WO2021026957A1 - High-precision large panel-level micro-assembly device - Google Patents

High-precision large panel-level micro-assembly device Download PDF

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Publication number
WO2021026957A1
WO2021026957A1 PCT/CN2019/101957 CN2019101957W WO2021026957A1 WO 2021026957 A1 WO2021026957 A1 WO 2021026957A1 CN 2019101957 W CN2019101957 W CN 2019101957W WO 2021026957 A1 WO2021026957 A1 WO 2021026957A1
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Prior art keywords
vision
turntable
board
assembly equipment
precision large
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PCT/CN2019/101957
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French (fr)
Chinese (zh)
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王敕
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苏州艾科瑞思智能装备股份有限公司
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Publication of WO2021026957A1 publication Critical patent/WO2021026957A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft

Definitions

  • the invention relates to the technical field of wafer packaging, in particular to a high-precision large-board-level micro-assembly equipment.
  • the panel-level fan-out chip loading machine is a key equipment in the semiconductor packaging production line, and it has a very wide range of applications in chip loading.
  • the panel-level fan-out chip loading machine needs to take the chips from a large-size wafer with a diameter of 12 inches, and then mount them on a 650X650-size panel with high speed and precision.
  • the existing panel-level fan-out type chip loading machine is mainly a rotary arm type chip loading machine, that is, the chip-to-substrate turnover is realized by the rotation of a mechanical arm.
  • the present invention aims to provide a method to overcome the shortcomings in the prior art.
  • the technical solution of the present invention is:
  • a high-precision large-board-level micro-assembly equipment comprising: a wafer table, a first transfer mechanism, a rotation mechanism, a second transfer mechanism, and a loading table;
  • the first transfer mechanism is located above the wafer stage, and transfers the chips on the wafer stage to the rotation mechanism;
  • the rotation mechanism is located between the wafer table and the loading table, and includes: a turntable that rotates with an axis perpendicular to the table surface as a rotation axis, and the turntable receives the chips from the first transfer mechanism and transfers the chips by rotating The chip is transferred to the second transfer mechanism;
  • the second transfer mechanism is located above the loading table, and the second transfer mechanism transfers the chips on the turntable to the rotation mechanism.
  • the first conveying mechanism includes: a first conveying arm, a first suction nozzle arranged at an end of the first conveying arm, and driving the first conveying arm
  • the first driving structure of the arm action includes: a first screw that drives the first transmission arm to move along the X-axis direction, and drives the first screw and its upper first transmission arm to move along the Z axis.
  • the first cylinder moving in the axial direction.
  • the turntable has a disc structure, and the rotation axis of the disc structure is an axis passing through the center of the disc.
  • the turntable is a rectangular plate, and the rotation axis of the rectangular plate is an axis passing through the center of the rectangular plate.
  • the turntable is driven to rotate by a rotating motor, and the motor shaft of the rotating motor is drivingly connected to the turntable through a flange.
  • the second conveying mechanism includes: a second conveying arm, a second suction nozzle arranged at the end of the second conveying arm, and driving the second conveying
  • the second driving structure of the arm action includes: a second screw that drives the second transmission arm to move along the X-axis direction, a second screw that drives the second screw and its upper second transmission arm along Z The second cylinder moving in the axial direction.
  • the first conveying mechanism, the rotating mechanism, the second conveying mechanism, and the loading table form a loading station, and the loading station is mirror-symmetrically left and right. Distributed on both sides of the wafer table.
  • the high-precision large-board-level micro-assembly equipment further includes: a first vision, a second vision, a third vision, and a fourth vision.
  • the first vision is located at The upper part of the wafer table is located obliquely above the first conveying mechanism, the second vision and the third vision are located above the turntable, and the second vision is correspondingly arranged above the loading level, The third vision is correspondingly arranged above the unloading position, and the fourth vision is located on the upper part of the loading table.
  • the beneficial effect of the present invention is that the high-precision large-board-level micro-assembly equipment of the present invention uses a turntable for loading and feeding by rotating, which is compared with the way that multiple rotating arms are used for loading. It has the advantages of short feeding stroke and high efficiency, which is beneficial to improve the loading efficiency and realize the miniaturization of the equipment volume.
  • Fig. 1 is a front view of an embodiment of the high-precision large-board-level micro-assembly equipment of the present invention.
  • the high-precision large-board-level micro-assembly equipment includes: a wafer stage 1, a first transfer mechanism 2, a rotating mechanism 3, a second transfer mechanism 4, and a loading stage 5.
  • the wafer table 1 is used to place large-size wafers.
  • the placed wafers are cut into several wafers in advance, and the wafers are transferred to the rotating mechanism 3 through the first transfer mechanism 2.
