WO2012100460A1 - Led lamp - Google Patents

Led lamp Download PDF

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Publication number
WO2012100460A1
WO2012100460A1 PCT/CN2011/072520 CN2011072520W WO2012100460A1 WO 2012100460 A1 WO2012100460 A1 WO 2012100460A1 CN 2011072520 W CN2011072520 W CN 2011072520W WO 2012100460 A1 WO2012100460 A1 WO 2012100460A1
Authority
WO
WIPO (PCT)
Prior art keywords
led light
pcb
led
substrate
heat dissipation
Prior art date
Application number
PCT/CN2011/072520
Other languages
French (fr)
Chinese (zh)
Inventor
伍治华
谢伊明
林月辉
邵小兵
Original Assignee
东莞市美能电子有限公司
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Application filed by 东莞市美能电子有限公司 filed Critical 东莞市美能电子有限公司
Publication of WO2012100460A1 publication Critical patent/WO2012100460A1/en

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the utility model relates to an LED lamp technology, in particular to an LED bulb. Background technique
  • LED Light Emitting Diode
  • LED lighting fixtures such as light bulbs.
  • the LED light bulb generally comprises a lamp cap, a lamp cover mounted on the top of the lamp cap, and a power source located in the lamp cap.
  • the lamp cap is provided with an LED light-emitting column, and the LED light-emitting column is electrically connected with the power source in the lamp cap, and when the LED light-emitting column is powered on, it emits The light can be illuminated through the lampshade for illumination or decoration purposes.
  • most of the LED light-emitting columns of the LED bulbs in the prior art directly solder the packaged LEDs on the PCB (printed circuit board) substrate, and the LEDs are all located on one side of the PCB substrate, so that the LED light-emitting columns can only emit light in one direction.
  • the light coverage is small (maximum 180 degrees), and the heat generated by the LED is only guided and scattered through the PCB substrate, and the heat dissipation rate is slow, and the heat dissipation effect is not good.
  • An LED bulb comprising a lamp cap, a lamp cover, a power source located in the lamp cap, a heat dissipating metal casing between the lamp cap and the lamp cap, and a top of the heat dissipating metal casing is located in the lamp cover.
  • a heat dissipating substrate is fixed on the top of the heat dissipating metal casing, and the LED light emitting column is fixedly inserted into the heat dissipating substrate, the LED lighting column comprises two PCB substrates, and the LED chips are encapsulated on the front surface of the two PCB substrates, the LED chip and the PCB The substrate is electrically connected, and the PCB substrate is electrically connected to the power source.
  • the back sides of the two PCB substrates are closely attached to each other, and a heat dissipating metal piece is interposed between the back surfaces of the two PCB substrates.
  • the heat dissipating metal piece is a copper piece.
  • the area of the side surface of the heat dissipation metal sheet is larger than the area of the back surface of the PCB substrate.
  • the heights of the LED chips of the two PCB substrates are equal.
  • the LED light-emitting columns are two or more.
  • An insulating sleeve is fixedly engaged in the bottom of the heat dissipation metal casing.
  • the heat dissipating substrate and the PCB substrate are both heat dissipating aluminum substrates, and the bottom of the PCB substrate is provided with a plug portion, wherein the two PCB substrates of the LED light emitting column and the heat dissipating metal sheet are fixed by rivets.
  • the PCB substrate is provided with a blind hole for encapsulating the LED chip, and the LED chip is fixed in the blind hole through the resin package, and the inner edge of the blind hole is an outwardly inclined slope.
  • the lamp cap is a spiral cap.
  • the lampshade is a candle shade or a spherical lampshade.
  • the utility model has the beneficial effects that the utility model comprises: a lamp cap, a lamp cover, a power source located in the lamp cap, and a heat dissipating metal shell between the lamp cap and the lamp cover, the heat dissipating metal
  • the top of the outer casing is located in the lamp cover, and the top of the heat dissipation metal casing is fixed with a heat dissipation substrate, the heat dissipation substrate is inserted and fixed with an LED light column, the LED light column comprises two PCB substrates, and the front surface of the two PCB substrates are packaged with LED chips.
  • the LED chip is electrically connected to the PCB substrate, and the PCB substrate is electrically connected to the power source.
  • the back sides of the two PCB substrates are closely attached to each other, and a heat dissipating metal piece is interposed between the back surfaces of the two PCB substrates. Since the LED light-emitting column of the utility model has LED chips on both sides, when the LED chip emits light, radial light can be realized, and the light coverage range is large (up to 360 degrees); moreover, the heat-dissipating metal piece of the LED light-emitting column can be The heat accumulated on the PCB substrate is quickly transferred to the heat dissipation substrate, and then the heat dissipation substrate is quickly dissipated through the heat dissipation metal case. Therefore, the utility model has the characteristics of large light coverage and fast heat dissipation.
  • Embodiment 1 is a schematic structural view of Embodiment 1 of an LED light bulb of the present invention.
  • Embodiment 1 of an LED light bulb of the present invention is an exploded perspective view of Embodiment 1 of an LED light bulb of the present invention.
