WO2012022662A1

WO2012022662A1 - Light source

Info

Publication number: WO2012022662A1
Application number: PCT/EP2011/063787
Authority: WO
Inventors: Martin Moeck
Original assignee: Osram Opto Semiconductors Gmbh
Priority date: 2010-08-18
Filing date: 2011-08-10
Publication date: 2012-02-23
Also published as: DE102010034664B4; DE102010034664A1

Abstract

A light source comprising a light module (10) is specified, said light source comprising a carrier body (1) with a plurality of light-emitting semiconductor components (3) and a convection heat sink (2), wherein the semiconductor components (3) are arranged on a mounting surface (11) of the carrier body (1) and emit light along an emission direction (99) during operation, and wherein the convection heat sink (2) is arranged laterally with respect to the semiconductor components (3), is thermally connected to the carrier body (1) and extends away from the mounting surface (11) in the emission direction (99).

Description

Description light source

A light source is indicated.

This patent application claims the priority of German Patent Application 10 2010 034 664.0, the disclosure of which is hereby incorporated by reference.

Modules with light emitting diodes (LEDs) and

Lighting devices with these, for example in the form of ceiling spotlights, are nowadays for lighting

available with a luminous intensity of typically over 300 lumens and a color rendering index of more than 80. However, cooling, which is of paramount importance due to the heat generation associated with high luminous intensity and power, is inherent in such modules

Lighting equipment problematic. The problem of cooling occurs in particular in the luminaire planning, for example, with regard to the thermal with these systems. Typically, most modules or

Lighting devices are installed in spotlights and lights integrated in a ceiling to illuminate a room or parts thereof from above. As a result, the lights are often upwards thermally insulated, which, for example, on conventional ceiling insulation of buildings, such as

Residential houses, for sound insulation, moisture and heat is located.

In addition, the luminaires are often installed in fireproof ceilings that comply, for example, with fire protection class F90. Such ceilings are designed so that flames over a period of time, for example in the fire protection standard F90 for 90 minutes, can not penetrate through the ceiling. Therefore, lights that must then also meet such a fire protection standard, typically secured upwards with a metal pot or the like. However, it can easily happen that the LED modules and lights are far too hot because

For example, a removal of heat, for example via convection barely works or no longer works.

At least one object of certain embodiments is to provide a light source with a light module.

This object is achieved by an object having the features of the independent claim. advantageous

From embodiments and further developments of the subject matter are characterized in the dependent claims and continue to be apparent from the following description and the drawings.

According to one embodiment, a light source is included

Light module on.

According to a further embodiment, a light module has a carrier body with a plurality of light-emitting semiconductor components. The semiconductor components may in particular be arranged on a mounting surface of the carrier body and in operation light along a

Blend emission direction. In particular, each of the light-emitting semiconductor devices may have a

Have light output surface over which the light generated during operation is emitted along the emission direction. With "radiation direction" is in particular the averaged over all possible radiation directions emission direction denotes, which is particularly preferably perpendicular to the light output surface.

The carrier body can be, for example, a connection carrier which, for example, has a base body made of an electrically insulating material, in which or on the electrical connection points, contact points and / or conductor tracks are applied or applied. Particularly preferably, the carrier body can be designed as a circuit board with electrical contacts for the electrical connection of the plurality of light-emitting semiconductor components. For this purpose, the carrier body can be embodied particularly preferably as a printed circuit board (PCB) or as a metal core printed circuit board (MCPCB).

