CN102036139A - Method for assembling four components of microphone - Google Patents
Method for assembling four components of microphone Download PDFInfo
- Publication number
- CN102036139A CN102036139A CN2010106144450A CN201010614445A CN102036139A CN 102036139 A CN102036139 A CN 102036139A CN 2010106144450 A CN2010106144450 A CN 2010106144450A CN 201010614445 A CN201010614445 A CN 201010614445A CN 102036139 A CN102036139 A CN 102036139A
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- China
- Prior art keywords
- cavity
- sieve plate
- copper ring
- plate
- assembly
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 24
- 238000003825 pressing Methods 0.000 claims abstract description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 87
- 238000013016 damping Methods 0.000 claims description 54
- 208000002925 dental caries Diseases 0.000 claims description 4
- 239000011148 porous material Substances 0.000 abstract 4
- 238000005192 partition Methods 0.000 abstract 2
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
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- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
- Details Of Audible-Bandwidth Transducers (AREA)
Abstract
The invention discloses a method for assembling four components of a microphone. The method comprises the following steps of: placing cavities in open pores of a cavity sieve plate and covering by using a top plate to form a component 1; placing back electrodes in open pores of a back electrode sieve plate to form a component 2; placing the component 1 on the component 2 to make the cavities correspond to the back electrodes, and turning to make the back electrodes fall into the open pores of the cavity sieve plate; and taking the back electrode sieve plate away, covering by using a bottom plate, pressing the bottom plate to assemble the back electrodes into the cavities, integrally turning, taking the top plate away, covering by using a cavity partition plate and turning to form a component 3, wherein the cavity partition plate is provided with open pores corresponding to the cavities. By the method for assembling the four components of the microphone, fine scraps can be prevented from being scrapped when the back electrodes penetrate through the cavities so as to improve the effect of the microphone.
Description
[technical field]
The present invention relates to a kind of assemble method, particularly relate to a kind of assemble method of family of four of microphone.
[background technology]
The family of four of microphone comprises backplane, cavity, copper ring and damping copper ring.During assembling, at first backplane is positioned on the flat board, gets cavity with tweezers again, be positioned on the backplane, push cavity, make backplane be absorbed in the bottom of cavity; Then, the semi-finished product that previous step is finished are positioned in the shell of microphone; Again copper ring is put into the shell of microphone, made backplane pass cavity to an other end; At last, the damping copper ring is put into shell, manually push the damping copper ring, at this moment, the assembling of the family of four of microphone is finished.
Yet, in above-mentioned assembling process, when passing cavity, backplane scrapes the cavity fines easily, and the cavity fines falls to cause easily on vibrating diaphragm teleblem bad, thereby influences the effect of microphone.
[summary of the invention]
Based on this, be necessary to provide a kind of assemble method of family of four of the microphone that can improve the microphone effect.
A kind of family of four assemble method of microphone may further comprise the steps:
Cavity is positioned in the perforate of cavity sieve plate, and covers top board, form assembly one;
Backplane is positioned in the perforate of backplane sieve plate, forms assembly two;
Assembly one is positioned on the assembly two, and makes described cavity and described backplane correspondence, and upset, described backplane falls in the perforate of described cavity sieve plate;
Take described backplane sieve plate away, cover base plate, and push described base plate, make described backplane be installed in the described cavity, with after the integral body upset, take described top board away again, cover cavity dividing plate and upset, form assembly three, offer the perforate corresponding on the described cavity dividing plate with described cavity;
The damping copper ring is positioned in the perforate of damping copper ring sieve plate, covers the copper ring sieve plate, and copper ring is positioned in the perforate of copper ring sieve plate, and described damping copper ring is relative with described copper ring, form assembly four;
Assembly three is positioned on the assembly four, and upset makes described damping copper ring and copper ring freely drop in the perforate of described cavity sieve plate then, takes described damping copper ring sieve plate away, and covers the damping pressing plate, forms assembly five;
Press component five makes described damping copper ring and copper ring install in the cavity, takes described damping pressing plate, copper ring sieve plate and cavity dividing plate successively away, and described cavity sieve plate is taken in upset away, and the family of four assembling of microphone is finished.
In a preferred embodiment, after taking described damping pressing plate, copper ring sieve plate and cavity dividing plate successively away, flat board is positioned on the described cavity sieve plate, again upset.
In a preferred embodiment, adopt described stamping machine to push described base plate.
