ATE370975T1 - Photoresistpolymerzusammensetzungen - Google Patents
PhotoresistpolymerzusammensetzungenInfo
- Publication number
- ATE370975T1 ATE370975T1 AT04756066T AT04756066T ATE370975T1 AT E370975 T1 ATE370975 T1 AT E370975T1 AT 04756066 T AT04756066 T AT 04756066T AT 04756066 T AT04756066 T AT 04756066T AT E370975 T1 ATE370975 T1 AT E370975T1
- Authority
- AT
- Austria
- Prior art keywords
- polymer compositions
- photoresist polymer
- polymerization
- heteroatom
- cleavage
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F20/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
- C08F20/02—Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
- C08F20/10—Esters
- C08F20/12—Esters of monohydric alcohols or phenols
- C08F20/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F20/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
- C08F220/1812—C12-(meth)acrylate, e.g. lauryl (meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
- C08F220/28—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
- C08F220/281—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety and containing only one oxygen, e.g. furfuryl (meth)acrylate or 2-methoxyethyl (meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
- C08F220/28—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
- C08F220/283—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety and containing one or more carboxylic moiety in the chain, e.g. acetoacetoxyethyl(meth)acrylate
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Materials For Photolithography (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Polymerisation Methods In General (AREA)
- Polymerization Catalysts (AREA)
- Supporting Of Heads In Record-Carrier Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US48331003P | 2003-06-26 | 2003-06-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE370975T1 true ATE370975T1 (de) | 2007-09-15 |
Family
ID=33563916
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT04756066T ATE370975T1 (de) | 2003-06-26 | 2004-06-25 | Photoresistpolymerzusammensetzungen |
Country Status (9)
Country | Link |
---|---|
US (1) | US7510817B2 (de) |
EP (1) | EP1641848B1 (de) |
JP (1) | JP4725739B2 (de) |
KR (1) | KR101057570B1 (de) |
CN (1) | CN100549051C (de) |
AT (1) | ATE370975T1 (de) |
DE (1) | DE602004008468T2 (de) |
TW (1) | TWI358609B (de) |
WO (1) | WO2005003198A1 (de) |
Families Citing this family (64)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1732408B (zh) * | 2002-12-28 | 2010-04-21 | Jsr株式会社 | 辐射敏感性树脂组合物 |
ATE370975T1 (de) | 2003-06-26 | 2007-09-15 | Jsr Corp | Photoresistpolymerzusammensetzungen |
JP2007522262A (ja) * | 2003-06-26 | 2007-08-09 | シミックス・テクノロジーズ・インコーポレイテッド | フォトレジストポリマー |
US7696292B2 (en) | 2003-09-22 | 2010-04-13 | Commonwealth Scientific And Industrial Research Organisation | Low-polydispersity photoimageable acrylic polymers, photoresists and processes for microlithography |
US8741537B2 (en) | 2005-03-04 | 2014-06-03 | Fujifilm Corporation | Positive resist composition and pattern-forming method using the same |
JP4961707B2 (ja) * | 2005-09-29 | 2012-06-27 | Jsr株式会社 | 樹脂の合成法 |
US7424818B2 (en) * | 2005-10-20 | 2008-09-16 | Boeing Company | Ultrasonic inspection reference standard for porous composite materials |
