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IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT, VOL. 43,
NO. 3, JUNE 1994
489
CMOS Photodetectors for Industrial Position Sensing
sion:
Anssi J. Miikynen, Juha T. Kostamovaara, and Tim0 E. Rahkonen
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where the uncertainties in the parameter measurements are defined as
+
Here A = (2.303/20)10k = 0.115(AT l ) , and 6f and 6s are
the elementary errors in the resonant frequency measurement and
the transmission coefficient measurements, respectively, with 7 1 =
0.1.2.3.. . .. The discrete character of the measurements causes a
similar distribution of errors. Because there is no continuous spectrum
of readings available, the error in the resonant frequency measurement
h f may have a value of 6 f , / 2 or any multiple n thereof, where 6f,
is the increment of the frequency change in the measuring system.
The incremental error in the resonant frequency measurement was
0.025 MHz and 0.04 MHz, for the two modes, respectively, and the
error in the transmission coefficient measurement 6S21 was evaluated
experimentally for both modes of the cavity operation as 0.015 to
0.02 dB.
The uncertainty of mass determination, as calculated from (6) and
(7) for n l = 2 and 712 = 3, is approximately 2.5 mg for both modes
of cavity operation. These values are consistent with those found
previously 111 in which the uncertainty in moisture determination
by this technique was less than 1 % moisture. They indicate that
the uncertainty in the weighting of a single seed (average weight
w l i 0 mg), &0.2 mg, has a negligible effect on the final accuracy
of measurement. Thus, the mass of a single soybean seed may be
determined with an uncertainty of 5 milligrams at the 95-percent
confidence level nondestructively, without need for contact between
the measuring system and the object. Similar possibilities have been
demonstrated for other objects of organic as well as inorganic origin
[31-[51.
111. CONCLUSIONS
The moisture content and mass of single soybean seeds can be
determined by simultaneous measurement of the frequency shift and
change in the transmission characteristic of a resonant cavity at
microwave frequencies when the seed is inserted into an empty cavity.
Achieved uncertainties of less than 1% moisture content and 3% in
the mass determination are sufficiently accurate for practical interest
and potential development.
Abstract-The properties of a CMOS-compatible pn-photodiode, phototransistor, and one-dimensional lateral-effect photodiode (LEP) for
position-sensing applications are characterized. The photodiode and phototransistor seem to have properties that are comparable to typical
commercial photodetectors despite the quite large variations in their
spatial and spectral responses and the lower responsivity in the nearinfrared band. In addition to the above properties the LEP’s show
excellent linearity, but 3-4 times larger NEP than corresponding commercial LEP’s due to low resistance of the current dividing layer. The
responsivity variations have no effect on the linearity of the LEP, and the
slightly lower responsivity at near-infrared has only a negligible effect on
the achievable resolution (SNR). These properties, usually considered as
weak points of CMOS-compatible photodetectors, are believed to have
little or no effect on the properties of a position sensor, if the diameter
of the light spot is small (< 100pm). CMOS-compatible photodetectors
are therefore believed to be very suitable for industrial position-sensing
applications.
I. INTRODUCTION
P
OSITION-sensitive detectors (PSD’s) are widely used in optoelectronic instruments in industrial applications, which include
measurements of movement, angle, straightness, object location,
height, and centering. PSD’s in these instruments are applied for
determining the position of a light spot on the focal plane of the
receiving optics. Various types of photodetectors are used as PSD’s
including bicell and quadrant detectors, lateral-effect photodiodes
(LEP), and multielement arrays. In many applications, sensors with
rugged construction, real-time response, high accuracy, small size,
low power consumption, and simple signal processing are of the
utmost importance. These include, for example, portable sensor
systems for field applications. Standard CMOS technology provides
one way of implementing such sensors. Various kinds of CMOScompatible optical sensors have been reported during recent years,
including a single-chip video camera [l], a monolithic optical position
encoder [2], and a two-dimensional visual tracking array [3], etc.
[41-[71.
Our goal is to develop a PSD with integrated signal processing
for a portable optoelectronic instrument to be used in long-range
outdoor applications. Therefore, in addition to the above-mentioned
properties, the sensor should be as immune to air turbulences as
possible in order to maintain the sensor inherent accuracy. This is
ensured by using focused optics and a detector suitable for such focal
plane processing. There are basically three possible detector types that
can be used: a four-quadrant detector, a lateral-effect photodiode,
and an area array detector. The need for small size, low power
consumption and real-time operation excludes CCD-type detectors.