  • the first transfer mechanism 2 is located above the wafer table 1. In order to realize the transfer of wafers, the first transfer mechanism 2 needs to be able to move horizontally and vertically in a vertical plane.
  • the first conveying mechanism 2 includes: a first conveying arm 21, a first suction nozzle 22 provided at an end of the first conveying arm 21, and a first driving structure for driving the first conveying arm 21 to move. twenty three.
  • the first driving structure 23 includes: a first screw rod 231 that drives the first transfer arm 21 to move along the X axis, and drives the first screw rod 231 and its upper first transmission arm along the Z axis direction Movement of the first cylinder 232.
  • the first transfer arm 21 descends to the table surface of the wafer table 1, sucks chips through the first suction nozzle 22 thereon, and continues to rise to a certain level under the drive of the first air cylinder 232
  • driven by the first screw rod 231 it moves horizontally to the top of the rotating mechanism 3, and is again driven by the first air cylinder 232 to drop to the height of the rotating mechanism 3.
  • the first suction nozzle 22 releases the pressure to place the sucked chip To the rotating mechanism 3.
  • the first cylinder 232 can also be replaced by a screw rod or a cam or a direct drive motor.
  • the rotating mechanism 3 is used to transfer the chips from the first transfer mechanism 2 to the second transfer mechanism 4, which is located between the wafer table 1 and the loading table 5.
  • the rotating mechanism 3 includes: The axis is the turntable 31 on which the shaft rotates.
  • the turntable 31 may be a disc structure.
  • the rotation axis of the disc structure is an axis passing through the center of the disc.
  • the turntable 31 may also be a rectangular plate.
  • the rotation axis of the rectangular plate is an axis passing through the center of the rectangular plate.
  • the turntable 31 is driven to rotate by a rotating motor 32.
  • the motor shaft of the rotating motor 32 is drivingly connected to the turntable 31 through a flange. Therefore, after the turntable 31 receives the chips from the first conveying mechanism 2, it is driven by the rotating motor 32 to convey the chips to the second conveying mechanism 4 through a rotary motion.
  • the second transfer mechanism 4 is used to transfer the chips on the turntable 31 to the rotation mechanism 3, which is located above the loading table 5. In order to realize the transfer of wafers, a second transfer mechanism 4 is required. Able to move horizontally and vertically in the vertical plane.
  • the second conveying mechanism 4 includes: a second conveying arm 41, a second suction nozzle 42 provided at the end of the second conveying arm 41, and a second driving structure for driving the second conveying arm 41 to move. 43.
  • the second driving structure 43 includes: a second screw rod 431 that drives the second transmission arm 41 to move along the X-axis direction, and drives the second screw rod 431 and its upper second transmission arm along the Z-axis direction Movement of the second cylinder 432.
  • the second transfer arm 41 descends to the height of the rotating mechanism 3, sucks the chip through the second suction nozzle 42 on it, and continues to rise to the height under the drive of the second air cylinder 432 At a certain height, it moves horizontally to the top of the loading table 5 under the drive of the second screw rod 431, and is again driven by the second air cylinder 432 to drop to the table where the loading table 5 is located.
  • the chip is placed on the loading table 5.
  • the second cylinder 432 can also be replaced by a screw rod or a cam or a direct drive motor.
  • the loading table 5 is used as a table for chip loading. It can be set on a base and can slide along the slide rail 51 on the base to meet actual loading requirements.
  • the high-precision large board-level micro-assembly equipment of this embodiment can also be designed as a double-station chip loading machine.
  • the first conveying mechanism 2, the rotating mechanism 3, the second conveying mechanism 4, and the loading table 5 form a loading station, which is mirrored and symmetrically distributed on the left and right sides of the wafer table 1.
  • the two loading stations share the wafer table 1 in the middle, and suck chips from the wafer table 1 for mounting operations.
  • the high-precision large-board-level micro-assembly equipment also has multiple CCD vision detectors, which can observe the orientation of key positions during the chip turnover process. To ensure the accuracy of subsequent chip mounting.
  • the high-precision large-board-level micro-assembly equipment includes: a first vision 61, a second vision 62, a third vision 63, and a fourth vision 64.
  • the first vision 61 is used to observe and feed back the orientation of the chip when it is rotated by the first conveying mechanism 2.
  • the first vision 61 is located on the upper part of the wafer stage and is located obliquely above the first transfer mechanism.
  • the second vision 62 and the third vision 63 are respectively used to observe and feed back the orientation of the chip when it is loaded and unloaded by the turntable 31.