US7694546B2 (en) * | 2005-11-17 | 2010-04-13 | The Boeing Company | Porosity reference standard utilizing one or more hollow, non-cylindrical shafts |
US7752882B2 (en) | 2005-11-17 | 2010-07-13 | The Boeing Company | Porosity reference standard utilizing a mesh |
US7762120B2 (en) * | 2005-12-01 | 2010-07-27 | The Boeing Company | Tapered ultrasonic reference standard |
JP4881686B2 (ja) | 2005-12-09 | 2012-02-22 | 富士フイルム株式会社 | ポジ型レジスト組成物及びそれを用いたパターン形成方法 |
JP4881687B2 (ja) | 2005-12-09 | 2012-02-22 | 富士フイルム株式会社 | ポジ型レジスト組成物及びそれを用いたパターン形成方法 |
US7770457B2 (en) * | 2006-10-13 | 2010-08-10 | The Boeing Company | Pseudo porosity reference standard for metallic interleaved composite laminates |
US7617714B2 (en) * | 2006-12-06 | 2009-11-17 | The Boeing Company | Pseudo porosity reference standard for cored composite laminates |
US7617715B2 (en) * | 2006-12-21 | 2009-11-17 | The Boeing Company | Reference standard for ultrasonic measurement of porosity and related method |
JP4554665B2 (ja) | 2006-12-25 | 2010-09-29 | 富士フイルム株式会社 | パターン形成方法、該パターン形成方法に用いられる多重現像用ポジ型レジスト組成物、該パターン形成方法に用いられるネガ現像用現像液及び該パターン形成方法に用いられるネガ現像用リンス液 |
US8637229B2 (en) | 2006-12-25 | 2014-01-28 | Fujifilm Corporation | Pattern forming method, resist composition for multiple development used in the pattern forming method, developer for negative development used in the pattern forming method, and rinsing solution for negative development used in the pattern forming method |
US8530148B2 (en) * | 2006-12-25 | 2013-09-10 | Fujifilm Corporation | Pattern forming method, resist composition for multiple development used in the pattern forming method, developer for negative development used in the pattern forming method, and rinsing solution for negative development used in the pattern forming method |
JP5162290B2 (ja) * | 2007-03-23 | 2013-03-13 | 富士フイルム株式会社 | レジスト組成物及びそれを用いたパターン形成方法 |
EP1975714A1 (de) | 2007-03-28 | 2008-10-01 | FUJIFILM Corporation | Positive Resistzusammensetzung und Verfahren zur Strukturformung |
EP1975716B1 (de) | 2007-03-28 | 2013-05-15 | Fujifilm Corporation | Positive Resistzusammensetzung und Verfahren zur Strukturformung |
JP4621754B2 (ja) | 2007-03-28 | 2011-01-26 | 富士フイルム株式会社 | ポジ型レジスト組成物およびパターン形成方法 |
US8182975B2 (en) * | 2007-03-28 | 2012-05-22 | Fujifilm Corporation | Positive resist composition and pattern forming method using the same |
US8603733B2 (en) | 2007-04-13 | 2013-12-10 | Fujifilm Corporation | Pattern forming method, and resist composition, developer and rinsing solution used in the pattern forming method |
EP2138898B1 (de) | 2007-04-13 | 2014-05-21 | FUJIFILM Corporation | Verfahren zur Strukturbildung und Verwendung einer Fotolackzusammensetzung in diesem Verfahren |
US8034547B2 (en) * | 2007-04-13 | 2011-10-11 | Fujifilm Corporation | Pattern forming method, resist composition to be used in the pattern forming method, negative developing solution to be used in the pattern forming method and rinsing solution for negative development to be used in the pattern forming method |
JP4982288B2 (ja) * | 2007-04-13 | 2012-07-25 | 富士フイルム株式会社 | パターン形成方法 |
US8476001B2 (en) | 2007-05-15 | 2013-07-02 | Fujifilm Corporation | Pattern forming method |
