AU2003235846A1 - Substrate processing device, substrate processing method, and nozzle - Google Patents

Substrate processing device, substrate processing method, and nozzle

Info

Publication number
AU2003235846A1
AU2003235846A1 AU2003235846A AU2003235846A AU2003235846A1 AU 2003235846 A1 AU2003235846 A1 AU 2003235846A1 AU 2003235846 A AU2003235846 A AU 2003235846A AU 2003235846 A AU2003235846 A AU 2003235846A AU 2003235846 A1 AU2003235846 A1 AU 2003235846A1
Authority
AU
Australia
Prior art keywords
substrate processing
nozzle
processing device
processing method
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003235846A
Inventor
Masahito Hamada
Yukio Kiba
Osamu Miyahara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of AU2003235846A1 publication Critical patent/AU2003235846A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Nozzles (AREA)
  • Coating Apparatus (AREA)
AU2003235846A 2002-06-04 2003-05-06 Substrate processing device, substrate processing method, and nozzle Abandoned AU2003235846A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002163485A JP4312997B2 (en) 2002-06-04 2002-06-04 Substrate processing apparatus, substrate processing method, and nozzle
JP2002-163485 2002-06-04
PCT/JP2003/005665 WO2003103030A1 (en) 2002-06-04 2003-05-06 Substrate processing device, substrate processing method, and nozzle

Publications (1)

Publication Number Publication Date
AU2003235846A1 true AU2003235846A1 (en) 2003-12-19

Family

ID=29706635

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003235846A Abandoned AU2003235846A1 (en) 2002-06-04 2003-05-06 Substrate processing device, substrate processing method, and nozzle

Country Status (4)

Country Link
JP (1) JP4312997B2 (en)
AU (1) AU2003235846A1 (en)
TW (1) TW200307985A (en)
WO (1) WO2003103030A1 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4870342B2 (en) * 2004-08-25 2012-02-08 芝浦メカトロニクス株式会社 Two-fluid injection nozzle device
JP2007220956A (en) * 2006-02-17 2007-08-30 Toshiba Corp Substrate processing method and substrate processing apparatus
JP4900116B2 (en) * 2007-07-30 2012-03-21 東京エレクトロン株式会社 Development method, development device, and storage medium
JP4900117B2 (en) * 2007-07-30 2012-03-21 東京エレクトロン株式会社 Developing device, developing method, and storage medium
KR101202202B1 (en) * 2008-06-05 2012-11-16 도쿄엘렉트론가부시키가이샤 Liquid treatment apparatus and liquid treatment method
JP5212538B2 (en) * 2011-12-21 2013-06-19 東京エレクトロン株式会社 Development method, development device, and storage medium
JP5104994B2 (en) * 2011-12-21 2012-12-19 東京エレクトロン株式会社 Developing device, developing method, and storage medium
JP6223839B2 (en) * 2013-03-15 2017-11-01 東京エレクトロン株式会社 Substrate liquid processing method, substrate liquid processing apparatus, and storage medium
JP6203098B2 (en) 2013-03-29 2017-09-27 芝浦メカトロニクス株式会社 Substrate processing apparatus and substrate processing method
JP6341035B2 (en) * 2014-09-25 2018-06-13 東京エレクトロン株式会社 Substrate liquid processing method, substrate liquid processing apparatus, and storage medium
KR101880232B1 (en) * 2015-07-13 2018-07-19 주식회사 제우스 Substrate liquid processing apparatus and substrate liquid processing method
TWI700730B (en) * 2017-01-05 2020-08-01 大陸商盛美半導體設備（上海）股份有限公司 Wafer cleaning device and method
CN108828908B (en) * 2018-06-27 2021-11-19 上海德迈世欧化工有限公司 Developing solution processing device

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54102123A (en) * 1978-01-27 1979-08-11 Matsushita Electric Ind Co Ltd Developing method
JPH05315240A (en) * 1992-05-08 1993-11-26 Oki Electric Ind Co Ltd Developing apparatus
JP2976085B2 (en) * 1993-07-16 1999-11-10 東京エレクトロン株式会社 Processing equipment
JP3359208B2 (en) * 1995-11-28 2002-12-24 大日本スクリーン製造株式会社 Developing device
JP3251232B2 (en) * 1998-05-13 2002-01-28 ソニー株式会社 Rotary wet processing method and rotary wet processing apparatus
JP3334873B2 (en) * 2000-08-07 2002-10-15 住友精密工業株式会社 Rotary substrate processing equipment

Also Published As

Publication number Publication date
TW200307985A (en) 2003-12-16
JP4312997B2 (en) 2009-08-12
WO2003103030A1 (en) 2003-12-11
JP2004014646A (en) 2004-01-15

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase