BR7705207A - CONNECTION CONDUCT MANUFACTURING PROCESS - Google Patents

CONNECTION CONDUCT MANUFACTURING PROCESS

Info

Publication number
BR7705207A
BR7705207A BR7705207A BR7705207A BR7705207A BR 7705207 A BR7705207 A BR 7705207A BR 7705207 A BR7705207 A BR 7705207A BR 7705207 A BR7705207 A BR 7705207A BR 7705207 A BR7705207 A BR 7705207A
Authority
BR
Brazil
Prior art keywords
manufacturing process
connection conduct
conduct manufacturing
connection
manufacturing
Prior art date
Application number
BR7705207A
Other languages
Portuguese (pt)
Inventor
M Vogelsberger
Original Assignee
Sev Soc Equip Vehicules Altern
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sev Soc Equip Vehicules Altern filed Critical Sev Soc Equip Vehicules Altern
Publication of BR7705207A publication Critical patent/BR7705207A/en

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/115Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0271Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0286Programmable, customizable or modifiable circuits
    • H05K1/0292Programmable, customizable or modifiable circuits having a modifiable lay-out, i.e. adapted for engineering changes or repair
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0388Other aspects of conductors
    • H05K2201/0397Tab
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09118Moulded substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431Details of mounted components
    • H05K2201/1059Connections made by press-fit insertion
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17Post-manufacturing processes
    • H05K2203/175Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447Lead-in-hole components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092Integral conductive tabs, i.e. conductive parts partly detached from the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Metallurgy (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Synchronous Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacture Of Motors, Generators (AREA)
BR7705207A 1976-08-06 1977-08-05 CONNECTION CONDUCT MANUFACTURING PROCESS BR7705207A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7624204A FR2361007A1 (en) 1976-08-06 1976-08-06 METHOD OF MANUFACTURING AN ELECTRICAL CIRCUIT IN PARTICULAR FOR A MOTOR VEHICLE ALTERNATOR RECTIFIER BRIDGE

Publications (1)

Publication Number Publication Date
BR7705207A true BR7705207A (en) 1978-06-06

Family

ID=9176659

Family Applications (1)

Application Number Title Priority Date Filing Date
BR7705207A BR7705207A (en) 1976-08-06 1977-08-05 CONNECTION CONDUCT MANUFACTURING PROCESS

Country Status (7)

Country Link
JP (1) JPS6027158B2 (en)
BR (1) BR7705207A (en)
DE (1) DE2735124A1 (en)
ES (1) ES461390A1 (en)
FR (1) FR2361007A1 (en)
GB (1) GB1548517A (en)
IT (1) IT1083395B (en)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4430798A1 (en) * 1994-08-30 1996-03-07 Siemens Ag Lead frame for connecting electrical components
FR2486323A1 (en) * 1980-07-04 1982-01-08 Paris & Du Rhone Automobile alternator combined voltage regulator and brush mounting - has moulded insulating plate with embedded conductor strip providing electrical circuit
FR2544581B1 (en) * 1983-04-14 1985-07-19 Paris & Du Rhone RECTIFIER BRIDGE FOR A MOTOR VEHICLE ALTERNATOR, WITH ANTI-INTERFERENCE CAPACITOR
DE3515911A1 (en) * 1985-05-03 1986-11-06 SWF Auto-Electric GmbH, 7120 Bietigheim-Bissingen ELECTRIC SWITCH, IN PARTICULAR STEERING SWITCH FOR MOTOR VEHICLES
DE3641995C1 (en) * 1986-12-09 1988-05-19 Philips Patentverwaltung Process for the production of printed circuits
DE3728081A1 (en) * 1987-08-22 1989-03-02 Bosch Gmbh Robert RECTIFIER BEARING DEVICE
DE3924176A1 (en) * 1988-07-26 1990-02-01 Steinmueller Kg Atlanta Kabel Prodn. of printed circuit panel by stamping conductors in meta strip - moving strip into injection mould and cutting conductors, and injecting polymer encapsulate
DE3943261C2 (en) * 1989-12-29 1994-11-24 Stocko Metallwarenfab Henkels Electrical circuit
US5043614A (en) * 1990-02-02 1991-08-27 Ford Motor Company Alternator rectifier bridge assembly
KR0165544B1 (en) * 1990-03-05 1999-03-20 야마다 로꾸이찌 Electronic sound producing device
DE4017673C2 (en) * 1990-06-01 2001-02-01 Teves Gmbh Alfred Insulating plate for electrical switches
DE4323827C1 (en) * 1993-07-15 1994-12-08 Siemens Ag Pluggable assembly
DE4327584A1 (en) * 1993-08-17 1995-02-23 Bayerische Motoren Werke Ag Electric drive unit
DE19531126C1 (en) * 1995-08-24 1996-12-12 Delphi Automotive Systems Gmbh Electrical connector with pressed metal contacts e.g. for road vehicles
DE29516161U1 (en) * 1995-10-12 1995-12-07 Stocko Metallwarenfabriken Henkels Und Sohn Gmbh & Co, 42327 Wuppertal Circuit board
DE19707709C1 (en) * 1997-02-26 1998-04-16 Siemens Ag Relay modules circuit board e.g. for automobile
DE19712314A1 (en) * 1997-03-24 1998-10-01 Thomas & Betts Gmbh Connection for the ignition device of airbag systems in motor vehicles
DE19733237C1 (en) * 1997-08-01 1999-05-20 Barlian Reinhold Electrical housing for automobiles
FR2872622B1 (en) * 2004-07-02 2006-09-29 Valeo Securite Habitacle Sas METHOD FOR MANUFACTURING AN ELECTRICAL DEVICE COMPRISING CROSS CONDUCTIVE TRACKS
CN110757717A (en) * 2019-11-29 2020-02-07 扬州扬杰电子科技股份有限公司 Plastic package mold for rectifier bridge

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1156131B (en) * 1958-06-23 1963-10-24 Ibm Deutschland Method for producing an electrical conduction pattern
DE2305883A1 (en) * 1973-02-07 1974-08-15 Finsterhoelzl Rafi Elekt CIRCUIT BOARD

Also Published As

Publication number Publication date
ES461390A1 (en) 1978-12-01
DE2735124A1 (en) 1978-02-09
JPS5340889A (en) 1978-04-13
FR2361007B1 (en) 1981-09-11
FR2361007A1 (en) 1978-03-03
DE2735124C2 (en) 1988-10-13
JPS6027158B2 (en) 1985-06-27
IT1083395B (en) 1985-05-21
GB1548517A (en) 1979-07-18

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