CN101862738A - Roller of silicon wafer horizontal cleaning machine - Google Patents

Roller of silicon wafer horizontal cleaning machine Download PDF

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Publication number
CN101862738A
CN101862738A CN 201010171993 CN201010171993A CN101862738A CN 101862738 A CN101862738 A CN 101862738A CN 201010171993 CN201010171993 CN 201010171993 CN 201010171993 A CN201010171993 A CN 201010171993A CN 101862738 A CN101862738 A CN 101862738A
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CN
China
Prior art keywords
roller
upper roller
silicon chip
silicon wafer
cleaning machine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN 201010171993
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Chinese (zh)
Inventor
覃启东
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SUZHOU JUKING TECHNOLOGY Co Ltd
Original Assignee
SUZHOU JUKING TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SUZHOU JUKING TECHNOLOGY Co Ltd filed Critical SUZHOU JUKING TECHNOLOGY Co Ltd
Priority to CN 201010171993 priority Critical patent/CN101862738A/en
Publication of CN101862738A publication Critical patent/CN101862738A/en
Pending legal-status Critical Current

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Abstract

The invention provides a roller of a solar cell silicon wafer horizontal cleaning machine, wherein the roller can drive the silicon wafer to perform uniform and straight-line motion and the pressures of an upper roller and a lower roller are moderate without causing blockage or breaking the silicon wafer. The roller of the invention comprises at least one pair of rollers composed of the upper roller and the lower roller, wherein the upper roller and the lower roller of each pair are opposite to each other in vertical direction, the lower roller is connected with a lower rotation shaft which drives the lower roller to rotate; the roller of the invention also comprises an upper drive shaft which is used to drive the upper roller to rotate; and the cleaned silicon wafer is placed on the lower roller, the upper roller contacts with the upper surface of the silicon wafer, and a gap is left between the upper roller and the upper drive shaft in radial direction.