US7985534B2 (en) | 2007-05-15 | 2011-07-26 | Fujifilm Corporation | Pattern forming method |
WO2008153109A1 (ja) * | 2007-06-12 | 2008-12-18 | Fujifilm Corporation | ネガ型現像用レジスト組成物及びこれを用いたパターン形成方法 |
US8632942B2 (en) | 2007-06-12 | 2014-01-21 | Fujifilm Corporation | Method of forming patterns |
US8617794B2 (en) | 2007-06-12 | 2013-12-31 | Fujifilm Corporation | Method of forming patterns |
JP4590431B2 (ja) | 2007-06-12 | 2010-12-01 | 富士フイルム株式会社 | パターン形成方法 |
KR101457927B1 (ko) | 2007-06-12 | 2014-11-07 | 후지필름 가부시키가이샤 | 네가티브 톤 현상용 레지스트 조성물 및 이것을 사용한 패턴형성방법 |
JP4617337B2 (ja) * | 2007-06-12 | 2011-01-26 | 富士フイルム株式会社 | パターン形成方法 |
US8029644B2 (en) * | 2007-11-15 | 2011-10-04 | The Beoing Company | Controlled temperature scrap removal for tape process |
US8541511B2 (en) * | 2008-07-07 | 2013-09-24 | Arkema Inc. | Amphiphilic block copolymer formulations |
US9244352B2 (en) * | 2009-05-20 | 2016-01-26 | Rohm And Haas Electronic Materials, Llc | Coating compositions for use with an overcoated photoresist |
JP5634115B2 (ja) * | 2009-06-17 | 2014-12-03 | 富士フイルム株式会社 | パターン形成方法、化学増幅型レジスト組成物及びレジスト膜 |
JP5520590B2 (ja) * | 2009-10-06 | 2014-06-11 | 富士フイルム株式会社 | パターン形成方法、化学増幅型レジスト組成物及びレジスト膜 |
JP6175769B2 (ja) | 2011-05-30 | 2017-08-09 | 三菱ケミカル株式会社 | 重合体およびその製造方法 |
JP2013129649A (ja) * | 2011-11-22 | 2013-07-04 | Central Glass Co Ltd | 珪素化合物、縮合物およびそれを用いたレジスト組成物、ならびにそれを用いるパターン形成方法 |
JP6283477B2 (ja) * | 2012-06-25 | 2018-02-21 | ローム アンド ハース エレクトロニック マテリアルズ エルエルシーRohm and Haas Electronic Materials LLC | アミド成分を含むフォトレジスト |
JP6031420B2 (ja) * | 2012-08-31 | 2016-11-24 | ダウ グローバル テクノロジーズ エルエルシー | 光酸発生剤を含む末端基を含むポリマー、前記ポリマーを含むフォトレジストおよびデバイスの製造方法 |
JP5937549B2 (ja) | 2012-08-31 | 2016-06-22 | ダウ グローバル テクノロジーズ エルエルシー | 光酸発生剤化合物、光酸発生剤化合物を含有する末端基を含むポリマー、および製造方法 |
US9017934B2 (en) | 2013-03-08 | 2015-04-28 | Taiwan Semiconductor Manufacturing Company, Ltd. | Photoresist defect reduction system and method |
US9256128B2 (en) | 2013-03-12 | 2016-02-09 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method for manufacturing semiconductor device |
US8932799B2 (en) | 2013-03-12 | 2015-01-13 | Taiwan Semiconductor Manufacturing Company, Ltd. | Photoresist system and method |
US9175173B2 (en) | 2013-03-12 | 2015-11-03 | Taiwan Semiconductor Manufacturing Company, Ltd. | Unlocking layer and method |
US9110376B2 (en) | 2013-03-12 | 2015-08-18 | Taiwan Semiconductor Manufacturing Company, Ltd. | Photoresist system and method |
US9502231B2 (en) | 2013-03-12 | 2016-11-22 | Taiwan Semiconductor Manufacturing Company, Ltd. | Photoresist layer and method |
US9543147B2 (en) | 2013-03-12 | 2017-01-10 | Taiwan Semiconductor Manufacturing Company, Ltd. | Photoresist and method of manufacture |
US9245751B2 (en) | 2013-03-12 | 2016-01-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Anti-reflective layer and method |
US9354521B2 (en) | 2013-03-12 | 2016-05-31 | Taiwan Semiconductor Manufacturing Company, Ltd. | Photoresist system and method |
US9117881B2 (en) | 2013-03-15 | 2015-08-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | Conductive line system and process |
US9341945B2 (en) | 2013-08-22 | 2016-05-17 | Taiwan Semiconductor Manufacturing Company, Ltd. | Photoresist and method of formation and use |
