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EP1978551
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EP About this file: EP1978551
| EP1978551 - Substrate for thin chip packagings [Right-click to bookmark this link] | Status | The application is deemed to be withdrawn Status updated on 09.04.2010 Database last updated on 06.12.2024 | Most recent event Tooltip | 09.04.2010 | Application deemed to be withdrawn | published on 12.05.2010 [2010/19] | Applicant(s) | For all designated states Biar, Jeff 12F. No. 138, Heping Rd. Hsinchu City 300 / TW | For all designated states Huang, Chih-Kung 12F, No. 138, Heping Rd. Hsinchu City 300 / TW | [2008/41] | Inventor(s) | 01 /
see applicant ... | [2008/41] | Representative(s) | Straus, Alexander Patentanwälte Becker, Kurig, Straus Bavariastrasse 7 80336 München / DE | [N/P] |
| Former [2008/41] | Straus, Alexander Patentanwälte Becker, Kurig, Straus Bavariastrasse 7 80336 München / DE | Application number, filing date | 08001445.9 | 25.01.2008 | [2008/41] | Priority number, date | TW20070205417U | 03.04.2007 Original published format: TW 96205417 U | [2008/41] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP1978551 | Date: | 08.10.2008 | Language: | EN | [2008/41] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 28.05.2008 | Classification | IPC: | H01L21/48, H01L23/498, H01L23/31 | [2008/41] | CPC: |
H01L21/4846 (EP,US);
H01L21/4832 (EP,US);
H01L21/568 (EP,US);
H01L23/3121 (EP,US);
H01L23/49816 (EP,US);
H01L21/6835 (EP,US);
H01L2224/32245 (EP,US);
H01L2224/48247 (EP,US);
H01L2224/73265 (EP,US);
| C-Set: |
H01L2224/73265, H01L2224/32245, H01L2224/48247, H01L2924/00012 (EP,US)
| Designated contracting states | AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MT, NL, NO, PL, PT, RO, SE, SI, SK, TR [2008/41] | Title | German: | Substrat für Dünnchipgehäuse | [2008/41] | English: | Substrate for thin chip packagings | [2008/41] | French: | Substrat pour conditionnements de fines puces | [2008/41] | Examination procedure | 07.04.2009 | Examination requested [2009/22] | 18.06.2009 | Despatch of a communication from the examining division (Time limit: M04) | 18.06.2009 | Invitation to provide information on prior art | 29.10.2009 | Application deemed to be withdrawn, date of legal effect [2010/19] | 04.12.2009 | Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division and information on prior art not received in time [2010/19] | Fees paid | Penalty fee | Additional fee for renewal fee | 31.01.2010 | 03 M06 Not yet paid |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [XY]US2004106288 (IGARASHI YUSUKE [JP], et al) [X] 1-5,7-11 * paragraphs [0038] , [0065] , [0067]; figures 1-4 * [Y] 6; | [Y]JP2005136207 (NORTH KK) [Y] 6 * abstract * |