AU2000251024A1 - Wire saw and process for slicing multiple semiconductor ingots - Google Patents

Wire saw and process for slicing multiple semiconductor ingots

Info

Publication number
AU2000251024A1
AU2000251024A1 AU2000251024A AU5102400A AU2000251024A1 AU 2000251024 A1 AU2000251024 A1 AU 2000251024A1 AU 2000251024 A AU2000251024 A AU 2000251024A AU 5102400 A AU5102400 A AU 5102400A AU 2000251024 A1 AU2000251024 A1 AU 2000251024A1
Authority
AU
Australia
Prior art keywords
wire saw
multiple semiconductor
semiconductor ingots
slicing multiple
slicing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2000251024A
Inventor
Paolo De Maria
Ferdinando Severico
Carlo Zavattari
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MEMC Electronic Materials SpA
Original Assignee
MEMC Electronic Materials SpA
SunEdison Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MEMC Electronic Materials SpA, SunEdison Inc filed Critical MEMC Electronic Materials SpA
Publication of AU2000251024A1 publication Critical patent/AU2000251024A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
    • B23D57/003—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts
    • B23D57/0061—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts of devices for guiding or feeding saw wires
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/02—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing
    • B28D1/025—Use, recovery or regeneration of abrasive mediums
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mining & Mineral Resources (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
AU2000251024A 2000-05-31 2000-05-31 Wire saw and process for slicing multiple semiconductor ingots Abandoned AU2000251024A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/IT2000/000223 WO2001091981A1 (en) 2000-05-31 2000-05-31 Wire saw and process for slicing multiple semiconductor ingots

Publications (1)

Publication Number Publication Date
AU2000251024A1 true AU2000251024A1 (en) 2001-12-11

Family

ID=11133526

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2000251024A Abandoned AU2000251024A1 (en) 2000-05-31 2000-05-31 Wire saw and process for slicing multiple semiconductor ingots

Country Status (7)

Country Link
US (1) US6941940B1 (en)
EP (1) EP1284847B1 (en)
JP (1) JP4659326B2 (en)
AU (1) AU2000251024A1 (en)
DE (1) DE60033574T2 (en)
TW (1) TW527268B (en)
WO (1) WO2001091981A1 (en)

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US20130130597A1 (en) * 2011-11-21 2013-05-23 James William Brown Glass treatment apparatus and methods of treating glass
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US10052848B2 (en) 2012-03-06 2018-08-21 Apple Inc. Sapphire laminates
CN102672832A (en) * 2012-06-08 2012-09-19 英利能源（中国）有限公司 Method for eliminating defects of head part and tail part of battery silicon block
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JP6157421B2 (en) * 2014-07-03 2017-07-05 信越半導体株式会社 Work cutting method and work holding jig
US10406634B2 (en) 2015-07-01 2019-09-10 Apple Inc. Enhancing strength in laser cutting of ceramic components
WO2018203448A1 (en) * 2017-05-02 2018-11-08 信越半導体株式会社 Workpiece cutting method and joining member
CN107486951A (en) * 2017-08-29 2017-12-19 浙江华友电子有限公司 A kind of in line efficient silicon wafer cutting device of push type
KR102037745B1 (en) * 2017-12-14 2019-10-29 에스케이실트론 주식회사 Ingot clamping device and wire sawing apparatus for cutting Ingot having the same
CN109129949B (en) * 2018-10-24 2024-02-23 乐山新天源太阳能科技有限公司 Silicon wafer multi-wire cutting machine
JP7148437B2 (en) * 2019-03-01 2022-10-05 信越半導体株式会社 Work cutting method and work cutting device
CN112372862A (en) * 2020-11-12 2021-02-19 上海新昇半导体科技有限公司 Crystal bar workpiece plate and crystal bar cutting method
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Also Published As

Publication number Publication date
DE60033574D1 (en) 2007-04-05
DE60033574T2 (en) 2007-11-15
TW527268B (en) 2003-04-11
EP1284847B1 (en) 2007-02-21
US6941940B1 (en) 2005-09-13
JP2003534939A (en) 2003-11-25
WO2001091981A1 (en) 2001-12-06
EP1284847A1 (en) 2003-02-26
WO2001091981A9 (en) 2002-03-28
JP4659326B2 (en) 2011-03-30

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