WO2008031278A1 - A method for manufacturing a smart handset with a super-thin thickness - Google Patents

A method for manufacturing a smart handset with a super-thin thickness Download PDF

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Publication number
WO2008031278A1
WO2008031278A1 PCT/CN2006/002373 CN2006002373W WO2008031278A1 WO 2008031278 A1 WO2008031278 A1 WO 2008031278A1 CN 2006002373 W CN2006002373 W CN 2006002373W WO 2008031278 A1 WO2008031278 A1 WO 2008031278A1
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WO
WIPO (PCT)
Prior art keywords
pcb
manufacturing
handset
mounting
main board
Prior art date
Application number
PCT/CN2006/002373
Other languages
French (fr)
Chinese (zh)
Inventor
Zhenfeng Yang
Linbo Zou
Original Assignee
E28 (Shanghai) Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by E28 (Shanghai) Limited filed Critical E28 (Shanghai) Limited
Priority to PCT/CN2006/002373 priority Critical patent/WO2008031278A1/en
Publication of WO2008031278A1 publication Critical patent/WO2008031278A1/en

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit

Definitions

  • the present invention relates to a method of manufacturing an ultra-thin smartphone. Background technique
  • a liquid crystal display module and a battery module including a tablet are disposed opposite to each other, and a supporting steel plate is disposed between the two modules;
  • the manufacturing method further includes the steps of: sequentially arranging a camera, a receiver, and a headphone jack at an upper end of the entire body, a microphone at a lower end of the body, and the above component and the first PCB through a flexible printed circuit
  • the motherboard is connected.
  • the manufacturing method further comprises the step of manufacturing a portion of the outer casing of the mobile phone surrounding the liquid crystal display module and a portion covering the battery module with a metal material.
  • the support steel plate has a thickness of 0.3 legs.
  • the Tf 1 ash card holder is only allowed to plug and unplug the T-f 1 ash card laterally.
  • the volume can be made small, the thickness is thin, and no work is reduced.
  • the ultra-thin smartphone that meets the needs of people who carry and use their smartphones.
  • FIGS. 2a and 2b are diagrams showing a camera, a receiver and a headphone jack disposed at an upper end of the entire mobile phone body in accordance with the method of the present invention; Being and using the flexible printed circuit to connect the above components with the first
  • FIG. 3 is a schematic view showing the centralized arrangement of a T-fash card holder and a SIM card holder on a second PCB in accordance with the method of the present invention.
  • FIG. 1 A side view of an ultra-thin smartphone manufactured by the method of the present invention is shown in Fig. 1.
  • the overall thickness of the mobile phone mainly depends on the liquid crystal display module 1 and the battery module 2 containing the tablet.
  • the steel plate 3 having a thickness of 0.3 ⁇ 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3
  • a radio frequency module (not shown) and a baseband module (not shown) are collectively disposed on both sides of the first PCB main board 4, thereby improving device integration.
  • the antenna 5 is placed at the lower end of the entire mobile phone, which is also beneficial for SAR protection.
  • the camera 6, the receiver 7 and the headphone jack 8 are collectively disposed at the upper end of the entire mobile phone, a microphone (not shown) is disposed at the lower end of the mobile phone, and a flexible printed circuit is used.
  • FPC FPC
  • the Tf lash card holder 11 and the SIM card holder 10 are collectively disposed on the second PCB board 12, and the second PCB board is attached by means of a connector (not shown). 12 is connected to the first PCB main board 4 to make full use of the thickness space.
  • the SIM card holder 10 is designed to be removed only After the battery is inserted and removed, the S-type card can be inserted and removed; and the T-f1 ash card holder 11 is only allowed to plug and unplug the T-flan card sideways.
  • a portion surrounding the liquid crystal display module 1 and a portion covering the battery module 2 on the outer casing of the mobile phone are manufactured using a metal material.

