Tseng et al., 2012 - Google Patents

Thermal conductivity and morphology of silver‐filled multiwalled carbon nanotubes/polyimide nanocomposite films

Tseng et al., 2012

Document ID
14045400165769879004
Author
Tseng I
Lin H
Tsai M
Chen D
Publication year
Publication venue
Journal of Applied Polymer Science

External Links

Snippet

A facile methodology has been developed to synthesize silver‐filled multiwalled carbon nanotubes (S‐MWNTs)‐polyimide (PI) nanocomposites with high thermal conductivity for applications in flexible printed circuits or buried film capacitors, requiring efficient heat …
Continue reading at onlinelibrary.wiley.com (other versions)

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
    • C08K3/00—Use of inorganic ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
    • C08K3/00—Use of inorganic ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/22—Expanded, porous or hollow particles

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