US10036953B2 (en) | 2013-11-08 | 2018-07-31 | Taiwan Semiconductor Manufacturing Company | Photoresist system and method |
US10095113B2 (en) | 2013-12-06 | 2018-10-09 | Taiwan Semiconductor Manufacturing Company | Photoresist and method |
US9761449B2 (en) | 2013-12-30 | 2017-09-12 | Taiwan Semiconductor Manufacturing Company, Ltd. | Gap filling materials and methods |
US9599896B2 (en) | 2014-03-14 | 2017-03-21 | Taiwan Semiconductor Manufacturing Company, Ltd. | Photoresist system and method |
US9581908B2 (en) | 2014-05-16 | 2017-02-28 | Taiwan Semiconductor Manufacturing Company, Ltd. | Photoresist and method |
US9696624B2 (en) * | 2015-07-29 | 2017-07-04 | Rohm And Haas Electronic Materials Llc | Nanoparticle-polymer resists |
US11852970B2 (en) | 2015-08-24 | 2023-12-26 | Mitsubishi Gas Chemical Company, Inc. | Material for lithography, production method therefor, composition for lithography, pattern formation method, compound, resin, and method for purifying the compound or the resin |
JP7219260B2 (ja) * | 2018-03-19 | 2023-02-07 | 株式会社ダイセル | フォトレジスト用樹脂、フォトレジスト用樹脂の製造方法、フォトレジスト用樹脂組成物、及びパターン形成方法 |
Family Cites Families (69)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5314962A (en) | 1987-04-07 | 1994-05-24 | Mitsubishi Petrochemical Company Limited | ABA type block copolymers |
MX173261B (es) | 1988-06-28 | 1994-02-14 | Minnesota Mining & Mfg | Copolimeros acrilicos y metodo para su fabricacion |
JP2578646B2 (ja) | 1988-07-18 | 1997-02-05 | 三洋電機株式会社 | 非水系二次電池 |
JP2741540B2 (ja) | 1989-07-10 | 1998-04-22 | キヤノン株式会社 | カラー画像形成装置 |
EP0421149B1 (de) | 1989-09-07 | 1994-06-01 | Tosoh Corporation | Chloroprenpolymerisat |
FR2651781B1 (fr) | 1989-09-14 | 1991-12-06 | Norsolor Sa | Polymeres a groupements disulfure de thiurame et leur preparation. |
CA2038117A1 (en) | 1990-03-29 | 1991-09-30 | Mahfuza B. Ali | Controllable radiation curable photoiniferter prepared adhesives for attachment of microelectronic devices and a method of attaching microelectronic devices therewith |
JP2648805B2 (ja) | 1990-04-24 | 1997-09-03 | インターナショナル・ビジネス・マシーンズ・コーポレイション | 液体適用型の水性処理可能なホトレジスト組成物 |
DE69214035T2 (de) | 1991-06-28 | 1997-04-10 | Ibm | Reflexionsverminderde Überzüge |
JP3568599B2 (ja) | 1993-12-28 | 2004-09-22 | 富士通株式会社 | 放射線感光材料及びパターン形成方法 |
JP3250635B2 (ja) | 1994-02-04 | 2002-01-28 | サンケン電気株式会社 | 半導体装置 |
KR100206664B1 (ko) | 1995-06-28 | 1999-07-01 | 세키사와 다다시 | 화학증폭형 레지스트 조성물 및 레지스트 패턴의 형성방법 |
EP0814095B1 (de) | 1996-06-21 | 2001-10-24 | Menicon Co., Ltd. | Verfahren zur Herstellung eines Formkörpers |
US7714075B1 (en) | 1996-07-10 | 2010-05-11 | Commonwealth Scientific And Industrial Research Organisation | Polymerization with living characteristics |
US5929271A (en) | 1996-08-20 | 1999-07-27 | Tokyo Ohka Kogyo Co., Ltd. | Compounds for use in a positive-working resist composition |
US6720186B1 (en) | 1998-04-03 | 2004-04-13 | Symyx Technologies, Inc. | Method of research for creating and testing novel catalysts, reactions and polymers |
US5962184A (en) | 1996-12-13 | 1999-10-05 | International Business Machines Corporation | Photoresist composition comprising a copolymer of a hydroxystyrene and a (meth)acrylate substituted with an alicyclic ester substituent |
US6190833B1 (en) | 1997-03-30 | 2001-02-20 | Jsr Corporation | Radiation-sensitive resin composition |