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  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Telephone Set Structure (AREA)

Abstract

A method for manufacturing a smart handset with a super-thin thickness comprises the following steps: 1) mounting a LCD module (1) which has a handwriting plate and a battery module (2) back-to-back, and mounting a support steel plate (3) between them; 2) assembling RF modules and base-band modules on both sides of a first PCB main board (4); 3) mounting an antenna (5) on the most bottom of the handset; 4) assembling a T-flash card frame (11) and a SIM card frame (10) on a second PCB board (12), and connecting the second PCB board (12) and the first PCB main board (4) by a connector. The method further comprises the following steps: mounting a pick-up head (6), a receiver (7) and an earphone jack (8) on the upper end of the handset body, and mounting a microphone on the lower end of the handset body, then connecting the members above and the first PCB main board (4) by flexible printed circuit boards (FPCB) (9). It may obtain a super-thin handset with small size, thin thickness and without any function losing by using this method. It could meet the requirement of persons for carrying a handset with easy and using a smart handset.

Description

一种制造超薄智能手机的方法 技术领域  Method for manufacturing ultra-thin smartphone
本发明涉及一种制造超薄智能手机的方法。 背景技术  The present invention relates to a method of manufacturing an ultra-thin smartphone. Background technique
随着通信技术的迅猛发展， 用户对所使用手机的功能需求越来越多， 集多种功能于一身的智能手机应运而生。 但是采用当前的智能手机制造 方法所制出的手机虽然功能丰富， 但体积庞大、 厚度较厚， 不便于随身 携带使用。 因此如何能制造出同时具有丰富的功能和小巧的尺寸及较薄 厚度的智能手机是急待解决的问题。 发明内容  With the rapid development of communication technology, users have more and more demand for the functions of mobile phones used, and a variety of functions in one smartphone has emerged. However, although the mobile phone manufactured by the current smart phone manufacturing method is rich in functions, it is bulky and thick, and is not convenient to carry around. Therefore, how to manufacture a smart phone with a large number of functions and a small size and a thin thickness is an urgent problem to be solved. Summary of the invention
本发明的目的是提供一种制造超薄智能手机的方法， 其包括以下步 驟：  It is an object of the present invention to provide a method of manufacturing an ultra-thin smartphone that includes the following steps:
( 1 )彼此背面相对地设置含有手写板的液晶显示模块和电池模块， 并在上述两模块之间设置一支撑钢板；  (1) a liquid crystal display module and a battery module including a tablet are disposed opposite to each other, and a supporting steel plate is disposed between the two modules;
( 2 )在第一 PCB 主板的两面上集中地设置射频模块与基带模块； ( 3 )在整个机身的最下端设置天线；  (2) centrally setting the RF module and the baseband module on both sides of the first PCB main board; (3) arranging the antenna at the lowermost end of the entire body;
( 4 )在第二 PCB板上集中设置 T- f lash卡卡座与 SIM卡卡座， 并 通过连接器将所述第二 PCB板与第一 PCB主板相连。  (4) Centrally setting a T-fash card holder and a SIM card holder on the second PCB, and connecting the second PCB to the first PCB through a connector.
根据本发明， 所述制造方法还包括以下步骤， 在整个机身的上端顺 序设置摄像头、 接收器及耳机插孔， 在机身的下端设置麦克风， 并通过 柔性印刷电路将上述部件与第一 PCB主板相连。  According to the present invention, the manufacturing method further includes the steps of: sequentially arranging a camera, a receiver, and a headphone jack at an upper end of the entire body, a microphone at a lower end of the body, and the above component and the first PCB through a flexible printed circuit The motherboard is connected.
根据本发明， 所述制造方法进而以下步骤， 釆用金属材料制造所述 手机的外壳上围绕液晶显示模块的部分和覆盖所述电池模块的部分。  According to the invention, the manufacturing method further comprises the step of manufacturing a portion of the outer casing of the mobile phone surrounding the liquid crystal display module and a portion covering the battery module with a metal material.
优选地， 所述支撑钢板的厚度为 0. 3腿。  5腿。 The support steel plate has a thickness of 0.3 legs.
优选地， 所述 T-f 1 a s h卡卡座是只允许侧向插拔 T- f 1 a s h卡的。 采用本发明的方法， 可以制造出体积小， 厚度薄， 且未减少任何功 能的超薄智能手机， 满足了人们随身携带和使用智能手机的需求。 附图说明 Preferably, the Tf 1 ash card holder is only allowed to plug and unplug the T-f 1 ash card laterally. By adopting the method of the invention, the volume can be made small, the thickness is thin, and no work is reduced. The ultra-thin smartphone that meets the needs of people who carry and use their smartphones. DRAWINGS
