CN101763154A - Air blasting device - Google Patents
Air blasting device Download PDFInfo
- Publication number
- CN101763154A CN101763154A CN200810306501A CN200810306501A CN101763154A CN 101763154 A CN101763154 A CN 101763154A CN 200810306501 A CN200810306501 A CN 200810306501A CN 200810306501 A CN200810306501 A CN 200810306501A CN 101763154 A CN101763154 A CN 101763154A
- Authority
- CN
- China
- Prior art keywords
- air
- blast device
- circuit board
- printed circuit
- pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures Of Non-Positive Displacement Pumps (AREA)
Abstract
The invention relates to an air blasting device, which is used for heat dissipation of a printed circuit board, the air blasting device comprises a shell body and a fan which is arranged in the shell body, one side surface of the air blasting device is provided with an air inlet which corresponds to the fan, one side wall of the air blasting device is provided with a clamping groove and an air outlet which are adjacent, the clamping groove is used for containing one end of the printed circuit board, the air outlet is used for guiding out air flow to carry out temperature reduction and heat dissipation to the printed circuit board, the side surface is provided with a fixed part which is used for fixing one end of the printed circuit board in the clamping groove.
Description
Technical field
The present invention relates to a kind of air-blast device.
Background technology
General electronic equipment such as computer all can produce heat in the process of operation, if these heats are not in time discharged, heat will be cumulative, finally causes electronic equipment to move even to damage.Main heat generating components in the computer is central processing unit and other chipset etc., in the prior art, usually by installing heating radiator on the heat generating components and install the heat discharge of the mode of fan with its generation on heating radiator.
Along with computer industry constantly develops, the high frequency of computer, high-powerly bring new problem to heat radiation again, in order to reach better radiating effect, there are many dealers in cabinet, to install air-blast device, the air flow that is beneficial in the cabinet is dispelled the heat.But, if when needing a printed circuit board (PCB) of plug-in mounting in the slot of computer main board is provided with an air-blast device specially and dispels the heat as heat generating components such as a video card or memory bars, then air-blast device is installed on securely the comparison difficulty that seems on the described printed circuit board (PCB).
Summary of the invention
In view of above content, be necessary to provide a kind of easy-to-install air-blast device, be beneficial to better electronic equipment be dispelled the heat.
A kind of air-blast device, be used for a printed circuit board (PCB) is dispelled the heat, described air-blast device comprises a housing and is installed in the interior fan of described housing, an air inlet is offered corresponding to described fan in one side of described air-blast device, one sidewall of described air-blast device is offered an adjacent draw-in groove and an air outlet, described draw-in groove is used for an end of ccontaining described printed circuit board (PCB), described air outlet is used to derive distinguished and admirable so that described printed circuit board (PCB) is carried out cooling, described side is provided with a fixed part, and described fixed part is used for an end of described printed circuit board (PCB) is fixed in described draw-in groove.
Air-blast device of the present invention is by an end of the ccontaining described printed circuit board (PCB) of described draw-in groove, and fix at described fixed part by described, the guiding air enters described air-blast device from described air inlet, and from described air outlet direction with distinguished and admirable derivation, described printed circuit board (PCB) being dispelled the heat and then its temperature is reduced, and described air-blast device is easy to install.
Description of drawings
Fig. 1 is the better embodiment of air-blast device of the present invention and the three-dimensional exploded view of a video card.
Fig. 2 is the three-dimensional combination figure of Fig. 1.
Embodiment
Please refer to Fig. 1, air-blast device 20 of the present invention is used for a printed circuit board (PCB) is dispelled the heat as an a memory bar or video card 12 etc., the golden finger 16 of described video card 12 is used to insert a printed circuit board (PCB) slot as a PCI (Peripheral ComponentInterconnect, peripheral component interconnect) in slot etc., settle a chip 14 on the described video card 12, described chip 14 is main pyrotoxin.
The better embodiment of described air-blast device 20 comprises a housing 29 and is installed in a fan 22 in the described housing 29, described housing 29 roughly is square, a circular air inlet 24 is offered corresponding to described fan 22 in one side 26, itself and described side 26 adjacent sidewalls are offered an adjacent draw-in groove 232 and an air outlet 236 for 27 times, and described draw-in groove 232 is used for an end (abutting end of golden finger 16 as shown in Figure 1) of ccontaining described video card 12.Described air outlet 236 is used to derive distinguished and admirable so that described chip 14 is carried out cooling, and described air outlet 236 is vertical with described air inlet 24.Two jiaos of described side 26 respectively are provided with fixed part as a fixed orifice 252 and a fixed orifice 256, and described fixed orifice 252 and fixed orifice 256 are used for by DRIVE SCREWS 30 end of described video card 12 being fixed in described draw-in groove 232.
In other embodiments, the shape of described housing 29 is not limited to square, and the quantity of described fixed orifice is not limited to two, and described fixed orifice 252 and 256 position also are not limited to be opened in the Liang Jiaochu of described side 26.The sectional area of the air inlet 24 of described air-blast device 20 has determined intake, can regulate as required, and the direction of the air inlet 24 of described air-blast device 20 can be opened in different directions as required.
Refer again to Fig. 2, during assembling, one end of described video card 12 is inserted in the draw-in groove 232 of described air-blast device 20, two-screw 30 is locked respectively in the fixed orifice 252 and fixed orifice 256 of described air-blast device 20, make described screw 30 prop up an end of described video card 12, described air-blast device 20 is fixed on an end of described video card 12.