JP2943759B2 (ja) | 1997-04-16 | 1999-08-30 | 日本電気株式会社 | (メタ)アクリレート、重合体、フォトレジスト組成物およびそれを用いたパターン形成方法 |
JP3509473B2 (ja) | 1997-06-04 | 2004-03-22 | Jsr株式会社 | 感放射線性樹脂組成物 |
FR2764892B1 (fr) | 1997-06-23 | 2000-03-03 | Rhodia Chimie Sa | Procede de synthese de polymeres a blocs |
JP3902835B2 (ja) | 1997-06-27 | 2007-04-11 | 東京応化工業株式会社 | ポジ型ホトレジスト組成物 |
EP1149075B1 (de) | 1997-07-21 | 2008-12-31 | Commonwealth Scientific and Industrial Research Organisation | Synthese von dithioester-kettentransferagentien |
US6303268B1 (en) | 1997-08-14 | 2001-10-16 | Showa Denko K.K. | Resist resin, resist resin composition and method of forming pattern using resist resin and resist resin composition |
JP3228193B2 (ja) | 1997-08-27 | 2001-11-12 | 日本電気株式会社 | ネガ型フォトレジスト組成物及びそれを用いたパターン形成方法 |
JP3676918B2 (ja) | 1997-10-09 | 2005-07-27 | 富士通株式会社 | レジスト材料及びレジストパターンの形成方法 |
DE69836501T3 (de) | 1997-12-18 | 2013-07-18 | Commonwealth Scientific And Industrial Research Organisation | Polymerisationsverfahren mit lebenden eigenschaften und daraus hergestellte polymere |
JP2002500251A (ja) | 1997-12-31 | 2002-01-08 | ロディア・シミ | 制御されたラジカル重合によるジチオカーバメートからのブロックポリマーの合成方法 |
WO1999035171A1 (en) | 1998-01-09 | 1999-07-15 | The Board Of Trustees Of The Leland Stanford Jr. University | High-melting polyolefin copolymer elastomers, catalysts and methods of synthesis |
JP3955384B2 (ja) | 1998-04-08 | 2007-08-08 | Azエレクトロニックマテリアルズ株式会社 | 化学増幅型レジスト組成物 |
US20030180662A1 (en) * | 1998-05-25 | 2003-09-25 | Daicel Chemical Industries, Ltd. | Acid-sensitive compound and resin composition for photoresist |
US6291130B1 (en) | 1998-07-27 | 2001-09-18 | Fuji Photo Film Co., Ltd. | Positive photosensitive composition |
US6569971B2 (en) | 1998-08-27 | 2003-05-27 | Hyundai Electronics Industries Co., Ltd. | Polymers for photoresist and photoresist compositions using the same |
US6280911B1 (en) | 1998-09-10 | 2001-08-28 | Shipley Company, L.L.C. | Photoresist compositions comprising blends of ionic and non-ionic photoacid generators |
US6303266B1 (en) | 1998-09-24 | 2001-10-16 | Kabushiki Kaisha Toshiba | Resin useful for resist, resist composition and pattern forming process using the same |
TWI263866B (en) | 1999-01-18 | 2006-10-11 | Sumitomo Chemical Co | Chemical amplification type positive resist composition |
JP3963602B2 (ja) | 1999-01-27 | 2007-08-22 | 富士フイルム株式会社 | 遠紫外線露光用ポジ型フォトレジスト組成物 |
JP4150834B2 (ja) | 1999-03-04 | 2008-09-17 | Jsr株式会社 | 感光性樹脂組成物、感光性樹脂膜およびこれらを用いたバンプ形成方法 |
JP2000275838A (ja) * | 1999-03-25 | 2000-10-06 | Fuji Photo Film Co Ltd | ポジ型フォトレジスト組成物 |
US6596458B1 (en) | 1999-05-07 | 2003-07-22 | Fuji Photo Film Co., Ltd. | Positive-working photoresist composition |
FR2794463B1 (fr) | 1999-06-04 | 2005-02-25 | Rhodia Chimie Sa | Procede de synthese de polymeres par polymerisation radicalaire controlee a l'aide de xanthates halogenes |
JP4566304B2 (ja) | 1999-08-06 | 2010-10-20 | ニチバン株式会社 | 光硬化型シーリング剤 |
US6492086B1 (en) | 1999-10-08 | 2002-12-10 | Shipley Company, L.L.C. | Phenolic/alicyclic copolymers and photoresists |
JP4135276B2 (ja) | 1999-10-12 | 2008-08-20 | Jsr株式会社 | 感放射線性樹脂組成物 |
JP4282185B2 (ja) | 1999-11-02 | 2009-06-17 | 株式会社東芝 | フォトレジスト用高分子化合物及びフォトレジスト用樹脂組成物 |