Description

Roller of silicon wafer horizontal cleaning machine
Technical field
The present invention relates to the roller of silicon chip of solar cell horizontal cleaning machine.
Background technology
When the silicon chip of solar cell horizontal cleaning machine cleaned silicon chip of solar cell, silicon chip moved at the underwater along continuous straight runs, and the current of runner clean silicon chip.Roller in the silicon chip of solar cell horizontal cleaning machine is exactly to drive the mechanism that the silicon wafer horizontal straight line moves.
At least one pair of roller that existing roller is made up of upper roller, bottom roller, the upper roller in every pair roller is relative up and down with bottom roller, and bottom roller links to each other with the lower rotary shaft that drives its rotation; Upper roller or be fixed in the last rotating shaft that drives its rotation perhaps is free activity fully.
If upper roller is fixed on rotating shaft, because the distance between upper roller and the bottom roller is a definite value, when silicon chip is placed between upper roller and the bottom roller, upper roller contacts with lower surface with the upper surface of silicon chip respectively with bottom roller, upper roller and bottom roller all drive silicon chip by frictional force and move, the roller of this structure is prone to the fragment that dead pressure silicon chip (silicon chip can not move) or upper roller and bottom roller cause greatly the pressure of silicon chip when transmitting during silicon chip.But the advantage of this structure is can drive the silicon chip straight line to move.
If upper roller is free movable, when silicon chip is placed between upper roller and the bottom roller, upper roller only is to contact with the upper surface of silicon chip owing to gravity, the silicon chip that moves under the frictional force effect of bottom roller drives upper roller again and rotates, the roller of this structure is when transmitting during silicon chip, silicon chip wanders off easily in transmission (departing from mobile straight line) or skids, and a slice silicon chip is folded and the phenomenon of card mutually with inconsistent, the preceding a slice silicon chip of back a slice silicon chip translational speed and back a slice silicon chip before can occurring.
Summary of the invention
The purpose of this invention is to provide a kind of drive silicon chip at the uniform velocity straight line move, upper roller and bottom roller to the moderate pressure of silicon chip, the silicon chip of solar cell horizontal cleaning machine roller of card or fragment phenomenon can not appear.
Roller of silicon wafer horizontal cleaning machine of the present invention comprises at least one pair of roller of being made up of upper roller, bottom roller, and the upper roller in every pair roller is relative up and down with bottom roller, and bottom roller links to each other with the lower rotary shaft that drives its rotation; It also comprises the last driving shaft that is used to drive the upper roller rotation; The silicon chip that is cleaned is placed on the bottom roller, and upper roller contacts with the upper surface of silicon chip, and is gapped in radial direction between upper roller and the last driving shaft.
After adopting such structure, because gapped between upper roller and the last driving shaft, in the upper roller rotation, can easy on and off activity in the scope in gap, make upper roller certain pressure be arranged, avoided upper roller excessive and produce the silicon chip fragment the pressure of silicon chip to silicon chip.Among the present invention, upper roller is not only to rely on gravity pressure to compress silicon chip, prevented that upper roller breaks away from silicon chip, simultaneously, last driving shaft can drive upper roller again and rotate, and upper roller drives silicon chip by frictional force and moves, can make silicon chip in transmission, move and can not wander off along straight line, also avoided the skidding between upper roller and the silicon chip, like this, preceding a slice silicon chip is consistent with back a slice silicon chip translational speed, can not occur before a slice silicon chip with back a slice silicon chip the folded mutually and phenomenon of card.
Above-mentioned roller of silicon wafer horizontal cleaning machine, it also comprises two blocks that are arranged on the driving shaft, upper roller is between two blocks, and is all gapped between upper roller and two blocks.Two blocks define the position that upper roller moves vertically, make that upper roller is free movable, better to the guide effect of silicon chip like this at specific axial location, makes silicon chip to move along straight line.
The structure of the last driving shaft that the drive upper roller rotates has varied, and the last driving shaft of fairly simple practicality comprises rotating shaft and the drive pin that radially extends along last rotating shaft; The endoporus of upper roller is passed in last rotating shaft; Have groove on the upper roller inner hole wall; Drive pin stretches in the groove; The broadband of drive pin is less than the broadband of groove, and the height of drive pin is less than the degree of depth of groove, and the external diameter of last rotating shaft is less than the diameter of bore of upper roller.Because the external diameter of last rotating shaft is less than the diameter of bore of upper roller, so gapped in radial direction between upper roller and last rotating shaft.Be used for the degree of depth of the height of drive pin, so gapped in radial direction between upper roller and drive pin less than groove.
Above-mentioned roller of silicon wafer horizontal cleaning machine, described roller have two pairs.Two pair rollers can drive a silicon chip respectively and move, and have so just improved operating efficiency.
Description of drawings
Fig. 1 is a front view of the present invention.
Fig. 2 is the A-A cutaway view of Fig. 1.
Fig. 3 is the schematic diagram of upper roller.
Fig. 4 is the left view of Fig. 3.
Fig. 5 is the connection diagram of drive pin and right baffle plate.
Fig. 6 is the left view of Fig. 5.
The specific embodiment
The present invention is further detailed explanation below in conjunction with the drawings and specific embodiments.
Referring to roller of silicon wafer horizontal cleaning machine shown in Figure 1, comprise two pair rollers 1, the upper roller 2 in every pair roller is relative up and down with bottom roller 3, and bottom roller 3 is one with the lower rotary shaft 4 that drives its rotation.
Be used to drive the last driving shaft 5 that upper roller 2 rotates and comprise rotating shaft 51 and two drive pins 52, drive pin 52 radially extends along last rotating shaft, the axis symmetry of two drive pin 52 above rotating shafts 51.The endoporus 21 of upper roller 2 is passed in last rotating shaft 51; Have two grooves 23 on the upper roller inner hole wall 22; Two grooves 23 are with endoporus 21 axis symmetries.Drive pin 52 stretches in the groove 23.
In last rotating shaft, also be fixed with two groups of blocks 6.Every group of block comprises left block 61, right block 62.Each upper roller 2 both sides has the left block 61, the right block 62 that are fixed in the rotating shaft respectively.Gapped J between upper roller and the left block 61, gapped K between upper roller and the right block 62.
The height H of drive pin is less than the degree of depth F of groove, between upper roller and the drive pin at the gapped G of radial direction.The broadband W of drive pin is less than the broadband U of groove, between upper roller and the drive pin with the perpendicular direction of radial direction on gapped V.The external diameter Z of last rotating shaft is less than the diameter X of the endoporus 21 of upper roller, between upper roller and the last rotating shaft at the gapped Y of radial direction.
When the silicon chip that is cleaned is placed between bottom roller and the upper roller, upper roller contacts with the upper surface of silicon chip, bottom roller contacts with the lower surface of silicon chip, upper roller that rotates under last drive pin 52 drives and the bottom roller that rotates under lower rotary shaft drives produce frictional force to silicon chip simultaneously, drive silicon chip and move forward.
In the present embodiment, drive pin 52 and right block 62 are fixed together.Certainly, drive pin 52 also can directly be fixed on rotating shaft 51 and need not to fixedly connected with right block 62.
Upper roller 2 has relative activity space with last driving shaft 5, avoids compressing silicon chip, simultaneously, prevents that also upper roller breaks away from silicon chip, makes silicon chip can not wander off or skid in transmission.And 5 pairs of upper rollers 2 of last driving shaft have the effect of driving, make upper roller 2 be driving wheel, have increased the frictional force to silicon chip, and a slice silicon chip is consistent with back a slice silicon chip speed before making, lamination card phenomenon before and after can not occurred.Since above-mentioned clearance G, V, Y, J, K are arranged, can be free movable in above-mentioned gap in upper roller 2 rotates.The rotating speed of bottom roller and the rotating speed of upper roller form certain relation, guarantee that upper roller, bottom roller equate with the linear velocity value of the contact point of silicon chip, like this, avoid the relative friction between upper roller and the bottom roller, guarantee chip transmission speed uniform and stable, reduce fragment.