Quadrant detectors have very high inherent sensitivity, but because
they need to be defocused to obtain a certain measurement field, their
resolution in a turbulent environment is severely impaired [8]. At the
moment an LEP provides the best compactness and overall resolution
due to its immunity to turbulences. An area array is believed to
provide the optimal solution for our needs if small enough pixelto-pixel spacing can be implemented, because it is highly linear
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REFERENCES
A. W. Kraszewski, T.-S. You, and S. 0. Nelson, “Microwave resonator
technique for moisture content determination in single soybean seeds,”
IEEE Trans. Insfrum. Meas., vol. 38, no. 1, pp. 79-84, Feb. 1989.
A. W. Kraszewski, S.0. Nelson, and T.-S. You, “Moisture content determination in single corn kernels by microwave resonator techniques,”
J . Agric. Eng. Res., vol. 48, no. 1, pp. 77-87, 1991.
A. W. Kraszewski and S. 0. Nelson, “Nondestructive microwave
measurement of moisture content and mass of single peanut kernels,”
Trans. ASAE, vol. 36, no. I , pp. 127-134, 1993.
__. “Observations on resonant cavity perturbation by dielectric objects,” IEEE Trans. Microwave Theory Te;.hn.. vol. MTT-40, no. 1, pp.
151-155, Jan. 1992.
-,
“Resonant microwave cavities for sensing properties of agricultural products.” Trans. ASAE, vol. 35, no. 4, pp. 1315-1321, 1992.
Manuscript received July 16, 1993.
The authors are with the Electronics Laboratory, University of Oulu,
Linnanmaa, SF-90570 Oulu, Finland.
IEEE Log Number 9402235.
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490
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IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT, VOL. 43, NO. 3, JUNE 1994
and insensitive to turbulences due to focusing and because moderate
lateral resolutions can be achieved with much lower signal power
than with an LEP.
There are three obvious solutions to our problem: a CMOScompatible array-type detector with local computation such as proposed in papers [4] and [ 5 ] , for example; a commercially available
linear (duolateral) LEP with a CMOS-ASIC for signal processing;
or a CMOS-compatible tetralateral LEP the nonlinearity of which is
minimized by using the anode geometry proposed in paper [9] with
signal-processing electronics integrated on the same chip. As a first
step towards an integrated position sensor, we have characterized the
properties of some CMOS-compatible photodetectors which could be
used as basic elements of the sensor chip, namely a pn-photodiode,
a phototransistor, and an LEP.
PD
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ANODE
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1
1
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1
n
P
P1
P
11. DESCRIPTION OF THE IMPLEMENTED
CMOS-COMPATIBLE PHOTODETECTORS
.
A. CMOS-Compatible Photodetectors
LEP
ANODE
In a standard CMOS process there are basically two photodetector
structures available: photodiode and phototransistor. The photodiode
has the advantage of better linearity and faster response time whereas
the phototransistor benefits from greater gain [ 3 ] .Two pn-junctions
have been mainly utilized to implement photodetectors: the wellsubstrate and the well-diffused junctions. The well-substrate photodiode has the best responsivity due to a wide depletion region and
because it is also able to collect the minority carriers photogenerated
deeply in the substrate provided that they are generated within
the diffusion length of the minority camers. The well-substrate
photodiode also has the lowest capacitance, which helps to achieve a
high bandwidth. The disadvantages of the well-substrate photodiode
are its sensitivity to substrate noise and crosstalk from the neighboring
photodiodes due to the long diffusion length of the camers [6], [7].
The CMOS-compatible phototransistors are based on vertical or
lateral structure. The lateral transistor provides a higher , j , but has
a complicated structure and large device-to-device variations, both
of which can be detrimental to array-type detector implementation
and performance. The vertical parasitic PNP bipolar transistor in the
n-well CMOS process provides high compactness, moderate gain,
and speed. Using a special layout, gains of over one hundred can be
achieved within a large dynamic range with this structure [lo].
A lateral-effect photodiode is an analog photodetector which can
provide continuous information about the position of a light spot on
the detector's active surface. The LEP is a large photodiode with
extended electrodes at the edges of a resistive layer. The position
is derived by dividing carriers generated in the illuminated region
between the electrodes in proportion to the conductance of the current
paths between the illuminated region and the electrodes. Since the
photon-generated current through each of the lateral contacts is a
function only of the distance of the light spot centroid from these
contacts, position information can be extracted by measuring the
currents of the contacts. One way to construct a CMOS-compatible
LEP is to use the basic well-substrate photodiode with appropriate end
contacts in the well. This structure provides all the advantages that a
well-substrate phototiode has, plus the highest possible resistivity for
the current dividing layer (well). This means the lowest possible detector noise, because the thermal noise of the interelectrode resistance
almost solely determines the noise level of the device.