  • the second vision 62 and the third vision 63 are located above the turntable, and the second vision 62 is correspondingly disposed above the upper material level, and the third vision 63 is correspondingly disposed above the lower material level.
  • the four vision 64 is used to observe and feedback the orientation of the chip when the chip is finally loaded, and the fourth vision 64 is located on the upper part of the loading table.
  • the high-precision large-board-level micro-assembly equipment of the present invention uses a turntable for loading and feeding by rotating. Compared with the method of loading with multiple rotating arms, it has a short feeding stroke and high efficiency. The advantages are conducive to improving the loading efficiency and miniaturization of the equipment volume.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

A high-precision large panel-level micro-assembly device, comprising: a wafer stage (1), a first delivery mechanism (2), a rotation mechanism (3), a second delivery mechanism (4), and a die bonding stage (5). The first delivery mechanism (2) is located above the wafer stage (1), and delivers a die on the wafer stage (1) to the rotation mechanism (3); the rotation mechanism (3) is located between the wafer stage (1) and the die bonding stage (5), and comprises a turntable (31) that rotates with the axis perpendicular to the table surface as the rotation axis; the turntable (31) receives the die from the first delivery mechanism (2), and delivers the die to the second delivery mechanism (4) by means of rotation; the second delivery mechanism (4) is located above the die bonding stage (5), and the second delivery mechanism (4) delivers the die on the turntable (31) to the die bonding stage (5). The turntable performs die bonding and feeding by means of rotation, providing the advantages of short feeding stroke and high efficiency compared with a mode of feeding by using multiple rotation arms, thereby facilitating improvement of the die bonding efficiency and implementation of device miniaturization.

Description

高精度大板级微组装设备High-precision large board-level micro-assembly equipment 技术领域Technical field
本发明涉及晶圆片封装技术领域，尤其涉及一种高精度大板级微组装设备。The invention relates to the technical field of wafer packaging, in particular to a high-precision large-board-level micro-assembly equipment.
背景技术Background technique
面板级扇出型装片机是半导体封装生产线中的关键设备，其在芯片装片中具有非常广泛的应用。面板级扇出型装片机需要从直径12寸的大尺寸晶圆上取片，然后高速精准的贴装在650X650尺寸的面板上。现有的面板级扇出型装片机主要为旋臂式装片机，即通过机械臂的旋转实现芯片至基板周转。然而，上述旋臂式装片机通常需要多个旋臂配合工作，其需要面板级扇出型装片机需要提供较长的运动行程，如此增大了设备的尺寸，且旋臂式装片机也存在装片效率不高的问题。因此，针对上述问题，有必要提出进一步地解决方案。The panel-level fan-out chip loading machine is a key equipment in the semiconductor packaging production line, and it has a very wide range of applications in chip loading. The panel-level fan-out chip loading machine needs to take the chips from a large-size wafer with a diameter of 12 inches, and then mount them on a 650X650-size panel with high speed and precision. The existing panel-level fan-out type chip loading machine is mainly a rotary arm type chip loading machine, that is, the chip-to-substrate turnover is realized by the rotation of a mechanical arm. However, the above-mentioned rotary arm type film loader usually requires multiple rotary arms to work together, which requires a panel-level fan-out type film loader to provide a longer movement stroke, which increases the size of the equipment and the rotary arm type The machine also has the problem of low film loading efficiency. Therefore, it is necessary to propose further solutions to the above problems.
发明内容Summary of the invention
本发明旨在提供一种，以克服现有技术中存在的不足。The present invention aims to provide a method to overcome the shortcomings in the prior art.
为解决上述技术问题，本发明的技术方案是：To solve the above technical problems, the technical solution of the present invention is:
一种高精度大板级微组装设备，其包括：晶圆台、第一传送机构、旋转机构、第二传送机构以及装片台；A high-precision large-board-level micro-assembly equipment, comprising: a wafer table, a first transfer mechanism, a rotation mechanism, a second transfer mechanism, and a loading table;
所述第一传送机构位于所述晶圆台上方，其将晶圆台上的芯片传送至所述旋转机构上；The first transfer mechanism is located above the wafer stage, and transfers the chips on the wafer stage to the rotation mechanism;
所述旋转机构位于所述晶圆台和装片台之间，其包括：以垂直于台面的 轴线为转轴进行旋转的转台，所述转台接收来自所述第一传送机构的芯片，并通过旋转运动将芯片传送至第二传送机构处；The rotation mechanism is located between the wafer table and the loading table, and includes: a turntable that rotates with an axis perpendicular to the table surface as a rotation axis, and the turntable receives the chips from the first transfer mechanism and transfers the chips by rotating The chip is transferred to the second transfer mechanism;
所述第二传送机构位于所述装片台上方，所述第二传送机构将所述转台上的芯片传送至所述旋转机构上。The second transfer mechanism is located above the loading table, and the second transfer mechanism transfers the chips on the turntable to the rotation mechanism.
