USD798249S1 - Electric terminal - Google Patents
Electric terminal Download PDFInfo
- Publication number
- USD798249S1 USD798249S1 US29/556,621 US201629556621F USD798249S US D798249 S1 USD798249 S1 US D798249S1 US 201629556621 F US201629556621 F US 201629556621F US D798249 S USD798249 S US D798249S
- Authority
- US
- United States
- Prior art keywords
- electric terminal
- design
- view
- elevation view
- dashed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
The ornamental design which is claimed is shown in the figures.
The dashed-dot-dashed lines represent the boundary line of the claimed design. The even dashed broken lines shown in the drawings represent portions of the electric terminal that form no part of the claimed design.
The claimed design should be understood to include the outer solid line edges of the protruding members shown in FIGS. 1-5 , as well as the bottom surface area in FIG. 7 .
Claims (1)
- The ornamental design for an electric terminal, as shown and described.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/556,621 USD798249S1 (en) | 2013-10-17 | 2016-03-02 | Electric terminal |
US29/614,894 USD834548S1 (en) | 2013-10-17 | 2017-08-24 | Electric terminal |
US29/669,185 USD877708S1 (en) | 2013-10-17 | 2018-11-06 | Electrical terminal |
US29/723,349 USD942406S1 (en) | 2013-10-17 | 2020-02-06 | Electric terminal |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/470,060 USD754083S1 (en) | 2013-10-17 | 2013-10-17 | Electric terminal |
US29/556,621 USD798249S1 (en) | 2013-10-17 | 2016-03-02 | Electric terminal |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/470,060 Division USD754083S1 (en) | 2013-10-17 | 2013-10-17 | Electric terminal |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/614,894 Division USD834548S1 (en) | 2013-10-17 | 2017-08-24 | Electric terminal |
Publications (1)
Publication Number | Publication Date |
---|---|
USD798249S1 true USD798249S1 (en) | 2017-09-26 |
Family
ID=55700350
Family Applications (7)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/470,060 Active USD754083S1 (en) | 2013-10-17 | 2013-10-17 | Electric terminal |
US29/556,621 Active USD798249S1 (en) | 2013-10-17 | 2016-03-02 | Electric terminal |
US29/556,618 Active USD775092S1 (en) | 2013-10-17 | 2016-03-02 | Electric terminal |
US29/556,619 Active USD775093S1 (en) | 2013-10-17 | 2016-03-02 | Electric terminal |
US29/614,894 Active USD834548S1 (en) | 2013-10-17 | 2017-08-24 | Electric terminal |
US29/669,185 Active USD877708S1 (en) | 2013-10-17 | 2018-11-06 | Electrical terminal |
US29/723,349 Active USD942406S1 (en) | 2013-10-17 | 2020-02-06 | Electric terminal |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/470,060 Active USD754083S1 (en) | 2013-10-17 | 2013-10-17 | Electric terminal |
Family Applications After (5)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/556,618 Active USD775092S1 (en) | 2013-10-17 | 2016-03-02 | Electric terminal |
US29/556,619 Active USD775093S1 (en) | 2013-10-17 | 2016-03-02 | Electric terminal |
US29/614,894 Active USD834548S1 (en) | 2013-10-17 | 2017-08-24 | Electric terminal |
US29/669,185 Active USD877708S1 (en) | 2013-10-17 | 2018-11-06 | Electrical terminal |
US29/723,349 Active USD942406S1 (en) | 2013-10-17 | 2020-02-06 | Electric terminal |
Country Status (1)
Country | Link |
---|---|