A kind of family of four assemble method of microphone may further comprise the steps:
A plurality of cavitys are positioned over respectively in a plurality of perforates of cavity sieve plate, and cover top board, form assembly one;
A plurality of backplanes are positioned over respectively in a plurality of perforates of backplane sieve plate, form assembly two;
Described assembly one is positioned on the described assembly two, and makes described a plurality of cavity and a plurality of backplane corresponding one by one, and upset, described a plurality of backplanes fall in the perforate of corresponding cavity sieve plate;
Take described backplane sieve plate away, cover base plate, and push described base plate, make described a plurality of backplane be installed in respectively in the corresponding cavity, with after the integral body upset, take described top board away again, cover cavity dividing plate and upset, form assembly three, offer a plurality of perforates corresponding on the described cavity dividing plate with cavity;
A plurality of damping copper rings are positioned over respectively in a plurality of perforates of damping copper ring sieve plate, cover the copper ring sieve plate, and a plurality of copper rings are positioned over respectively in a plurality of perforates of copper ring sieve plate, and described a plurality of damping copper ring is corresponding one by one with a plurality of copper rings, form assembly four;
Assembly three is positioned on the assembly four, and upset then makes described a plurality of damping copper ring and a plurality of copper ring freely drop on the cavity sieve plate in the corresponding perforate, takes described damping copper ring sieve plate away, and covers the damping pressing plate, forms assembly five;
Press component five makes described a plurality of damping copper ring and a plurality of copper ring install in the corresponding cavity, takes described damping pressing plate, copper ring sieve plate and cavity dividing plate successively away, and described cavity sieve plate is taken in upset away, and the family of four assembling of a plurality of microphones is finished.
After adopting above-mentioned assemble method, scrape fines in the time of can avoiding backplane to pass cavity, thereby improve the effect of microphone.
[description of drawings]
Fig. 1 is the exploded view of the tool that uses in the family of four assembling process of a better embodiment microphone.
The front view of the tool that uses in the family of four assembling process of Fig. 2 for microphone among Fig. 1.
Front view after the assembling of the tool that uses in the family of four assembling process of Fig. 3 for microphone among Fig. 2.
[embodiment]
The family of four of microphone comprises backplane, cavity, copper ring and damping copper ring.
The family of four assemble method of the microphone of first execution mode may further comprise the steps:
One, cavity is positioned in the perforate 211 of cavity sieve plate 21, and covers top board, form assembly one.
Two, backplane is positioned in the perforate of backplane sieve plate, forms assembly two, and backplane there is diaphragm one dress that faces down.
Three, assembly one is positioned on the assembly two, and makes cavity and backplane correspondence, and upset, make the backplane sieve plate be positioned at topmost, cavity sieve plate 21 is between top board and backplane sieve plate, and backplane falls in the perforate 211 of cavity sieve plate 21.
Four, take the backplane sieve plate away, cover base plate 23, and by pushing (can adopt manually push or stamping machine is pushed) base plate 23, make backplane be installed in the cavity, with after the integral body upset, take top board away again, at this moment, backplane is assembled on the cavity, covers cavity dividing plate 22 and upset, form assembly three.Cavity dividing plate 22 drops out in cavity sieve plate 21 in order to prevent cavity, and offers the perforate corresponding with cavity 221 on it.
Five, the damping copper ring is positioned in the perforate of damping copper ring sieve plate, covers copper ring sieve plate 24, and copper ring is positioned in the perforate 241 of copper ring sieve plate 24, and the damping copper ring is relative with copper ring, form assembly four.
Six, assembly three is positioned on the assembly four, upset makes damping copper ring and copper ring freely drop in the perforate 211 of cavity sieve plate 21 then, takes damping copper ring sieve plate away, and covers damping pressing plate 25, forms assembly five;
Seven, press component five, make damping copper ring and copper ring install in the cavity, take damping pressing plate 25, copper ring sieve plate 24 and cavity dividing plate 22 successively away, take flat board to be positioned on the cavity sieve plate 21 at last, cavity sieve plate 21 is taken in upset away, at this moment, the assembling of the family of four of microphone is finished.
After adopting above-mentioned assemble method, scrape fines in the time of can avoiding backplane to pass cavity, thereby improve the effect of microphone.
The microphone family of four assemble method of second execution mode may further comprise the steps:
One, a plurality of cavitys is positioned over respectively in a plurality of perforates 221 of cavity sieve plate 21, and covers top board, form assembly one.
