WO2013008455A1 - 太陽電池裏面保護シート及び太陽電池モジュール - Google Patents
太陽電池裏面保護シート及び太陽電池モジュール Download PDFInfo
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- WO2013008455A1 WO2013008455A1 PCT/JP2012/004458 JP2012004458W WO2013008455A1 WO 2013008455 A1 WO2013008455 A1 WO 2013008455A1 JP 2012004458 W JP2012004458 W JP 2012004458W WO 2013008455 A1 WO2013008455 A1 WO 2013008455A1
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- solar cell
- adhesive
- base material
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- 230000001681 protective effect Effects 0.000 title claims abstract description 35
- 239000000853 adhesive Substances 0.000 claims abstract description 82
- 230000001070 adhesive effect Effects 0.000 claims abstract description 78
- 239000010410 layer Substances 0.000 claims abstract description 74
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 70
- 229920005862 polyol Polymers 0.000 claims abstract description 53
- 150000003077 polyols Chemical class 0.000 claims abstract description 53
- 239000007787 solid Substances 0.000 claims abstract description 41
- 229920005906 polyester polyol Polymers 0.000 claims abstract description 36
- 239000000758 substrate Substances 0.000 claims abstract description 30
- 239000003822 epoxy resin Substances 0.000 claims abstract description 24
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 24
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims abstract description 23
- 239000012790 adhesive layer Substances 0.000 claims abstract description 21
- 239000004814 polyurethane Substances 0.000 claims abstract description 19
- 229920002635 polyurethane Polymers 0.000 claims abstract description 19
- 229920000728 polyester Polymers 0.000 claims abstract description 16
- 229930185605 Bisphenol Natural products 0.000 claims abstract description 12
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000000463 material Substances 0.000 claims description 72
- 239000002253 acid Substances 0.000 claims description 50
- 125000001931 aliphatic group Chemical group 0.000 claims description 33
- 125000004432 carbon atom Chemical group C* 0.000 claims description 31
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 24
- 125000003118 aryl group Chemical group 0.000 claims description 14
- 239000005056 polyisocyanate Substances 0.000 claims description 12
- 229920001228 polyisocyanate Polymers 0.000 claims description 12
- 239000005058 Isophorone diisocyanate Substances 0.000 claims description 9
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 claims description 9
- 238000010248 power generation Methods 0.000 claims description 8
- 125000005442 diisocyanate group Chemical group 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 6
- 239000008393 encapsulating agent Substances 0.000 claims 1
- 230000007774 longterm Effects 0.000 abstract description 15
- 238000000576 coating method Methods 0.000 abstract description 12
- 239000011248 coating agent Substances 0.000 abstract description 10
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 33
- 229920005989 resin Polymers 0.000 description 32
- 239000011347 resin Substances 0.000 description 32
- -1 ester compound Chemical class 0.000 description 30
- 239000000243 solution Substances 0.000 description 21
- 230000000052 comparative effect Effects 0.000 description 20
- 238000006243 chemical reaction Methods 0.000 description 15
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 12
- 229920000139 polyethylene terephthalate Polymers 0.000 description 11
- 239000005020 polyethylene terephthalate Substances 0.000 description 11
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 10
- 230000007062 hydrolysis Effects 0.000 description 8
- 238000006460 hydrolysis reaction Methods 0.000 description 8
- 238000001035 drying Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 150000005846 sugar alcohols Polymers 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- 239000004593 Epoxy Substances 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- WOZVHXUHUFLZGK-UHFFFAOYSA-N dimethyl terephthalate Chemical compound COC(=O)C1=CC=C(C(=O)OC)C=C1 WOZVHXUHUFLZGK-UHFFFAOYSA-N 0.000 description 6
- 238000007667 floating Methods 0.000 description 6
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 6
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 6
- 239000006087 Silane Coupling Agent Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 230000002349 favourable effect Effects 0.000 description 5
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 5
- 238000010030 laminating Methods 0.000 description 5
- 229920001684 low density polyethylene Polymers 0.000 description 5
- 239000004702 low-density polyethylene Substances 0.000 description 5
- 230000014759 maintenance of location Effects 0.000 description 5
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 239000004698 Polyethylene Substances 0.000 description 4
- 239000004743 Polypropylene Substances 0.000 description 4
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 4
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 4
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 4
- 239000004205 dimethyl polysiloxane Substances 0.000 description 4
- 125000003700 epoxy group Chemical group 0.000 description 4
- 238000005227 gel permeation chromatography Methods 0.000 description 4
- 238000005304 joining Methods 0.000 description 4
- 239000002075 main ingredient Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 4
- 229920000573 polyethylene Polymers 0.000 description 4
- 229920001155 polypropylene Polymers 0.000 description 4
- 239000003566 sealing material Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 239000006096 absorbing agent Substances 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 3
- 239000007822 coupling agent Substances 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 238000007865 diluting Methods 0.000 description 3
- 238000010790 dilution Methods 0.000 description 3
- 239000012895 dilution Substances 0.000 description 3
- 238000005886 esterification reaction Methods 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 3
- 239000012948 isocyanate Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 150000001282 organosilanes Chemical class 0.000 description 3
- 229920002620 polyvinyl fluoride Polymers 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 238000005809 transesterification reaction Methods 0.000 description 3
- 239000013638 trimer Substances 0.000 description 3
- 230000005641 tunneling Effects 0.000 description 3
- 238000004383 yellowing Methods 0.000 description 3
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 2
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 2
- 239000004372 Polyvinyl alcohol Substances 0.000 description 2
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000011354 acetal resin Substances 0.000 description 2
- ZOIORXHNWRGPMV-UHFFFAOYSA-N acetic acid;zinc Chemical compound [Zn].CC(O)=O.CC(O)=O ZOIORXHNWRGPMV-UHFFFAOYSA-N 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 239000002313 adhesive film Substances 0.000 description 2
- 239000001361 adipic acid Substances 0.000 description 2
- 235000011037 adipic acid Nutrition 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 239000002518 antifoaming agent Substances 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 238000007756 gravure coating Methods 0.000 description 2
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 2
- 229920001903 high density polyethylene Polymers 0.000 description 2
- 239000004700 high-density polyethylene Substances 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 2
- 150000002513 isocyanates Chemical class 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 229920000092 linear low density polyethylene Polymers 0.000 description 2
- 239000004707 linear low-density polyethylene Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
- 229920006122 polyamide resin Polymers 0.000 description 2
- 229920001083 polybutene Polymers 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 229920005668 polycarbonate resin Polymers 0.000 description 2
- 239000004431 polycarbonate resin Substances 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 239000011112 polyethylene naphthalate Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229920005672 polyolefin resin Polymers 0.000 description 2
- 229920006324 polyoxymethylene Polymers 0.000 description 2
- 229920005990 polystyrene resin Polymers 0.000 description 2
- 239000011118 polyvinyl acetate Substances 0.000 description 2
- 229920002689 polyvinyl acetate Polymers 0.000 description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 239000005033 polyvinylidene chloride Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 2
- 239000004246 zinc acetate Substances 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 1
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- DHKHKXVYLBGOIT-UHFFFAOYSA-N 1,1-Diethoxyethane Chemical compound CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 1
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 1
- MTZUIIAIAKMWLI-UHFFFAOYSA-N 1,2-diisocyanatobenzene Chemical compound O=C=NC1=CC=CC=C1N=C=O MTZUIIAIAKMWLI-UHFFFAOYSA-N 0.000 description 1
- SBJCUZQNHOLYMD-UHFFFAOYSA-N 1,5-Naphthalene diisocyanate Chemical compound C1=CC=C2C(N=C=O)=CC=CC2=C1N=C=O SBJCUZQNHOLYMD-UHFFFAOYSA-N 0.000 description 1
- ICLCCFKUSALICQ-UHFFFAOYSA-N 1-isocyanato-4-(4-isocyanato-3-methylphenyl)-2-methylbenzene Chemical compound C1=C(N=C=O)C(C)=CC(C=2C=C(C)C(N=C=O)=CC=2)=C1 ICLCCFKUSALICQ-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- IIZPXYDJLKNOIY-JXPKJXOSSA-N 1-palmitoyl-2-arachidonoyl-sn-glycero-3-phosphocholine Chemical compound CCCCCCCCCCCCCCCC(=O)OC[C@H](COP([O-])(=O)OCC[N+](C)(C)C)OC(=O)CCC\C=C/C\C=C/C\C=C/C\C=C/CCCCC IIZPXYDJLKNOIY-JXPKJXOSSA-N 0.000 description 1
- DXPIUHXKXUKZDK-UHFFFAOYSA-N 2,5-dimethyl-4,5-dihydro-1,3-oxazole Chemical compound CC1CN=C(C)O1 DXPIUHXKXUKZDK-UHFFFAOYSA-N 0.000 description 1
- BXGYYDRIMBPOMN-UHFFFAOYSA-N 2-(hydroxymethoxy)ethoxymethanol Chemical compound OCOCCOCO BXGYYDRIMBPOMN-UHFFFAOYSA-N 0.000 description 1
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 1
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical compound C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 description 1
- SXFJDZNJHVPHPH-UHFFFAOYSA-N 3-methylpentane-1,5-diol Chemical compound OCCC(C)CCO SXFJDZNJHVPHPH-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000002033 PVDF binder Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical group [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 description 1
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 1
- XQBCVRSTVUHIGH-UHFFFAOYSA-L [dodecanoyloxy(dioctyl)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCCCCCC)(CCCCCCCC)OC(=O)CCCCCCCCCCC XQBCVRSTVUHIGH-UHFFFAOYSA-L 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 229920006243 acrylic copolymer Polymers 0.000 description 1
- IBVAQQYNSHJXBV-UHFFFAOYSA-N adipic acid dihydrazide Chemical compound NNC(=O)CCCCC(=O)NN IBVAQQYNSHJXBV-UHFFFAOYSA-N 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- UTTHLMXOSUFZCQ-UHFFFAOYSA-N benzene-1,3-dicarbohydrazide Chemical compound NNC(=O)C1=CC=CC(C(=O)NN)=C1 UTTHLMXOSUFZCQ-UHFFFAOYSA-N 0.000 description 1
- HIFVAOIJYDXIJG-UHFFFAOYSA-N benzylbenzene;isocyanic acid Chemical class N=C=O.N=C=O.C=1C=CC=CC=1CC1=CC=CC=C1 HIFVAOIJYDXIJG-UHFFFAOYSA-N 0.000 description 1
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- ZWLIYXJBOIDXLL-UHFFFAOYSA-N decanedihydrazide Chemical compound NNC(=O)CCCCCCCCC(=O)NN ZWLIYXJBOIDXLL-UHFFFAOYSA-N 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 239000002274 desiccant Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- WCRDXYSYPCEIAK-UHFFFAOYSA-N dibutylstannane Chemical compound CCCC[SnH2]CCCC WCRDXYSYPCEIAK-UHFFFAOYSA-N 0.000 description 1
- 239000012975 dibutyltin dilaurate Substances 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- 238000009820 dry lamination Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- NBMMYUUHZVNLKL-UHFFFAOYSA-N ethene;1,1,2-trifluoroethene Chemical group C=C.FC=C(F)F NBMMYUUHZVNLKL-UHFFFAOYSA-N 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 239000000787 lecithin Substances 0.000 description 1
- 229940067606 lecithin Drugs 0.000 description 1
- 235000010445 lecithin Nutrition 0.000 description 1
- 238000004811 liquid chromatography Methods 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- KYTZHLUVELPASH-UHFFFAOYSA-N naphthalene-1,2-dicarboxylic acid Chemical compound C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 KYTZHLUVELPASH-UHFFFAOYSA-N 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 229910000349 titanium oxysulfate Inorganic materials 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical group CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 239000012463 white pigment Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/049—Protective back sheets
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/08—Processes
- C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/42—Polycondensates having carboxylic or carbonic ester groups in the main chain
- C08G18/4202—Two or more polyesters of different physical or chemical nature
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/42—Polycondensates having carboxylic or carbonic ester groups in the main chain
- C08G18/4205—Polycondensates having carboxylic or carbonic ester groups in the main chain containing cyclic groups
- C08G18/4208—Polycondensates having carboxylic or carbonic ester groups in the main chain containing cyclic groups containing aromatic groups
- C08G18/4225—Polycondensates having carboxylic or carbonic ester groups in the main chain containing cyclic groups containing aromatic groups derived from residues obtained from the manufacture of dimethylterephthalate and from polyhydroxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
- C08G18/75—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic
- C08G18/751—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring
- C08G18/752—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring containing at least one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group
- C08G18/753—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring containing at least one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group containing one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group having a primary carbon atom next to the isocyanate or isothiocyanate group
- C08G18/755—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring containing at least one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group containing one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group having a primary carbon atom next to the isocyanate or isothiocyanate group and at least one isocyanate or isothiocyanate group linked to a secondary carbon atom of the cycloaliphatic ring, e.g. isophorone diisocyanate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/77—Polyisocyanates or polyisothiocyanates having heteroatoms in addition to the isocyanate or isothiocyanate nitrogen and oxygen or sulfur
- C08G18/78—Nitrogen
- C08G18/79—Nitrogen characterised by the polyisocyanates used, these having groups formed by oligomerisation of isocyanates or isothiocyanates
- C08G18/791—Nitrogen characterised by the polyisocyanates used, these having groups formed by oligomerisation of isocyanates or isothiocyanates containing isocyanurate groups
- C08G18/792—Nitrogen characterised by the polyisocyanates used, these having groups formed by oligomerisation of isocyanates or isothiocyanates containing isocyanurate groups formed by oligomerisation of aliphatic and/or cycloaliphatic isocyanates or isothiocyanates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/06—Polyurethanes from polyesters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/12—Photovoltaic modules
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/52—PV systems with concentrators
Definitions
- the present invention relates to a solar cell back surface protection sheet used on the back surface of a solar cell module, and a solar cell module including the solar cell back surface protection sheet.
- a solar cell module is used for photovoltaic power generation, and a solar cell back surface protection sheet (so-called back sheet) is provided for the purpose of protection and insulation from the back surface.
- the solar cell module is required to have a service life of a long period of more than ten years, and the long-term reliability is also required for the backsheet that protects it.
- the backsheet is required to have insulation against electricity generated from a power generation element called a cell and good adhesion to a sealing material for sealing the cell.
- Patent Documents 1 and 2 back sheets obtained by laminating various resin films and metal foils via an adhesive have been proposed.
- Patent Document 3 an outdoor polyurethane adhesive containing a polyester polyol or a polyester polyurethane polyol has been proposed (Patent Document 3).
- the adhesive used for the backsheet is required to have good adhesion and weather resistance that can withstand long-term use. Further, it is required that the adhesive is inexpensive and can be easily applied by a general coating method such as gravure coating or comma coating. Furthermore, it is required to be excellent in wet heat resistance and exhibit an excellent adhesive force even in an environment lower than normal temperature.
- the conventional backsheet has room for further improvement in these respects.
- the present invention has been made in view of the above background, and is excellent in long-term reliability, wet heat resistance, excellent adhesiveness in a low-temperature environment, and further excellent in cost and coating properties.
- the main object is to provide a sheet and a solar cell module.
- the present inventor used an adhesive containing a main agent and a curing agent having a specific composition, and a specific amount of the specific curing agent with respect to the main agent. The inventors have found that the above object can be achieved and have completed the present invention.
- the solar cell back surface protective sheet according to the present invention includes at least 1) an outer layer base material having weather resistance, 2) an intermediate layer base material, and 3) a seal for sealing a power generation element used in the solar cell module.
- An adhesive layer composed of a stopper and an inner layer base material having good adhesiveness and joining at least one side of the thickest base material among the outer layer base material, the intermediate layer base material, and the inner layer base material is the following (1) Formed of a main agent containing (3) and an adhesive containing a curing agent of (4) below, The adhesive has a solid content of 4 to 12 parts by weight based on 100 parts by weight of the main component solids.
- a dibasic acid component containing 40 to 70 mol% of an aromatic dibasic acid and 30 to 60 mol% of an aliphatic dibasic acid having 9 to 10 carbon atoms, and an aliphatic dihydric alcohol 30 having 5 or more carbon atoms A linear polyester polyol having a weight average molecular weight of 70,000 to 80,000 obtained by reacting with a dihydric alcohol component containing ⁇ 40 mol%.
- a dibasic acid component containing 60 to 80 mol% of an aromatic dibasic acid and 20 to 40 mol% of an aliphatic dibasic acid having 9 to 10 carbon atoms, and an aliphatic dihydric alcohol 70 having 5 or more carbon atoms A polyester polyurethane polyol having a weight average molecular weight of 30,000 to 40,000, which is obtained by reacting a polyester polyol obtained by reacting with a dihydric alcohol component containing ⁇ 80 mol% with an organic diisocyanate.
- the thickness of the thickest substrate is preferably 125 to 350 ⁇ m, and the adhesive amount of the adhesive layer in contact with the thickest substrate is in the range of more than 5 g / m 2 and 30 g / m 2 or less. Is preferred. Moreover, it is preferable that there are a plurality of the intermediate layer base materials, and at least a part thereof is bonded to each other via the adhesive layer.
- the linear polyester polyol is preferably 60 to 80% by weight in a total of 100% by weight of the linear polyester polyol and the polyester polyurethane polyol.
- the solar cell module according to the present invention includes the solar cell back surface protective sheet of the above aspect.
- the solar cell back surface protective sheet of the present invention is excellent in long-term reliability and wet heat resistance, and is excellent in adhesiveness in a low-temperature environment, and is excellent in cost and coating properties. And the outstanding effect that a solar cell module can be provided is produced.
- any number A to any number B means a range larger than the numbers A and A but smaller than the numbers B and B.
- the solar cell back surface protective sheet of the present invention includes at least 1) an outer layer base material having weather resistance, 2) an intermediate layer base material, and 3) a sealing material for sealing a power generation element used in a solar cell module; It is comprised from the inner-layer base material which has favorable adhesiveness.
- the adhesive layer for bonding at least one surface of the thickest base material among the outer layer base material, the intermediate layer base material, and the inner layer base material has the following (1) to (3). It is formed with the main ingredient containing this and the adhesive agent containing the hardening
- the solar cell back surface protective sheet of the present invention can also bond the substrates to each other with another adhesive.
- An inner layer base material is arrange
- the intermediate layer base material may be singular or plural.
- the solar cell back surface protection sheet is required to have voltage resistance. It is preferable to provide the voltage resistance mainly to the intermediate layer base material. However, when a plurality of intermediate layer base materials are provided, all of the intermediate layer base materials may not have voltage resistance.
- the term “adhesive” refers to the adhesive of the present invention containing the main agent containing the following (1) to (3) and the curing agent (4) below.
- the thickness of the thickest substrate among the outer layer substrate, the intermediate layer substrate, and the inner layer substrate is preferably 125 to 350 ⁇ m.
- the adhesive amount after drying of the adhesive layer in contact with the thickest substrate is in the range of more than 5 g / m 2 and 30 g / m 2 or less. The reason will be described later.
- the thickest substrate may be any of an outer layer substrate, an intermediate layer substrate, and an inner layer substrate, but the intermediate layer substrate is preferably the thickest substrate.
- the application surface of the above-mentioned adhesive amount is one surface, but when the intermediate layer base material is the thickest base material, the intermediate layer base material It is preferable that at least one of the two joint surfaces of the material satisfies the above coating conditions.
- the adhesive layer of the present invention has a range of more than 5 g / m 2 and 30 g / m 2 or less at the two joining surfaces. .
- the said adhesive agent can be applied suitably also to joining of base materials other than the thickest base material. That is, the adhesive of the present invention can be suitably used for all the joining of each base material (for example, plastic film, metal foil, etc.) constituting the solar cell back surface protective sheet.
- the adhesive of the present invention is a polyurethane adhesive containing a main agent and a curing agent.
- the adhesive may be a two-component mixed adhesive that mixes the main agent and the curing agent at the time of use, or may be a one-component adhesive in which the main agent and the curing agent are mixed in advance. .
- curing agent at the time of use may be sufficient.
- the main component of the adhesive is (1) a dibasic acid component containing 40 to 70 mol% of an aromatic dibasic acid and 30 to 60 mol% of an aliphatic dibasic acid having 9 to 10 carbon atoms, and 5 or more carbon atoms.
- the curing agent for the adhesive contains (4) a polyisocyanate having an isocyanurate of isophorone diisocyanate.
- the adhesive of the present invention contains 4 to 12 parts by weight of the solid content of the curing agent with respect to 100 parts by weight of the solid content of the main agent. More preferably, it is 6 to 12 parts by weight, and still more preferably 8 to 10 parts by weight.
- the linear polyester polyol (hereinafter also simply referred to as “polyester polyol”) used in the present invention comprises 40 to 70 mol% of an aromatic dibasic acid and 30 to 60 mol% of an aliphatic dibasic acid having 9 to 10 carbon atoms.
- the dibasic acid component contained is reacted with a dihydric alcohol component containing 30 to 40 mol% of an aliphatic dihydric alcohol having 5 or more carbon atoms.
- a dibasic acid or a polyhydric alcohol component having another structure may be included.
- dibasic acid and its ester compound examples include isophthalic acid, terephthalic acid, naphthalenedicarboxylic acid, phthalic anhydride, adipic acid, azelaic acid, sebacic acid, succinic acid, glutaric acid, tetrahydrophthalic anhydride, hexahydrophthalic anhydride Examples thereof include acid, maleic anhydride, itaconic anhydride and ester compounds thereof.
- the aromatic dibasic acid is 40 to 70 mol% (preferably 50 to 60 mol%) and the aliphatic dibasic having 9 to 10 carbon atoms based on the total amount of the dibasic acid.
- the acids are combined so as to be 30 to 60 mol% (preferably 40 to 50 mol%).
- the amount of aromatic dibasic acid used is less than 40 mol%, sufficient heat resistance and viscoelasticity may not be obtained. Moreover, by setting it as 70 mol% or less, adhesive force can be exhibited more effectively. Further, by setting the aliphatic dibasic acid having 9 to 10 carbon atoms to 30 mol% or more, the ester bond degree of the polyester polyol is made appropriate, the hydrolysis base point is suppressed, and long-term wet heat resistance is more effectively brought out. be able to. Further, by setting the aliphatic dibasic acid having 9 to 10 carbon atoms to 60 mol% or less, it is possible to appropriately adjust the heat resistance and viscoelasticity and to more effectively express the adhesive force.
- the aromatic dibasic acid is preferably terephthalic acid, dimethyl terephthalate, isophthalic acid, or phthalic anhydride from the viewpoint of reactivity in the transesterification reaction.
- azelaic acid having 9 carbon atoms and sebacic acid having 10 carbon atoms are preferable from the viewpoint of high lipophilicity, hydrophobicity, and suppression of water absorption into the polymer. .
- the dihydric alcohol component by controlling the proportion of aliphatic dihydric alcohol having 5 or more carbon atoms to 30 mol% or more, it is possible to suppress the increase in hydrolysis base point by making the ester bond degree of the polyester polyol appropriate, and long-term moisture resistance Thermal properties can be extracted more effectively. Moreover, the solubility to the organic solvent of a product becomes favorable by making the ratio of an aliphatic dihydric alcohol 40 mol% or less, and the applicability
- aliphatic dihydric alcohols having 5 or more carbon atoms as aliphatic dihydric alcohols having 5 or more carbon atoms, neopentyl glycol having 5 carbon atoms and having improved side chain stability and 3-methyl-1,5-pentane having 6 carbon atoms Diol, 1,6-hexanediol and the like that are highly lipophilic and hydrophobic and suppress water absorption into the polymer are preferred.
- the weight average molecular weight of the polyester polyol is 70,000 to 80,000 from the viewpoint of ensuring cohesive strength, stretchability and adhesive strength. Among these, from the viewpoint of the solubility of the resin, the viscosity, and the coating property (handleability) of the adhesive, it is more preferably 72,000-78,000.
- the number average molecular weight was measured using GPC (gel permeation chromatography) “HPC-8020” manufactured by Tosoh Corporation. GPC is liquid chromatography that separates and quantifies substances dissolved in a solvent (THF; tetrahydrofuran) based on the difference in molecular size.
- LF-604 manufactured by Showa Denko KK: GPC column for rapid analysis: 6MMID ⁇ 150MM size
- the flow rate is 0.6 ML / MIN
- the column temperature is 40. It carried out on the conditions of (degreeC) and the determination of the weight average molecular weight (Mw) was performed in polystyrene conversion.
- polyester polyurethane polyol used in the present invention comprises 60 to 80 mol% (preferably 65 to 75 mol%) of an aromatic dibasic acid and 20 to 40 mol% (preferably 25 to 40 mol%) of an aliphatic dibasic acid having 9 to 10 carbon atoms. 35 mol%) and a dihydric alcohol component containing 70 to 80 mol% (preferably 72 to 78 mol%) of an aliphatic dihydric alcohol having 5 or more carbon atoms.
- the polyester polyol obtained is reacted with an organic diisocyanate.
- the amount of aromatic dibasic acid used 60 mol% or more heat resistance and viscoelasticity can be obtained effectively.
- the adhesive force can be more effectively exhibited by setting it to 80 mol% or less.
- the ester bond degree of the polyester polyol is made appropriate, the hydrolysis base point is suppressed, and long-term wet heat resistance is more effectively brought out. be able to.
- the aliphatic dibasic acid having 9 to 10 carbon atoms 40 mol% or less it is possible to appropriately adjust the heat resistance and viscoelasticity and to exhibit the adhesive force more effectively. It is done.
