WO2008031278A1 - Procédé de fabrication d'un combiné intelligent ultra-mince - Google Patents

Procédé de fabrication d'un combiné intelligent ultra-mince Download PDF

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Publication number
WO2008031278A1
WO2008031278A1 PCT/CN2006/002373 CN2006002373W WO2008031278A1 WO 2008031278 A1 WO2008031278 A1 WO 2008031278A1 CN 2006002373 W CN2006002373 W CN 2006002373W WO 2008031278 A1 WO2008031278 A1 WO 2008031278A1
Authority
WO
WIPO (PCT)
Prior art keywords
pcb
manufacturing
handset
mounting
main board
Prior art date
Application number
PCT/CN2006/002373
Other languages
English (en)
Chinese (zh)
Inventor
Zhenfeng Yang
Linbo Zou
Original Assignee
E28 (Shanghai) Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by E28 (Shanghai) Limited filed Critical E28 (Shanghai) Limited
Priority to PCT/CN2006/002373 priority Critical patent/WO2008031278A1/fr
Publication of WO2008031278A1 publication Critical patent/WO2008031278A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit

Definitions

  • the present invention relates to a method of manufacturing an ultra-thin smartphone. Background technique
  • a liquid crystal display module and a battery module including a tablet are disposed opposite to each other, and a supporting steel plate is disposed between the two modules;
  • the manufacturing method further includes the steps of: sequentially arranging a camera, a receiver, and a headphone jack at an upper end of the entire body, a microphone at a lower end of the body, and the above component and the first PCB through a flexible printed circuit
  • the motherboard is connected.
  • the manufacturing method further comprises the step of manufacturing a portion of the outer casing of the mobile phone surrounding the liquid crystal display module and a portion covering the battery module with a metal material.
  • the support steel plate has a thickness of 0.3 legs.
  • the Tf 1 ash card holder is only allowed to plug and unplug the T-f 1 ash card laterally.
  • the volume can be made small, the thickness is thin, and no work is reduced.
  • the ultra-thin smartphone that meets the needs of people who carry and use their smartphones.
  • FIGS. 2a and 2b are diagrams showing a camera, a receiver and a headphone jack disposed at an upper end of the entire mobile phone body in accordance with the method of the present invention; Being and using the flexible printed circuit to connect the above components with the first
  • FIG. 3 is a schematic view showing the centralized arrangement of a T-fash card holder and a SIM card holder on a second PCB in accordance with the method of the present invention.
  • FIG. 1 A side view of an ultra-thin smartphone manufactured by the method of the present invention is shown in Fig. 1.
  • the overall thickness of the mobile phone mainly depends on the liquid crystal display module 1 and the battery module 2 containing the tablet.
  • the steel plate 3 having a thickness of 0.3 ⁇ 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3
  • a radio frequency module (not shown) and a baseband module (not shown) are collectively disposed on both sides of the first PCB main board 4, thereby improving device integration.
  • the antenna 5 is placed at the lower end of the entire mobile phone, which is also beneficial for SAR protection.
  • the camera 6, the receiver 7 and the headphone jack 8 are collectively disposed at the upper end of the entire mobile phone, a microphone (not shown) is disposed at the lower end of the mobile phone, and a flexible printed circuit is used.
  • FPC FPC
  • the Tf lash card holder 11 and the SIM card holder 10 are collectively disposed on the second PCB board 12, and the second PCB board is attached by means of a connector (not shown). 12 is connected to the first PCB main board 4 to make full use of the thickness space.
  • the SIM card holder 10 is designed to be removed only After the battery is inserted and removed, the S-type card can be inserted and removed; and the T-f1 ash card holder 11 is only allowed to plug and unplug the T-flan card sideways.
  • a portion surrounding the liquid crystal display module 1 and a portion covering the battery module 2 on the outer casing of the mobile phone are manufactured using a metal material.

Landscapes

  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Telephone Set Structure (AREA)

Abstract

Procédé de fabrication d'un combiné intelligent ultra-mince consistant à: (1) monter dos-à-dos un module LCD (1) possédant une plaque tactile et un module batterie (2) et intercaler entre ceux-ci une plaque de support (3) en acier; (2) monter des modules RF et des modules de bande de base des deux côtés d'une première carte principale PCB (4); (3) monter une antenne (5) tout au fond du combiné; (4) monter un cadre (11) de carte flash T et un cadre (10) de carte SIM sur une deuxième carte PCB (12) et accoupler la deuxième carte PCB (12) et la première carte principale PCB (4) au moyen d'un raccord. Ce procédé consiste également à: monter une tête de lecture (6), un récepteur (7) et une prise d'écouteur (8) sur l'extrémité supérieur du corps du combiné, monter un micro sur l'extrémité inférieur du corps du combiné, puis relier les éléments ci-dessus et la première carte principale PCB (4) par des cartes de circuits imprimés souples (FPCB) (9). Ceci permet d'obtenir un combiné ultra-mince compact pourvu d'une fonctionnalité et d'un confort d'utilisation optimisés.
PCT/CN2006/002373 2006-09-13 2006-09-13 Procédé de fabrication d'un combiné intelligent ultra-mince WO2008031278A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/CN2006/002373 WO2008031278A1 (fr) 2006-09-13 2006-09-13 Procédé de fabrication d'un combiné intelligent ultra-mince

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2006/002373 WO2008031278A1 (fr) 2006-09-13 2006-09-13 Procédé de fabrication d'un combiné intelligent ultra-mince

Publications (1)

Publication Number Publication Date
WO2008031278A1 true WO2008031278A1 (fr) 2008-03-20

Family

ID=39183361

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2006/002373 WO2008031278A1 (fr) 2006-09-13 2006-09-13 Procédé de fabrication d'un combiné intelligent ultra-mince

Country Status (1)

Country Link
WO (1) WO2008031278A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2530914A1 (fr) * 2010-10-13 2012-12-05 ZTE Corporation Panneau de support pour une carte mère ayant une structure de carte brisée dans un téléphone mobile
CN106790824A (zh) * 2017-01-17 2017-05-31 维沃移动通信有限公司 一种移动终端

Citations (22)

* Cited by examiner, † Cited by third party
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CN1219059A (zh) * 1997-08-28 1999-06-09 三星电子株式会社 移动电话的用户识别模块卡锁定装置
JPH11275194A (ja) * 1998-03-25 1999-10-08 Denso Corp 携帯電話機
JP2001086206A (ja) * 1999-09-09 2001-03-30 Sony Corp カード型電話
CN2469628Y (zh) * 2000-04-21 2002-01-02 北京邮电通信设备厂 超薄形移动电话机
JP2003045489A (ja) * 2001-07-30 2003-02-14 Toshiba Battery Co Ltd 非水電解質電池の製造方法
CN1402498A (zh) * 2001-08-23 2003-03-12 日本电气株式会社 折叠式移动无线电通信装置
CN2583893Y (zh) * 2002-08-12 2003-10-29 北京中电怡平科技发展有限公司 一种适于中小学生使用的UniKid手机
CN1469614A (zh) * 2002-07-19 2004-01-21 广达电脑股份有限公司 手机
CN1477896A (zh) * 2002-07-15 2004-02-25 摩托罗拉公司 用于增强的通信装置辐射性能的系统
CN1507736A (zh) * 2001-03-19 2004-06-23 ���µ�����ҵ��ʽ���� 带有拍摄功能的便携式终端设备
CN2622944Y (zh) * 2003-05-26 2004-06-30 海信集团有限公司 薄型手机
CN1534964A (zh) * 2003-03-31 2004-10-06 摩托罗拉公司 触敏显示组件的安装
CN2660807Y (zh) * 2003-11-26 2004-12-01 夏新电子股份有限公司 一种超薄直板式移动电话
CN2671245Y (zh) * 2003-12-17 2005-01-12 宁波波导股份有限公司 一种翻盖式手机
CN1655561A (zh) * 2004-02-12 2005-08-17 乐金电子(中国)研究开发中心有限公司 一种移动电话
WO2005083991A1 (fr) * 2004-02-27 2005-09-09 Nec Corporation TELEPHONE MOBILE du type Carte
CN1674598A (zh) * 2004-03-25 2005-09-28 明基电通股份有限公司 用户识别卡的固定装置
CN2768338Y (zh) * 2005-02-01 2006-03-29 上海环达计算机科技有限公司 令智能移动电话减少厚度的结构
CN1783740A (zh) * 2004-11-26 2006-06-07 京瓷株式会社 无线终端
CN2788405Y (zh) * 2005-03-30 2006-06-14 美国莫列斯股份有限公司 记忆卡及用户识别模块连接器
CN1808763A (zh) * 2005-02-01 2006-07-26 捷讯研究有限公司 包括集成天线和键盘的移动无线通信设备及相关方法
CN2805119Y (zh) * 2005-03-04 2006-08-09 美国莫列斯股份有限公司 记忆卡及用户识别模块连接器

Patent Citations (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1219059A (zh) * 1997-08-28 1999-06-09 三星电子株式会社 移动电话的用户识别模块卡锁定装置
JPH11275194A (ja) * 1998-03-25 1999-10-08 Denso Corp 携帯電話機
JP2001086206A (ja) * 1999-09-09 2001-03-30 Sony Corp カード型電話
CN2469628Y (zh) * 2000-04-21 2002-01-02 北京邮电通信设备厂 超薄形移动电话机
CN1507736A (zh) * 2001-03-19 2004-06-23 ���µ�����ҵ��ʽ���� 带有拍摄功能的便携式终端设备
JP2003045489A (ja) * 2001-07-30 2003-02-14 Toshiba Battery Co Ltd 非水電解質電池の製造方法
CN1402498A (zh) * 2001-08-23 2003-03-12 日本电气株式会社 折叠式移动无线电通信装置
CN1477896A (zh) * 2002-07-15 2004-02-25 摩托罗拉公司 用于增强的通信装置辐射性能的系统
CN1469614A (zh) * 2002-07-19 2004-01-21 广达电脑股份有限公司 手机
CN2583893Y (zh) * 2002-08-12 2003-10-29 北京中电怡平科技发展有限公司 一种适于中小学生使用的UniKid手机
CN1534964A (zh) * 2003-03-31 2004-10-06 摩托罗拉公司 触敏显示组件的安装
CN2622944Y (zh) * 2003-05-26 2004-06-30 海信集团有限公司 薄型手机
CN2660807Y (zh) * 2003-11-26 2004-12-01 夏新电子股份有限公司 一种超薄直板式移动电话
CN2671245Y (zh) * 2003-12-17 2005-01-12 宁波波导股份有限公司 一种翻盖式手机
CN1655561A (zh) * 2004-02-12 2005-08-17 乐金电子(中国)研究开发中心有限公司 一种移动电话
WO2005083991A1 (fr) * 2004-02-27 2005-09-09 Nec Corporation TELEPHONE MOBILE du type Carte
CN1674598A (zh) * 2004-03-25 2005-09-28 明基电通股份有限公司 用户识别卡的固定装置
CN1783740A (zh) * 2004-11-26 2006-06-07 京瓷株式会社 无线终端
CN2768338Y (zh) * 2005-02-01 2006-03-29 上海环达计算机科技有限公司 令智能移动电话减少厚度的结构
CN1808763A (zh) * 2005-02-01 2006-07-26 捷讯研究有限公司 包括集成天线和键盘的移动无线通信设备及相关方法
CN2805119Y (zh) * 2005-03-04 2006-08-09 美国莫列斯股份有限公司 记忆卡及用户识别模块连接器
CN2788405Y (zh) * 2005-03-30 2006-06-14 美国莫列斯股份有限公司 记忆卡及用户识别模块连接器

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2530914A1 (fr) * 2010-10-13 2012-12-05 ZTE Corporation Panneau de support pour une carte mère ayant une structure de carte brisée dans un téléphone mobile
US20120309457A1 (en) * 2010-10-13 2012-12-06 Zte Corporation Support board used in mobile phone with main board having broken-board structure
EP2530914A4 (fr) * 2010-10-13 2014-02-26 Zte Corp Panneau de support pour une carte mère ayant une structure de carte brisée dans un téléphone mobile
US8892178B2 (en) 2010-10-13 2014-11-18 Zte Corporation Support board used in mobile phone with main board having broken-board structure
CN106790824A (zh) * 2017-01-17 2017-05-31 维沃移动通信有限公司 一种移动终端

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