AU4395185A - Producing multilayer circuit boards - Google Patents

Producing multilayer circuit boards

Info

Publication number
AU4395185A
AU4395185A AU43951/85A AU4395185A AU4395185A AU 4395185 A AU4395185 A AU 4395185A AU 43951/85 A AU43951/85 A AU 43951/85A AU 4395185 A AU4395185 A AU 4395185A AU 4395185 A AU4395185 A AU 4395185A
Authority
AU
Australia
Prior art keywords
circuit boards
multilayer circuit
producing multilayer
producing
boards
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU43951/85A
Inventor
Rainer Burger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
President Engineering Corp
Original Assignee
President Engineering Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by President Engineering Corp filed Critical President Engineering Corp
Publication of AU4395185A publication Critical patent/AU4395185A/en
Abandoned legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/34Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
    • H01L21/46Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428
    • H01L21/461Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/469Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After-treatment of these layers
    • H01L21/47Organic layers, e.g. photoresist
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4611Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4638Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431Details of mounted components
    • H05K2201/10598Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
  • Details Of Indoor Wiring (AREA)
AU43951/85A 1984-06-22 1985-06-21 Producing multilayer circuit boards Abandoned AU4395185A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3423181 1984-06-22
DE19843423181 DE3423181A1 (en) 1984-06-22 1984-06-22 METHOD FOR PRODUCING PRE-LAMINATES FOR MULTIPLE-LAYER PCB

Publications (1)

Publication Number Publication Date
AU4395185A true AU4395185A (en) 1986-01-02

Family

ID=6238964

Family Applications (1)

Application Number Title Priority Date Filing Date
AU43951/85A Abandoned AU4395185A (en) 1984-06-22 1985-06-21 Producing multilayer circuit boards

Country Status (18)

Country Link
EP (1) EP0167867A3 (en)
JP (1) JPS6169197A (en)
KR (1) KR860000711A (en)
AU (1) AU4395185A (en)
BR (1) BR8502956A (en)
CA (1) CA1224884A (en)
DD (1) DD234643A5 (en)
DE (1) DE3423181A1 (en)
DK (1) DK278185A (en)
ES (1) ES8701453A1 (en)
FI (1) FI852464L (en)
GR (1) GR851516B (en)
HU (1) HUT39311A (en)
IL (1) IL75551A0 (en)
NO (1) NO852512L (en)
PL (1) PL254118A1 (en)
PT (1) PT80686B (en)
ZA (1) ZA854662B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU592627B2 (en) * 1986-03-13 1990-01-18 Nintendo Co., Ltd. Printed circuit board capable of preventing electromagnetic interference

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62295488A (en) * 1986-06-14 1987-12-22 松下電工株式会社 Munufacture of multilayer printed interconnection board
DE3819785A1 (en) * 1988-06-10 1989-12-14 Ferrozell Sachs & Co Gmbh METHOD FOR PRODUCING MULTI-LAYER PRINTED CIRCUITS
CH678412A5 (en) * 1988-11-11 1991-09-13 Fela Planungs Ag
SE9001766L (en) * 1990-05-16 1991-09-02 Perstorp Ab SET ON MANUFACTURE OF MULTI-LAYER PATTERN CARDS
US5832596A (en) * 1996-12-31 1998-11-10 Stmicroelectronics, Inc. Method of making multiple-bond shelf plastic package

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57196598A (en) * 1981-05-29 1982-12-02 Hitachi Ltd Method of producing multilayer printed board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU592627B2 (en) * 1986-03-13 1990-01-18 Nintendo Co., Ltd. Printed circuit board capable of preventing electromagnetic interference

Also Published As

Publication number Publication date
ZA854662B (en) 1986-04-30
EP0167867A3 (en) 1987-01-28
ES8701453A1 (en) 1986-11-16
FI852464L (en) 1985-12-23
NO852512L (en) 1985-12-23
DK278185D0 (en) 1985-06-19
FI852464A0 (en) 1985-06-20
IL75551A0 (en) 1985-10-31
KR860000711A (en) 1986-01-30
EP0167867A2 (en) 1986-01-15
PT80686B (en) 1987-02-12
DD234643A5 (en) 1986-04-09
ES544405A0 (en) 1986-11-16
BR8502956A (en) 1986-03-04
PL254118A1 (en) 1986-05-06
JPS6169197A (en) 1986-04-09
CA1224884A (en) 1987-07-28
HUT39311A (en) 1986-08-28
PT80686A (en) 1985-07-01
GR851516B (en) 1985-11-25
DK278185A (en) 1985-12-23
DE3423181A1 (en) 1986-01-02

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