- Organic diisocyanate is not particularly limited. Specific examples include 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, xylylene diisocyanate, diphenylmethane diisocyanate, isophorone diisocyanate, 1,5-naphthalene diisocyanate, hexamethylene diisocyanate, hydrogenated diphenylmethane diisocyanate, and the like. It is done. These can be used alone or in combination of two or more. From the viewpoint of reducing yellowing of the adhesive over time, it is preferable to use an aliphatic or alicyclic isocyanate compound for the urethane cross-linking part.
- the weight average molecular weight of the polyester polyurethane polyol is 30,000 to 40,000 in view of adjusting the viscosity as an adhesive in consideration of the large weight average molecular weight of the polyester polyol and the high viscosity. Among these, 32,000 to 38,000 is more preferable.
- the bisphenol type epoxy resin used in the present invention preferably has a number average molecular weight of 1,000 to 2,000 and an epoxy equivalent of 500 to 1,000 g / eq.
- the epoxy group reacts with the carboxyl group generated by hydrolysis of the ester bond to suppress the decrease in molecular weight due to the hydrophobicity of the bisphenol skeleton.
- bisphenol-type epoxy resins bisphenol A-type epoxy resins and bisphenol F-type epoxy resins are preferable from the viewpoint of maintaining shear strength, and these can be used alone or in combination of two or more.
- the number average molecular weight of the bisphenol type epoxy resin may be 1,000 to 2,000 from the viewpoints of adjusting the heat resistance and viscoelasticity of the cured adhesive film and adjusting the solution viscosity. If the number average molecular weight of the bisphenol-type epoxy resin is less than 1,000, sufficient heat resistance may not be obtained. Moreover, adhesive force can be more effectively exhibited by a number average molecular weight being 2,000 or less. In the present invention, the use of a high molecular weight polyol is expected to reduce the viscosity of the adhesive solution by using a low molecular weight epoxy resin, thereby improving the coating property. However, the number average molecular weight is 2,000. By making it below, the solution viscosity can be effectively reduced.
- the number average molecular weight of the bisphenol type epoxy resin is preferably 1,200 to 1,800 from the balance between wet heat resistance and low temperature adhesive strength.
- the composition ratio of the polyester polyol and the polyester polyurethane polyol (hereinafter collectively referred to as “polyol component”) is not particularly limited, but the polyester polyol is used in an amount of 60 to 80% by weight in a total of 100% by weight of the polyol component. It is preferable to use 65 to 75% by weight.
- the ratio of the polyester polyol in the polyol component is preferably in the range of 60 to 80% by weight from the balance between wet heat resistance and low temperature adhesive force.
- the ratio of ester bond by reaction of carboxyl group and hydroxyl group in the polyol component (reaction ratio of carboxyl group and hydroxyl group is 1: 1) is expressed as the degree of ester bond (mol / 100 g) in the molecule. It is desirable to design to be less than 1. That is, by setting the degree of ester bond to less than 1, the ratio of ester bonds can be reduced to increase hydrolysis resistance, and deterioration of adhesive strength over time can be further suppressed to improve long-term wet heat resistance.
- the present invention uses a dibasic acid having a large molecular weight of 9 to 10 and a polyhydric alcohol having a large molecular weight of 5 or more as a dibasic acid, so in unit weight (in 100 g).
- the ester bond degree of the polyol component is preferably in the range of 0.75 to 0.99.
- Such an ester bond degree can be achieved within the range of the ratio of the aromatic dibasic acid in the dibasic acid component and the carbon number of the polyhydric alcohol in the adhesive used in the present invention.
- the acid value (mgKOH / g) of the polyol component is preferably 5 or less, and more preferably 2 or less.
- the main component of the adhesive can contain any additive as long as the effects of the present invention are not impaired.
- the additive include a silane coupling agent, a reaction accelerator, a leveling agent, and an antifoaming agent.
- silane coupling agent examples include trialkoxysilanes having a vinyl group such as vinyltrimethoxysilane and vinyltriethoxysilane, 3-aminopropyltriethoxysilane, and N- (2-aminoethyl) 3-aminopropyltrimethoxy.
- Trialkoxysilanes having amino groups such as silane; glycidyl groups such as 3-glycidoxypropyltrimethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, and 3-glycidoxypropyltriethoxysilane; The trialkoxysilane which has is mentioned.
- These silane coupling agents can be used alone or in combination of two or more.
- the amount of the silane coupling agent added is preferably 0.5 to 5% by weight, more preferably 1 to 3% by weight, based on the total amount of the main agent. If it is less than 0.5% by weight, the effect of improving the adhesive strength by adding the silane coupling agent is poor, and even if it exceeds 5% by weight, no further improvement in performance is observed.
- reaction accelerator examples include metal catalysts such as dibutyltin diacetate, dibutyltin dilaurate, dioctyltin dilaurate, and dibutyltin dimaleate; 1,8-diaza-bicyclo (5,4,0) undecene-7,1,5 -Tertiary amines such as diazabicyclo (4,3,0) nonene-5,6-dibutylamino-1,8-diazabicyclo (5,4,0) undecene-7; reactive tertiary amines such as triethanolamine 1 type, or 2 or more types of reaction accelerators selected from these groups can be used.
- metal catalysts such as dibutyltin diacetate, dibutyltin dilaurate, dioctyltin dilaurate, and dibutyltin dimaleate
- leveling agents include polyether-modified polydimethylsiloxane, polyester-modified polydimethylsiloxane, aralkyl-modified polymethylalkylsiloxane, polyester-modified hydroxyl group-containing polydimethylsiloxane, polyetherester-modified hydroxyl group-containing polydimethylsiloxane, and acrylic copolymers.
- antifoaming agent examples include silicone resins, silicone solutions, copolymers of alkyl vinyl ethers, acrylic acid alkyl esters, and methacrylic acid alkyl esters.
- the curing agent used in the present invention includes a polyisocyanate having an isocyanurate of isophorone diisocyanate.
- This isocyanurate has a long pot life after mixing with the main agent, good solution stability, and long-term wet heat resistance of the adhesive.
- the isocyanurate content is 50 to 100% by weight in the polyisocyanate.
- isocyanurate means the trimer of diisocyanate.
- the curing agent can contain any polyisocyanate in an amount of less than 50% by weight in addition to the above polyisocyanate.
- it is preferably a low yellowing type aliphatic or alicyclic polyisocyanate.
- Examples of the low molecular weight polyisocyanate include hexamethylene diisocyanate, phenylene diisocyanate, 2,4- or 2,6-tolylene diisocyanate, diphenylmethane-4,4-diisocyanate, 3,3-dimethyl-4,4-biphenylene diisocyanate, Examples include dicyclohexylmethane-4,4-diisocyanate, isophorone diisocyanate, and mixtures thereof.
- Examples of the polyhydric alcohol to be reacted with these low molecular weight polyisocyanates include those described above as raw materials for the polyester polyol in the previous stage for producing the polyester polyurethane polyol.
- the main agent and the curing agent have a hardener solid content of 4 to 12 parts by weight with respect to 100 parts by weight of the main agent solid content.
- the amount of the curing agent By setting the amount of the curing agent to 4 parts by weight or more, the wet heat resistance can be improved more effectively.
- the adhesive force in low temperature can be more effectively exhibited by making a hardening
- the isocyanate group in the curing agent is blended so that the equivalent ratio is 1.0 to 10.0 with respect to the total of the hydroxyl groups of the polyester polyol and the polyester polyurethane polyol in the main agent. Considering the disappearance of isocyanate groups due to the reaction with water and the aging time after lamination, it is preferably 3.0 to 7.0.
- weather resistant outer layer base material 1 examples include polyolefin resins such as polyethylene (PE) (high density polyethylene, low density polyethylene, linear low density polyethylene), polypropylene (PP), polybutene, and (meth) acrylic.
- PE polyethylene
- PP polypropylene
- acrylic polybutene
- polyvinyl chloride resin polystyrene resin, polyvinylidene chloride resin, saponified ethylene-vinyl acetate copolymer, polyvinyl alcohol, polycarbonate resin, fluororesin, polyvinylidene fluoride resin, polyvinyl fluoride resin
- Polyvinyl acetate resins, acetal resins, polyester resins (polyethylene terephthalate (PET), polybutylene terephthalate, polyethylene naphthalate), polyamide resins, and other various resin films or sheets can be used. These resin films or sheets may be stretched in a uniaxial or biaxial direction.
- a white pigment such as titanium oxide or barium sulfate or a black pigment such as carbon may be mixed for the purpose of absorbing or reflecting ultraviolet rays.
- the thickness of the outer layer base material 1) is not limited, but can be, for example, about 10 to 350 ⁇ m, preferably about 10 to 100 ⁇ m.