A light-emitting semiconductor component of the plurality of light-emitting semiconductor components may be particularly suitable for light in a wavelength range of

ultraviolet radiation to infrared radiation, more preferably visible light. In this case, the light-emitting semiconductor component can emit monochromatic or mixed-colored light, for example, particularly preferably for illumination purposes, white light. The light-emitting semiconductor device can do so

For example, also have a dye that can convert at least a portion of the radiation generated by a semiconductor layer sequence into light with a different wavelength, so that the semiconductor device can emit mixed-colored light. By a suitable combination of identical or different colored light emitting

Semiconductor devices are a high color rendering index and high brightness of the light source possible. The light-emitting semiconductor component can in particular be used as an epitaxially grown semiconductor layer sequence

be formed or an epitaxially grown

Have semiconductor layer sequence. The

Semiconductor layer sequence may be embodied in particular as a semiconductor chip. The semiconductor layer sequence can be

Arsenide, phosphide and / or nitride compound semiconductor material having regard to its

Composition and in terms of its layer structure is formed according to the desired light. The light-emitting semiconductor component can in particular be designed as a light-emitting diode (LED). The light

For this purpose, the emitting semiconductor component can have, for example, a housing body in which the epitaxially

grown semiconductor layer sequence, ie the semiconductor chip, mounted and optionally in a potting material

is embedded. Alternatively, the semiconductor light-emitting device may also be epitaxially grown

Semiconductor layer sequence in the form of a semiconductor chip directly on the mounting surface of the carrier body without a

Housing body to be mounted.

According to a further disclosed embodiment, the light

emitting semiconductor components of the plurality of light-emitting semiconductor components each emit light having a same wavelength or a same wavelength range and thus with a same color impression.

Alternatively, the light emitting

Semiconductor devices of the plurality of light-emitting semiconductor devices also radiate different colored light, so that the superposition of different colored light of the plurality of light-emitting Semiconductor devices leads to a mixed-color light for the light module.

According to another embodiment, the light module of the light source has a convection cooling body.

The convection cooling body can be arranged in particular laterally to the semiconductor components. This means that the convection cooling body is arranged in the emission direction next to and thus laterally offset from the semiconductor components. The convection cooling body can furthermore be particularly preferably thermally connected to the carrier body. As a result, it may be possible to advantageously heat, which in the operation of the semiconductor light-emitting components

arises, of these on the carrier body to the

Convection heat sink can be delivered. Furthermore, the convection cooling body can extend away in the emission direction of the mounting surface. This may mean, in particular, that the convection cooling body radiates in the emission direction from the carrier body and thus from the light

Semiconductor devices away. Alternatively, the convection heat sink can also be against the

Extending emission direction away from the carrier body.

According to another disclosed embodiment, the

Convection heat sink at least two wall elements, between which a plurality of thermally to the

Wall elements connected cooling fins is arranged, wherein one of the wall elements adjacent to the carrier body.

In particular, the two wall elements can be thermally thermally connected to respective opposite edges of each of the cooling fins, so that the wall elements with the cooling fins each form cavities, which of a Cooling medium, in particular air, can be flowed through. The fact that two elements adjoin one another means here and in the following that a thermal and a mechanical contact exist.

According to a further disclosed embodiment, the cooling fins are arranged such that a cooling medium, in particular air, by convection, the convection cooling body at least

partially in or against the emission direction can flow through. Thus, the wall elements may extend in particular away from the mounting surface of the carrier body along the emission direction, while the cooling fins between the wall elements at least partially also along the

Extend emission direction away from the mounting surface. This may mean, for example, that the cooling fins are arranged perpendicular to the mounting surface. Furthermore, it may also mean that the cooling fins are arranged inclined to the emission direction and thus inclined to the mounting surface. By inclined to the radiation direction cooling fins can with

Advantage an improvement of a convection flow in

Radiation direction or against the emission direction can be achieved. In particular, a chimney effect can be achieved by the convection cooling body, through which the cooling medium, in particular air, effectively the convection cooling body

can flow through and thus heat from the

Convection heat sink and thus also from the light

emitting semiconductor devices can be removed.

In the light source described here with the light module with the carrier body and the convection cooling body, it may be possible with advantage that no active cooling such as a fan or a heavy heat sink used Need to become. This can be a compact light source

be made possible, which can nevertheless ensure sufficient cooling for the light-emitting semiconductor devices.

Advantageously, this can reduce the temperature of the light

In contrast to known luminaires with LEDs, emitting semiconductor components can be lowered or it can be ensured that the temperature in the semiconductor layer sequences of the semiconductor components does not exceed a certain maximum temperature. This may make it possible that the radiated wavelength or the radiated

Wavelength range and thus the color temperature of the light emitted by the semiconductor devices light remain more stable compared to known lights with LEDs. As a result, for example, brightness and color drifts can be reduced. Furthermore, due to an effective cooling the

Life of the light-emitting semiconductor devices can be extended with advantage.

According to a further embodiment, the

Mounting surface have a shape that is selected from a group, which is formed by a circle, a

Ellipse, a circular arc, an elliptical arc, a spiral, a spline and a combination of them. In this case, a spline is referred to as a spline which has curve pieces set against each other continuously and without kinking, each of which can be defined, for example, by polynomial functions, circular functions, elliptical functions and / or trigonometric functions. A spline can thus also as

Freeform curve are designated, in particular in

mathematical sense steadily and at least once

differentiable and thus no gaps or kinks having. In particular, the carrier body can have an annular mounting surface. As an annular

Mounting surface is here and hereinafter referred to a mounting surface which is strip-shaped and a

Opening completely encloses. Particularly preferably, the annular mounting surface is designed in the form of a circular ring or an ellipse ring or strip-shaped along a closed spline.

According to a further embodiment, the

Convection heatsink to a basic shape, the to the

Mounting surface of the carrier body is adjusted. With a basic form of convection heat sink is here and in the

The following designates the form that the

Convection heat sink in a plane perpendicular to

Emission direction of the light-emitting

Semiconductor devices has. The mounting surface can be limited, for example, by at least one edge line and the convection cooling body can adjoin the edge line and follow the edge line. In particular, a wall element of the convection cooling body can follow the edge line of the mounting surface. The fact that the convection heat sink a

Basic shape, which is attached to the mounting surface of the

Carrier body is adapted, a large-area connection of the convection cooling body can be achieved to the carrier body, although the carrier body laterally to the

Semiconductor devices is arranged.

If, for example, the carrier body is designed such that it has an annular, for example annular or elliptical ring-shaped or strip-shaped, mounting surface running along a closed spline, the wall elements of the convection cooling body can be particularly preferably form an equally shaped cylinder ring in which the cooling fins are arranged.

According to a further embodiment, the

Convection heat sink a the semiconductor devices

facing, extending away from the mounting surface in the emission direction side surface, which is reflective. The side surface may be diffuse or directionally reflective, that is, in the latter case, shiny executed.

In particular, the side surface may be formed by a side surface of one of the wall elements of the convection cooling body, which adjoins the carrier body.

One or both of the wall elements of the convection cooling body can be arranged parallel to the emission direction of the light-emitting semiconductor components and thus perpendicular to the mounting surface of the carrier body. Alternatively, one or both of the wall elements can also be inclined at an angle different from 90 ° to the mounting surface, in other words, different from 0 ° to the emission direction, be arranged. Is that the light, for example?

Formed facing semiconductor element facing wall element with a reflective side wall, which is arranged inclined, it may be possible that advantageously a desired light distribution and radiation characteristic

can be achieved.

According to a further embodiment, the light module can have a further convection cooling body, which is likewise arranged laterally to the semiconductor components and is thermally connected to the carrier body. In particular, the further convection cooling body can likewise extend away from the mounting surface in the emission direction. Particularly preferably, the light-emitting semiconductor components are between the

Convektionskühlkörpern arranged so that the carrier body, for example, has a ring shape with two edges, on each of which a convection cooling body is arranged. Are the light emitting semiconductor devices

each side of the Konvektionskühlkörper reflective formed, a gain of the

Radiation of light in the direction of radiation can be achieved. At the same time, an enlargement of the cooling effect can be achieved by the further convection cooling body. The further convection cooling body can have one or more of the aforementioned features for the convection cooling body.