B. Implemented Photodetecmr. Structures
CATHODE
n+
\
P+
1
CATHODE1
P+
CATHODES
n+
D
Fig. 1. Implemented CMOS-compatible photosensor structures: photodiode
one-dimensional
,
lateral-effect photodiode (LEP).
(PD), phototransistor (IT)
polysilicon-two-metal n-well CMOS process. The operation of the
detectors is based on the well-substrate junction. The substrate and
the well with diffusion strapping form the anode and cathode of the
photodiode, respectively. The cathode diffusion has narrow metal
contact wires spaced every 75 pm. The anode contact is made to
the p+ guard ring surrounding the detector. The total Si02 thickness
above the Si is about 1.65 pni and the Si3N4 above that about
1 pin. The active area size of the photodiode is 0.5 x 0.5nim2.
The phototransistor is a vertical, parasitic PNP-transistor having the
same size and geometrical structure as the photodiode. The LEP is
one-dimensional, and its active area dimensions are 1 x 0.13nini2.
It uses the same structure as the photodiode except that there is
diffusion only under the cathode end-contacts. The LEP was made
one-dimensional, because the geometry is inherently linear (unlike
two-dimensional tetralateral geometry), enabling us to better detect
the amount of the technology-dependent nonlineanties caused by
such factors as nonuniform spatial responsivity or nonuniformities
in the current dividing layer, for example. The extemal connections
of the photodiode and phototransistor were made by using standard
pads including protection devices. The LEP was connected without
protection devices.
111. EXPERIMENTAL RESULTS
The experimental results are presented in Table I. According
to the results, most of the measured properties of the photodiode
and phototransistor are comparable with the commercially available
detectors produced with tailored technologies. At 4.5 V reverse
bias the capacitance was about 30 pF/nim2, which is sufficiently
small to achieve speeds high enough for most applications. A 34
ns risetime was achieved by connecting the photodiode to a 150
MHz transimpedance amplifier. In this experiment, the speed was
slowed down remarkably by the extra series resistance 1-2 kl2) of
the ESD protection device, and the response time is believed to be
only a few nanoseconds if the photodiode was connected directly to
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The implemented photosensor structures are presented in Fig. 1 .
The photosensors were realized using the standard 1.2 / / i i i one-
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49 1
IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT, VOL. 43, NO. 3, JUNE 1994
TABLE I
EXPERIMENTAL
RESULTS
OF THE PHOTODIODE
(PD),
PHOTOTRANSISTOR
(PT), AND LATERAL-EFFECT
PHOTODIODE
(LEP)
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Property
Response S
Spectral
variation of
S
Spatial
variation of
S
Junction
capacitance
c,
Dark current
Id
Shunt
resistance
Unit
Comments
PD
PT
A/W
0.47
%
f20
X = 0.63 pm," ) A =
27.5 0.4 * ) 0.85pm
- 0.6pm < X < 0.75 p m
%
f15
f8
LEP
-
-
I
pF
7
6
-
r;
pA
7
11
-
L-, = 4.9 v
MR
770
710
-
UT = 0
NEP
Interelectrode
resistance
v,
ns
pW/&z
kQ
34
_
< 5 ns, t , > 100 ns
56
-
t,
-
2.5
X = 0.85pm,f = 1 kHz
-
16.8
-
-
900
1000
1100
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0.5
I
%
600
700
800
WAVELENGTH [nm]
Fig. 2. Spectral response of the photodiode.
I
0.~1
R S
Nonlinearity
500
400
300
= 4.5 v
L't(ris) = 100 mV
Rsh
Risetime t,-
0.6
&0.2 90% of the active
dimension
i
A/w 0.2
0
a transimpedance amplifier. The shunt resistance of several hundred
Mn and the dark current of only 30 pA/mm2 suggest quite normal
sensitivity provided that other noise sources such as substrate noise
do not dominate.
