwards.According to another embodiment, interface 175 ' provides the disk be made up as tetrafluoroethylene of smooth material.
According to another embodiment, shower plate does not have and backboard secure bond.On the contrary, multiple slip fastening assembly is used in conjunction with shower plate and backboard, thus its free expansion in all directions.But the center that the plurality of slip fastening assembly is oriented to regardless of shower plate expansion or contraction shower plate remains on identical position.This has illustrated in accompanying drawing 8A and 8B.
Accompanying drawing 8A and 8B is the bottom elevation view of backboard 125 (shown in dotted line) according to the embodiment of the present invention and shower plate 120.Dotted arrow indicates from shower plate center radiated entends and through each rectilinear direction arranging the center of the point of fastening assembly.As shown in the figure, each elliptical aperture 154 of fastening assembly is oriented to and its major axis is positioned at along in the rectilinear direction from shower plate center radiated entends.As mentioned above, each plug-in unit 170 comprises bolt, thus being orientated of its setting makes the major axis of its elliptical aperture 172 also be orientated along the rectilinear direction from shower plate center radiated entends when its patchhole 154.By this way, be provided with on the point of fastening assembly at each, shower nozzle is only to slide along from shower plate center radiated entends and through the rectilinear direction of this point.Therefore, be appreciated that shower plate can by slide or mobile and expand in all directions and shrink on fastening assembly, but due to the orientation of this fastening assembly, no matter this shower plate expands and contraction, and the center of this shower nozzle remains on identical position.That is, the orientation of retention mechanism prevents any rotation or the displacement of shower plate, except radial direction expansion and shrink except.
Accompanying drawing 8A illustrates that this shower plate is at its expanding position.As shown in the figure, shower plate expands, and makes bolt 150 be in the inner radial side of elliptical aperture 154.On the contrary, figure 8 b depict punctured position, the bolt 150 illustrated is in the outer radial side of elliptical aperture 154.
Although describe the present invention with reference to its specific embodiments, the present invention is not limited to those embodiments.Especially, those skilled in the art when do not depart from as appended claims book limit the spirit and scope of the present invention can make various variation and amendment.In addition, above-cited all prior aries are incorporated herein by reference by with reform at this.

Claims (12)

1. a vacuum chamber, comprising:
Chamber housing;
Nozzle component, it is connected to the top section of chamber housing, and described nozzle component comprises:
With the backboard that chamber housing rigidity is combined;
The shower plate of perforation;
Multiple fastening assembly, is slidably fixed on backboard by described shower plate, and shower plate can be slided relative to backboard, and wherein, air seal is held between shower plate and backboard;
Wherein, each fastening assembly comprises ball bearing assembly and the bolt through described ball bearing assembly, and
Wherein, described ball bearing assembly comprises:
Wherein there is the plug-in unit of slotted eye;
Wherein there is the sliding panel of multiple non-circular hole;
Multiple ball, each corresponds to non-circular hole described in one of them; And
Wherein there is the cover plate of circular port.
2. vacuum chamber according to claim 1, is characterized in that, the shower plate of perforation comprises multiple slotted eye in its periphery, and each in wherein said multiple fastening assembly is inserted in the correspondence one of described multiple slotted eye.
3. vacuum chamber according to claim 1, is characterized in that, nozzle component comprises the O type circle be arranged between shower plate and backboard further.
4. vacuum chamber according to claim 1, is characterized in that, nozzle component comprises the liner be arranged between shower plate and backboard further, thus between shower plate and backboard, keep very little gap.
5. vacuum chamber according to claim 1, is characterized in that, shower plate comprises circular port further and passes described circular port and the bolt be firmly secured to by shower plate on backboard.
6. vacuum chamber according to claim 2, is characterized in that, each in described multiple slotted eye is oriented to and makes its major axis be positioned at along from shower plate center radiated entends and through in the rectilinear direction of this slotted eye.
7. vacuum chamber according to claim 6, is characterized in that, each fastening assembly comprises bolt, makes to be merely able to there is an orientation when fastening assembly is fixed in the slotted eye of its correspondence.
8. vacuum chamber according to claim 2, is characterized in that, plug-in unit comprises bolt further, to be oriented in one of them slotted eye of shower plate by described plug-in unit.
9. vacuum chamber according to claim 1, is characterized in that, at least one in plug-in unit, sliding panel, multiple ball and cover plate is made up of pottery.
10. vacuum chamber according to claim 1, is characterized in that, described vacuum chamber comprises the cover plate for covering fastening assembly further.
11. 1 kinds of vacuum chamber, comprising:
Chamber housing;
Nozzle component, it is connected to the top section of chamber housing, and described nozzle component comprises:
With the backboard that chamber housing rigidity is combined;
The shower plate of perforation;
Multiple fastening assembly, is slidably fixed on backboard by described shower plate, and shower plate can be slided relative to backboard,
Wherein, air seal is held between shower plate and backboard;
Wherein, each fastening assembly comprises:
Plug-in unit, it has slotted eye and slipping plane;
Cover plate, it has the mating surface in the face of described slipping plane; With
Through the bolt of described plug-in unit and cover plate; And
Wherein, each fastening assembly comprises the sliding panel be inserted between plug-in unit and cover plate further.
12. vacuum chamber according to claim 11, it is characterized in that, sliding panel comprises polyfluortetraethylene plate.
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