Furthermore, the light module can be an optical element

have, which is arranged downstream of the semiconductor devices in the emission direction. The optical element can be designed, for example, transparent or translucent and

For example, include one or more lenses. Furthermore, the optical element can also be used as an optical diffuser

be formed, for example, as a scattering plate or

Scattering foil.

According to a further disclosed embodiment, the light source may comprise a plurality of light modules, each of which may have one or more of the aforementioned features and / or one or more of the aforementioned embodiments. Particularly preferred, the light modules to each other

border and thus form a compact, space-saving light source. In particular, the light modules can adjoin one another in such a way that at least one convection cooling body of a light module adjoins the carrier body of an adjacent light module Light module adjacent and thermally with this m contact is. This may mean, in particular, that the majority of

Light modules are arranged such that in each case a carrier body is always arranged between two convection cooling bodies. This can advantageously contribute to a convection cooling body, for example for cooling of at least two carrier bodies.

Particularly preferably, a first and a second of the plurality of light modules may be formed annularly of different sizes, wherein the first light module surrounds the second light module and directly adjoins the second light module. This may mean in particular that the first and the second light module are arranged one inside the other. If the light source has more than two light modules, then in a particularly preferred embodiment they can all be of annular design with different sizes and be arranged one inside the other.

According to a further disclosed embodiment, the mounting surface of the second light module, which is surrounded by the first light module, in the emission direction to the mounting surface of the first

Light module can be arranged offset. In particular, the mounting surface of the second light module can be arranged in the emission direction in front of the mounting surface of the first light module. As a result, the carrier body of the light modules can form a staircase or stepped arrangement, whereby the light source, for example, a stepped pyramidal overall shape

can have.

According to a further embodiment, the light source furthermore has a fastening element on which the at least one light module or the plurality of light modules is arranged and are attached. The fastening element can in particular also serve for the electrical connection of the one or more light modules and for this purpose have suitable electrical leads and connection possibilities for the light modules. In particular, the fastener may be formed, for example, column or peg-shaped and the light module may surround the fastener annular. The

In particular, fastening element may also be suitable for being arranged and fastened in an already existing or known lamp socket or mounting device.

As a result, the light source can be arranged without additional measures, for example, in a known lamp socket. In particular, the light source can be designed as a so-called retrofit light source. The fact that the light source has the convection cooling body, no further measures for cooling the light source and in particular the light-emitting

Semiconductor devices are provided since the light

emitting semiconductor devices can be effectively cooled by convection. The disadvantage of known

Retrofit LED modules, which often get too hot when mounted in existing lamp sockets without further cooling, can be advantageously avoided.

In particular, the light source in a preferred

Embodiment, a ceiling spotlight or a

Ceiling light form, which has fixed by means of the fastening element light modules, which are arranged spaced from a ceiling, so that an effective convection can take place through the convection heat sink. As a result, the light emitted by the operation of the light

Semiconductor devices formed hot air upward

dodge and does not stay trapped in the ceiling space. By such a hanging arrangement of the light source, the

Convection can be maximized with advantage.

Further advantages and advantageous embodiments and forms

Further developments emerge from the following in

Compound described with the figures 1 to 4

Execution forms.

Show it:

Figure 1 is a schematic representation of a light source

according to an embodiment,

Figure 2 is a schematic representation of a light source

according to a further embodiment,

FIGS. 3A to 3E show different schematic representations of a light source according to another

Embodiment and

Figure 4 is a schematic representation of a light source

according to yet another embodiment.

In the exemplary embodiments and figures, the same or equivalent components may each have the same

Be provided with reference numerals. The illustrated elements and their proportions with each other are basically not to be considered as true to scale. Rather, individual elements such as layers, components, components and areas for exaggerated representability and / or better understanding can be shown exaggerated thick or large dimensions. FIG. 1 shows an exemplary embodiment of a light source 100 that has a light module 10. The light module 10 has a carrier body 1 with a plurality of light-emitting semiconductor components 3.