Claims (4)

1. roller of silicon wafer horizontal cleaning machine comprises at least one pair of roller of being made up of upper roller, bottom roller, and the upper roller in every pair roller is relative up and down with bottom roller, and bottom roller links to each other with the lower rotary shaft that drives its rotation; It is characterized in that: further comprising and be used to drive the last driving shaft that upper roller rotates; The silicon chip that is cleaned is placed on the bottom roller, and upper roller contacts with the upper surface of silicon chip, and is gapped in radial direction between upper roller and the last driving shaft.
2. roller of silicon wafer horizontal cleaning machine as claimed in claim 1 it is characterized in that: further comprising two blocks that are arranged on the driving shaft, and upper roller is between two blocks, and is all gapped between upper roller and two blocks.
3. roller of silicon wafer horizontal cleaning machine as claimed in claim 2 is characterized in that: go up driving shaft and comprise rotating shaft and the drive pin that radially extends along last rotating shaft; The endoporus of upper roller is passed in last rotating shaft; Have groove on the upper roller inner hole wall; Drive pin stretches in the groove; The broadband of drive pin is less than the broadband of groove, and the height of drive pin is less than the degree of depth of groove, and the external diameter of last rotating shaft is less than the diameter of bore of upper roller.
4. roller of silicon wafer horizontal cleaning machine as claimed in claim 1 is characterized in that: described roller has two pairs.
CN 201010171993 2010-05-14 2010-05-14 Roller of silicon wafer horizontal cleaning machine Pending CN101862738A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201010171993 CN101862738A (en) 2010-05-14 2010-05-14 Roller of silicon wafer horizontal cleaning machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201010171993 CN101862738A (en) 2010-05-14 2010-05-14 Roller of silicon wafer horizontal cleaning machine