Two, a plurality of backplanes are positioned over respectively in a plurality of perforates of backplane sieve plate, form assembly two, and a plurality of backplane there is diaphragm one dress that faces down.
Three, assembly one is positioned on the assembly two, and make a plurality of cavitys and a plurality of backplane corresponding one by one, and upset, make the backplane sieve plate be positioned at topmost, cavity sieve plate 21 is between top board and backplane sieve plate, and a plurality of backplanes fall in the perforate 221 of corresponding cavity sieve plate 21.
Four, take the backplane sieve plate away, cover base plate 23, and, make a plurality of backplanes be installed in respectively in the corresponding cavity by pressing press 23, with after the integral body upset, take top board away, at this moment again, a plurality of backplanes are assembled on the respective chamber, cover cavity dividing plate 22 and upset, form assembly three.Cavity dividing plate 22 drops out in cavity sieve plate 21 in order to prevent cavity, and offers a plurality of perforates corresponding with cavity 221 on it.
Five, a plurality of damping copper rings are positioned over respectively in a plurality of perforates of damping copper ring sieve plate, cover copper ring sieve plate 24, and a plurality of copper rings are positioned over respectively in a plurality of perforates 241 of copper ring sieve plate 24, and a plurality of damping copper ring is corresponding one by one with a plurality of copper rings, forms assembly four.
Six, assembly three is positioned on the assembly four, upset then makes a plurality of damping copper rings and a plurality of copper ring freely drop on cavity sieve plate 21 in the corresponding perforate 221, takes damping copper ring sieve plate away, and covers damping pressing plate 25, forms assembly five;
Seven, press component five, make a plurality of damping copper rings and a plurality of copper ring install in the corresponding cavity, take damping pressing plate 25, copper ring sieve plate 24 and cavity dividing plate 22 successively away, take flat board to be positioned on the cavity sieve plate 21 at last, upset, take cavity sieve plate 21 away, at this moment, the assembling of the family of four of a plurality of microphones is finished.
Above-mentioned assemble method scrapes fines in the time of can avoiding backplane to pass cavity equally, thereby improves the effect of microphone.And after adopting above-mentioned assemble method, improved production efficiency greatly.
The above embodiment has only expressed one embodiment of the present invention, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to claim of the present invention.Should be pointed out that for the person of ordinary skill of the art without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection range of patent of the present invention should be as the criterion with claims.
Claims (4)
1. the family of four assemble method of a microphone may further comprise the steps:
Cavity is positioned in the perforate of cavity sieve plate, and covers top board, form assembly one;
Backplane is positioned in the perforate of backplane sieve plate, forms assembly two;
Assembly one is positioned on the assembly two, and makes described cavity and described backplane correspondence, and upset, described backplane falls in the perforate of described cavity sieve plate;
Take described backplane sieve plate away, cover base plate, and push described base plate, make described backplane be installed in the described cavity, with after the integral body upset, take described top board away again, cover cavity dividing plate and upset, form assembly three, offer the perforate corresponding on the described cavity dividing plate with described cavity;
The damping copper ring is positioned in the perforate of damping copper ring sieve plate, covers the copper ring sieve plate, and copper ring is positioned in the perforate of copper ring sieve plate, and described damping copper ring is relative with described copper ring, form assembly four;
Assembly three is positioned on the assembly four, and upset makes described damping copper ring and copper ring freely drop in the perforate of described cavity sieve plate then, takes described damping copper ring sieve plate away, and covers the damping pressing plate, forms assembly five;
Press component five makes described damping copper ring and copper ring install in the cavity, takes described damping pressing plate, copper ring sieve plate and cavity dividing plate successively away, and described cavity sieve plate is taken in upset away, and the family of four assembling of microphone is finished.
2. the family of four assemble method of microphone according to claim 1 is characterized in that, after taking described damping pressing plate, copper ring sieve plate and cavity dividing plate successively away, flat board is positioned on the described cavity sieve plate, upset again.
3. the family of four assemble method of microphone according to claim 1 is characterized in that, adopts described stamping machine to push described base plate.