When the golden finger 16 with described video card 12 inserts in the video card slot, described video card 12 is started working and during fan 22 operation of described air-blast device 20, distinguished and admirable air inlet 24 from described air-blast device 22 is inhaled into described air-blast device 20, after pressurization, distinguished and admirable air outlet 236 from described air-blast device 20 is sent, thereby made the temperature of described chip 14 reduce.
Air-blast device 20 of the present invention is by an end of described draw-in groove 232 ccontaining described printed circuit board (PCB)s, and in described fixed orifice 252, fixed orifice 256, screw in described screw 30 and fix by described, the guiding air enters described air-blast device 20 from described air inlet 24, and from described air outlet 236 directions with distinguished and admirable derivation, described printed circuit board (PCB) being dispelled the heat and then its temperature is reduced, and the regular shape of described air-blast device 20 and be easy to install.
Claims (6)
1. air-blast device, be used for a printed circuit board (PCB) is dispelled the heat, described air-blast device comprises a housing and is installed in the interior fan of described housing, an air inlet is offered corresponding to described fan in one side of described air-blast device, one sidewall of described air-blast device is offered an adjacent draw-in groove and an air outlet, described draw-in groove is used for an end of ccontaining described printed circuit board (PCB), described air outlet is used to derive distinguished and admirable so that described printed circuit board (PCB) is carried out cooling, described side is provided with a fixed part, and described fixed part is used for an end of described printed circuit board (PCB) is fixed in described draw-in groove.
2. air-blast device as claimed in claim 1 is characterized in that: described housing is square.
3. air-blast device as claimed in claim 1 is characterized in that: described fixed part comprises first and second fixed orifice, and described first and second fixed orifice is used for respectively by a screw one end of described printed circuit board (PCB) being fixed in described draw-in groove.
4. air-blast device as claimed in claim 1 is characterized in that: described printed circuit board (PCB) is a video card.
5. air-blast device as claimed in claim 1 is characterized in that: described printed circuit board (PCB) is a memory bar.
6. air-blast device as claimed in claim 1 is characterized in that: described air inlet be shaped as circle.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810306501A CN101763154A (en) | 2008-12-24 | 2008-12-24 | Air blasting device |
| US12/344,267 US20100155029A1 (en) | 2008-12-24 | 2008-12-25 | Blower assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810306501A CN101763154A (en) | 2008-12-24 | 2008-12-24 | Air blasting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101763154A true CN101763154A (en) | 2010-06-30 |
Family
ID=42264370
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200810306501A Pending CN101763154A (en) | 2008-12-24 | 2008-12-24 | Air blasting device |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US20100155029A1 (en) |
| CN (1) | CN101763154A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102778936A (en) * | 2011-05-12 | 2012-11-14 | 鸿富锦精密工业（深圳）有限公司 | Heat dissipation device and heat dissipation system with same |
| CN104615216A (en) * | 2013-11-01 | 2015-05-13 | 联想(北京)有限公司 | Electronic equipment |
| CN110662394A (en) * | 2019-09-04 | 2020-01-07 | 广东浪潮大数据研究有限公司 | Cooling device |
| CN114689910A (en) * | 2022-05-27 | 2022-07-01 | 苏州联讯仪器有限公司 | Chip reliability testing device |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101453829B (en) * | 2007-11-29 | 2010-12-08 | 辉达公司 | Method for providing substitute electric power supply to graphic card, graphic card and computer operation apparatus |
| CN102200807A (en) * | 2010-03-25 | 2011-09-28 | 鸿富锦精密工业（深圳）有限公司 | Expansion card heat insulation shield |
| CN103990616B (en) * | 2014-05-30 | 2017-03-15 | 苏州倍辰莱电子科技有限公司 | Pcb board air blowing tool |
| USD780901S1 (en) * | 2015-02-06 | 2017-03-07 | Dynatron Corporation | Dual port blower |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6442024B1 (en) * | 2000-12-11 | 2002-08-27 | Shoei-Yuan Shih | Fan flow guide |
| TWM323687U (en) * | 2007-06-01 | 2007-12-11 | Comptake Technology Inc | Auxiliary heat-dissipating apparatus of memory heat-dissipating piece |
-
2008
- 2008-12-24 CN CN200810306501A patent/CN101763154A/en active Pending
- 2008-12-25 US US12/344,267 patent/US20100155029A1/en not_active Abandoned
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102778936A (en) * | 2011-05-12 | 2012-11-14 | 鸿富锦精密工业（深圳）有限公司 | Heat dissipation device and heat dissipation system with same |
| CN104615216A (en) * | 2013-11-01 | 2015-05-13 | 联想(北京)有限公司 | Electronic equipment |
| CN104615216B (en) * | 2013-11-01 | 2018-04-27 | 联想(北京)有限公司 | A kind of electronic equipment |
| CN110662394A (en) * | 2019-09-04 | 2020-01-07 | 广东浪潮大数据研究有限公司 | Cooling device |
| CN110662394B (en) * | 2019-09-04 | 2021-02-19 | 广东浪潮大数据研究有限公司 | Cooling device |
| CN114689910A (en) * | 2022-05-27 | 2022-07-01 | 苏州联讯仪器有限公司 | Chip reliability testing device |
| CN114689910B (en) * | 2022-05-27 | 2022-08-16 | 苏州联讯仪器有限公司 | Chip reliability testing device |
Also Published As
| Publication number | Publication date |
|---|---|
| US20100155029A1 (en) | 2010-06-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20100630 |