Publications (1)

Publication Number Publication Date
CN101862738A true CN101862738A (en) 2010-10-20

Family

ID=42954771

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 201010171993 Pending CN101862738A (en) 2010-05-14 2010-05-14 Roller of silicon wafer horizontal cleaning machine

Country Status (1)

Country Link
CN (1) CN101862738A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103668377A (en) * 2012-09-14 2014-03-26 无锡尚德太阳能电力有限公司 Solar cell equipment and self-weight type soft contact conduction device thereof
CN107256909A (en) * 2017-07-26 2017-10-17 昊诚光电(太仓)有限公司 One kind catches up with water installations and wool-weaving machine
CN108574024A (en) * 2018-02-01 2018-09-25 横店集团东磁股份有限公司 A kind of water squeezing idler wheel for wet etching

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6163916A (en) * 1998-07-09 2000-12-26 Speedfam Clean System Co., Ltd. Cleaning apparatus for disk-shaped workpieces
US6625835B1 (en) * 1999-05-27 2003-09-30 Lam Research Corporation Disk cascade scrubber
US20040238000A1 (en) * 2003-05-28 2004-12-02 In-Joon Yeo Wafer cleaning apparatus with probe cleaning and methods of using the same
CN1986086A (en) * 2006-12-22 2007-06-27 上海集成电路研发中心有限公司 Device and method for cleaning semiconductor silicon chip
CN201098688Y (en) * 2007-11-27 2008-08-13 万向硅峰电子股份有限公司 Device for cleaning single-crystal silicon chip by using ultrasonic wave
CN101533760A (en) * 2009-04-09 2009-09-16 上海集成电路研发中心有限公司 Cleaning equipment of semiconductor silicon chip and cleaning method thereof
DE102008022282A1 (en) * 2008-04-24 2009-10-29 Gebr. Schmid Gmbh & Co. Device and method for treating silicon wafers or flat objects
WO2010001761A1 (en) * 2008-06-30 2010-01-07 アイオン株式会社 Sponge roller for cleaning

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6163916A (en) * 1998-07-09 2000-12-26 Speedfam Clean System Co., Ltd. Cleaning apparatus for disk-shaped workpieces
US6625835B1 (en) * 1999-05-27 2003-09-30 Lam Research Corporation Disk cascade scrubber
US20040238000A1 (en) * 2003-05-28 2004-12-02 In-Joon Yeo Wafer cleaning apparatus with probe cleaning and methods of using the same
CN1986086A (en) * 2006-12-22 2007-06-27 上海集成电路研发中心有限公司 Device and method for cleaning semiconductor silicon chip
CN201098688Y (en) * 2007-11-27 2008-08-13 万向硅峰电子股份有限公司 Device for cleaning single-crystal silicon chip by using ultrasonic wave
DE102008022282A1 (en) * 2008-04-24 2009-10-29 Gebr. Schmid Gmbh & Co. Device and method for treating silicon wafers or flat objects
WO2010001761A1 (en) * 2008-06-30 2010-01-07 アイオン株式会社 Sponge roller for cleaning
CN101533760A (en) * 2009-04-09 2009-09-16 上海集成电路研发中心有限公司 Cleaning equipment of semiconductor silicon chip and cleaning method thereof

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103668377A (en) * 2012-09-14 2014-03-26 无锡尚德太阳能电力有限公司 Solar cell equipment and self-weight type soft contact conduction device thereof
CN107256909A (en) * 2017-07-26 2017-10-17 昊诚光电(太仓)有限公司 One kind catches up with water installations and wool-weaving machine
CN107256909B (en) * 2017-07-26 2023-11-10 太仓市哲泰天产品设计有限公司 Catch up with water device and wool making machine
CN108574024A (en) * 2018-02-01 2018-09-25 横店集团东磁股份有限公司 A kind of water squeezing idler wheel for wet etching

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Open date: 20101020