作为本发明的高精度大板级微组装设备的改进，所述第一传送机构包括：第一传送臂、设置于所述第一传送臂端部的第一吸嘴以及驱动所述第一传送臂动作的第一驱动结构，所述第一驱动结构包括：带动所述第一传送臂沿X轴方向运动的第一丝杆、带动所述第一丝杆及其上第一传动臂沿Z轴方向运动的第一气缸。As an improvement of the high-precision large-board-level micro-assembly equipment of the present invention, the first conveying mechanism includes: a first conveying arm, a first suction nozzle arranged at an end of the first conveying arm, and driving the first conveying arm The first driving structure of the arm action, the first driving structure includes: a first screw that drives the first transmission arm to move along the X-axis direction, and drives the first screw and its upper first transmission arm to move along the Z axis. The first cylinder moving in the axial direction.
作为本发明的高精度大板级微组装设备的改进，所述转台为一圆盘结构，所述圆盘结构的转轴为通过圆盘中心的轴线。As an improvement of the high-precision large-board-level micro-assembly equipment of the present invention, the turntable has a disc structure, and the rotation axis of the disc structure is an axis passing through the center of the disc.
作为本发明的高精度大板级微组装设备的改进，所述转台为一矩形板，所述矩形板的转轴为通过矩形板中心的轴线。As an improvement of the high-precision large-board-level micro-assembly equipment of the present invention, the turntable is a rectangular plate, and the rotation axis of the rectangular plate is an axis passing through the center of the rectangular plate.
作为本发明的高精度大板级微组装设备的改进，所述转台由一旋转电机带动旋转，所述旋转电机的电机轴通过法兰与所述转台传动连接。As an improvement of the high-precision large-board-level micro-assembly equipment of the present invention, the turntable is driven to rotate by a rotating motor, and the motor shaft of the rotating motor is drivingly connected to the turntable through a flange.
作为本发明的高精度大板级微组装设备的改进，所述第二传送机构包括：第二传送臂、设置于所述第二传送臂端部的第二吸嘴以及驱动所述第二传送臂动作的第二驱动结构，所述第二驱动结构包括：带动所述第二传送臂沿X轴方向运动的第二丝杆、带动所述第二丝杆及其上第二传动臂沿Z轴方向运动的第二气缸。As an improvement of the high-precision large-board-level micro-assembly equipment of the present invention, the second conveying mechanism includes: a second conveying arm, a second suction nozzle arranged at the end of the second conveying arm, and driving the second conveying The second driving structure of the arm action, the second driving structure includes: a second screw that drives the second transmission arm to move along the X-axis direction, a second screw that drives the second screw and its upper second transmission arm along Z The second cylinder moving in the axial direction.
作为本发明的高精度大板级微组装设备的改进，所述第一传送机构、旋转机构、第二传送机构以及装片台形成一上料工位，所述上料工位左右镜像 对称地分布于所述晶圆台的两侧。As an improvement of the high-precision large-board-level micro-assembly equipment of the present invention, the first conveying mechanism, the rotating mechanism, the second conveying mechanism, and the loading table form a loading station, and the loading station is mirror-symmetrically left and right. Distributed on both sides of the wafer table.
作为本发明的高精度大板级微组装设备的改进，所述高精度大板级微组装设备还包括：第一视觉、第二视觉、第三视觉以及第四视觉，所述第一视觉位于所述晶圆台的上部，并位于所述第一传送机构的斜上方，所述第二视觉和第三视觉位于所述转台的上方，且所述第二视觉对应设置于上料位的上方，第三视觉对应设置于下料位的上方，所述第四视觉位于所述装片台的上部。As an improvement of the high-precision large-board-level micro-assembly equipment of the present invention, the high-precision large-board-level micro-assembly equipment further includes: a first vision, a second vision, a third vision, and a fourth vision. The first vision is located at The upper part of the wafer table is located obliquely above the first conveying mechanism, the second vision and the third vision are located above the turntable, and the second vision is correspondingly arranged above the loading level, The third vision is correspondingly arranged above the unloading position, and the fourth vision is located on the upper part of the loading table.
与现有技术相比，本发明的有益效果是：本发明的高精度大板级微组装设备采用转台通过旋转的方式进行装片上料，其相比采用多个旋臂进行上料的方式，具有上料行程短、效率高的优点，有利于提高装片效率以及实现设备体积的小型化。Compared with the prior art, the beneficial effect of the present invention is that the high-precision large-board-level micro-assembly equipment of the present invention uses a turntable for loading and feeding by rotating, which is compared with the way that multiple rotating arms are used for loading. It has the advantages of short feeding stroke and high efficiency, which is beneficial to improve the loading efficiency and realize the miniaturization of the equipment volume.