- the intermediate layer base material 2 for example, polyethylene terephthalate resin, ethylene trifluoroethylene film, and other various resin films or sheets can be used. These resin films or sheets may be stretched in a uniaxial or biaxial direction.
- the thickness of the intermediate layer substrate 2) is not limited, but is preferably 30 to 350 ⁇ m, more preferably 100 to 350 ⁇ m, still more preferably 125 to 350 ⁇ m, and particularly preferably 150 to 300 ⁇ m. preferable.
- the solar cell back surface protection sheet may be required to have a partial discharge voltage of 600 V or 1,000 V depending on the power generation capacity of the solar cell. . Since the partial discharge voltage depends on the thickness of the solar cell back surface protection sheet, the base material constituting the solar cell back surface protection sheet is required to be thicker than the base material constituting the food packaging laminate.
- the intermediate layer base material 2) responsible for voltage resistance mainly bears “thickness”.
- the thickness of the intermediate layer base material 2) is preferably 100 to 350 ⁇ m as described above.
- the thickness of the intermediate layer base material 2) is preferably 125 to 350 ⁇ m.
- PE polyethylene
- high-density polyethylene low-density polyethylene, linear low-density polyethylene
- an inner layer base material having good adhesiveness
- Polyolefin resin such as polypropylene (PP), polybutene, (meth) acrylic resin, polyvinyl chloride resin, polystyrene resin, polyvinylidene chloride resin, saponified ethylene-vinyl acetate copolymer, polyvinyl alcohol, Polycarbonate resin, fluororesin, polyvinyl fluoride resin, polyvinyl acetate resin, acetal resin, polyester resin (polyethylene terephthalate (PET), polybutylene terephthalate, polyethylene naphthalate), polyamide resin, and other various types Resin film It is possible to use a solid or sheet. These resin films or sheets may be stretched in a uniaxial or biaxial direction.
- the thickness of the inner layer base material is not limited, but is, for example, 10 to 350 ⁇ m, preferably about 30 to 250 ⁇ m, more preferably 30 to 100 ⁇ m.
- the thickest substrate among the outer layer base material 1), the intermediate layer base material 2), and the inner layer base material 3) is joined by the adhesive.
- the bonding method is not particularly limited, but an adhesive is applied to one side of one laminated base material by gravure printing, comma coating, dry laminating, etc., and the solvent is stripped, and then bonded to the other laminated base material, Alternatively, it may be cured under heating.
- the thickness of the thickest base material among the outer layer base material, the intermediate layer base material, and the inner layer base material and the amount of the adhesive layer after drying can be appropriately designed.
- the thickness of the thickest base material is 125 to 350 ⁇ m.
- the amount of the adhesive layer after drying applied to at least one surface of the laminate substrate is preferably more than 5 g / m 2 and not more than 30 g / m 2 as described above. More preferably, by more than 5 g / m 2, and at 25 g / m 2 or less, more preferably, 6 g / m 2 or more and 20 g / m 2 or less. Since the specific gravity of the adhesive excluding the organic solvent is about 1.1 g / cm 3 , 1.1 g / m 2 can be converted to about 1 ⁇ m / m 2 . Therefore, the amount of the adhesive layer is about 4.5 to 27.3 ⁇ m in terms of thickness.
- the amount of the adhesive layer after drying exceed 5 g / m 2 , it is possible to more effectively reduce the influence of hydrolysis on the adhesive layer.
- the amount of the adhesive layer is set to 30 g / m 2 or less, the organic solvent in the adhesive can be easily volatilized at the time of drying before being bonded to the base material.
- the solar cell back surface protective sheet of the present invention is manufactured by industrially laminating a plurality of base materials and then completing the curing of the adhesive layer in a state of being wound in a roll shape
- the present inventors have conducted intensive studies. As a result, it was found that industrial productivity can be further improved in the following embodiments. That is, the thickness of the thickest substrate among the outer layer substrate, the intermediate layer substrate, and the inner layer substrate is 125 to 350 ⁇ m, and the amount of the adhesive layer is more than 5 g / m 2 and not more than 30 g / m 2
- the laminate is wound into a roll in the adhesive development process after applying the adhesive while effectively satisfying the electrical insulation with respect to the light emitting elements disposed in the solar cell module.
- tunneling floating (hereinafter referred to as tunneling) in the roll-shaped laminate can be more effectively suppressed.
- tunneling floating
- the solar cell back surface protective sheet of the present invention is installed in a solar cell module by adhering the inner layer base material side with a sealing material for sealing the power generation element of the solar cell module.
- the configuration of the solar cell module of the present invention is not particularly limited, and a known solar cell module can be used.
- the solar cell back surface protective sheet of the present invention at least one surface of the thickest base material among the outer layer base material, the intermediate layer base material, and the interior base material is bonded by the specific adhesive described above. Adhesives with good agent performance and weather resistance that can withstand long-term use are obtained. As a result, a solar cell back surface protective sheet with high long-term reliability can be provided.
- the adhesive used in the present invention is inexpensive and has a characteristic that it can be easily applied by a general coating method such as gravure coating or comma coating.
- the solar cell back surface protective sheet of the present invention is resistant to moist heat by using an adhesive in which the ratio of the main agent and the curing agent is 4 to 12 parts by weight of the curing agent solid content with respect to 100 parts by weight of the main agent solid content. Excellent adhesion at low temperatures. That is, it is possible to provide a solar cell back surface protective sheet that is excellent in long-term reliability and wet heat resistance, is excellent in adhesiveness in a low temperature environment, and is excellent in cost and coating properties.
- Example 1 25 kg of titanium oxide particles were added to 100 kg of low density polyethylene resin (LDPE) having a density of 0.91 g / cm 3 and kneaded sufficiently to prepare an LDPE resin composition. Subsequently, it was extruded with an extruder to produce a first film having a thickness of 50 ⁇ m.
- LDPE low density polyethylene resin
- a 250 ⁇ m thick polyethylene terephthalate film (manufactured by Toyobo Co., Ltd .: Toyobo Ester Film E5102) was prepared as a second film having excellent electrical insulation. Further, a PVF film (manufactured by DuPont, 38 ⁇ m) was prepared as the third film. These films were bonded by a dry laminating method using an adhesive for dry laminating. The adhesive for dry lamination is as follows.
- the reaction vessel was gradually depressurized to 1 to 2 Torr, and when the acid value became 0.8 mgKOH / g or less, the reaction under reduced pressure was stopped to obtain a polyester polyol having a weight average molecular weight of 75,000.
- a resin solution in which the concentration of the polyester polyol obtained by dilution with ethyl acetate was 50% was designated as polyol A.
- a reactor was charged with 94.2 parts of neopentyl glycol, 91.7 parts of 1,6-hexanediol, 37.6 parts of ethylene glycol, 211.5 parts of isophthalic acid, and 122.9 parts of sebacic acid.
- the esterification reaction was carried out by heating to 160 to 250 ° C. with stirring.
- the reaction vessel was gradually depressurized to 1 to 2 Torr, and when the acid value became 1 mgKOH / g or less, the reaction under reduced pressure was stopped to obtain a polyester polyol in the previous stage having a weight average molecular weight of 6,000.
- 22.9 parts of isophorone diisocyanate was gradually added and reacted by heating at 100 to 150 ° C.
- Polyol B was a resin solution in which the concentration of the polyester polyurethane polyol obtained by dilution with ethyl acetate was 50%.
- Polyol A 100 parts (solid content 50 parts), polyol B 40 parts (solid content 20 parts), number average molecular weight 1,200 and epoxy equivalent 600 g / eq of bisphenol A type epoxy resin 30 parts and epoxy group-containing organosilane coupling agent 3
- a resin solution with a solid content of 50% obtained by heating, dissolving and mixing the parts at 70 ° C. and diluting with ethyl acetate was used as the main agent 1.
- the total ester bond degree of polyol A and polyol B in the main agent 1 is 0.89 when determined as follows.
- the number of ester bonds is set to 1.
- the average molecular weight (equivalent) of the dibasic acid and dihydric alcohol in the polyol is calculated.
- the ester bond degree is defined as the number of ester bonds (subtracting dehydration during the reaction) divided by the molecular weight.
- Curing agent 1 was obtained by diluting a trimer of isophorone diisocyanate with ethyl acetate to give a resin solution having a solid content of 50%.
- the adhesive solution was adjusted so that the amount of the adhesive layer after drying was 10 g / m 2, and the first to third films were laminated to obtain a laminate of 210 mm ⁇ 295 mm (A4 size). .
- aging was performed at 60 ° C. for 7 days to cure the adhesive, thereby producing a back protective sheet for solar cells.
- the adhesive strength 25 ° C., 15 ° C.