  • FIG. 3 is a schematic view showing the structure of a hidden lampshade of Embodiment 1 of an LED light bulb of the present invention.
  • FIG. 4 is a schematic view showing the structure of an LED light-emitting column of Embodiment 1 of an LED light bulb of the present invention.
  • Fig. 5 is a side elevational view of the LED lighting column of the LED lamp of the first embodiment of the present invention.
  • FIG. 6 is a schematic exploded view of an LED light-emitting column of Embodiment 1 of an LED light bulb of the present invention.
  • Embodiment 7 is a packaged LED chip of Embodiment 1 of an LED bulb of the present invention. The light goes to the schematic.
  • Figure 8 is a schematic diagram of the light direction of a conventional packaged LED chip.
  • Figure 1 Figure 2
  • An LED bulb of the present invention includes a lamp cap 1, a lampshade 2, a power source 3 located in the lamp cap 1, and a power source 3 electrically connected to the lamp cap 1 so that the power source 3 can be externally connected through the lamp cap 1
  • the heat-dissipating metal casing 4 is fastened between the lamp cap 1 and the lamp cover 2, and the top of the heat-dissipating metal casing 4 is located in the lampshade 2, and the heat-dissipating metal casing 4 is fixedly attached with a heat-dissipating substrate 5 so that the heat-dissipating substrate 5 can dissipate heat.
  • the LED substrate 6 is inserted and fixed to the heat dissipation metal substrate 4, and the LED light-emitting column 6 includes two PCB substrates 61.
  • the front surface of the two PCB substrates 61 is packaged with LED chips 62, that is, the LED chip 62 is directly packaged.
  • the substrate 61 is electrically connected to the power source 3, so that the power source 3 can convert the alternating current into direct current, and the LED chip 62 is powered by the PCB substrate 61.
  • the back sides of the two PCB substrates 61 are closely attached to each other, so that both sides of the LED light-emitting column 6 are With the LED chip 62, when the LED chip 62 emits light, radial illumination can be achieved, and the light coverage is large (up to 360 degrees).
  • a heat dissipating metal sheet 63 is interposed between the back surfaces of the two PCB substrates 61 of the LED light-emitting column 6.
  • the heat-dissipating metal sheet 63 can be The heat accumulated on the PCB substrate 61 is transferred to the heat dissipation substrate 5, and then quickly radiated from the heat dissipation substrate 5 through the heat dissipation metal case 4.
  • the heat dissipating metal piece 63 is a copper piece.
  • the heat dissipating metal sheet 63 may also be made of other heat dissipating materials as long as it has advantages such as high thermal conductivity.
  • the area of the side surface of the heat dissipating metal piece 63 is larger than the area of the back surface of the PCB substrate 61, that is, the periphery of the heat dissipating metal piece 63 slightly protrudes from the PCB substrate 61 to increase heat dissipation and heat conduction area.
  • the heights of the LED chips 62 of the two PCB substrates 61 of the LED light-emitting column 6 are equal, so that the LED chips 62 on both sides of the LED light-emitting column 6 can be illuminated at the same height to form a point light source; wherein the LED light-emitting columns 6 are two or two.
  • the LED chip 62 is a high-power LED chip 62 of 1 to 10 W, so that the LED light-emitting column 6 has sufficient brightness when illuminated, so that the LED light-emitting column 6 can be formed similar to the conventional one.
  • the "fireworks" effect of the tungsten filament lamp that is, the luminous effect of the tungsten filament lamp, so that the utility model can replace the traditional tungsten filament lamp to achieve the purpose of illumination or decoration.
  • the utility model uses the LED chip 62 with power saving and long service life.
  • the utility model has the advantages of power saving, long service life and the like.
  • An insulating sleeve 7 is fixedly attached to the bottom of the heat dissipating metal casing 4 to insulate the heat dissipating metal casing 4 from the power source 3.
  • the heat dissipating substrate 5 and the PCB substrate 61 are both heat dissipating aluminum substrates, and the heat dissipating aluminum substrate has a good heat dissipating effect; the bottom of the PCB substrate 61 of the LED lighting column 6 is provided with a plug portion 611, so that the LED light emitting column 6 can be inserted and fixed in the heat dissipation. On the substrate 5.
  • the two PCB substrates 61 of the LED light-emitting column 6 and the heat-dissipating metal sheet 63 are fixed by rivets 612. More specifically, the rivets 612 pass through the two PCB substrates 61 and the heat-dissipating metal sheets 63, thereby disposing the two PCB substrates 61 and dissipating heat.
  • the metal piece 63 is locked and fixed, so that the heat dissipating metal piece 63 is closely attached to the back surface of the two PCB substrates 61, thereby increasing the heat dissipating area, so that the present invention can increase the heat dissipating speed by 8 to 10%.
  • the two PCB substrates 61 of the LED light-emitting column 6 can also adopt other fixing methods, such as fastening, fixing, and the like, as long as the fixing effect is good.
  • the PCB substrate 61 is cut transversely.
  • the PCB substrate 61 of the LED light-emitting column 6 of the present invention is provided with a blind hole 613 for packaging the LED chip 62.
  • the LED chip 62 is fixed in the blind hole 613 by a resin package.
  • the inside edge 614 of the blind hole 613 is an outwardly inclined slope, and the inner edge 614 can reflect the light emitted from the side of the LED chip 62, thereby improving the brightness of the LED chip 62; however, as shown in FIG.
  • the inner side edge of the blind hole of the conventional PCB substrate for packaging the LED chip is vertically disposed, so that the light emitted from the side of the LED chip cannot be reflected out; therefore, the package structure of the LED chip 62 of the present invention can be used for LED chip The light emitted from the side of 62 is reflected out. According to the test, the brightness of the LED chip 62 can be increased by 2 to 5 %.
  • the lamp cap 1 is a spiral lamp cap 1, so that the utility model can be fixedly connected with a conventional lamp socket.
  • the lamp cap 1 of the utility model can be a lamp cap of E12, E14, E17, E26, E27, B22 and the like.
  • the lampshade 2 is a candle-shaped lampshade, so that the light emitted by the LED chip 62 can be radiated through the lampshade 2 for illumination or decoration purposes.
  • the candle-shaped lampshade can be selected as a glass candle-shaped lampshade or a plastic candle-shaped lampshade according to the actual application environment, or can be a transparent candle-shaped lampshade or a translucent candle-shaped lampshade.
  • the embodiment 2 of the LED light bulb of the present invention is different from the first embodiment in that the lamp cover 2 is a spherical lamp cover, and the spherical lamp cover can be selected as a glass spherical lamp cover or a plastic spherical lamp cover according to the actual application environment. It can also be a transparent globe or a translucent globe.
  • the lampshade of the present invention may also have other shapes, not limited to a candle shape or a spherical shape. Other structures and working principles of this embodiment are the same as those in Embodiment 1, and are not described herein again.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)

Abstract

An LED lamp is disclosed, comprising a base (1), an envelope (2) and a power source (3) inside the base. A metal housing (4) for heat dissipation, with its top portion located inside the envelope, is secured between the base and the envelope, and a heat dissipation substrate (5) is secured on the top of the metal housing. LED light emitting posts (6) are inserted and fixed into the heat dissipation substrate and each LED light emitting post comprises two printing circuit board (PCB) substrates containing LED chips mounted on both front faces. The LED chips are electrically connected to the PCB substrates, which are electrically connected to the power source. The two PCB substrates are closely fixed against each other by their back faces, between which a heat dissipation metal plate is sandwiched. The LED lamp can realize light emitting in a radial way and enable a large range of lumination and fast heat dissipation.

Description

一种 LED灯泡  LED bulb
技术领域 Technical field
本实用新型涉及 LED灯具技术， 尤其涉及一种 LED灯泡。 背景技术  The utility model relates to an LED lamp technology, in particular to an LED bulb. Background technique
由于 LED (Light Emitting Diode, 发光二极管） 具有使用寿命 长、 能耗低、 节约能源显著等特点， 因此， LED作为光源已广泛地 应用于日常生活中， 如杯灯、 射灯、 汽车灯、 LED灯泡等 LED照明 灯具。  LED (Light Emitting Diode) has long life, low energy consumption, and significant energy saving. Therefore, LED has been widely used as a light source in daily life, such as cup lamps, spotlights, car lights, and LEDs. LED lighting fixtures such as light bulbs.
目前， LED灯泡一般包括灯头、 安装在灯头顶部的灯罩、 位于 灯头内的电源，灯罩内设置有 LED发光柱， LED发光柱与灯头内的 电源电连接， 当 LED发光柱通电发光时， 其发出的光线可透过灯罩 照射出去， 达到照明或装饰的目的。 但是， 现有技术中 LED灯泡的 LED发光柱大多是在 PCB (印刷电路板） 基板上直接焊接封装好的 LED, 且 LED均位于 PCB基板的一侧， 导致 LED发光柱只能单方 向发光， 光线覆盖范围较小（最大 180度）， 而且， LED工作时产生 的热量只是通过 PCB基板导走及散发， 散热速度较慢， 散热效果不 好。  At present, the LED light bulb generally comprises a lamp cap, a lamp cover mounted on the top of the lamp cap, and a power source located in the lamp cap. The lamp cap is provided with an LED light-emitting column, and the LED light-emitting column is electrically connected with the power source in the lamp cap, and when the LED light-emitting column is powered on, it emits The light can be illuminated through the lampshade for illumination or decoration purposes. However, most of the LED light-emitting columns of the LED bulbs in the prior art directly solder the packaged LEDs on the PCB (printed circuit board) substrate, and the LEDs are all located on one side of the PCB substrate, so that the LED light-emitting columns can only emit light in one direction. The light coverage is small (maximum 180 degrees), and the heat generated by the LED is only guided and scattered through the PCB substrate, and the heat dissipation rate is slow, and the heat dissipation effect is not good.
实用新型内容 Utility model content
本实用新型的目的在于针对现有技术的不足而提供一种可径向 发光、 散热速度快的 LED灯泡。 本实用新型的目的通过以下技术措施实现： 一种 LED灯泡， 它 包括有灯头、 灯罩、 位于灯头内的电源， 灯头与灯罩之间卡接有散 热金属外壳， 散热金属外壳的顶部位于灯罩内， 且散热金属外壳的 顶部卡接固定有散热基板， 散热基板插接固定有 LED发光柱， 所述 LED发光柱包括两块 PCB基板，两块 PCB基板的正面均封装有 LED 芯片， LED芯片与 PCB基板电连接， PCB基板与电源电连接， 两块 PCB基板的背面互相紧贴固定，且两块 PCB基板的背面之间夹置有 散热金属片。 The purpose of the utility model is to provide an LED light bulb which can emit light in a radial direction and has a fast heat dissipation speed in view of the deficiencies of the prior art. The object of the present invention is achieved by the following technical measures: An LED bulb comprising a lamp cap, a lamp cover, a power source located in the lamp cap, a heat dissipating metal casing between the lamp cap and the lamp cap, and a top of the heat dissipating metal casing is located in the lamp cover. And a heat dissipating substrate is fixed on the top of the heat dissipating metal casing, and the LED light emitting column is fixedly inserted into the heat dissipating substrate, the LED lighting column comprises two PCB substrates, and the LED chips are encapsulated on the front surface of the two PCB substrates, the LED chip and the PCB The substrate is electrically connected, and the PCB substrate is electrically connected to the power source. The back sides of the two PCB substrates are closely attached to each other, and a heat dissipating metal piece is interposed between the back surfaces of the two PCB substrates.
所述散热金属片为铜片。  The heat dissipating metal piece is a copper piece.
所述散热金属片侧面的面积大于 PCB基板背面的面积。  The area of the side surface of the heat dissipation metal sheet is larger than the area of the back surface of the PCB substrate.
所述两块 PCB基板的 LED芯片的高度相等。  The heights of the LED chips of the two PCB substrates are equal.
所述 LED发光柱为两支或两支以上。  The LED light-emitting columns are two or more.
所述散热金属外壳的底部内卡接固定有绝缘套。  An insulating sleeve is fixedly engaged in the bottom of the heat dissipation metal casing.
所述散热基板、 PCB基板均为散热铝基板， PCB基板的底部设 置有插接部， 其中， LED发光柱的两块 PCB基板与散热金属片是通 过铆钉固定。  The heat dissipating substrate and the PCB substrate are both heat dissipating aluminum substrates, and the bottom of the PCB substrate is provided with a plug portion, wherein the two PCB substrates of the LED light emitting column and the heat dissipating metal sheet are fixed by rivets.
所述 PCB基板开设有用于封装 LED芯片的盲孔， LED芯片通 过树脂封装固定在盲孔内， 且盲孔的内侧边缘为向外倾斜的斜坡。  The PCB substrate is provided with a blind hole for encapsulating the LED chip, and the LED chip is fixed in the blind hole through the resin package, and the inner edge of the blind hole is an outwardly inclined slope.
所述灯头为螺旋灯头。  The lamp cap is a spiral cap.
所述灯罩为烛形灯罩或球形灯罩。  The lampshade is a candle shade or a spherical lampshade.
本实用新型有益效果在于： 本实用新型包括有灯头、 灯罩、 位 于灯头内的电源， 灯头与灯罩之间卡接有散热金属外壳， 散热金属 外壳的顶部位于灯罩内， 且散热金属外壳的顶部卡接固定有散热基 板， 散热基板插接固定有 LED发光柱， LED发光柱包括两块 PCB 基板， 两块 PCB基板的正面均封装有 LED芯片， LED芯片与 PCB 基板电连接， PCB基板与电源电连接， 两块 PCB基板的背面互相紧 贴固定， 且两块 PCB基板的背面之间夹置有散热金属片。 由于本实 用新型的 LED发光柱的两侧均具有 LED芯片，当 LED芯片发光时， 可实现径向发光， 且光线覆盖范围大（可达 360度）； 而且， LED发 光柱的散热金属片可以将 PCB基板上聚集的热量快速地传递给散热 基板， 再由散热基板通过散热金属外壳快速地散发出去。 因此， 本 实用新型具有光线覆盖范围大、 散热速度快的特点。 The utility model has the beneficial effects that the utility model comprises: a lamp cap, a lamp cover, a power source located in the lamp cap, and a heat dissipating metal shell between the lamp cap and the lamp cover, the heat dissipating metal The top of the outer casing is located in the lamp cover, and the top of the heat dissipation metal casing is fixed with a heat dissipation substrate, the heat dissipation substrate is inserted and fixed with an LED light column, the LED light column comprises two PCB substrates, and the front surface of the two PCB substrates are packaged with LED chips. The LED chip is electrically connected to the PCB substrate, and the PCB substrate is electrically connected to the power source. The back sides of the two PCB substrates are closely attached to each other, and a heat dissipating metal piece is interposed between the back surfaces of the two PCB substrates. Since the LED light-emitting column of the utility model has LED chips on both sides, when the LED chip emits light, radial light can be realized, and the light coverage range is large (up to 360 degrees); moreover, the heat-dissipating metal piece of the LED light-emitting column can be The heat accumulated on the PCB substrate is quickly transferred to the heat dissipation substrate, and then the heat dissipation substrate is quickly dissipated through the heat dissipation metal case. Therefore, the utility model has the characteristics of large light coverage and fast heat dissipation.
附图说明 DRAWINGS
图 1是本实用新型一种 LED灯泡实施例 1的结构示意图。  1 is a schematic structural view of Embodiment 1 of an LED light bulb of the present invention.
图 2是本实用新型一种 LED灯泡实施例 1的分解示意图。  2 is an exploded perspective view of Embodiment 1 of an LED light bulb of the present invention.
图 3是本实用新型一种 LED灯泡实施例 1的隐去灯罩的结构示 意图。  3 is a schematic view showing the structure of a hidden lampshade of Embodiment 1 of an LED light bulb of the present invention.
图 4是本实用新型一种 LED灯泡实施例 1的 LED发光柱的结 构示意图。  4 is a schematic view showing the structure of an LED light-emitting column of Embodiment 1 of an LED light bulb of the present invention.
图 5是本实用新型一种 LED灯泡实施例 1的 LED发光柱的侧 视图。  Fig. 5 is a side elevational view of the LED lighting column of the LED lamp of the first embodiment of the present invention.
图 6是本实用新型一种 LED灯泡实施例 1的 LED发光柱的分 解示意图。  6 is a schematic exploded view of an LED light-emitting column of Embodiment 1 of an LED light bulb of the present invention.
图 7是本实用新型一种 LED灯泡实施例 1的封装的 LED芯片 的光线走向示意图。 7 is a packaged LED chip of Embodiment 1 of an LED bulb of the present invention; The light goes to the schematic.
图 8是传统封装的 LED芯片的光线走向示意图。  Figure 8 is a schematic diagram of the light direction of a conventional packaged LED chip.
在图 1、 图 2、 图 3、 图 4、 图 5、 图 6和图 7中包括有:  In Figure 1, Figure 2, Figure 3, Figure 4, Figure 5, Figure 6, and Figure 7, include:
2——灯罩 2——shade
Figure imgf000006_0001
4一一散热金属外壳
Figure imgf000006_0001
4 one heat sink metal shell
-散热基板 6—— LED发光柱  - Heat sink substrate 6 - LED light column
PCB基板 611——插接部  PCB substrate 611 - plug-in
612- -铆钉 613——盲孔  612- - rivet 613 - blind hole
614- -内侧边缘 62—— LED芯片  614- - Inner edge 62 - LED chip
63——散热金属片 7——绝缘套。  63——heating metal sheet 7——insulating sleeve.
具体实施方式 detailed description
下面结合附图对本实用新型作进一步的说明。  The present invention will be further described below in conjunction with the accompanying drawings.
实施例 1 Example 1
本实用新型的一种 LED灯泡，如图 1〜6所示，其包括有灯头 1、 灯罩 2、 位于灯头 1内的电源 3， 电源 3与灯头 1电连接， 使电源 3 可以通过灯头 1外接交流电， 灯头 1与灯罩 2之间卡接有散热金属 外壳 4， 散热金属外壳 4的顶部位于灯罩 2内， 且散热金属外壳 4 的顶部卡接固定有散热基板 5，使散热基板 5可以将热量传递给散热 金属外壳 4， 散热基板 5插接固定有 LED发光柱 6， LED发光柱 6 包括两块 PCB基板 61， 两块 PCB基板 61的正面均封装有 LED芯 片 62， 即 LED芯片 62直接封装在 PCB基板 61上， 以减小 LED发 基板 61与电源 3电连接， 使电源 3可以将交流电转换为直流电， 并 通过 PCB基板 61为 LED芯片 62供电，两块 PCB基板 61的背面互 相紧贴固定， 使 LED发光柱 6的两侧均具有 LED芯片 62， 当 LED 芯片 62发光时，可实现径向发光，且光线覆盖范围大（可达 360度）。 An LED bulb of the present invention, as shown in FIGS. 1 to 6, includes a lamp cap 1, a lampshade 2, a power source 3 located in the lamp cap 1, and a power source 3 electrically connected to the lamp cap 1 so that the power source 3 can be externally connected through the lamp cap 1 The heat-dissipating metal casing 4 is fastened between the lamp cap 1 and the lamp cover 2, and the top of the heat-dissipating metal casing 4 is located in the lampshade 2, and the heat-dissipating metal casing 4 is fixedly attached with a heat-dissipating substrate 5 so that the heat-dissipating substrate 5 can dissipate heat. The LED substrate 6 is inserted and fixed to the heat dissipation metal substrate 4, and the LED light-emitting column 6 includes two PCB substrates 61. The front surface of the two PCB substrates 61 is packaged with LED chips 62, that is, the LED chip 62 is directly packaged. On the PCB substrate 61, to reduce the LED hair The substrate 61 is electrically connected to the power source 3, so that the power source 3 can convert the alternating current into direct current, and the LED chip 62 is powered by the PCB substrate 61. The back sides of the two PCB substrates 61 are closely attached to each other, so that both sides of the LED light-emitting column 6 are With the LED chip 62, when the LED chip 62 emits light, radial illumination can be achieved, and the light coverage is large (up to 360 degrees).
LED发光柱 6的两块 PCB基板 61的背面之间夹置有散热金属 片 63， 由于 LED芯片 62工作发光时， 会产生大量的热量并聚集在 PCB基板 61上， 所以， 散热金属片 63可以将 PCB基板 61上聚集 的热量传递给散热基板 5，再由散热基板 5通过散热金属外壳 4快速 地散发出去。 在本实施例中， 优选散热金属片 63为铜片， 因为铜片 具有导热率高等优点， 可以将 PCB基板 61上聚集的热量快速地导 走， 即散热速度较快。 当然， 所述散热金属片 63也可以为其它散热 材料制成， 只要其具有导热率高等优点即可。  A heat dissipating metal sheet 63 is interposed between the back surfaces of the two PCB substrates 61 of the LED light-emitting column 6. When the LED chip 62 is illuminated, a large amount of heat is generated and collected on the PCB substrate 61. Therefore, the heat-dissipating metal sheet 63 can be The heat accumulated on the PCB substrate 61 is transferred to the heat dissipation substrate 5, and then quickly radiated from the heat dissipation substrate 5 through the heat dissipation metal case 4. In the present embodiment, it is preferable that the heat dissipating metal piece 63 is a copper piece. Since the copper piece has the advantages of high thermal conductivity and the like, the heat accumulated on the PCB substrate 61 can be quickly guided away, that is, the heat dissipating speed is fast. Of course, the heat dissipating metal sheet 63 may also be made of other heat dissipating materials as long as it has advantages such as high thermal conductivity.
散热金属片 63侧面的面积大于 PCB基板 61背面的面积， 即散 热金属片 63的四周稍凸出于 PCB基板 61，以增加散热及导热面积。  The area of the side surface of the heat dissipating metal piece 63 is larger than the area of the back surface of the PCB substrate 61, that is, the periphery of the heat dissipating metal piece 63 slightly protrudes from the PCB substrate 61 to increase heat dissipation and heat conduction area.
LED发光柱 6的两块 PCB基板 61的 LED芯片 62的高度相等， 使 LED发光柱 6两侧的 LED芯片 62可以保持同一高度发光， 形成 点光源； 其中， LED发光柱 6为两支或两支以上， 例如本实施例选 用的 3支， 而且 LED芯片 62为 1〜10W的大功率 LED芯片 62， 使 LED发光柱 6发光时具有足够的亮度，从而使 LED发光柱 6可以形 成类似于传统的钨丝灯的 "焰火"效果， 即形成钨丝灯的发光效果 从而使本实用新型可以替代传统的钨丝灯，达到照明或装饰的目的。 当然， 由于本实用新型采用了省电、 使用寿命长的 LED芯片 62作 为光源， 相比于传统的钨丝灯， 本实用新型具有省电、 使用寿命长 等优点。 The heights of the LED chips 62 of the two PCB substrates 61 of the LED light-emitting column 6 are equal, so that the LED chips 62 on both sides of the LED light-emitting column 6 can be illuminated at the same height to form a point light source; wherein the LED light-emitting columns 6 are two or two. Above, for example, three of the selected ones in the embodiment, and the LED chip 62 is a high-power LED chip 62 of 1 to 10 W, so that the LED light-emitting column 6 has sufficient brightness when illuminated, so that the LED light-emitting column 6 can be formed similar to the conventional one. The "fireworks" effect of the tungsten filament lamp, that is, the luminous effect of the tungsten filament lamp, so that the utility model can replace the traditional tungsten filament lamp to achieve the purpose of illumination or decoration. Of course, since the utility model uses the LED chip 62 with power saving and long service life. For the light source, compared with the conventional tungsten filament lamp, the utility model has the advantages of power saving, long service life and the like.
散热金属外壳 4的底部内卡接固定有绝缘套 7，使散热金属外壳 4与电源 3之间绝缘。  An insulating sleeve 7 is fixedly attached to the bottom of the heat dissipating metal casing 4 to insulate the heat dissipating metal casing 4 from the power source 3.
散热基板 5、 PCB基板 61均为散热铝基板， 散热铝基板具有良 好的散热效果； LED发光柱 6的 PCB基板 61的底部设置有插接部 611， 使 LED发光柱 6可以插接固定在散热基板 5上。  The heat dissipating substrate 5 and the PCB substrate 61 are both heat dissipating aluminum substrates, and the heat dissipating aluminum substrate has a good heat dissipating effect; the bottom of the PCB substrate 61 of the LED lighting column 6 is provided with a plug portion 611, so that the LED light emitting column 6 can be inserted and fixed in the heat dissipation. On the substrate 5.
LED发光柱 6的两块 PCB基板 61与散热金属片 63是通过铆钉 612固定， 更具体地说，铆钉 612穿过两块 PCB基板 61和散热金属 片 63， 从而将两块 PCB基板 61和散热金属片 63锁紧固定， 使散热 金属片 63与两块 PCB基板 61的背面紧密地贴在一起， 从而增加散 热面积， 使本实用新型可以增加 8〜10%的散热速度。 当然， 所述 LED发光柱 6的两块 PCB基板 61也可以采用其它的固定方式， 如 扣接固定、 粘贴固定等， 只要其固定效果较好即可。  The two PCB substrates 61 of the LED light-emitting column 6 and the heat-dissipating metal sheet 63 are fixed by rivets 612. More specifically, the rivets 612 pass through the two PCB substrates 61 and the heat-dissipating metal sheets 63, thereby disposing the two PCB substrates 61 and dissipating heat. The metal piece 63 is locked and fixed, so that the heat dissipating metal piece 63 is closely attached to the back surface of the two PCB substrates 61, thereby increasing the heat dissipating area, so that the present invention can increase the heat dissipating speed by 8 to 10%. Of course, the two PCB substrates 61 of the LED light-emitting column 6 can also adopt other fixing methods, such as fastening, fixing, and the like, as long as the fixing effect is good.
如图 7所示，将 PCB基板 61横向切开，其中，本实用新型 LED 发光柱 6的 PCB基板 61开设有用于封装 LED芯片 62的盲孔 613， LED芯片 62通过树脂封装固定在盲孔 613内，且盲孔 613的内侧边 缘 614为向外倾斜的斜坡， 而内侧边缘 614可以将 LED芯片 62侧 边发出的光线反射出去， 从而提高了 LED芯片 62的亮度； 但是， 如图 8所示， 传统的 PCB基板用于封装 LED芯片的盲孔的内侧边 缘为垂直设置，所以，导致 LED芯片侧边发出的光线不能反射出去； 因此， 本实用新型上述的 LED芯片 62的封装结构可以将 LED芯片 62侧边发出的光线反射出去， 根据测试， 可以将 LED芯片 62的亮 度提高 2〜5 %。 As shown in FIG. 7, the PCB substrate 61 is cut transversely. The PCB substrate 61 of the LED light-emitting column 6 of the present invention is provided with a blind hole 613 for packaging the LED chip 62. The LED chip 62 is fixed in the blind hole 613 by a resin package. The inside edge 614 of the blind hole 613 is an outwardly inclined slope, and the inner edge 614 can reflect the light emitted from the side of the LED chip 62, thereby improving the brightness of the LED chip 62; however, as shown in FIG. The inner side edge of the blind hole of the conventional PCB substrate for packaging the LED chip is vertically disposed, so that the light emitted from the side of the LED chip cannot be reflected out; therefore, the package structure of the LED chip 62 of the present invention can be used for LED chip The light emitted from the side of 62 is reflected out. According to the test, the brightness of the LED chip 62 can be increased by 2 to 5 %.
灯头 1为螺旋灯头 1，使本实用新型可以与传统的灯具插座固定 连接， 当然， 本实用新型灯头 1可以为 E12、 E14、 E17、 E26、 E27、 B22等型号的灯头。  The lamp cap 1 is a spiral lamp cap 1, so that the utility model can be fixedly connected with a conventional lamp socket. Of course, the lamp cap 1 of the utility model can be a lamp cap of E12, E14, E17, E26, E27, B22 and the like.
灯罩 2为烛形灯罩，使 LED芯片 62发出的光线可以透过灯罩 2 照射出去， 达到照明或装饰的目的。 当然， 所述烛形灯罩可以根据 实际应用环境而选用为玻璃烛形灯罩或塑料烛形灯罩， 也可以为透 明烛形灯罩或半透明烛形灯罩。  The lampshade 2 is a candle-shaped lampshade, so that the light emitted by the LED chip 62 can be radiated through the lampshade 2 for illumination or decoration purposes. Of course, the candle-shaped lampshade can be selected as a glass candle-shaped lampshade or a plastic candle-shaped lampshade according to the actual application environment, or can be a transparent candle-shaped lampshade or a translucent candle-shaped lampshade.
实施例 2 Example 2
本实用新型的一种 LED灯泡的实施例 2， 本实施例与实施例 1 的不同之处在于， 灯罩 2为球形灯罩， 且球形灯罩可以根据实际应 用环境而选用为玻璃球形灯罩或塑料球形灯罩， 也可以为透明球形 灯罩或半透明球形灯罩。 当然， 本实用新型的灯罩也可以为其它形 状， 不仅限于烛形或球形。 本实施例的其它结构及工作原理与实施 例 1相同， 在此不再赘述。  The embodiment 2 of the LED light bulb of the present invention is different from the first embodiment in that the lamp cover 2 is a spherical lamp cover, and the spherical lamp cover can be selected as a glass spherical lamp cover or a plastic spherical lamp cover according to the actual application environment. It can also be a transparent globe or a translucent globe. Of course, the lampshade of the present invention may also have other shapes, not limited to a candle shape or a spherical shape. Other structures and working principles of this embodiment are the same as those in Embodiment 1, and are not described herein again.
最后应当说明的是， 以上实施例仅用以说明本实用新型的技术 方案， 而非对本实用新型保护范围的限制， 尽管参照较佳实施例对 本实用新型作了详细地说明， 本领域的普通技术人员应当理解， 可 以对本实用新型的技术方案进行修改或者等同替换， 而不脱离本实 用新型技术方案的实质和范围。  It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit the scope of the present invention. Although the present invention is described in detail with reference to the preferred embodiments, It should be understood that the technical solutions of the present invention may be modified or equivalently substituted without departing from the spirit and scope of the technical solutions of the present invention.

Claims

伙 不 U " Don't U"
1、 一种 LED灯泡， 它包括有灯头、 灯罩、 位于灯头内的电源， 灯头与灯罩之间卡接有散热金属外壳， 散热金属外壳的顶部位于灯 罩内， 且散热金属外壳的顶部卡接固定有散热基板， 散热基板插接 固定有 LED发光柱， 其特征在于： 所述 LED发光柱包括两块 PCB 基板， 两块 PCB基板的正面均封装有 LED芯片， LED芯片与 PCB 基板电连接， PCB基板与电源电连接， 两块 PCB基板的背面互相紧 贴固定， 且两块 PCB基板的背面之间夹置有散热金属片。 1. An LED bulb comprising a lamp cap, a lamp cover, a power source located in the lamp cap, a heat dissipating metal casing between the lamp cap and the lamp cover, a top of the heat dissipating metal casing is located in the lamp cover, and a top of the heat dissipating metal casing is fixedly fastened There is a heat dissipating substrate, and the heat dissipating substrate is fixedly connected with an LED light emitting column, wherein the LED light emitting column comprises two PCB substrates, and the LED chips are packaged on the front sides of the two PCB substrates, and the LED chip and the PCB substrate are electrically connected, and the PCB The substrate is electrically connected to the power source, and the back surfaces of the two PCB substrates are closely adhered to each other, and a heat dissipating metal piece is interposed between the back surfaces of the two PCB substrates.
2、 根据权利要求 1所述的 LED灯泡， 其特征在于： 所述散热 金属片为铜片。  The LED light bulb according to claim 1, wherein the heat dissipating metal piece is a copper piece.
3、 根据权利要求 2所述的 LED灯泡， 其特征在于： 所述散热 金属片侧面的面积大于 PCB基板背面的面积。  The LED light bulb according to claim 2, wherein the area of the side surface of the heat dissipation metal piece is larger than the area of the back surface of the PCB substrate.
4、 根据权利要求 2所述的 LED灯泡， 其特征在于： 所述两块 PCB基板的 LED芯片的高度相等。  4. The LED light bulb according to claim 2, wherein the LED chips of the two PCB substrates have the same height.
5、 根据权利要求 4所述的 LED灯泡， 其特征在于： 所述 LED 发光柱为两支或两支以上。  The LED light bulb according to claim 4, wherein the LED light-emitting columns are two or more.
6、 根据权利要求 5所述的 LED灯泡， 其特征在于： 所述散热 金属外壳的底部内卡接固定有绝缘套。  The LED light bulb according to claim 5, wherein the insulating metal sleeve is fixedly fastened to the bottom of the heat dissipation metal casing.
7、 根据权利要求 5所述的 LED灯泡， 其特征在于： 所述散热 基板、 PCB基板均为散热铝基板， PCB基板的底部设置有插接部， 其中， LED发光柱的两块 PCB基板与散热金属片是通过铆钉固定。  The LED light bulb according to claim 5, wherein: the heat dissipation substrate and the PCB substrate are heat dissipation aluminum substrates, and the bottom of the PCB substrate is provided with a plug portion, wherein the two PCB substrates of the LED light column are The heat sink metal piece is fixed by rivets.
8、 根据权利要求 1所述的 LED灯泡， 其特征在于： 所述 PCB ¾很升设 ^用卞封¾ LED心斤的 9卣扎， LED心斤通; ^树脂封 ¾回¾ 在盲孔内， 且盲孔的内侧边缘为向外倾斜的斜坡。 8. The LED light bulb of claim 1 wherein: said PCB 3⁄4 is very suitable for the use of 卞 3 3⁄4 LED 斤 的9卣 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , ,
9、 根据权利要求 1所述的 LED灯泡， 其特征在于： 所述灯头 为螺旋灯头。  9. The LED light bulb of claim 1, wherein: the base is a spiral base.
10、 根据权利要求 1至 9任意一项所述的 LED灯泡， 其特征在 于： 所述灯罩为烛形灯罩或球形灯罩。  The LED light bulb according to any one of claims 1 to 9, wherein the lampshade is a candlelight cover or a globe.
PCT/CN2011/072520 2011-01-28 2011-04-08 Led lamp WO2012100460A1 (en)

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