附图说明Description of the drawings
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明中记载的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。In order to explain the embodiments of the present invention or the technical solutions in the prior art more clearly, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only These are some of the embodiments described in the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative work.
图1为本发明的高精度大板级微组装设备一实施例的主视图。Fig. 1 is a front view of an embodiment of the high-precision large-board-level micro-assembly equipment of the present invention.
具体实施方式detailed description
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.
如图1所示，本发明一实施例的的高精度大板级微组装设备包括：晶圆台1、第一传送机构2、旋转机构3、第二传送机构4以及装片台5。As shown in FIG. 1, the high-precision large-board-level micro-assembly equipment according to an embodiment of the present invention includes: a wafer stage 1, a first transfer mechanism 2, a rotating mechanism 3, a second transfer mechanism 4, and a loading stage 5.
所述晶圆台1用于放置大尺寸晶圆，放置的晶圆被提前切割为若干晶圆片，晶圆片通过第一传送机构2传送至旋转机构3上。The wafer table 1 is used to place large-size wafers. The placed wafers are cut into several wafers in advance, and the wafers are transferred to the rotating mechanism 3 through the first transfer mechanism 2.
所述第一传送机构2位于所述晶圆台1上方，为了实现晶圆片的传送，需要第一传送机构2能够在竖直平面内进行水平以及竖直方向的移动。具体地，所述第一传送机构2包括：第一传送臂21、设置于所述第一传送臂21端部的第一吸嘴22以及驱动所述第一传送臂21动作的第一驱动结构23。The first transfer mechanism 2 is located above the wafer table 1. In order to realize the transfer of wafers, the first transfer mechanism 2 needs to be able to move horizontally and vertically in a vertical plane. Specifically, the first conveying mechanism 2 includes: a first conveying arm 21, a first suction nozzle 22 provided at an end of the first conveying arm 21, and a first driving structure for driving the first conveying arm 21 to move. twenty three.
其中，所述第一驱动结构23包括：带动所述第一传送臂21沿X轴方向运动的第一丝杆231、带动所述第一丝杆231及其上第一传动臂沿Z轴方向运动的第一气缸232。从而，在第一气缸232的带动下，第一传送臂21下降至晶圆台1的台面处，通过其上的第一吸嘴22吸取芯片，并继续在第一气缸232的带动下上升至一定高度，然后在第一丝杆231的带动下水平运动至旋转机构3上方，并再次由第一气缸232带动下降至旋转机构3所在的高度处，第一吸嘴22泄压将吸取的芯片放置到旋转机构3上。此外，所述第一气缸232也可由丝杆或者凸轮或者直驱电机所替代。Wherein, the first driving structure 23 includes: a first screw rod 231 that drives the first transfer arm 21 to move along the X axis, and drives the first screw rod 231 and its upper first transmission arm along the Z axis direction Movement of the first cylinder 232. Thus, driven by the first air cylinder 232, the first transfer arm 21 descends to the table surface of the wafer table 1, sucks chips through the first suction nozzle 22 thereon, and continues to rise to a certain level under the drive of the first air cylinder 232 Then, driven by the first screw rod 231, it moves horizontally to the top of the rotating mechanism 3, and is again driven by the first air cylinder 232 to drop to the height of the rotating mechanism 3. The first suction nozzle 22 releases the pressure to place the sucked chip To the rotating mechanism 3. In addition, the first cylinder 232 can also be replaced by a screw rod or a cam or a direct drive motor.
所述旋转机构3用于将来自第一传送机构2的芯片传送至第二传送机构4，其位于所述晶圆台1和装片台5之间，所述旋转机构3包括：以垂直于台面的轴线为转轴进行旋转的转台31。The rotating mechanism 3 is used to transfer the chips from the first transfer mechanism 2 to the second transfer mechanism 4, which is located between the wafer table 1 and the loading table 5. The rotating mechanism 3 includes: The axis is the turntable 31 on which the shaft rotates.
所述转台31可以为一圆盘结构，优选地，所述圆盘结构的转轴为通过圆盘中心的轴线。可替代地，所述转台31还可以为一矩形板，优选地，所述矩形板的转轴为通过矩形板中心的轴线。The turntable 31 may be a disc structure. Preferably, the rotation axis of the disc structure is an axis passing through the center of the disc. Alternatively, the turntable 31 may also be a rectangular plate. Preferably, the rotation axis of the rectangular plate is an axis passing through the center of the rectangular plate.
