BE709891A - - Google Patents

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Publication number
BE709891A
BE709891A BE709891DA BE709891A BE 709891 A BE709891 A BE 709891A BE 709891D A BE709891D A BE 709891DA BE 709891 A BE709891 A BE 709891A
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BE
Belgium
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Filing date
Publication date
Application filed filed Critical
Publication of BE709891A publication Critical patent/BE709891A/xx

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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    • H01L24/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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    • H01L24/93Batch processes
    • H01L24/95Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
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    • H01L2224/45001Core members of the connector
    • H01L2224/45099Material
    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144Gold (Au) as principal constituent
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    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
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    • H01L2224/48227Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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    • H01L2224/852Applying energy for connecting
    • H01L2224/85201Compression bonding
    • H01L2224/85205Ultrasonic bonding
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    • H01L2224/97Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00014Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/097Glass-ceramics, e.g. devitrified glass
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    • H01L2924/1204Optical Diode
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    • H01L2924/14Integrated circuits
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Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
BE709891D 1967-01-27 1968-01-25 BE709891A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6701294A NL6701294A (en) 1967-01-27 1967-01-27

Publications (1)

Publication Number Publication Date
BE709891A true BE709891A (en) 1968-07-25

Family

ID=19799151

Family Applications (1)

Application Number Title Priority Date Filing Date
BE709891D BE709891A (en) 1967-01-27 1968-01-25

Country Status (7)

Country Link
AT (1) AT286416B (en)
BE (1) BE709891A (en)
CH (1) CH483774A (en)
DE (1) DE1285581C2 (en)
FR (1) FR1553301A (en)
GB (1) GB1211412A (en)
NL (1) NL6701294A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE68921115T2 (en) * 1988-07-25 1995-10-12 Asahi Glass Co Ltd Window antenna for a motor vehicle.
US4933812A (en) * 1989-10-11 1990-06-12 Hewlett-Packard Company Package and circuit arrangement for housing and connecting polarized electrical components and method of manufacture

Also Published As

Publication number Publication date
GB1211412A (en) 1970-11-04
DE1285581B (en) 1968-12-19
NL6701294A (en) 1968-07-29
FR1553301A (en) 1969-01-10
CH483774A (en) 1969-12-31
AT286416B (en) 1970-12-10
DE1285581C2 (en) 1973-08-23

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