CN100535765C - 6-freedom micro-motion platform capable of isolating exterior vibration - Google Patents
6-freedom micro-motion platform capable of isolating exterior vibration Download PDFInfo
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- CN100535765C CN100535765C CNB2007101735749A CN200710173574A CN100535765C CN 100535765 C CN100535765 C CN 100535765C CN B2007101735749 A CNB2007101735749 A CN B2007101735749A CN 200710173574 A CN200710173574 A CN 200710173574A CN 100535765 C CN100535765 C CN 100535765C
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Abstract
The invention discloses a six-degree of freedom micropositioner capable of isolating external vibration. The micropositioner comprises a motor sheet support, a level drive module, a wafer supporting stage, an air foot, a leveling focusing module and a plurality of gravity compensators; wherein the level drive module is arranged on the motor sheet support; moreover, the level drive module is connected with the wafer supporting stage to drive the wafer supporting stage to move in horizontal direction; the air foot is arranged at the bottom of the entire micropositioner to support the motor sheet support and the gravity compensators; the gravity compensators is used to support the leveling focusing module; the wafer supporting stage floats on the leveling focusing module by means of an airfloated structure; the horizontal and vertical uncoupling of the micropositioner is realized by the leveling focusing module and the airfloated structure of the wafer supporting stage. With high controllability, the micropositioner can realize high-speed and high-precision locating and can isolate vibration.
Description
Technical field
The present invention relates to a kind of work stage, particularly be used for having a high-precision micropositioner of six-freedom degree on semiconductor equipment or the liquid crystal display production equipment.
Background technology
Commonly used on semiconductor manufacturing facility or the liquid crystal display production equipment to having the high-precision work stage of six-freedom degree, such as lithographic equipment in the semicon industry, high-accuracy process equipment and precision measurement equipment.In lithographic equipment, work stage is made up of coarse motion platform and micropositioner, and the effect of micropositioner is the carrying silicon chip, and silicon chip accurately located, this accurate location comprise vertical and level to.Micropositioner and the combination of coarse motion platform be stroke motion greatly.Along with the size and the output of silicon chip constantly increases, require the stroke of micropositioner to become big, speed accelerates, this will make that the driving force of motor is bigger, the acceleration of motor operation is also bigger, so the vibrations that bring are also bigger, such vibrations can be passed on the plummer of carrying silicon chip, influence the silicon chip bearing accuracy.The method of eliminating this vibrations is a lot, and such as publication number US707562482 in the american documentation literature, open day is on July 11st, 2006; Publication number US687340482, the patent documentation that open day is on March 29th, 2005 all is in order to solve the problem of vibrations.Above-mentioned patent documentation substantially all is to rely on magnetic levitation to eliminate vibrations, and the shortcoming of this method is that control is complicated, and poor stability has magnetic interference.The another kind of technical scheme of eliminating vibrations is by the air supporting shock insulation, and the air supporting shock insulation is that the whole work-piece platform is isolated, and load quality is big like this, and control stiffness is poor.In addition, level does not overlap to the driving force and the wafer-supporting platform barycenter of motor, and this has interference when whole wafer-supporting platform acceleration-deceleration, at present the solution level to and vertical coupling aspect, all be to rely on reed to solve, effect is good not as the air supporting shock insulation.
Summary of the invention
Technical matters solved by the invention is to provide a kind of high controllability, and is high-speed, and hi-Fix and the micropositioner that can isolate vibrations to eliminate the vibrations that produce when micropositioner moves, are convenient to silicon chip and are accurately located.
In order to solve the problems of the technologies described above, but the 6-freedom micro-motion platform of isolating exterior vibration of the present invention, it is used for the carrying of semiconductor lithography equipment silicon chip and the accurate location of little stroke, described micropositioner comprises motor support plate, the horizontal drive module, wafer-supporting platform, described horizontal drive module is installed on the motor support plate, described horizontal drive module links to each other with wafer-supporting platform, being used to drive wafer-supporting platform moves in the horizontal direction, its unique distinction is: described micropositioner also comprises the gas foot, leveling and focusing module and several gravity compensators, described gas foot is arranged at the bottom of whole micropositioner, be used to support described motor support plate and gravity compensator, described several gravity compensators are used to support the leveling and focusing module, described wafer-supporting platform relies on air floating structure to swim on the leveling and focusing module, and the level of described micropositioner is to realizing with the vertical air floating structure of separating idol dependence leveling and focusing module and wafer-supporting platform.
Described micropositioner comprises three gravity compensators, is Chinese character pin-shaped distribution to support the leveling and focusing module.
In above-mentioned micropositioner, described horizontal drive module is made up of four horizontal fine motion motors, is installed on the motor support plate respectively and is distributed in around the wafer-supporting platform.
Further, the barycenter of the driving force of described four horizontal fine motion motors and wafer-supporting platform is on sustained height; Each horizontal fine motion motor includes stationary part and mover part, and described stationary part is fixed on the gas foot, and the mover part is connected with wafer-supporting platform.
Described micropositioner also comprises dihedral reflector, and it vertically is installed on the wafer-supporting platform edge, and dihedral reflector itself is vertical mutually.