本实施例中，所述转台31由一旋转电机32带动旋转，此时，所述旋转电机32的电机轴通过法兰与所述转台31传动连接。从而，所述转台31接收来自所述第一传送机构2的芯片后，在旋转电机32的带动下，通过旋转运动将芯片传送至第二传送机构4处。In this embodiment, the turntable 31 is driven to rotate by a rotating motor 32. At this time, the motor shaft of the rotating motor 32 is drivingly connected to the turntable 31 through a flange. Therefore, after the turntable 31 receives the chips from the first conveying mechanism 2, it is driven by the rotating motor 32 to convey the chips to the second conveying mechanism 4 through a rotary motion.
所述第二传送机构4用于将所述转台31上的芯片传送至所述旋转机构3上，其位于所述装片台5上方，为了实现晶圆片的传送，需要第二传送机构4能够在竖直平面内进行水平以及竖直方向的移动。具体地，所述第二传送机构4包括：第二传送臂41、设置于所述第二传送臂41端部的第二吸嘴42以及驱动所述第二传送臂41动作的第二驱动结构43。The second transfer mechanism 4 is used to transfer the chips on the turntable 31 to the rotation mechanism 3, which is located above the loading table 5. In order to realize the transfer of wafers, a second transfer mechanism 4 is required. Able to move horizontally and vertically in the vertical plane. Specifically, the second conveying mechanism 4 includes: a second conveying arm 41, a second suction nozzle 42 provided at the end of the second conveying arm 41, and a second driving structure for driving the second conveying arm 41 to move. 43.
其中，所述第二驱动结构43包括：带动所述第二传送臂41沿X轴方向运动的第二丝杆431、带动所述第二丝杆431及其上第二传动臂沿Z轴方向运动的第二气缸432。从而，在第二气缸432的带动下，第二传送臂41下降至旋转机构3所在的高度处，通过其上的第二吸嘴42吸取芯片，并继续在第二气缸432的带动下上升至一定高度，然后在第二丝杆431的带动下水平运动至装片台5上方，并再次由第二气缸432带动下降至装片台5所在的台面处，第二吸嘴42泄压将吸取的芯片放置到装片台5上。此外，所述第二气缸432也可由丝杆或者凸轮或者直驱电机所替代。Wherein, the second driving structure 43 includes: a second screw rod 431 that drives the second transmission arm 41 to move along the X-axis direction, and drives the second screw rod 431 and its upper second transmission arm along the Z-axis direction Movement of the second cylinder 432. Thus, driven by the second air cylinder 432, the second transfer arm 41 descends to the height of the rotating mechanism 3, sucks the chip through the second suction nozzle 42 on it, and continues to rise to the height under the drive of the second air cylinder 432 At a certain height, it moves horizontally to the top of the loading table 5 under the drive of the second screw rod 431, and is again driven by the second air cylinder 432 to drop to the table where the loading table 5 is located. The chip is placed on the loading table 5. In addition, the second cylinder 432 can also be replaced by a screw rod or a cam or a direct drive motor.
所述装片台5作为芯片装片时的台面使用，其可设置于一基座上，并可沿基座上的滑轨51进行滑动，以满足实际的装片需求。The loading table 5 is used as a table for chip loading. It can be set on a base and can slide along the slide rail 51 on the base to meet actual loading requirements.
为了提高装片的效率，本实施例的高精度大板级微组装设备也可设计为双工位装片机。此时，所述第一传送机构2、旋转机构3、第二传送机构4以及装片台5形成一上料工位，所述上料工位左右镜像对称地分布于所述晶圆 台1的两侧。从而，两个上料工位共用中间的晶圆台1，并分别自晶圆台1吸取芯片进行装片动作。In order to improve the efficiency of chip loading, the high-precision large board-level micro-assembly equipment of this embodiment can also be designed as a double-station chip loading machine. At this time, the first conveying mechanism 2, the rotating mechanism 3, the second conveying mechanism 4, and the loading table 5 form a loading station, which is mirrored and symmetrically distributed on the left and right sides of the wafer table 1. On both sides. Therefore, the two loading stations share the wafer table 1 in the middle, and suck chips from the wafer table 1 for mounting operations.
此外，为了保证芯片周转过程中的准确性，所述高精度大板级微组装设备还具有多个CCD视觉检测器，该多个CCD视觉检测器能够观察芯片周转过程中，关键位置的方位，以保证后续芯片装片的精度。In addition, in order to ensure the accuracy of the chip turnover process, the high-precision large-board-level micro-assembly equipment also has multiple CCD vision detectors, which can observe the orientation of key positions during the chip turnover process. To ensure the accuracy of subsequent chip mounting.
