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Open Comunication Module

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FW & SW debug info

Features SW Part:

  • Read/Write via Bulk EP.

  • Planning support all available busses on HW MCU - USART/SPI/I2C/CAN.

  • Planning support some busses via SW layer - PATA/1-Wire.

Features HW Part:

  • Small size PCB - only 40 x 40 mm.

  • Modular device architecture.

  • USB Type-C connection to host.

  • Host powered device.

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STM32F4 custom USB device with bulk comunication

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