- the adhesive strength after the weather resistance test (25 ° C.) were evaluated by the methods described later.
- Examples 2-4 The solar system is the same as in Example 1 except that 100 parts of the main agent 1 is 10 parts (Example 2), 6 parts (Example 3), and 4 parts (Example 4) of the curing agent 1, respectively. A battery back protection sheet was prepared and evaluated.
- Comparative Example 1 A solar cell back surface protective sheet was prepared and evaluated in the same manner as in Example 1 except that the solid content of the curing agent 1 was changed to 14 parts with respect to the main component 1 having a solid content of 100 parts.
- Example 5 Using the adhesive solution of Example 2, the amount of the adhesive layer after drying was 3 g / m 2 (Example 5), 5 g / m 2 (Example 6), 15 g / m 2 (Example 7), and 20 g. / M 2 (Example 8), 25 g / m 2 (Example 9), 30 g / m 2 (Example 10), 35 g / m 2 (Comparative Example 11)
- the back surface protection sheet for solar cells was produced and evaluated in the same manner as described above.
- Example 12 A 100 ⁇ m thick polyethylene terephthalate film (manufactured by Toyobo Co., Ltd .: Toyobo Ester Film E5100) was used in place of the 250 ⁇ m thick polyethylene terephthalate film as the second film, and the same adhesive solution as in Example 2 was used. And the solar cell back surface protection sheet was produced and evaluated like Example 1 except having adjusted so that the hardening
- curing agent 1 is 14 parts (Comparative Example 2), 12 parts (Example 13), 10 parts (Example 14), 6 parts (Example 15), 4 parts (implemented). Except for Example 16), a back protective sheet for solar cell was prepared and evaluated in the same manner as in Example 1.
- Examples 17 and 18 Instead of an epoxy resin having a number average molecular weight of 1,200, a bisphenol A type epoxy resin having a number average molecular weight of 1,400 and an epoxy equivalent of 700 g / eq (Example 17), a number average molecular weight of 1,000 and an epoxy equivalent of 500 g / eq A back protective sheet for solar cell was prepared and evaluated in the same manner as in Example 2 except that 30 parts of each of bisphenol A type epoxy resins (Example 18) were used.
- Comparative Example 3 A resin solution having a solid content of 50% was used as the main agent 3 in the same manner as in Comparative Example 1, except that the polyol A was 120 parts (solid content 60 parts) and the polyol B was 20 parts (solid content 10 parts). Except that the base material 3 and the curing agent 1 were blended at a ratio of 100: 14 (weight ratio), diluted with ethyl acetate and adjusted to a solid content of 30%, and used as an adhesive solution, the sun was applied as in Example 1. A battery back protection sheet was prepared and evaluated.
- Comparative Example 4 (Polyol B not used) A solar cell back surface protective sheet was prepared and evaluated in the same manner as in Comparative Example 1 except that polyol B was not used and polyol A was changed to 140 parts (solid content: 70 parts).
- Comparative Example 5 (no use of polyol A) A solar cell back surface protective sheet was prepared and evaluated in the same manner as in Comparative Example 1 except that polyol A was not used and polyol B was changed to 140 parts (solid content: 70 parts).
- Comparative Example 6 Dilute isophorone diisocyanate trimer with ethyl acetate to cure 50% solids resin solution instead of tolylene diisocyanate TMP adduct with ethyl acetate to cure 50% solids resin solution Agent 2 was obtained. Moreover, 14 parts of solid content of the hardening
- Comparative Examples 7 and 8 (polyol A is not used) Charge 99.6 parts of dimethyl terephthalate, 92.2 parts of ethylene glycol, 72.2 parts of neopentyl glycol, 0.02 part of zinc acetate and heat to 160-210 ° C with stirring under a nitrogen stream. After transesterification, 97% of the theoretical amount of methanol was distilled off, and then 77.5 parts of isophthalic acid and 129.6 parts of adipic acid were charged and heated to 160 to 240 ° C. to carry out the esterification reaction. The reaction can was gradually depressurized to 1-2 torr.
- the reaction under reduced pressure was stopped when the acid value was 0.8 mgKOH / g or less to obtain a polyester polyol (degree of ester bond 0.90 mol / 100 g) having a weight average molecular weight of 60,000.
- a resin solution having a solid content of 50% obtained by dilution with ethyl acetate was designated as polyol C.
- 100 parts polyol C was used.
- curing agent 1 were used with respect to the main ingredient 1 of solid content 100 parts. Except this, it carried out similarly to Example 1, and produced and evaluated the back surface protection sheet for solar cells.
- the polyol C has a weight average molecular weight of 60,000 and does not contain an aliphatic dibasic acid having 9 to 10 carbon atoms, and therefore does not correspond to the polyester polyol A in the present invention.
- Comparative Example 9 (does not contain bisphenol type epoxy resin) 40 parts of polyol A (20 parts of solid content), 100 parts of polyol B (50 parts of solid content) and 3 parts of an epoxy group-containing organosilane coupling agent were heated, dissolved and mixed at 70 ° C., and diluted with ethyl acetate. A resin solution having a solid content of 50% was used as the main agent 4. Further, 14 parts of the curing agent 1 was used with respect to 100 parts of the main agent 4. Except this, it carried out similarly to Example 1, and produced and evaluated the back surface protection sheet for solar cells.
- Comparative Example 10 A back protective sheet for solar cells in the same manner as in Example 2 except that 30 parts of bisphenol A type epoxy resin having a number average molecular weight of 800 and an epoxy equivalent of 400 g / eq was used instead of the epoxy resin having a number average molecular weight of 1,200. Were made and evaluated.
- ⁇ Partial discharge> The measurement was performed in air and in oil by a method based on the IEC partial discharge test (IEC61730-2, IEC606664-1). ⁇ : 1,000 V or more measured in air and in oil ⁇ : 1,000 V or more measured only in oil ⁇ : Less than 1,000 V in any measuring method Partial discharge evaluation is Although it is not necessarily an essential property for the solar cell back surface protective sheet, it is good in any sample except Example 12 using a 100 ⁇ m thick polyethylene terephthalate film instead of a 250 ⁇ m polyethylene terephthalate film as the second film. Results were obtained.
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Abstract
Description
また、ポリエステルポリオールやポリエステルポリウレタンポリオールを含有する屋外用ポリウレタン系接着剤が提案されている(特許文献3)。
前記接着剤は、主剤固形分100重量部に対し、硬化剤の固形分を4~12重量部とするものである。
(1)芳香族二塩基酸40~70モル%と炭素数9~10の脂肪族二塩基酸30~60モル%とを含む二塩基酸成分と、炭素数5以上の脂肪族2価アルコール30~40モル%を含む2価アルコール成分とを反応させてなる、重量平均分子量が70,000~80,000の直鎖ポリエステルポリオール。
(2)芳香族二塩基酸60~80モル%と炭素数9~10の脂肪族二塩基酸20~40モル%とを含む二塩基酸成分と、炭素数5以上の脂肪族2価アルコール70~80モル%を含む2価アルコール成分とを反応させることにより得られるポリエステルポリオールに有機ジイソシアネートを反応させてなる、重量平均分子量が30,000~40,000のポリエステルポリウレタンポリオール。
(3)数平均分子量が1,000~2,000のビスフェノール型エポキシ樹脂。
(4)イソホロンジイソシアネートのイソシアヌレートを有するポリイソシアネート。
前記最も厚い基材の厚みは125~350μmとすることが好ましく、前記最も厚い基材と接する前記接着剤層の接着剤量は5g/m2を超えて30g/m2以下の範囲とすることが好ましい。
また、前記中間層基材は、複数あり、少なくとも一部において互いに前記接着剤層を介して接着されていることが好ましい。
また、前記直鎖ポリエステルポリオールと、前記ポリエステルポリウレタンポリオールとの合計100重量%中、前記直鎖ポリエステルポリオールが60~80重量%であることが好ましい。
上記接着剤の硬化剤は、(4)イソホロンジイソシアネートのイソシアヌレートを有するポリイソシアネートを含有する。本発明の接着剤は、主剤の固形分100重量部に対し、前記硬化剤の固形分を4~12重量部含有する。より好ましくは、6~12重量部であり、さらに好ましくは8~10重量部である。
本発明で用いる直鎖ポリエステルポリオール(以下、単に「ポリエステルポリオール」とも言う)は、芳香族二塩基酸40~70モル%と炭素数9~10の脂肪族二塩基酸30~60モル%とを含む二塩基酸成分と、炭素数5以上の脂肪族2価アルコール30~40モル%を含む2価アルコール成分とを反応させてなる。上記条件を満たす範囲であれば、他の構造の二塩基酸や多価アルコール成分を含んでいてもよい。
なお、本発明における数平均分子量測定は東ソー社製GPC(ゲルパーミエーションクロマトグラフィー)「HPC-8020」を用いた。GPCは溶媒(THF;テトラヒドロフラン)に溶解した物質をその分子サイズの差によって分離定量する液体クロマトグラフィーである。本発明における測定は、カラムに「LF-604」(昭和電工社製:迅速分析用GPCカラム:6MMID×150MMサイズ)を直列に2本接続して用い、流量0.6ML/MIN、カラム温度40℃の条件で行い、重量平均分子量(Mw)の決定はポリスチレン換算で行った。
本発明で用いるポリエステルポリウレタンポリオールは、芳香族二塩基酸60~80モル%(好ましくは65~75モル%)と炭素数9~10の脂肪族二塩基酸20~40モル%(好ましくは25~35モル%)とを含む二塩基酸成分と、炭素数5以上の脂肪族2価アルコール70~80モル%(好ましくは72~78モル%)を含む2価アルコール成分とを反応させることにより得られるポリエステルポリオールに、有機ジイソシアネートを反応させてなる。
本発明で用いるビスフェノール型エポキシ樹脂は、数平均分子量が1,000~2,000であり、更にエポキシ当量が500~1,000g/eqであることが好ましい。ビスフェノール型エポキシ樹脂を含むことにより、ビスフェノール骨格の疎水性によって、エポキシ基がエステル結合の加水分解により発生したカルボキシル基と反応して分子量低下を抑制することが期待される。
上記ポリエステルポリオールとポリエステルポリウレタンポリオール(以下、これらをまとめて「ポリオール成分」とも称する)の組成比は、特に限定されないが、ポリエステルポリオールを、ポリオール成分の合計100重量%中、60~80重量%使用することが好ましく、65~75重量%使用することがより好ましい。ポリオール成分中のポリエステルポリオールの割合を、80重量%以下とすることにより耐湿熱性をより効果的に引き出すことができる。一方、ポリエステルポリオールの割合を60重量%以上にすることにより低温での接着力をより良好にできる。従って、湿熱耐性と低温での接着力のバランスから、ポリオール成分中のポリエステルポリオールの割合は、60~80重量%の範囲であることが好ましい。
本発明で用いる硬化剤は、イソホロンジイソシアネートのイソシアヌレートを有するポリイソシアネートを含む。このイソシアヌレートは、主剤と混合した後のポットライフが長く、溶液安定性が良好である上、接着剤の長期に亘る耐湿熱性が得られる。このイソシアヌレートの含有量はポリイソシアネート中に50~100重量%である。なお、イソシアヌレートとは、ジイソシアネートの三量体の意である。
また、主剤中のポリエステルポリオール及びポリエステルポリウレタンポリオールの水酸基の合計に対して、硬化剤中のイソシアネート基が当量比にして1.0~10.0になるように配合されることが好ましく、空気中の水分との反応によるイソシアネート基の消失や、ラミネート後のエージング時間を考慮すると3.0~7.0であることが好ましい。
耐候性を有する外層基材1)としては、例えば、ポリエチレン(PE)(高密度ポリエチレン、低密度ポリエチレン、線状低密度ポリエチレン)、ポリプロピレン(PP)、ポリブテン等のポリオレフィン系樹脂、(メタ)アクリル系樹脂、ポリ塩化ビニル系樹脂、ポリスチレン系樹脂、ポリ塩化ビニリデン系樹脂、エチレン-酢酸ビニル共重合体ケン化物、ポリビニルアルコール、ポリカーボネート系樹脂、フッ素樹脂、ポリフッ化ビニリデン系樹脂、ポリフッ化ビニル系樹脂、ポリ酢酸ビニル系樹脂、アセタール系樹脂、ポリエステル系樹脂(ポリエチレンテレフタレート(PET)、ポリブチレンテレフタレート、ポリエチレンナフタレート)、ポリアミド系樹脂、その他の各種の樹脂のフィルム又はシートを使用することができる。これらの樹脂のフィルムまたはシートは、一軸又は二軸方向に延伸されているものでもよい。
太陽電池用裏面保護シートには、太陽電池モジュールを電圧印加による破損から保護する為に、太陽電池セルの発電容量に応じ、部分放電電圧600V、若しくは1,000Vの耐性が要求されることがある。部分放電電圧は、太陽電池裏面保護シートの厚みに依存するので、太陽電池裏面保護シートを構成する基材は、食品包装用積層体を構成する基材よりも厚いことが求められる。太陽電池裏面保護シートを構成する基材のうち、耐電圧性を担う中間層基材2)が、主として「厚さ」を担う。そこで、中間層基材2)の厚みは前記の通り、100~350μmであることが好ましい。一方、太陽電池裏面保護シートを構成する基材が厚くなると、価格が高くなる。そこで、中間層基材2)の厚みは125~350μmであることが好ましい。
密度0.91g/cm3の低密度ポリエチレン樹脂(LDPE)100kgに酸化チタン粒子25kgを添加し、十分に混練してLDPE樹脂組成物を調製した。次いで押出機で押出して厚み50μmの第1フィルムを作製した。
なお、ドライラミネート用接着剤は次の通りである。
なお、主剤1中のポリオールAとポリオールBとの合計のエステル結合度は、以下のようにして求めると0.89である。
即ち、各ポリオールの原料である二塩基酸:2価アルコール=1:1 (モル比)で反応したとして、そのエステル結合数を1とする。そのポリオール中の二塩基酸と2価アルコールの平均分子量(当量)を算出する。(反応時の脱水などを差し引いた)エステル結合数をその分子量で割り算したものを、エステル結合度と規定する。
式)エステル結合度=1/分子量値 (単位 /g)=100/分子量値 (単位 /100g)
ポリオールAのエステル結合度が0.93であり、ポリオールBのエステル結合が0.79であるので、主剤1のエステル結合度は、
(0.93×100+0.79×40)/(100+40)=0.89
となる。
後述する方法にて、接着力(25℃、15℃)、耐候性試験後の接着力(25℃)、トンネリングを評価した。
100部の主剤1に対して、硬化剤1をそれぞれ10部(実施例2)、6部(実施例3)、4部(実施例4)とした以外は、実施例1と同様にして太陽電池用裏面保護シートを作製し、評価した。
固形分100部の主剤1に対して、硬化剤1の固形分を14部とした以外は、実施例1と同様にして太陽電池用裏面保護シートを作製し、評価した。
実施例2の接着剤溶液を用い、乾燥後の接着剤層の量が3g/m2(実施例5)、5g/m2(実施例6)、15g/m2(実施例7)、20g/m2(実施例8)、25g/m2(実施例9)、30g/m2(実施例10)、35g/m2(比較例11)となるように調整した以外は、実施例2と同様にして太陽電池用裏面保護シートを作製し、評価した。
第2フィルムとして厚さ250μmのポリエチレンテレフタレートフィルムの代わりに厚さ100μmのポリエチレンテレフタレートフィルム(東洋紡績社製:東洋紡エステルフィルムE5100)を用い、実施例2と同様の接着剤溶液を用いた。そして、硬化剤1を10重量部となるように調整した以外は、実施例1と同様にして太陽電池用裏面保護シートを作製し、評価した。
使用する樹脂製フィルムの種類は実施例1と同様とし、使用する接着剤を変更した。
ポリオールA40部(固形分20部)、ポリオールB100部(固形分50部)、数平均分子量1,200でエポキシ当量600g/eqのビスフェノールA型エポキシ樹脂30部及びエポキシ基含有オルガノシランカップリング剤3部を70℃で加熱・溶解・混合し、酢酸エチルで希釈して得られた固形分50%の樹脂溶液を主剤2とした。