US (7) | USD754083S1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD814431S1 (en) * | 2015-05-15 | 2018-04-03 | Mitsubishi Electric Corporation | Power semiconductor device |
USD834548S1 (en) * | 2013-10-17 | 2018-11-27 | Vlt, Inc. | Electric terminal |
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USD759022S1 (en) * | 2013-03-13 | 2016-06-14 | Nagrastar Llc | Smart card interface |
USD758372S1 (en) | 2013-03-13 | 2016-06-07 | Nagrastar Llc | Smart card interface |
US9888283B2 (en) | 2013-03-13 | 2018-02-06 | Nagrastar Llc | Systems and methods for performing transport I/O |
USD742581S1 (en) * | 2013-12-09 | 2015-11-03 | Kenall Manufacturing Company | Driver housing |
USD864968S1 (en) * | 2015-04-30 | 2019-10-29 | Echostar Technologies L.L.C. | Smart card interface |
USD846513S1 (en) * | 2016-04-27 | 2019-04-23 | Ngk Insulators, Ltd. | Sheet heater for electrostatic chuck |
JP1582228S (en) * | 2016-08-02 | 2017-07-24 | ||
USD845906S1 (en) * | 2017-03-09 | 2019-04-16 | Sendyne Corporation | Electrical shunt |
USD888673S1 (en) | 2018-06-26 | 2020-06-30 | Rohm Co., Ltd. | Semiconductor module |
JP1641098S (en) * | 2018-06-26 | 2019-09-09 | ||
JP1664282S (en) * | 2019-07-24 | 2020-07-27 | ||
USD956707S1 (en) * | 2019-09-26 | 2022-07-05 | Lapis Semiconductor Co., Ltd. | Circuit board |
USD934820S1 (en) * | 2019-10-24 | 2021-11-02 | Nuvoton Technology Corporation Japan | Semiconductor device |
USD938925S1 (en) | 2019-10-24 | 2021-12-21 | Nuvoton Technology Corporation Japan | Semiconductor device |
USD947801S1 (en) * | 2019-11-07 | 2022-04-05 | Phoenix Contact Gmbh & Co. Kg | Printed circuit board |
USD951215S1 (en) * | 2019-12-11 | 2022-05-10 | Panasonic Semiconductor Solutions Co., Ltd. | Semiconductor device |
USD951214S1 (en) * | 2019-12-11 | 2022-05-10 | Panasonic Semiconductor Solutions Co., Ltd. | Semiconductor device |
USD951212S1 (en) * | 2019-12-11 | 2022-05-10 | Panasonic Semiconductor Solutions Co., Ltd. | Semiconductor device |
USD951213S1 (en) * | 2019-12-11 | 2022-05-10 | Panasonic Semiconductor Solutions Co., Ltd. | Semiconductor device |
USD986174S1 (en) * | 2020-07-10 | 2023-05-16 | Xinghui Peng | Power connector |
Citations (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3579046A (en) | 1969-05-02 | 1971-05-18 | Jordan Controls Inc | Electrical housing assembly having a plurality of chambers with adjacent circuit board elements |
US4338621A (en) | 1980-02-04 | 1982-07-06 | Burroughs Corporation | Hermetic integrated circuit package for high density high power applications |
US4698663A (en) | 1986-09-17 | 1987-10-06 | Fujitsu Limited | Heatsink package for flip-chip IC |
USD317300S (en) | 1987-07-04 | 1991-06-04 | Terutomi Hasegawa | Semi-conductor mounting substrate |
US5066999A (en) | 1989-10-23 | 1991-11-19 | Micron Technology, Inc. | Resistor under wirebond pad |
US5742005A (en) * | 1994-09-14 | 1998-04-21 | Sumitomo Wiring Systems, Ltd. | Electrical connection box |
US5757082A (en) | 1995-07-31 | 1998-05-26 | Rohm Co., Ltd. | Semiconductor chips, devices incorporating same and method of making same |
US5994772A (en) | 1996-12-19 | 1999-11-30 | Lg Semicon Co., Ltd. | Semiconductor package |
US6078505A (en) | 1999-05-14 | 2000-06-20 | Triquint Semiconductor, Inc. | Circuit board assembly method |
US6348742B1 (en) | 1999-01-25 | 2002-02-19 | Clear Logic, Inc. | Sacrificial bond pads for laser configured integrated circuits |
US6476505B2 (en) | 1999-04-27 | 2002-11-05 | Oki Electric Industry Co, Ltd. | Semiconductor device having pads, the intervals of which are adjusted and arranged in semiconductor chip corners |
US6483038B2 (en) | 2000-05-23 | 2002-11-19 | Samsung Electronics Co., Ltd. | Memory card |
USD466093S1 (en) | 2001-04-27 | 2002-11-26 | Taiyo Yuden Co., Ltd. | Hybird integrated circuit board |
US6537850B1 (en) * | 2001-03-16 | 2003-03-25 | Micron Technology, Inc. | Method for fabricating semiconductor components with terminal contacts having alternate electrical paths |
USD485536S1 (en) | 2003-03-10 | 2004-01-20 | Pulse Engineering, Inc. | Electronics component assembly |
US6753482B1 (en) * | 2002-05-06 | 2004-06-22 | Micron Technology, Inc. | Semiconductor component with adjustment circuitry |
US20060097374A1 (en) | 2004-11-10 | 2006-05-11 | Yoshimi Egawa | Multi chip package |
USD540272S1 (en) | 2005-04-18 | 2007-04-10 | Murata Manufacturing Co., Ltd. | Semiconductor module |
USD547371S1 (en) | 2005-10-22 | 2007-07-24 | Karl Frederick Miller | Reminder form |
US20090004776A1 (en) * | 2007-06-28 | 2009-01-01 | Ning Ye | Method of fabricating a memory card using sip/smt hybrid technology |
USD601520S1 (en) | 2005-01-14 | 2009-10-06 | Panasonic Corporation | Electric circuit board |
USD612347S1 (en) | 2005-01-14 | 2010-03-23 | Panasonic Corporation | Electric circuit board |
US7709292B2 (en) * | 2006-09-29 | 2010-05-04 | Sadwick Laurence P | Processes and packaging for high voltage integrated circuits, electronic devices, and circuits |
USD633054S1 (en) | 2009-07-28 | 2011-02-22 | Panasonic Electric Works Co., Ltd. | Electro luminescence module |
USD633450S1 (en) | 2009-07-28 | 2011-03-01 | Panasonic Electric Works Co., Ltd. | Electro luminescence module |
USD638810S1 (en) | 2010-05-14 | 2011-05-31 | Panasonic Corporation | Substrate for light source of light emitting diode |
USD638809S1 (en) | 2010-05-14 | 2011-05-31 | Panasonic Corporation | Substrate for light source of light emitting diode |
USD684547S1 (en) | 2011-08-30 | 2013-06-18 | Panasonic Corporation | Fixing base for an electroluminescence module |
USD690277S1 (en) | 2011-09-07 | 2013-09-24 | Panasonic Corporation | Electroluminescence module |
USD690672S1 (en) | 2011-10-04 | 2013-10-01 | Kabushiki Kaisha Yaskawa Denki | Encoder optical module |
USD694200S1 (en) | 2011-09-07 | 2013-11-26 | Panasonic Corporation | Electroluminescence module |
USD699201S1 (en) | 2012-10-01 | 2014-02-11 | Gemalto M2M Gmbh | Pad arrangement of a circuit module |
US20140070381A1 (en) * | 2012-09-12 | 2014-03-13 | Kabushiki Kaisha Toshiba | Semiconductor memory card |
US20140099805A1 (en) * | 2012-10-10 | 2014-04-10 | Motorola Mobility Llc | Electronic connector capable of accepting a single subscriber identity mopdule or a memory card |
US20140106621A1 (en) * | 2012-10-11 | 2014-04-17 | Carry Technology Co., Ltd. | Memory card adapter device |
USD708595S1 (en) | 2013-01-11 | 2014-07-08 | Panasonic Corporation | Electroluminescence module |
USD708594S1 (en) | 2013-01-11 | 2014-07-08 | Panasonic Corporation | Panel board for electroluminescence module |
USD730304S1 (en) | 2014-05-15 | 2015-05-26 | Kabushiki Kaisha Toshiba | Substrate for an electronic circuit |
USD736213S1 (en) | 2014-07-01 | 2015-08-11 | Samsung Electronics Co., Ltd. | Memory card |