US6517990B1 (en) | 2000-01-19 | 2003-02-11 | Samsung Electronics Co., Ltd. | Photosensitive polymer including copolymer of alkyl vinyl ether and resist composition containing the same |
US6596899B1 (en) * | 2000-02-16 | 2003-07-22 | Noveon Ip Holdings Corp. | S,S′BIS-(α, α′-DISUBSTITUTED-α″-ACETIC ACID)- TRITHIOCARBONATES AND DERIVATIVES AS INITIATOR-CHAIN TRANSFER AGENT-TERMINATOR FOR CONTROLLED RADICAL POLYMERIZATIONS AND THE PROCESS FOR MAKING THE SAME |
US6468712B1 (en) | 2000-02-25 | 2002-10-22 | Massachusetts Institute Of Technology | Resist materials for 157-nm lithography |
JP3994680B2 (ja) | 2000-04-04 | 2007-10-24 | 住友化学株式会社 | 化学増幅型ポジ型レジスト組成物 |
DE60100463T2 (de) | 2000-04-04 | 2004-05-13 | Sumitomo Chemical Co., Ltd. | Chemisch verstärkte, positiv arbeitende Resistzusammensetzung |
FR2809829B1 (fr) | 2000-06-05 | 2002-07-26 | Rhodia Chimie Sa | Nouvelle composition photosensible pour la fabrication de photoresist |
JP2002030116A (ja) | 2000-07-14 | 2002-01-31 | Tokyo Ohka Kogyo Co Ltd | 新規コポリマー、ホトレジスト組成物、および高アスペクト比のレジストパターン形成方法 |
DE60143334D1 (de) | 2000-08-21 | 2010-12-09 | Tokyo Ohka Kogyo Co Ltd | Vernetzte, positiv arbeitende Photoresist-Zusammensetzung |
US6518364B2 (en) | 2000-09-28 | 2003-02-11 | Symyx Technologies, Inc. | Emulsion living-type free radical polymerization, methods and products of same |
US6569969B2 (en) * | 2000-09-28 | 2003-05-27 | Symyx Technologies, Inc. | Control agents for living-type free radical polymerization, methods of polymerizing and polymers with same |
US6395850B1 (en) | 2000-09-28 | 2002-05-28 | Symyx Technologies, Inc. | Heterocycle containing control agents for living-type free radical polymerization |
US6380335B1 (en) * | 2000-09-28 | 2002-04-30 | Symyx Technologies, Inc. | Control agents for living-type free radical polymerization, methods of polymerizing and polymers with same |
JP4051931B2 (ja) * | 2001-01-18 | 2008-02-27 | Jsr株式会社 | 感放射線性樹脂組成物 |
KR20030081462A (ko) | 2001-02-26 | 2003-10-17 | 로디아 쉬미 | 저에너지 표면의 친수성을 증가시키기 위한 양쪽성 블록코폴리머의 용도 |
JP2002357905A (ja) * | 2001-03-28 | 2002-12-13 | Sumitomo Chem Co Ltd | レジスト組成物 |
US6517994B2 (en) | 2001-04-10 | 2003-02-11 | Shin-Etsu Chemical Co., Ltd. | Lactone ring-containing (meth)acrylate and polymer thereof for photoresist composition |
DE60225550T2 (de) | 2001-05-04 | 2009-04-02 | Rhodia Chimie | Blockcopolymer-tenside durch eine kontrollierte radikalpolymerisation hergestellt |
EP1392737B1 (de) | 2001-05-04 | 2007-07-04 | Rhodia Chimie | Verfahren zur radikalen reduzierung von dithiocarbonyl- und dithiophosphorylfunktionen von polymeren |
JP3970562B2 (ja) * | 2001-07-10 | 2007-09-05 | ダイセル化学工業株式会社 | 粒子状フォトレジスト用高分子化合物とその製造法 |
JP4727092B2 (ja) * | 2001-09-10 | 2011-07-20 | 東京応化工業株式会社 | 化学増幅型レジスト組成物 |
JP4149154B2 (ja) * | 2001-09-28 | 2008-09-10 | 富士フイルム株式会社 | ポジ型レジスト組成物 |
TWI291953B (de) * | 2001-10-23 | 2008-01-01 | Mitsubishi Rayon Co | |
JP3803313B2 (ja) * | 2002-10-10 | 2006-08-02 | 富士通株式会社 | レジスト材料及びレジストパターンの形成方法 |
ATE370975T1 (de) | 2003-06-26 | 2007-09-15 | Jsr Corp | Photoresistpolymerzusammensetzungen |
-
2004
- 2004-06-25 AT AT04756066T patent/ATE370975T1/de not_active IP Right Cessation
- 2004-06-25 KR KR1020057024783A patent/KR101057570B1/ko active IP Right Grant