4. the family of four assemble method of a microphone may further comprise the steps:
A plurality of cavitys are positioned over respectively in a plurality of perforates of cavity sieve plate, and cover top board, form assembly one;
A plurality of backplanes are positioned over respectively in a plurality of perforates of backplane sieve plate, form assembly two;
Described assembly one is positioned on the described assembly two, and makes described a plurality of cavity and a plurality of backplane corresponding one by one, and upset, described a plurality of backplanes fall in the perforate of corresponding cavity sieve plate;
Take described backplane sieve plate away, cover base plate, and push described base plate, make described a plurality of backplane be installed in respectively in the corresponding cavity, with after the integral body upset, take described top board away again, cover cavity dividing plate and upset, form assembly three, offer a plurality of perforates corresponding on the described cavity dividing plate with cavity;
A plurality of damping copper rings are positioned over respectively in a plurality of perforates of damping copper ring sieve plate, cover the copper ring sieve plate, and a plurality of copper rings are positioned over respectively in a plurality of perforates of copper ring sieve plate, and described a plurality of damping copper ring is corresponding one by one with a plurality of copper rings, form assembly four;
Assembly three is positioned on the assembly four, and upset then makes described a plurality of damping copper ring and a plurality of copper ring freely drop on the cavity sieve plate in the corresponding perforate, takes described damping copper ring sieve plate away, and covers the damping pressing plate, forms assembly five;
Press component five makes described a plurality of damping copper ring and a plurality of copper ring install in the corresponding cavity, takes described damping pressing plate, copper ring sieve plate and cavity dividing plate successively away, and described cavity sieve plate is taken in upset away, and the family of four assembling of a plurality of microphones is finished.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010614445 CN102036139B (en) | 2010-12-30 | 2010-12-30 | Method for assembling four components of microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010614445 CN102036139B (en) | 2010-12-30 | 2010-12-30 | Method for assembling four components of microphone |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102036139A true CN102036139A (en) | 2011-04-27 |
| CN102036139B CN102036139B (en) | 2013-07-24 |
Family
ID=43888344
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010614445 Expired - Fee Related CN102036139B (en) | 2010-12-30 | 2010-12-30 | Method for assembling four components of microphone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102036139B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105451144B (en) * | 2015-12-24 | 2020-04-21 | 潍坊煜华电子科技股份有限公司 | Three-piece assembling tool and method for back plate |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1327357A (en) * | 2000-05-30 | 2001-12-19 | 星精密株式会社 | Electret capacity microphone and its assembling method |
| CN2904539Y (en) * | 2005-12-07 | 2007-05-23 | 郑润远 | H ring metal cavity of electret capacitance microphone and microphone using said cavity |
| US7269267B2 (en) * | 2003-11-05 | 2007-09-11 | Bse Co., Ltd. | Method of mounting condenser microphone on main PCB and condenser microphone adapted for the same |
| CN101330775A (en) * | 2008-07-28 | 2008-12-24 | 深圳市豪恩声学股份有限公司 | Method for integrating washer and back pole as well as method for assembling microphone |
| CN201444696U (en) * | 2009-06-19 | 2010-04-28 | 歌尔声学股份有限公司 | Miniature microphone structure capable of being assembled easily |
| CN101835077A (en) * | 2010-05-28 | 2010-09-15 | 深圳市豪恩声学股份有限公司 | Electret condenser microphone and manufacturing method thereof |
-
2010
- 2010-12-30 CN CN 201010614445 patent/CN102036139B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1327357A (en) * | 2000-05-30 | 2001-12-19 | 星精密株式会社 | Electret capacity microphone and its assembling method |
| US7269267B2 (en) * | 2003-11-05 | 2007-09-11 | Bse Co., Ltd. | Method of mounting condenser microphone on main PCB and condenser microphone adapted for the same |
| CN2904539Y (en) * | 2005-12-07 | 2007-05-23 | 郑润远 | H ring metal cavity of electret capacitance microphone and microphone using said cavity |
| CN101330775A (en) * | 2008-07-28 | 2008-12-24 | 深圳市豪恩声学股份有限公司 | Method for integrating washer and back pole as well as method for assembling microphone |
| CN201444696U (en) * | 2009-06-19 | 2010-04-28 | 歌尔声学股份有限公司 | Miniature microphone structure capable of being assembled easily |
| CN101835077A (en) * | 2010-05-28 | 2010-09-15 | 深圳市豪恩声学股份有限公司 | Electret condenser microphone and manufacturing method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105451144B (en) * | 2015-12-24 | 2020-04-21 | 潍坊煜华电子科技股份有限公司 | Three-piece assembling tool and method for back plate |
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| Publication number | Publication date |
|---|---|
| CN102036139B (en) | 2013-07-24 |
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Granted publication date: 20130724 |
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