图 1是示出了根据本发明方法制造的超薄智能手机的侧视图； 图 2a及图 2b是示出了根据本发明的方法在整个手机机身的上端设 置摄像头、 接收器及耳机插孔被并通过柔性印刷电路将上述部件与第一 1 is a side view showing an ultra-thin smartphone manufactured according to the method of the present invention; FIGS. 2a and 2b are diagrams showing a camera, a receiver and a headphone jack disposed at an upper end of the entire mobile phone body in accordance with the method of the present invention; Being and using the flexible printed circuit to connect the above components with the first
PCB主板相连接的示意图； A schematic diagram of the connection of PCB boards;
图 3是示出了根据本发明的方法在第二 PCB板上集中设置 T- f lash 卡卡座与 SIM卡卡座的示意图。 具体实施方式  3 is a schematic view showing the centralized arrangement of a T-fash card holder and a SIM card holder on a second PCB in accordance with the method of the present invention. detailed description
下面结合附图对本发明的优选实施例进行详细描述。  The preferred embodiments of the present invention are described in detail below with reference to the accompanying drawings.
在图 1中示出了采用本发明的方法所制造的超薄智能手机的侧视图， 从图中可以看出， 手机的整体厚度主要取决于含有手写板的液晶显示模 块 1和电池模块 2。 为了将手机厚度降低到最低，根据本发明方法首先将 所述含有手写板的液晶显示模块 1和所述电池模块 2彼此背面相对地设 置， 同时在其间设置一厚度为 0. 3讓的钢板 3作为支撑以提高强度。  A side view of an ultra-thin smartphone manufactured by the method of the present invention is shown in Fig. 1. As can be seen from the figure, the overall thickness of the mobile phone mainly depends on the liquid crystal display module 1 and the battery module 2 containing the tablet. The steel plate 3 having a thickness of 0.3 。 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 As a support to increase strength.
为了进一步减小手机体积， 将射频模块（未示出） 与基带模块（未 示出） 集中地两面布置在第一 PCB主板 4上， 从而提高器件集成度。  In order to further reduce the size of the handset, a radio frequency module (not shown) and a baseband module (not shown) are collectively disposed on both sides of the first PCB main board 4, thereby improving device integration.
为了最大限度地利用空间， 防止相互干扰， 将天线 5设置在整个手 机的最下端， 这样也有利于实现 SAR保护。  In order to maximize the use of space and prevent mutual interference, the antenna 5 is placed at the lower end of the entire mobile phone, which is also beneficial for SAR protection.
接下来， 如图 2a及图 2b所示， 将摄像头 6、 接收器 7和耳机插孔 8 集中地设置在整个手机的上端， 将麦克风（未示出）设置在手机下端， 并使用柔性印刷电路（ FPC ) 9将上述多个部件与第一 PCB主板 4相连从 而构成一个完整的系统。  Next, as shown in FIG. 2a and FIG. 2b, the camera 6, the receiver 7 and the headphone jack 8 are collectively disposed at the upper end of the entire mobile phone, a microphone (not shown) is disposed at the lower end of the mobile phone, and a flexible printed circuit is used. (FPC) 9 connects the above various components to the first PCB main board 4 to form a complete system.
最后， 如图 3中所示出的， 将 T-f lash卡卡座 11 和 SIM卡卡座 10 集中设置在第二 PCB板 12上， 并借助连接器 （未示出）将所述第二 PCB 板 12与第一 PCB主板 4相连接从而充分利用厚度空间。 优选地， 为了防 止对 SIM卡进行热插拔操作， .所述 SIM卡卡座 10被设计为， 只有在取出 电池后才能对 S IM卡进行插拔操作； 而所述 T- f 1 a s h卡卡座 11为是只允 许侧向插拔 T- f lash卡。 Finally, as shown in FIG. 3, the Tf lash card holder 11 and the SIM card holder 10 are collectively disposed on the second PCB board 12, and the second PCB board is attached by means of a connector (not shown). 12 is connected to the first PCB main board 4 to make full use of the thickness space. Preferably, in order to prevent hot plugging operation on the SIM card, the SIM card holder 10 is designed to be removed only After the battery is inserted and removed, the S-type card can be inserted and removed; and the T-f1 ash card holder 11 is only allowed to plug and unplug the T-flan card sideways.
为了更加有效地减少手机的厚度同时保证其结构强度， 采用金属材 料制造所述手机的外壳上围绕液晶显示模块 1 的部分和覆盖所述电池模 块 2的部分。  In order to more effectively reduce the thickness of the mobile phone while ensuring the structural strength thereof, a portion surrounding the liquid crystal display module 1 and a portion covering the battery module 2 on the outer casing of the mobile phone are manufactured using a metal material.
本领域普通技术人员应当知道， 除特别指出的部件排布方案以及连 接方式以外， 可以采用本领域已知的任何恰当的方法布设与连接所述智 能手机的其他部件与模块， 从而构成稳定运行的手机系统。  Those skilled in the art will appreciate that other components and modules of the smartphone can be deployed and connected in any suitable manner known in the art, in addition to the particular arrangement of components and connections, to provide stable operation. Phone system.
通过采用本发明的方法， 可以制造出体积小， 厚度薄， 且未减少任 何功能的超薄智能手机， 满足了人们随身携带和使用智能手机的需求。  By adopting the method of the present invention, it is possible to manufacture an ultra-thin smartphone which is small in size, thin in thickness, and which does not reduce any function, and satisfies the demand for carrying and using a smartphone.