Further, the cooperation of described dihedral reflector and external intervention instrument can make wafer-supporting platform accurately locate at six degree of freedom.
The present invention makes it compared with prior art owing to adopted above-mentioned technical scheme, has following advantage and good effect:
1. the air supporting shock insulation is integrated in micropositioner inside, can directly isolate the vibrations of wafer-supporting platform;
2. level and vertical accurate location are in same level, can control wafer-supporting platform simultaneously;
3. leveling and focusing module and air supporting decoupling zero are passed through in level and vertical coupling, than prior art reed decoupling zero good damping effect;
Level to the fine motion motor be distributed in wafer-supporting platform around, the barycenter of driving force and wafer-supporting platform has reduced level to vertical disturbance on one side.
Description of drawings
Fig. 1 for micropositioner of the present invention vertically to sectional view;
Fig. 2 for the level of micropositioner of the present invention to sectional view;
Fig. 3 is the structural representation of micropositioner of the present invention;
Fig. 4 is the structural representation after micropositioner of the present invention and coarse motion platform are integrated.
Embodiment
Describe the present invention below in conjunction with accompanying drawing:
As shown in Figure 1, 2, 3, but the 6-freedom micro-motion platform of isolating exterior vibration of the present invention comprises gas foot 1, motor support plate 2, wafer-supporting platform 3, leveling and focusing module 4, horizontal fine motion motor 5 and gravity compensator (mini-airmount) 6.Gas foot 1 is positioned at the bottom of micropositioner, is carrying whole micropositioner, and is leading in the horizontal direction for micropositioner.With prior art air supporting shock insulation the isolation of whole work-piece platform is compared, 1 carrying micropositioner of gas foot of the present invention, gas foot 1 can be isolated frame vibration, and reduction friction of motion, eliminate the foozle of base platform, can prevent the shear pressure that microdisplacement that the upsetting moment of accelerator causes causes air-float guide rail.
Above the gas foot is three gravity compensators 6, is Chinese character pin-shaped distribution, and formation is stood like the legs of a tripod, can be safe support leveling and focusing module 4 and wafer-supporting platform 3 on the gravity compensator 6.Gravity compensator 6 can be isolated vertical vibrations by special construction, its topworks can be in vertical accurate location, gravity compensator 6 drives leveling and focusing module 4, realize vertical fine motion adjustment function, rely on linear variable-differential transformer (LVDT) or laser interferometer measurement, can obtain accurate vertical direction control.Wafer-supporting platform 3 relies on air floating structures (among the figure not label) to swim on the leveling and focusing module 4, wafer-supporting platform 3 can horizontal direction free movement on leveling and focusing module 4, because this air floating structure is integrated in micropositioner inside, so can directly isolate the vibrations of wafer-supporting platform 3.
Horizontal drive module drive wafer-supporting platform 3, the horizontal drive module is made up of four high-precision horizontal fine motion motors 5, be installed on the motor support plate 2 and branch around wafer-supporting platform 3.Because horizontal fine motion motor 5 directly drives wafer-supporting platform 3, and the barycenter of the driving force of four horizontal fine motion motors 5 and wafer-supporting platform 3 is on same one side, can reduce level to vertical disturbance, and the quality of wafer-supporting platform 3 is very little, so just can obtain bigger acceleration.The stationary part of horizontal fine motion motor 5 is fixed on the gas foot 1, and the mover part is connected with wafer-supporting platform 3, does not have mechanical connection owing to moving between the stator, thus can level of isolation to vibrations, and can not pass on the wafer-supporting platform 3.
The micropositioner level is to separating the air floating structure that idol relies on leveling and focusing module 4 and wafer-supporting platform 3 with vertical, and level and vertical accurate location be in same level, thereby solved the problem of prior art reed decoupling zero damping effect difference well.Since adopt above-mentioned vertical and level to vibration isolating method, extraneous interference just can not passed on the wafer-supporting platform 3.
Referring to Fig. 3 and Fig. 4, catoptron 12 and 13 are installed on the wafer-supporting platform 3, and dihedral reflector vertically is installed on wafer-supporting platform 3 edges, and dihedral reflector itself is vertical mutually, use the laser interferometer measurement system, whole wafer-supporting platform 3 just can be realized high-precision location at six-freedom degree.According to the measurement result after the practical application, the vertical Positioning Precision Control that can make wafer-supporting platform 3 is in 50nm, and the horizontal location precision is controlled in the 10nm, therefore, has increased substantially the manufacturing accuracy of semiconductor equipment.
In addition, the present invention also can realize big stroke motion in conjunction with photo-etching machine work-piece platform coarse motion platform.If adopt high-precision laser interferometer control, can make whole micropositioner on big stroke, realize accurately location, thereby be implemented in stepping and scan function on the whole exposure silicon chip.As shown in Figure 4, micropositioner is incorporated on the coarse motion platform, drive to motor 9 by coarse motion platform Y, by coarse motion platform Y to guide rail 10 make micropositioner along Y to big stroke motion, coarse motion platform Y is positioned at coarse motion platform X on guide rail 8 to guide rail 10, by coarse motion platform X to motor 7 make micropositioner along X to big stroke motion, realize that at last micropositioner moves on whole marble plane 11, after coarse motion motor and the combination of fine motion motor, utilize micropositioner of the present invention just can realize the accurate location of wafer-supporting platform 3 at big stroke.