具体地，所述高精度大板级微组装设备包括：第一视觉61、第二视觉62、第三视觉63以及第四视觉64。其中，所述第一视觉61用于观察并反馈芯片在由第一传送机构2周转时的方位。所述第一视觉61位于所述晶圆台的上部，并位于所述第一传送机构的斜上方。所述第二视觉62和第三视觉63分别用于观察并反馈芯片在由转台31上料和下料时的方位。所述第二视觉62和第三视觉63位于所述转台的上方，且所述第二视觉62对应设置于上料位的上方，第三视觉63对应设置于下料位的上方，所述第四视觉64用于观察并反馈芯片最后装片时的方位，所述第四视觉64位于所述装片台的上部。Specifically, the high-precision large-board-level micro-assembly equipment includes: a first vision 61, a second vision 62, a third vision 63, and a fourth vision 64. Wherein, the first vision 61 is used to observe and feed back the orientation of the chip when it is rotated by the first conveying mechanism 2. The first vision 61 is located on the upper part of the wafer stage and is located obliquely above the first transfer mechanism. The second vision 62 and the third vision 63 are respectively used to observe and feed back the orientation of the chip when it is loaded and unloaded by the turntable 31. The second vision 62 and the third vision 63 are located above the turntable, and the second vision 62 is correspondingly disposed above the upper material level, and the third vision 63 is correspondingly disposed above the lower material level. The four vision 64 is used to observe and feedback the orientation of the chip when the chip is finally loaded, and the fourth vision 64 is located on the upper part of the loading table.
综上所述，本发明的高精度大板级微组装设备采用转台通过旋转的方式进行装片上料，其相比采用多个旋臂进行上料的方式，具有上料行程短、效率高的优点，有利于提高装片效率以及实现设备体积的小型化。In summary, the high-precision large-board-level micro-assembly equipment of the present invention uses a turntable for loading and feeding by rotating. Compared with the method of loading with multiple rotating arms, it has a short feeding stroke and high efficiency. The advantages are conducive to improving the loading efficiency and miniaturization of the equipment volume.
对于本领域技术人员而言，显然本发明不限于上述示范性实施例的细节，而且在不背离本发明的精神或基本特征的情况下，能够以其他的具体形式实现本发明。因此，无论从哪一点来看，均应将实施例看作是示范性的，而且是非限制性的，本发明的范围由所附权利要求而不是上述说明限定，因此旨在将落在权利要求的等同要件的含义和范围内的所有变化囊括在本发明内。不应将权利要求中的任何附图标记视为限制所涉及的权利要求。For those skilled in the art, it is obvious that the present invention is not limited to the details of the above exemplary embodiments, and the present invention can be implemented in other specific forms without departing from the spirit or basic characteristics of the present invention. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting. The scope of the present invention is defined by the appended claims rather than the above description, and therefore it is intended to fall within the claims. All changes within the meaning and scope of the equivalent elements of are included in the present invention. Any reference signs in the claims should not be regarded as limiting the claims involved.
此外，应当理解，虽然本说明书按照实施方式加以描述，但并非每个实施方式仅包含一个独立的技术方案，说明书的这种叙述方式仅仅是为清楚起见，本领域技术人员应当将说明书作为一个整体，各实施例中的技术方案也可以经适当组合，形成本领域技术人员可以理解的其他实施方式。In addition, it should be understood that although this specification is described in accordance with the implementation manners, not each implementation manner only contains an independent technical solution. This narration in the specification is only for clarity, and those skilled in the art should regard the specification as a whole The technical solutions in each embodiment can also be appropriately combined to form other implementations that can be understood by those skilled in the art.

Claims (8)

  1. 一种高精度大板级微组装设备，其特征在于，所述高精度大板级微组装设备包括：晶圆台、第一传送机构、旋转机构、第二传送机构以及装片台；A high-precision large-board-level micro-assembly equipment, characterized in that the high-precision large-board-level micro-assembly equipment comprises: a wafer stage, a first transfer mechanism, a rotation mechanism, a second transfer mechanism, and a loading table;
    所述第一传送机构位于所述晶圆台上方，其将晶圆台上的芯片传送至所述旋转机构上；The first transfer mechanism is located above the wafer stage, and transfers the chips on the wafer stage to the rotation mechanism;
    所述旋转机构位于所述晶圆台和装片台之间，其包括：以垂直于台面的轴线为转轴进行旋转的转台，所述转台接收来自所述第一传送机构的芯片，并通过旋转运动将芯片传送至第二传送机构处；The rotation mechanism is located between the wafer table and the loading table, and includes: a turntable that rotates with an axis perpendicular to the table surface as a rotation axis, and the turntable receives the chips from the first transfer mechanism and transfers the chips by rotating The chip is transferred to the second transfer mechanism;
    所述第二传送机构位于所述装片台上方，所述第二传送机构将所述转台上的芯片传送至所述旋转机构上。The second transfer mechanism is located above the loading table, and the second transfer mechanism transfers the chips on the turntable to the rotation mechanism.