The most distinct differences between the tested CMOS photodetectors and detectors produced with tailored processes were
found by examining the spectral and spatial responses. The average
responsivity of the photodiode at 633 nm was 0.47 A/W, which is
about the same as the commercial detecors have. The responsivity
of the phototransistor, 27 Am, corresponds to the typical value
of B achievable with the vertical transistor in this process. The
spectral responsivity of the photodiode presented in Fig. 2 has a
peak-to-peak ripple of about 1!~20%,in the visible band, and in the
near-infrared the average responsivity is somewhat damped compared
to a typical Si detector. The ripple is caused by incident light
interference in passivation layers, and the low responsivity in the
near-infrared is believed to be caused by the inefficient collection of
the minority carriers photogenerated deep in the substrate [ 111. The
spatial responsivity was measured by scanning the detector surface
with a 50 pm light spot of a HeNe laser. The responsivity variations
were *l5% for the diode (Fig. 3) and +8%. for the transistor. The
changes are quite smooth if we compare them to the dimensions
of a typical light spot (z100pm) used in position sensing, and
therefore their contributions, to the nonlinearity of a position sensor
are believed to be quite small, irrespective of the principle of the PSD
implementation. The spatial variations are believed to be caused by
passivation layer thickness variations which modulate the responsivity
together with the interference effect.
The properties of the LEP were evaluated by measuring the
responsivity, noise, and linearity. The responsivity was measured
using an infrared-emitting LED ( A = 850 nm) and was about 0.4
A m , which is slightly better than that measured for the photodiode
(0.32 Am).The difference is probably due to the uncertainty caused
by the ripple. The noise equivalent power (NEP) calculated on
the basis of the measured noise and responsivity was about 2.5
pW/JHz ( A = 850 nm), which is 3 4 times larger than that of
a typical commercial LEP. This is mainly due to the quite low
50 100
micrometre
O0 450
Fig. 3. Spatial response of the photodiode.
r-
-2 i
-3
-0.5 -0.4
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-0.3 -0.2 -0.1
0
0.1
0.2 0.3
POSITION OF THE LIGHT SPOT [mm]
0.4
0.5
Fig. 4. Nonlinearity of the lateral-effect photodiode.
resistivity (2.4kR/D) of the well acting as the current dividing
layer. The linearity of the detector was measured using a light spot
the diameter of which was about 130 pm. The measured peak-topeak nonlinearity error was only &0.2'% when 90% of the active
dimension was used; this clearly indicates that CMOS-compatible
LEP's are suitable for high-accuracy position sensing (Fig. 4).
IV. CONCLUSIONS
We have characterized the properties of a CMOS-compatible pnphotodiode, phototransistor, and LEP which could be used as basic
elements of a new position sensor chip and found them very suitable
for our purpose. According to the experimental results the CMOScompatible photodiode and phototransistor seem to have properties
that are comparable with typical silicon photodetectors fabricated
with special technologies despite the quite large variations in spatial
and spectral responses and the lower responsivity in the near-
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IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT, VOL. 43, NO. 3, JUNE 1994
infrared band. However, in such position-sensing applications, where
the light spot diameter has to be small (< 100pm), the spatial
responsivity variations have little effect on the performance of the
position sensor. This can be clearly seen from the excellent linearity
of the one-dimensional LEP. The spectral responsivity variations
affect only slightly the NEP of the detector which in many cases
can be neglected. The NEP of the LEP is 3-4 times larger than
that of the commercially available detectors, but this is mainly due
to the low resistivity of the well. To be used in high-accuracy
position-sensing applications, the CMOS-compatible LEPs should be
implemented using processes with high (> 10kQ) well resistivities,
or the properties of some new structures like the pinched well, for
example, should be examined as the current dividing layer. In order
to be suitable for two-dimensional applications the possibilities of
minimizing the quite large inherent nonlinearity of the tetralateral
geometry should be studied.
Angular Range Extension of an Analog Integrated
Circuit Synthesizing Trigonometric Functions
Stephanus J. Spammer, Pieter L. Swart, and Johan Meyer
Abstract-The fixed scale factors of analog integrated circuit trigonometric function converters limit their maximum input angular range.
A method to increase the total input span is described. Experimental
results demonstrate that the input range can be extended easily from the
maximum value of f 3 n to f l G . r r . By changing the hardware resolution,
it may even be increased further. Factors which determine the angular
resolution and linearity of the improved function converter are discussed.
I. INTRODUCTION
T
RIGONOMETRIC function generators are typically used in
analog computation applications such as polar-to-rectangular and
rectangular-to-polar conversions [ 11, [2]. Other applications of these
components include the generation of quadrature signals used in
phase-tracking circuits for open-loop optical-fiber gyroscopes [3], [4].