In actual applications, micropositioner of the present invention is used for the high precision photo-etching machine work-piece platform in conjunction with the coarse motion platform, according to the measurement result after the practical application, the vertical Positioning Precision Control that can make wafer-supporting platform is in 50nm, the horizontal location precision is controlled in the 10nm, therefore, increased substantially the manufacturing accuracy of semiconductor equipment.
That more than introduces only is based on preferred embodiment of the present invention, can not limit scope of the present invention with this.Any method of the present invention is done replacement, the combination, discrete of step well know in the art, and the invention process step is done well know in the art being equal to change or replace and all do not exceed exposure of the present invention and protection domain.
Claims (7)
1, but a kind of 6-freedom micro-motion platform of isolating exterior vibration, be used for the carrying of semiconductor lithography equipment silicon chip and the accurate location of little stroke, described micropositioner comprises motor support plate, the horizontal drive module, wafer-supporting platform, described horizontal drive module is installed on the motor support plate, described horizontal drive module links to each other with wafer-supporting platform, being used to drive wafer-supporting platform moves in the horizontal direction, it is characterized in that: described micropositioner also comprises the gas foot, leveling and focusing module and several gravity compensators, described gas foot is arranged at the bottom of whole micropositioner, be used to support described motor support plate and gravity compensator, described several gravity compensators are used to support the leveling and focusing module, described wafer-supporting platform relies on air floating structure to swim on the leveling and focusing module, and the level of described micropositioner is to realizing with the vertical air floating structure of separating idol dependence leveling and focusing module and wafer-supporting platform.
2, micropositioner as claimed in claim 1 is characterized in that: described micropositioner comprises three gravity compensators, is Chinese character pin-shaped distribution to support the leveling and focusing module.
3, micropositioner as claimed in claim 1 is characterized in that: described horizontal drive module is made up of four horizontal fine motion motors, is installed on the motor support plate respectively and is distributed in around the wafer-supporting platform.
4, micropositioner as claimed in claim 3 is characterized in that: the driving force of described four horizontal fine motion motors and the barycenter of wafer-supporting platform are on sustained height.
5, micropositioner as claimed in claim 3 is characterized in that: each horizontal fine motion motor includes stationary part and mover part, and described stationary part is fixed on the gas foot, and the mover part is connected with wafer-supporting platform.
6, micropositioner as claimed in claim 1 is characterized in that: described micropositioner also comprises dihedral reflector, and it vertically is installed on the wafer-supporting platform edge, and dihedral reflector itself is vertical mutually.
7, micropositioner as claimed in claim 6 is characterized in that: described dihedral reflector and external intervention instrument cooperate can make wafer-supporting platform accurately locate at six degree of freedom.
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| Application Number | Priority Date | Filing Date | Title |
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| CNB2007101735749A CN100535765C (en) | 2007-12-28 | 2007-12-28 | 6-freedom micro-motion platform capable of isolating exterior vibration |
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| CNB2007101735749A CN100535765C (en) | 2007-12-28 | 2007-12-28 | 6-freedom micro-motion platform capable of isolating exterior vibration |
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| CN101221366A CN101221366A (en) | 2008-07-16 |
| CN100535765C true CN100535765C (en) | 2009-09-02 |
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Cited By (1)
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| WO2014169550A1 (en) * | 2013-04-17 | 2014-10-23 | 深圳市科曼医疗设备有限公司 | Electrocardiograph signal collecting device and collecting method |
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| CN112701075B (en) * | 2021-03-24 | 2021-06-04 | 上海隐冠半导体技术有限公司 | Micro-motion platform, handover method and sports equipment |
| CN113917796A (en) * | 2021-09-22 | 2022-01-11 | 哈尔滨工业大学 | Multi-degree-of-freedom macro-micro hybrid precision motion platform |
| CN114562709B (en) * | 2022-03-14 | 2023-04-25 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Bottom lighting module adjusting device |
| CN117055305B (en) * | 2023-10-10 | 2023-12-22 | 无锡星微科技有限公司 | Six-degree-of-freedom air floating type mobile equipment |
| US12090590B1 (en) | 2023-10-10 | 2024-09-17 | Wuxi Xivi Science And Technology Co., Ltd. | Six-degree-of-freedom air-floating moving apparatus |
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| CN101221366A (en) | 2008-07-16 |
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Address after: 201203 Zhangjiang High Tech Park, Shanghai, Zhang Dong Road, No. 1525 Co-patentee after: Shanghai Micro And High Precision Mechine Engineering Co., Ltd. Patentee after: Shanghai microelectronics equipment (Group) Limited by Share Ltd Address before: 201203 Zhangjiang High Tech Park, Shanghai, Zhang Dong Road, No. 1525 Co-patentee before: Shanghai Micro And High Precision Mechine Engineering Co., Ltd. Patentee before: Shanghai Micro Electronics Equipment Co., Ltd. |
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