- 2004-06-25 JP JP2006517641A patent/JP4725739B2/ja not_active Expired - Lifetime
- 2004-06-25 CN CNB2004800224609A patent/CN100549051C/zh not_active Expired - Fee Related
- 2004-06-25 TW TW093118645A patent/TWI358609B/zh not_active IP Right Cessation
- 2004-06-25 WO PCT/US2004/020351 patent/WO2005003198A1/en active IP Right Grant
- 2004-06-25 DE DE602004008468T patent/DE602004008468T2/de not_active Expired - Lifetime
- 2004-06-25 EP EP04756066A patent/EP1641848B1/de not_active Expired - Lifetime
-
2005
- 2005-12-12 US US11/300,657 patent/US7510817B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
CN1845941A (zh) | 2006-10-11 |
WO2005003198A1 (en) | 2005-01-13 |
US20060257781A1 (en) | 2006-11-16 |
JP4725739B2 (ja) | 2011-07-13 |
DE602004008468D1 (en) | 2007-10-04 |
JP2007526496A (ja) | 2007-09-13 |
KR101057570B1 (ko) | 2011-08-17 |
TWI358609B (en) | 2012-02-21 |
TW200508795A (en) | 2005-03-01 |
CN100549051C (zh) | 2009-10-14 |
US7510817B2 (en) | 2009-03-31 |
EP1641848A1 (de) | 2006-04-05 |
KR20060088480A (ko) | 2006-08-04 |
EP1641848B1 (de) | 2007-08-22 |
DE602004008468T2 (de) | 2008-05-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ATE370975T1 (de) | Photoresistpolymerzusammensetzungen | |
MXPA02010628A (es) | Floculantes polimericos modificados estructuralmente. | |
DE50303577D1 (de) | Verfahren zur herstellung von isobutenpolymeren | |
BR0002671A (pt) | Composição adesiva dental | |
ATE357450T1 (de) | In einem selbstätzendes, selbstgrundierendes dentales haftmittel | |
NO20002547D0 (no) | Poly(vinylamin)-baserte superabsorberende geler og fremgangsmÕte for fremstilling derav | |
EP1767555A3 (de) | Neuees Polymer und Zementzusatzmittel | |
HRP20050319A2 (en) | Water-soluble polymer alkanals | |
DE502006006005D1 (de) | Verfahren zur um- oder veresterung von seitenketten in polymeren | |
BRPI0914103A2 (pt) | utilização de um copolímero hidrossolúvel ou álcali-solúvel | |
EE200000313A (et) | Meetod väga madala jääkmonomeerisisaldusega sünteetiliste polümerisaatide valmistamiseks, selle meetodi järgi valmistatud produktid ja nende kasutamine | |
EA200601468A1 (ru) | Частицы | |
BRPI0407882A (pt) | conjugados de polìmero-porção de fator viii | |
EA200600510A1 (ru) | Способ распылительной полимеризации | |
EA200200401A1 (ru) | Противовирусные композиции | |
BRPI0810766A2 (pt) | Polímero de silicone enxertado e produtos feitos com mesmo | |
TW200942967A (en) | Positive photosensitive polymer composition | |
ATE338775T1 (de) | Wässrige polymerdispersion | |
DE60101283D1 (de) | "Living radical" Polymerisation | |
BR9901393A (pt) | Dispositivos oculares produzidos com absorvedores de ultravioleta latente polimerizável por radicais livres | |
EA200901426A1 (ru) | Полимермодифицированная асфальтовая композиция, способ ее получения и ее применение | |
DE602007007437D1 (de) | Verfahren zur herstellung von stabilisiertem latex mittels emulsionspolymerisation | |
NO20060413L (no) | Polymeriseringsmetode for fremstilling av (ko)polymerer | |
BR9914104A (pt) | Processo para preparação de polìmeros contendo grupos terminais n--o | |
ES2148983T3 (es) | Nueva composicion de cemento fosfomagnesiano que comprende un polimero en forma de particulas. |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |