BR7605354A - Conjunto semicondutor encapsulado e passivado e processo de fabrica-lo - Google Patents

Conjunto semicondutor encapsulado e passivado e processo de fabrica-lo

Info

Publication number
BR7605354A
BR7605354A BR7605354A BR7605354A BR7605354A BR 7605354 A BR7605354 A BR 7605354A BR 7605354 A BR7605354 A BR 7605354A BR 7605354 A BR7605354 A BR 7605354A BR 7605354 A BR7605354 A BR 7605354A
Authority
BR
Brazil
Prior art keywords
encapsulated
manufacturing process
passivated semiconductor
semiconductor set
passivated
Prior art date
Application number
BR7605354A
Other languages
English (en)
Inventor
M Goldberg
W Voorhis
Original Assignee
Gen Instrument Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=24420755&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=BR7605354(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Gen Instrument Corp filed Critical Gen Instrument Corp
Publication of BR7605354A publication Critical patent/BR7605354A/pt

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/291Oxides or nitrides or carbides, e.g. ceramics, glass
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293Organic, e.g. plastic
    • H01L23/296Organo-silicon compounds
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135Double encapsulation or coating and encapsulation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/492Bases or plates or solder therefor
    • H01L23/4924Bases or plates or solder therefor characterised by the materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01005Boron [B]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01006Carbon [C]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01013Aluminum [Al]
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    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01014Silicon [Si]
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    • H01L2924/01015Phosphorus [P]
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    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01019Potassium [K]
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    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01023Vanadium [V]
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    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01029Copper [Cu]
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    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/0103Zinc [Zn]
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    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01039Yttrium [Y]
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    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/01042Molybdenum [Mo]
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    • H01L2924/01047Silver [Ag]
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    • H01L2924/01Chemical elements
    • H01L2924/01051Antimony [Sb]
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    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/01Chemical elements
    • H01L2924/01073Tantalum [Ta]
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    • H01L2924/01Chemical elements
    • H01L2924/01074Tungsten [W]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01075Rhenium [Re]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01082Lead [Pb]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013Alloys
    • H01L2924/0132Binary Alloys
    • H01L2924/01322Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/102Material of the semiconductor or solid state bodies
    • H01L2924/1025Semiconducting materials
    • H01L2924/10251Elemental semiconductors, i.e. Group IV
    • H01L2924/10253Silicon [Si]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/12Passive devices, e.g. 2 terminal devices
    • H01L2924/1204Optical Diode
    • H01L2924/12044OLED
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/13Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304Transistor
    • H01L2924/1306Field-effect transistor [FET]
    • H01L2924/13062Junction field-effect transistor [JFET]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
BR7605354A 1975-08-14 1976-08-16 Conjunto semicondutor encapsulado e passivado e processo de fabrica-lo BR7605354A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/604,722 US3996602A (en) 1975-08-14 1975-08-14 Passivated and encapsulated semiconductors and method of making same

Publications (1)

Publication Number Publication Date
BR7605354A true BR7605354A (pt) 1977-08-16

Family

ID=24420755

Family Applications (1)

Application Number Title Priority Date Filing Date
BR7605354A BR7605354A (pt) 1975-08-14 1976-08-16 Conjunto semicondutor encapsulado e passivado e processo de fabrica-lo

Country Status (12)

Country Link
US (1) US3996602A (pt)
JP (1) JPS5237772A (pt)
BR (1) BR7605354A (pt)
CA (1) CA1057420A (pt)
DE (1) DE2636580A1 (pt)
ES (1) ES450690A1 (pt)
FR (1) FR2321192A1 (pt)
GB (1) GB1510294A (pt)
IE (1) IE44200B1 (pt)
IT (1) IT1062666B (pt)
NL (1) NL7609034A (pt)
SE (1) SE7608988L (pt)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4187599A (en) * 1975-04-14 1980-02-12 Motorola, Inc. Semiconductor device having a tin metallization system and package containing same
US4198444A (en) * 1975-08-04 1980-04-15 General Electric Company Method for providing substantially hermetic sealing means for electronic components
JPS531469A (en) * 1976-06-26 1978-01-09 Hitachi Ltd Glass seal type semiconductor device
JPS5819125B2 (ja) * 1976-08-11 1983-04-16 株式会社日立製作所 半導体装置の製造方法
US4161746A (en) * 1978-03-28 1979-07-17 Westinghouse Electric Corp. Glass sealed diode
GB2031223A (en) * 1978-09-22 1980-04-16 Gen Instrument Corp Method for bonding a refractory metal contact member to a semiconductor body
US4571093A (en) * 1983-11-04 1986-02-18 Burroughs Corporation Method of testing plastic-packaged semiconductor devices
USRE32829E (en) * 1984-09-10 1989-01-10 General Instrument Corp. Rectifier with slug construction and mold for fabricating same
US4564885A (en) * 1984-09-10 1986-01-14 General Instrument Corporation Rectifier with slug construction and mold for fabricating same
NL8503023A (nl) * 1985-11-05 1987-06-01 Philips Nv Diode en metalen stud daarvoor.
US4745455A (en) * 1986-05-16 1988-05-17 General Electric Company Silicon packages for power semiconductor devices
US4888634A (en) * 1987-07-24 1989-12-19 Linear Technology Corporation High thermal resistance bonding material and semiconductor structures using same
US4987476A (en) * 1988-02-01 1991-01-22 General Instrument Corporation Brazed glass pre-passivated chip rectifier
US5151118A (en) * 1988-07-08 1992-09-29 Kabushiki Kaisha Goto Seisakusho Method for producing a package-type semiconductor assembly
US5008735A (en) * 1989-12-07 1991-04-16 General Instrument Corporation Packaged diode for high temperature operation
US5304429A (en) * 1992-03-24 1994-04-19 General Instrument Corporation Semiconductor devices having copper terminal leads
US5439849A (en) * 1994-02-02 1995-08-08 At&T Corp. Encapsulation techniques which include forming a thin glass layer onto a polymer layer
US6099783A (en) * 1995-06-06 2000-08-08 Board Of Trustees Operating Michigan State University Photopolymerizable compositions for encapsulating microelectronic devices
US5751061A (en) * 1995-12-18 1998-05-12 Motorola, Inc. Semiconductor diode device with non-planar heatsink and method of manufacture
US6111316A (en) * 1997-08-29 2000-08-29 Motorola, Inc. Electronic component encapsulated in a glass tube
DE102007041229A1 (de) * 2007-08-31 2009-03-05 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Schaltungsanordnung und ein Verfahren zum Verkapseln derselben
US11584673B2 (en) 2017-07-31 2023-02-21 Corning Incorporated Laminate article having a non-glass core and glass envelope and methods thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3505571A (en) * 1965-09-30 1970-04-07 Gen Electric Glass covered semiconductor device
US3913127A (en) * 1971-10-01 1975-10-14 Hitachi Ltd Glass encapsulated semiconductor device containing cylindrical stack of semiconductor pellets
US3844029A (en) * 1972-02-02 1974-10-29 Trw Inc High power double-slug diode package
JPS4970858U (pt) * 1972-10-04 1974-06-20
DE2261302A1 (de) * 1972-12-15 1974-07-04 Licentia Gmbh Halbleiteranordnung aus einem halbleiterbauelement

Also Published As

Publication number Publication date
NL7609034A (nl) 1977-02-16
ES450690A1 (es) 1977-12-01
FR2321192A1 (fr) 1977-03-11
IE44200L (en) 1977-02-14
JPS5237772A (en) 1977-03-23
US3996602A (en) 1976-12-07
GB1510294A (en) 1978-05-10
FR2321192B1 (pt) 1979-03-02
CA1057420A (en) 1979-06-26
DE2636580A1 (de) 1977-02-17
IT1062666B (it) 1984-10-20
AU1678376A (en) 1978-02-16
SE7608988L (sv) 1977-02-15
IE44200B1 (en) 1981-09-09

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