The carrier body 1 is annular in the embodiment shown. In particular, the carrier body 1 has a mounting surface 11, which is annular, in particular annular, is formed. The carrier body 1 is designed as a board which on the mounting surface 11th

Mounting areas and electrical leads for the plurality of light-emitting semiconductor devices 3 has.

The light-emitting semiconductor components 3 are designed as epitaxially grown semiconductor layer sequences in the form of semiconductor chips, which are arranged directly on the carrier body 1. For example, the lights

but also as light-emitting diodes (LEDs) in the form of semiconductor chips, each mounted in a separate housing body, preferably a preformed housing body, and are electrically connected. Depending on the desired light to be emitted by the light module 10 or by the light source 100, the light-emitting

Semiconductor devices 3 each light with the same

Shave wavelength or the same color impression or even different colored light. For example, as shown in Figure 1, the light emitting

Semiconductor devices 3 also in groups on the

Mounting surface 11 of the support body 1 may be arranged, each group at least one light-emitting

Semiconductor device 3, which emits red light, at least one light-emitting semiconductor device 3, the green Light radiates, and at least one light-emitting

Semiconductor device 3, which emits blue light has. Due to the superposition of each radiated

different colored light can be a mixed-color,

in particular white, luminous impression produced by the light source 100. For the homogenization of the of the

Semiconductor devices 3 radiated light may be this downstream in the emission and an optical element, such as an optical diffuser (not shown).

The semiconductor components 3 emit the light along the emission direction 99 indicated by the arrow.

Furthermore, the light module 10 has a convection cooling body 2 which is laterally, that is to say in a plane perpendicular to the emission direction 99, to the semiconductor components 3

is arranged. The convection heat sink 2 is here

thermally connected to the carrier body 1 and extends in the emission direction 99 of the mounting surface 11 of the carrier body 1 away.

The convection cooling body 2 has two wall elements 22 and 23, between which a plurality of thermally to the

Wall elements 22, 23 connected cooling fins 24 is arranged. In a plane perpendicular to the emission direction 99, the convection cooling body 2 has a basic shape, which is adapted to the mounting surface 11 of the carrier body 1. This means in the embodiment shown in particular that the convection cooling body 2 is also annular and that the wall elements 22, 23 form a cylindrical ring in which the cooling fins 24 are arranged. Alternatively to the illustrated annular embodiment of

Carrier body 1 and the convection heat sink 2 in the shown Embodiment of Figure 1, the carrier body 1 and / or the convection cooling body 2 also have a different shape, such as an elliptical ring shape or a ring shape along a closed spline.

Due to the thermal connection of the wall element 22 of the convection cooling body 2 to the carrier body 1, an effective heat dissipation from the light-emitting

Semiconductor devices 3 are ensured on the convection heat sink 2. In particular, the cooling ribs 24 are arranged such that a cooling medium, in particular air, by convection the convection cooling body 2 at least partially in or against the emission direction 99th

can flow through. For example, the light source 100 can be used with the light module 10 as ceiling lighting, so that air by convection against the

Abstrahlrichtung 99 can flow through the convection heat sink 2. According to the number of light-emitting

Semiconductor devices 3 and the heat generated by them and adapted to the ambient temperature, the

Humidity and other convection influencing factors, it has proved to be advantageous if the cooling fins 24 as shown in Figure 1 inclined to

Abstrahlrichtung 99 are arranged. This can be a

Improvement of a chimney effect can be obtained, which has an increased convection flow through the convection heat sink 2 result. Due to the thermal connection of the

Convection heat sink 2 are also the cooling fins 24th

thermally connected to the carrier body 1 and thus to the light-emitting semiconductor devices 3, so that these on the cooling fins 24 and the Convection heat sink 2 flowing air can be effectively cooled. As a result, a lower or lower operating temperature of the light-emitting semiconductor components 3 can be achieved in comparison to known luminaires with LEDs, as a result of which the life of the light

emitting semiconductor devices 3 can be increased with advantage and on the other brightness and color variations that can be caused by temperature fluctuations or drifts can be reduced.

The convection cooling body 2 is made of a thermally highly conductive material, such as a metal such as aluminum and / or copper. To increase the emission of light in the emission direction 99, the convection cooling body 2 has a light

emitting semiconductor devices facing away from the light emitting semiconductor devices 3 away

extending side surface 25, which faces through the light-emitting semiconductor devices 3

Side surface of the wall member 22 is formed and which is formed reflective. In this case, the side surface 25 depending on the desired Abstrahlcharakteristik be diffused or directed reflective.

The wall element 22 of the convection cooling body 2 can

alternatively to the vertical arrangement shown for

Mounting surface 11, in other words, for parallel arrangement to the emission direction 99, also be inclined, so with an angle different from 90 ° to

Mounting surface 11, in other words, different from 0 ° to the emission direction 99. This may advantageously by the reflective properties of the side surface 25 a desired light distribution and emission characteristics

can be achieved.

The light source 100 and in particular the light module 10 may additionally have other elements such as fastening, mounting and / or electrical connection elements, which are not shown for clarity.

By the allowed by the convection heat sink 2 effective cooling of the light-emitting

Semiconductor devices 3 are not required convection cooling body or active cooling such as by fans for the light source 100 shown. For example, for use as a ceiling lamp, the hot air with advantage to the top, that is opposite to the radiation direction 99, dodge. Due to the large surface area provided by the cooling fins 24, the heat from the light

emitting semiconductor devices 3 are efficiently transferred to the air flowing through the convection heat sink 2.

The further figures show further exemplary embodiments of light sources 200, 300, 400 which are based on the principle of the light source 100 according to the exemplary embodiment in FIG. In the following description are therefore in the

Substantial differences and modifications compared to the light source 100 are described, so not described

Features of the following embodiments as shown in Figure 1 or may be carried out in the general part described.

In Figure 2, an embodiment of a light source 200 is shown, wherein the view of the light source 200 in a Direction to the light-emitting semiconductor devices 3 opposite to the emission direction 99 is shown. The light source 200 has a light module 10 according to the previous one

Embodiment, in particular ring circular, that is with a correspondingly shaped mounting surface 11 of the carrier body 1 and a correspondingly shaped

Convection heat sink 2, is formed. In addition, the light source 200 has a further light module 20, which has a carrier body 1 'with a mounting surface 21 on which further light-emitting semiconductor components 3 are arranged.

The light module 20 furthermore has a convection cooling body 2 ', which is thermally connected to the carrier body 1 and which extends laterally relative to the carrier body 1 or the light-emitting semiconductor components 3 arranged in the emission direction away from the mounting surface 21 of the carrier body 1'. In particular, the light module 20 surrounds the light module 10, the support body 1 of the light module 10 also being in thermal contact with the convection cooling body 2 'of the light module 20. As a result, the carrier body 1 of the light module 20 is thermally connected both to the convection heat sink 2 and to the convection heat sink 2 ', whereby a very effective heat dissipation of the light-emitting semiconductor devices 3 of the light module 10 can be ensured to the surrounding air.

The light module 20 additionally has another one

Convection heat sink 2 '', which at a the

Convection heat sink 2 'opposite side of

Mounting surface 21 of the support body 1 'is connected.

This can also cool the light-emitting Semiconductor devices 3 of the light module 20 can be increased with advantage.

All convection heat sink 2, 2 'and 2' 'have cooling fins 2, which are arranged between corresponding wall elements and inclined to the emission direction of the light

emitting semiconductor devices 3 are aligned to the most effective convection through the

To allow convection heat sink 2, 2 ', 2' '.

In particular, all are the light emitting

Semiconductor devices 3 facing side surfaces of

Convection heat sink 2, 2 ', 2' 'reflective designed to allow effective light emission in the emission direction and thus a desired light distribution. The light-emitting semiconductor components 3 of the light module 10 and of the light module 20 can in each case be made different from one another or else the same, in order to produce a desired fixed or variable luminous impression

To enable light source 200.

Furthermore, the light-emitting

Semiconductor devices 3 between or in the emission direction over the convection heat sinks 2, 2 ', 2' 'optical elements (not shown) such as optical diffusers or lenses may be arranged downstream to a desired homogeneous

To achieve luminous impression. To be as homogeneous as possible

Luminous surface, the light-emitting semiconductor devices 3, in particular translucent

Subordinate diffuser rings.

As an alternative to the exemplary embodiment shown, more than two light modules can also be arranged one inside the other. The In contrast to the circular shape shown, light modules can also have other shapes, such as elliptical shapes or freeforms. Alternatively, the light modules

for example, also stretched or bent and not

be formed annularly closed.

FIGS. 3A to 3E show an exemplary embodiment of a light source 300. The following description refers equally to all figures 3A to 3E. In this case, in FIG. 3A, a schematic representation of FIG

Light source 300 in an oblique view and in Figure 3E is a schematic representation shown in a side view, wherein in Figures 3A and 3E, the light source is shown in each case with all light modules. Individual light modules of the light source 300 are shown in FIGS. 3B, 3C and 3D for easier understanding.

The light source 300 has three light modules 10, 20, 30, which are designed according to the light modules of the light sources of the previous embodiments. In particular, each of the light modules 10, 20, 30 has light-emitting

Semiconductor devices 3, which on a respective

Mounting surface 11, 21, 31 of a respective carrier body 1, 1 ', 1' 'are mounted. Furthermore, each light module 10, 20, 30 has a convection cooling body 2, 2 ', 2' ', which according to the description of the previous embodiments

is executed.

The light modules 10, 20, 30 are arranged in one another such that the mounting surfaces 21 and 31 of the light modules 20 and 30, which are each surrounded by another light module, namely the light modules 10 and 20, to the respective

Mounting surface of the surrounding light module in the emission direction is arranged offset. This results in a staircase or stepped arrangement of the mounting surfaces 11, 21, 31 and thus a corresponding step-shaped

Arrangement of the respective light-emitting

Semiconductor Devices 3.

The light modules 10, 20, 30 are arranged and fixed to a fastening element 4, which is also provided for the electrical connection of the light modules 10, 20, 30 and corresponding electrical lines and

Has connection options (not shown). Of the

For clarity, holding and

Fastening elements, by means of which the light modules 10, 20, 30 can be fixed to the fastening element 4, not shown. The fastening element 4 is in this case

formed that on an already existing one

Ceiling element 5 can be arranged and fixed, wherein the ceiling element 5, for example, an existing version or holder for a known

Ceiling lighting element, for example with a

Light bulb, a compact fluorescent lamp, one

Metal vapor lamp or other known lamp having. To attach the fastener 4 in the ceiling element 5, only the old lamp must be removed, and the socket or the holder for the old lamp only needs to be covered accordingly, for example by means of a plate and / or a

Zylinderhaiterung. The light source 300 is thus referred to as a so-called retrofit

Light source running, which can be attached to an existing socket or an existing lamp holder and easily already known ceiling light sources can replace. In particular, the fastening element 4 is designed in such a way that the light module 10 arranged closest to the ceiling element 5 has a spacing of approximately 5 cm or more, so that warm air flowing through the convection cooling bodies 2, 2 'and 2 "due to the convection projects upward and can flow away to the side. As already in the

In connection with the preceding embodiments, those emitting the light may also be used