  2. 根据权利要求1所述的高精度大板级微组装设备，其特征在于，所述第一传送机构包括：第一传送臂、设置于所述第一传送臂端部的第一吸嘴以及驱动所述第一传送臂动作的第一驱动结构，所述第一驱动结构包括：带动所述第一传送臂沿X轴方向运动的第一丝杆、带动所述第一丝杆及其上第一传动臂沿Z轴方向运动的第一气缸。The high-precision large-board-level micro-assembly equipment according to claim 1, wherein the first transfer mechanism comprises: a first transfer arm, a first suction nozzle arranged at an end of the first transfer arm, and a driving The first driving structure for the movement of the first transmission arm, the first driving structure includes: a first screw that drives the first transmission arm to move along the X-axis direction, a first screw that drives the first screw and its upper A first cylinder with a transmission arm that moves along the Z axis.
  3. 根据权利要求1所述的高精度大板级微组装设备，其特征在于，所述转台为一圆盘结构，所述圆盘结构的转轴为通过圆盘中心的轴线。The high-precision large-board-level micro-assembly equipment according to claim 1, wherein the turntable is a disc structure, and the rotation axis of the disc structure is an axis passing through the center of the disc.
  4. 根据权利要求1所述的高精度大板级微组装设备，其特征在于，所述转台为一矩形板，所述矩形板的转轴为通过矩形板中心的轴线。The high-precision large-board-level micro-assembly equipment according to claim 1, wherein the turntable is a rectangular plate, and the rotation axis of the rectangular plate is an axis passing through the center of the rectangular plate.
  5. 根据权利要求1所述的高精度大板级微组装设备，其特征在于，所述转台由一旋转电机带动旋转，所述旋转电机的电机轴通过法兰与所述转台传动连接。The high-precision large-board-level micro-assembly equipment according to claim 1, wherein the turntable is driven to rotate by a rotating motor, and the motor shaft of the rotating motor is drivingly connected to the turntable through a flange.
  6. 根据权利要求1所述的高精度大板级微组装设备，其特征在于，所述 第二传送机构包括：第二传送臂、设置于所述第二传送臂端部的第二吸嘴以及驱动所述第二传送臂动作的第二驱动结构，所述第二驱动结构包括：带动所述第二传送臂沿X轴方向运动的第二丝杆、带动所述第二丝杆及其上第二传动臂沿Z轴方向运动的第二气缸。The high-precision large-board-level micro-assembly equipment according to claim 1, wherein the second conveying mechanism comprises: a second conveying arm, a second suction nozzle arranged at the end of the second conveying arm, and a drive The second driving structure of the second transmission arm action, the second driving structure includes: a second screw rod that drives the second transmission arm to move in the X-axis direction, the second screw rod and the upper first screw rod The second cylinder for the second transmission arm to move along the Z axis.
  7. 根据权利要求1所述的高精度大板级微组装设备，其特征在于，所述第一传送机构、旋转机构、第二传送机构以及装片台形成一上料工位，所述上料工位左右镜像对称地分布于所述晶圆台的两侧。The high-precision large-board-level micro-assembly equipment according to claim 1, wherein the first conveying mechanism, the rotating mechanism, the second conveying mechanism, and the loading table form a loading station, and the loading worker The positions are mirrored and symmetrically distributed on both sides of the wafer table.
  8. 根据权利要求1所述的高精度大板级微组装设备，其特征在于，所述高精度大板级微组装设备还包括：第一视觉、第二视觉、第三视觉以及第四视觉，所述第一视觉位于所述晶圆台的上部，并位于所述第一传送机构的斜上方，所述第二视觉和第三视觉位于所述转台的上方，且所述第二视觉对应设置于上料位的上方，第三视觉对应设置于下料位的上方，所述第四视觉位于所述装片台的上部。The high-precision large-board-level micro-assembly equipment according to claim 1, wherein the high-precision large-board-level micro-assembly equipment further comprises: a first vision, a second vision, a third vision, and a fourth vision. The first vision is located on the upper part of the wafer table and obliquely above the first transfer mechanism, the second vision and the third vision are located above the turntable, and the second vision is correspondingly disposed on the upper Above the material level, the third vision is correspondingly arranged above the unloading level, and the fourth vision is located on the upper part of the loading table.
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