数平均分子量1,200のエポキシ樹脂の代わりに、数平均分子量1,400、エポキシ当量700g/eqのビスフェノールA型エポキシ樹脂(実施例17)、数平均分子量1,000、エポキシ当量500g/eqのビスフェノールA型エポキシ樹脂(実施例18)をそれぞれ30部用いた以外は、実施例2と同様にして太陽電池用裏面保護シートを作製し、評価した。
ポリオールAを120部(固形分60部)、ポリオールBを20部(固形分10部)とした以外は比較例1と同様にして固形分50%の樹脂溶液を主剤3とした。
主剤3と硬化剤1を100:14(重量比)で配合し、酢酸エチルで希釈して固形分30%に調整した溶液を接着剤溶液として用いた以外は、実施例1と同様にして太陽電池用裏面保護シートを作製し、評価した。
ポリオールBを使用せず、ポリオールAを140部(固形分70部)とした以外は、比較例1と同様にして太陽電池用裏面保護シートを作製し、評価した。
ポリオールAを使用せず、ポリオールBを140部(固形分70部)とした以外は、比較例1と同様にして太陽電池用裏面保護シートを作製し、評価した。
イソホロンジイソシアネートの三量体を酢酸エチルで希釈して固形分50%の樹脂溶液の代わりに、トリレンジイソシアネートのTMPアダクト体を酢酸エチルで希釈して固形分50%の樹脂溶液としたものを硬化剤2とした。また、固形分100部の主剤1に対して硬化剤2の固形分を14部用いた。これ以外は実施例1と同様にして太陽電池用裏面保護シートを作製し、評価した。
テレフタル酸ジメチル99.6部、エチレングリコール92.2部、ネオペンチルグリコール72.2部、酢酸亜鉛0.02部を反応缶に仕込み、窒素気流下で攪拌しながら160~210℃に加熱してエステル交換反応を行い、理論量の97%のメタノールが留出した後、イソフタル酸77.5部、アジピン酸129.6部を仕込み、160~240℃に加熱してエステル化反応を行った。反応缶を徐々に1~2トールまで減圧した。酸価が0.8mgKOH/g以下で減圧反応を停止し、重量平均分子量が60,000のポリエステルポリオール(エステル結合度0.90モル/100g)を得た。酢酸エチルで希釈して得られた固形分50%の樹脂溶液を、ポリオールCとした。
100部のポリオールAの代わりに100部のポリオールCを用いた。また、固形分100部の主剤1に対して硬化剤1の固形分を14部(比較例7)、または10部(比較例8)用いた。これ以外は実施例1と同様にして太陽電池用裏面保護シートを作製し、評価した。
なお、前記ポリオールCは、重量平均分子量が60,000であり、炭素数9~10の脂肪族二塩基酸を含まないので、本願発明におけるポリエステルポリオールAには該当しない。
ポリオールA40部(固形分20部)、ポリオールB100部(固形分50部)及びエポキシ基含有オルガノシランカップリング剤3部を70℃で加熱・溶解・混合し、酢酸エチルで希釈して得られた固形分50%の樹脂溶液を主剤4とした。また、100部の主剤4に対して硬化剤1を14部用いた。これ以外は、実施例1と同様にして太陽電池用裏面保護シートを作製し、評価した。
数平均分子量1,200のエポキシ樹脂の代わりに、数平均分子量800、エポキシ当量400g/eqのビスフェノールA型エポキシ樹脂を30部用いた以外は、実施例2と同様にして太陽電池用裏面保護シートを作製し、評価した。
<25℃初期接着力、15℃接着力>
実施例及び比較例で作製した太陽電池裏面保護シート(試料)を15mm幅・約150mm長さに切り出し、JIS K6854T型剥離試験に準拠し、接着力(=剥離強度)を測定した。試験機を用いて、25℃、15℃の雰囲気下にて、引張速度100mm/minで各樹脂フィルム層を180°剥離することで剥離強度を測定し、以下の基準にて評価した。
◎:12N/15mm以上
○:9N/15mm以上12N未満
△:6N/15mm以上9N未満
×:6N/15mm未満
ダンプヒート(試験条件85℃、85%)、1,000時間後、2,000時間後(屋外実曝露状態10年以上に相当)の接着力を試験前と同様にして25℃の雰囲気下にて測定し、初期を100%として剥離強度の保持率(%)を算出し、以下の基準にて評価した。
◎:2,000時間後に95%以上強度保持
○:2,000時間後に85%以上95%未満強度保持
△:2,000時間後に60%以上85%未満強度保持
×:2,000時間後に60%未満強度保持
実施例及び比較例で第1フィルム~第3フィルムのラミネートを行い、1m幅の長尺の積層体を、外径(直径)170mmの紙製の筒の外周に長さ10m分、巻き付け、ロール状積層体を得た。巻芯を天地方向にした状態で前記ロール状積層体を立て、60℃で7日間エージングし、太陽電池裏面保護シートを得た。ロール状の太陽電池裏面保護シートの浮きの有無を観察した。浮きの生じた箇所の数で以下の基準にて評価した。「浮き」とは、接着剤層と基材との間に隙間が生じることをいう。
○:浮き無し
△:浮き5箇所以内
×:浮き5箇所以上
IEC部分放電試験(IEC61730-2,IEC60664-1)に準拠した方法によって、気中および油中にて測定を行った。
○:気中及び油中測定方法で1,000V以上であるもの
△:油中測定方法のみで1,000V以上であるもの
×:どの測定方法でも1,000Vに満たないもの
部分放電評価は、必ずしも太陽電池裏面保護シートに必須の特性ではないが、第2のフィルムとして250μmのポリエチレンテレフタレートフィルムの代わりに厚さ100μmのポリエチレンテレフタレートフィルムを用いた実施例12以外は、いずれのサンプルにおいても良好な結果が得られた。
Claims (5)
- 少なくとも、1)耐候性を有する外層基材、2)中間層基材、及び3)太陽電池モジュールに用いられる発電素子を封止するための封止材と良好な接着性を有する内層基材から構成され、
前記外層基材、前記中間層基材、及び前記内層基材のうちの最も厚い基材の少なくとも片面を接合する接着剤層が下記(1)~(3)を含有する主剤と、下記(4)の硬化剤を含有する接着剤により形成され、
前記接着剤は、主剤の固形分100重量部に対し、前記硬化剤の固形分を4~12重量部含有する太陽電池裏面保護シート。
(1)芳香族二塩基酸40~70モル%と炭素数9~10の脂肪族二塩基酸30~60モル%とを含む二塩基酸成分と、炭素数5以上の脂肪族2価アルコール30~40モル%を含む2価アルコール成分とを反応させてなる、重量平均分子量が70,000~80,000の直鎖ポリエステルポリオール。
(2)芳香族二塩基酸60~80モル%と炭素数9~10の脂肪族二塩基酸20~40モル%とを含む二塩基酸成分と、炭素数5以上の脂肪族2価アルコール70~80モル%を含む2価アルコール成分とを反応させることにより得られるポリエステルポリオールに有機ジイソシアネートを反応させてなる、重量平均分子量が30,000~40,000のポリエステルポリウレタンポリオール。
(3)数平均分子量が1,000~2,000のビスフェノール型エポキシ樹脂。
(4)イソホロンジイソシアネートのイソシアヌレートを有するポリイソシアネート。 - 前記最も厚い基材の厚みが125~350μmであり、前記最も厚い基材と接する前記接着剤層の接着剤量が5g/m2を超えて30g/m2以下の範囲である請求項1記載の太陽電池裏面保護シート。
- 前記中間層基材は、複数あり、少なくとも一部において互いに前記接着剤層を介して接着されている請求項1又は2に記載の太陽電池裏面保護シート。
- 前記直鎖ポリエステルポリオールと、前記ポリエステルポリウレタンポリオールとの合計100重量%中、前記直鎖ポリエステルポリオールが60~80重量%である、請求項1~3のいずれか1項に記載の太陽電池裏面保護シート。
- 請求項1~4のいずれか1項に記載の太陽電池裏面保護シートを備えた太陽電池モジュール。
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CN102150279A (zh) * | 2008-07-11 | 2011-08-10 | 三菱树脂株式会社 | 太阳能电池背板 |
JP2010278375A (ja) | 2009-06-01 | 2010-12-09 | Toppan Printing Co Ltd | 太陽電池モジュール用裏面保護シートとそれを用いた太陽電池モジュール |
TWI545014B (zh) | 2009-09-17 | 2016-08-11 | 東洋油墨製造股份有限公司 | 太陽電池用背面保護片、其製造方法、及太陽電池模組 |
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JP2016089034A (ja) * | 2014-11-05 | 2016-05-23 | Dic株式会社 | ポリエステルポリイソシアネート、これを用いる2液型ウレタン系接着剤用硬化剤、2液型ウレタン系接着剤、積層フィルム及び太陽電池のバックシート |
JP2016089035A (ja) * | 2014-11-05 | 2016-05-23 | Dic株式会社 | ポリエステルポリイソシアネート、これを用いる2液型ウレタン系接着剤用硬化剤、2液型ウレタン系接着剤、積層フィルム及び太陽電池のバックシート |
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TW201304168A (zh) | 2013-01-16 |
JPWO2013008455A1 (ja) | 2015-02-23 |
KR101871293B1 (ko) | 2018-06-27 |
KR20140040765A (ko) | 2014-04-03 |
TWI559562B (zh) | 2016-11-21 |
CN103650156A (zh) | 2014-03-19 |
JP6046620B2 (ja) | 2016-12-21 |
CN103650156B (zh) | 2016-11-02 |
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