One method of generating trigonometric functions is by ROM
(read-only memory) look-up tables in conjunction with D/A (digitalto-analog) and A D (analog-to-digital) converters. Another method
of synthesizing trigonometric functions involves analog integrated
circuits such as the AD 639 made by Analog Devices. The same
trigonometric function converter can easily be used to generate sine,
consine, and tangent functions and their inverses. With an ambient
scale factor of 50”/V, the maximum input rating of the AD 639
is &12 V or k600” [2]. This poses a limitation on applications
which require the range to exceed *600”. One way of increasing the
maximum range of these components is to subtract from or to add to
the input a specific value. This can be done with analog components,
but they are prone to drift with temperature, or the output may become
unstable at transition levels of comparators, for instance.
This paper introduces an easily realizable mapping technique
surmounting the deficiency of limited input range. The method
involves the addition of an A/D and D/A converter which enables
one to subtract quantities equal to the equivalent of multiples of 27r
from the input signal of the AD 639. A theoretical model of the
system which is verified experimentally is introduced.
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REFERENCES
D. Renshaw, P. B. Denyer, G. Wang, and M. Lu, “Asic image sensors,”
in Proc. IEEE Int. Symp. Circuits and Systems, New Orleans, LA, 1990,
pp. 3038-3041.
P. Aubert, H. Oguey, and R. Vuilleumier, “Monolithic optical position
encoder with on-chip photodiodes,” IEEE J . Solid-State Circuits, vol.
23, pp. 465473, Apr. 1988.
S. P. DeWeerth and C. A. Mead, “A two-dimensional visual tracking
array,” in Proc. MIT Conf. VLSI. Cambridge, MA: M.I.T. Press, 1988,
pp. 259-275.
D. L. Stanley, “An object position and orientation IC with embedded
imager,” IEEE J . Solid-State Circuits, vol. 26, pp. 1853-1859, Dec.
1991.
W. R. Gonnason, J. W. Haslett, and F. N. Trofimenkoff, “A low cost
high resolution optical position sensor,” IEEE Trans. Instrum. Meas.,
vol. 39, pp. 658-663, Aug. 1990.
A. GNSS, L. R. Carley, and T. Kanade, “Integrated sensor and rangefinding analog signal processor,” IEEE J . Solid-Srare Circuits, vol. 26,
pp. 18L191, Mar. 1991.
0. Yadid-Pecht, R. Ginosar, and Y. S. Diamand, “A random access
photodiode array for intelligent image capture,” IEEE Trans. Electron
Devices, vol. 38, pp. 1772-1780, Aug. 1991.
A. M&ynen, J. Kostamovaara, and R. Myllyla, “Small angle measurement in a turbulent environment using position-sensitive detectors,” in
Engineering Systems with Intelligence, S. G. Tzafestas, Ed. Dordrecht,
The Netherlands: Kluwer, 1991, pp. 275-284.
Y. Terada and K. Yamamoto, “An improvement on two-dimensional
position sensitive semiconductor detector,” Japan. J . Optics, vol. 12,
no. 5 , pp. 367-373, 1983.
M. P. Vidal, M. Bafleur, J. Buxo, and G . Sarrabayrouse, “A bipolar
photodetector compatible with standard CMOS technology,” Solid-Stare
Electron., vol. 34, pp. 809-814, Aug. 1991.
G. Soncini, M. Zen, M. Rudan, and G. Verzellesi, “On the electrooptical characteristics of CMOS compatible photodiodes,” in Conf. Rec.
Melecon ’91, Ljubjana, Yugoslavia, May 1991.
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11. THEORY
Consider a trigonometric function converter with input range
[ - m 7 r , m x ] , where m = 1, 2 or 3. The output obtained can be
any one of the trigonometric functions sine, cosine, tangent or their
corresponding inverses. Consider an independent variable y with
domain [ - hh].
. where I; is an integer which is equal to or larger
than m . We want to map the variable y into a variable ?/ with a
domain which is identical to the input range of the trigonometric
function converter. The range of the transformed variable Q obtained
by the desired mapping of y is a subset of the set [-h,
k7r] given
by [-m7r. m7r] where m 5 I;. The mapping
Q = [y
+m
7r
signum ( y)] modulo (27rm)
- m 7r signum ( y )
(1)
Manuscript received January 5 , 1993; revised October 5 , 1993.
The authors are with the Sensors Sources and Signal Processing Research
Group, Faculty of Engineering, Rand Afrikaans University, Auckland Park
2006, South Africa.
IEEE Log Number 9302065.
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0018-9456/94$04.00 0 1994 IEEE