Semiconductor devices 3 facing side surfaces of

Convection heat sink 2, 2 ', 2' 'each be designed to be reflective, in order to achieve a desired radiation characteristic of the light source 300. Simulations of a

Light source 300 according to the embodiment shown with a distance of the uppermost light module 10 to the ceiling element 5 of about 6 cm have shown that effective cooling of the light-emitting semiconductor devices 3 at a

at the same time homogenous illumination of the environment can be achieved. In Figure 4 is another embodiment of a

Light source 400 is shown having compared to the light source 300 according to the figures 3A to 3E three light modules 10, 20, 30 with different diameters which are arranged inside each other, wherein the mounting surfaces 11, 21, 31 of the respective light source modules 10, 20, 30 in a level are arranged. This can be a very flat

Reach light source 400, which has a thickness which is the thickness of the convection heat sink 2, 2 ', 2' 'in

Direction of emission 99 corresponds. Simulations of such a light source 400 have shown that even with a telescoped arrangement of the light modules 10, 20, 30 a

effective cooling with a simultaneous homogeneous

Illumination of the environment can be achieved. The invention is not limited by the description based on the embodiments of these. Rather, the invention includes any novel feature and any combination of features, which in particular includes the combination of features in the claims, even if this feature or combination itself is not explicitly in the

Claims or embodiments is given.

Claims

claims

1. Light source with a light module (10), comprising

- A support body (1) with a plurality of light

emitting semiconductor devices (3) and a

Convection heat sink (2),

- Wherein the semiconductor devices (3) on a mounting surface (11) of the carrier body (1) are arranged and in operation emit light along a radiation direction (99), and - wherein the convection cooling body (2) lateral to the

Semiconductor devices (3) is arranged, is thermally connected to the carrier body (1) and in

Emission direction (99) from the mounting surface (11)

stretched away.

2. Light source according to claim 1, wherein the

Convection heat sink (2) at least two wall elements (22, 23) and in between a plurality of thermally to the

Wall elements (22, 23) connected cooling fins (24) and wherein one of the wall elements (22) adjacent to the carrier body (1).

3. Light source according to claim 2, wherein the cooling ribs (24) are arranged such that a cooling medium by convection the convection cooling body (2) at least partially in or against the emission direction (99) can flow through.

4. Light source according to claim 2 or 3, wherein the cooling ribs (24) inclined to the emission direction (99) are arranged.

5. Light source according to one of the preceding claims, wherein the carrier body (1) has an annular mounting surface (11).

6. Light source according to one of the preceding claims, wherein the convection cooling body (2) has a basic shape which is adapted to the mounting surface (11) of the carrier body (1).

7. Light source according to one of the preceding claims, wherein the wall elements (22, 23) of the convection cooling body (2) form a cylinder ring, in which the cooling fins (24) are arranged.

8. Light source according to one of the preceding claims, wherein the convection cooling body (2) facing the semiconductor components (3), from the mounting surface (11) in

Abstrahlrichtung (99) away extending side surface (25), which is reflective.

9. Light source according to one of the preceding claims, wherein the light module (10) the semiconductor components (3) in

Abstrahlrichtung (99) arranged downstream of an optical element.

10. The light source of claim 9, wherein the optical element is an optical diffuser.

11. A light source according to any one of the preceding claims, wherein the light source comprises a plurality of light modules (10, 20, 30) adjacent to each other.

12. The light source of claim 11, wherein at least a first and a second of the plurality of light modules (10, 20) are formed annularly of different sizes and the first light module (10) surrounds the second light module (20).

13. A light source according to claim 11 or 12, wherein the

Mounting surface (21) of the second light module (20) in

Abstrahlrichtung (99) to the mounting surface (11) of the first light module (10) is arranged offset.

14. Light source according to one of the preceding claims, further comprising a fastening element (4), wherein the light module (10) surrounds the fastening element (4) in an annular manner.