Thermally conductive and electrically insulating materials have attracted much attention due
to their applications in the field of microelectronics, but through-plane thermal conductivity of …

Overgrowth of the intermetallic compound (IMC) layer between Sn–58 wt.% Bi (Sn–58Bi)
solders and Cu substrates significantly degrades the reliability of electronic products …

In this study, a semi-empirical computational heat transfer model has been developed to
simulate anisotropic thermal characteristics in nickel-rich rechargeable 21700 lithium-ion …

Present developing trends in the miniaturization and power escalation on electronic
components have driven research interest in thermal interface materials (TIMs) to solve the …

A reusable phase-change thermal interface structure having a metal based foam and a
fusible metal based alloy is provided. In a solid phase of the fusible metal based alloy the …

Hexagonal boron nitride (h-BN) is one of the promising two-dimensional (2D) materials to
enhance the thermal, optical, electrical, and mechanical properties of polymer …

Abstract Development of polymeric packaging materials for electronic devices have attracted
discussions in many published works amid challenges in high speed electronic …

X‐ray photoelectron spectroscopy (XPS) was used to study the properties of liquid oxidation
of Sn‐Bi‐Zn (SBZ) solder alloys and the effect of Al/P on the oxide film. The results showed …

The aerospace sector demands optimum properties and optimized property combinations of
polymers and nanocomposites for specific applications [1À3]. Their low density …

通过考察P 在纯锡中的作用, 探讨微量P, P/Cu/Zn 对Sn-Bi 基合金焊料组织, 拉伸性能,
形变断裂的影响. 结果显示在纯锡中添加1%(质量分数, 下同) P, 能够提高强度, 刚度, 降低塑性; …