Yu et al., 2014 - Google Patents

Polymer‐Assisted Metal Deposition (PAMD): A Full‐Solution Strategy for Flexible, Stretchable, Compressible, and Wearable Metal Conductors

Yu et al., 2014

View PDF
Document ID
3502101760935554366
Author
Yu Y
Yan C
Zheng Z
Publication year
Publication venue
Advanced Materials

External Links

Snippet

Metal interconnects, contacts, and electrodes are indispensable elements for most applications of flexible, stretchable, and wearable electronics. Current fabrication methods for these metal conductors are mainly based on conventional microfabrication procedures …
Continue reading at www.researchgate.net (PDF) (other versions)

Similar Documents

Publication Publication Date Title
Yu et al. Polymer‐Assisted Metal Deposition (PAMD): A Full‐Solution Strategy for Flexible, Stretchable, Compressible, and Wearable Metal Conductors
Gong et al. Multiscale soft–hard interface design for flexible hybrid electronics
Wang et al. Standing enokitake-like nanowire films for highly stretchable elastronics
An et al. Self-Junctioned Copper Nanofiber Transparent Flexible Conducting Film via Electrospinning and Electroplating.
Liu et al. Surface‐Grafted Polymer‐Assisted Electroless Deposition of Metals for Flexible and Stretchable Electronics
Cheng et al. Stretchable thin‐film electrodes for flexible electronics with high deformability and stretchability
JP4737348B2 (en) Method for forming transparent conductive layer pattern
Hsu et al. Electrolessly deposited electrospun metal nanowire transparent electrodes
Cai et al. Selective electroless metallization of micro-and nanopatterns via poly (dopamine) modification and palladium nanoparticle catalysis for flexible and stretchable electronic applications
Guo et al. Matrix-assisted catalytic printing for the fabrication of multiscale, flexible, foldable, and stretchable metal conductors
Hidber et al. New strategy for controlling the size and shape of metallic features formed by electroless deposition of copper: Microcontact printing of catalysts on oriented polymers, followed by thermal shrinkage
KR101219613B1 (en) Metal-carbon hybrid nanostructure film and preparing method of the same
Wang et al. Quasi in situ polymerization to fabricate copper nanowire-based stretchable conductor and its applications
Liang et al. Microfluidic patterning of metal structures for flexible conductors by in situ polymer‐assisted electroless deposition
Azzaroni et al. Polyelectrolyte brushes as efficient ultrathin platforms for site-selective copper electroless deposition
Ko et al. Stretchable conductive adhesives with superior electrical stability as printable interconnects in washable textile electronics
WO2011074418A1 (en) Laminated body comprising porous layer and functional laminate using same
WO2007097249A1 (en) Porous film and layered product including porous film
Niu et al. Robust deposition of silver nanoparticles on paper assisted by polydopamine for green and flexible electrodes
Hu et al. SU-8-induced strong bonding of polymer ligands to flexible substrates via in situ cross-linked reaction for improved surface metallization and fast fabrication of high-quality flexible circuits
US20170267532A1 (en) Multi-functionalized carbon nanotubes
Yu et al. Binding conductive ink initiatively and strongly: transparent and thermally stable cellulose nanopaper as a promising substrate for flexible electronics
Xu et al. Fabrication of copper patterns on polydimethylsiloxane through laser-induced selective metallization
US20160157344A1 (en) Structure of conductive lines and method of manufacturing the same
Wang et al. Flexible Multifunctionalized Carbon Nanotubes‐Based Hybrid Nanowires