Claims

权 利 要 求 Rights request
1. 一种制造超薄智能手机的方法， 其特征在于， 其包括以下步骤：A method of manufacturing an ultra-thin smartphone, characterized in that it comprises the following steps:
( 1 )彼此背面相对地设置含有手写板的液晶显示模块和电池模块， 并在上述两模块之间设置一支撑钢板； (1) a liquid crystal display module and a battery module including a tablet are disposed opposite to each other, and a supporting steel plate is disposed between the two modules;
( 2 )在第一 PCB 主板的两面上集中地设置射频模块与基带模块； (2) centrally setting the RF module and the baseband module on both sides of the first PCB main board;
( 3 )在整个机身的最下端设置天线； (3) arranging an antenna at the lowermost end of the entire body;
( 4 )在第二 PCB板上集中设置 T- f lash卡卡座与 SIM卡卡座， 并 通过连接器将所述第二 PCB板与第一 PCB主板相连。  (4) Centrally setting a T-fash card holder and a SIM card holder on the second PCB, and connecting the second PCB to the first PCB through a connector.
2. 如权利要求 1所述的制造方法， 其特征在于， 所述方法还包括以 下步骤， 在整个机身的上端顺序设置摄像头、 接收器及耳机插孔， 在机 身的下端设置麦克风， 并通过柔性印刷电路将上述部件与第一 PCB主板 相连。  2. The manufacturing method according to claim 1, further comprising the steps of: sequentially arranging a camera, a receiver, and a headphone jack at an upper end of the entire body, and providing a microphone at a lower end of the body, and The above components are connected to the first PCB main board by a flexible printed circuit.
3. 如权利要求 1所述的制造方法， 其特征在于， 所述方法还包括以 下步骤， 釆用金属材料制造所述手机的外壳上围绕液晶显示模块的部分 和覆盖所述电池模块的部分。  3. The manufacturing method according to claim 1, wherein the method further comprises the step of manufacturing a portion of the outer casing of the mobile phone surrounding the liquid crystal display module and a portion covering the battery module with a metal material.
4. 如权利要求 1所述的制造方法， 其特征在于， 所述支撑钢板的厚 度为 0. 3mm.  0. 3mm. The thickness of the support steel plate is 0. 3mm.
5. 如权利要求 1所述的制造方法， 其特征在于， 所述 T- f lash卡卡 座是只允许侧向插拔 T- f 1 a s h卡的。  The manufacturing method according to claim 1, wherein the T-fash card holder is only allowed to insert and remove the T-f 1 a s h card laterally.
PCT/CN2006/002373 2006-09-13 2006-09-13 A method for manufacturing a smart handset with a super-thin thickness WO2008031278A1 (en)

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EP2530914A4 (en) * 2010-10-13 2014-02-26 Zte Corp Support board for main board with broken board structure in mobile telephone
US8892178B2 (en) 2010-10-13 2014-11-18 Zte Corporation Support board used in mobile phone with main board having broken-board structure
CN106790824A (en) * 2017-01-17 2017-05-31 维沃移动通信有限公司 A kind of mobile terminal

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