USD736216S1 (en) | 2014-07-30 | 2015-08-11 | Samsung Electronics Co., Ltd. | Memory card |
USD754083S1 (en) * | 2013-10-17 | 2016-04-19 | Vlt, Inc. | Electric terminal |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD363920S (en) * | 1992-12-02 | 1995-11-07 | K. W. Muth Company, Inc. | Electrical circuit board |
US6494723B2 (en) * | 2000-03-31 | 2002-12-17 | Autonetworks Technologies, Ltd. | Terminal that provides connection between a wire circuit and a printed circuit, and electric junction box including said terminal |
JP2004096950A (en) * | 2002-09-03 | 2004-03-25 | Sumitomo Wiring Syst Ltd | Conductive material |
JP2004159478A (en) * | 2002-11-08 | 2004-06-03 | Sumitomo Wiring Syst Ltd | Junction box |
US8966747B2 (en) * | 2011-05-11 | 2015-03-03 | Vlt, Inc. | Method of forming an electrical contact |
US9402319B2 (en) * | 2011-05-11 | 2016-07-26 | Vlt, Inc. | Panel-molded electronic assemblies |
US9936580B1 (en) * | 2015-01-14 | 2018-04-03 | Vlt, Inc. | Method of forming an electrical connection to an electronic module |
US10785871B1 (en) * | 2018-12-12 | 2020-09-22 | Vlt, Inc. | Panel molded electronic assemblies with integral terminals |
-
2013
- 2013-10-17 US US29/470,060 patent/USD754083S1/en active Active
-
2016
- 2016-03-02 US US29/556,621 patent/USD798249S1/en active Active
- 2016-03-02 US US29/556,618 patent/USD775092S1/en active Active
- 2016-03-02 US US29/556,619 patent/USD775093S1/en active Active
-
2017
- 2017-08-24 US US29/614,894 patent/USD834548S1/en active Active
-
2018
- 2018-11-06 US US29/669,185 patent/USD877708S1/en active Active
-
2020
- 2020-02-06 US US29/723,349 patent/USD942406S1/en active Active
Patent Citations (42)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3579046A (en) | 1969-05-02 | 1971-05-18 | Jordan Controls Inc | Electrical housing assembly having a plurality of chambers with adjacent circuit board elements |
US4338621A (en) | 1980-02-04 | 1982-07-06 | Burroughs Corporation | Hermetic integrated circuit package for high density high power applications |
US4698663A (en) | 1986-09-17 | 1987-10-06 | Fujitsu Limited | Heatsink package for flip-chip IC |
USD317300S (en) | 1987-07-04 | 1991-06-04 | Terutomi Hasegawa | Semi-conductor mounting substrate |
US5066999A (en) | 1989-10-23 | 1991-11-19 | Micron Technology, Inc. | Resistor under wirebond pad |
US5742005A (en) * | 1994-09-14 | 1998-04-21 | Sumitomo Wiring Systems, Ltd. | Electrical connection box |
US5757082A (en) | 1995-07-31 | 1998-05-26 | Rohm Co., Ltd. | Semiconductor chips, devices incorporating same and method of making same |
US5994772A (en) | 1996-12-19 | 1999-11-30 | Lg Semicon Co., Ltd. | Semiconductor package |
US6348742B1 (en) | 1999-01-25 | 2002-02-19 | Clear Logic, Inc. | Sacrificial bond pads for laser configured integrated circuits |
US6476505B2 (en) | 1999-04-27 | 2002-11-05 | Oki Electric Industry Co, Ltd. | Semiconductor device having pads, the intervals of which are adjusted and arranged in semiconductor chip corners |
US6078505A (en) | 1999-05-14 | 2000-06-20 | Triquint Semiconductor, Inc. | Circuit board assembly method |
US6483038B2 (en) | 2000-05-23 | 2002-11-19 | Samsung Electronics Co., Ltd. | Memory card |
US6537850B1 (en) * | 2001-03-16 | 2003-03-25 | Micron Technology, Inc. | Method for fabricating semiconductor components with terminal contacts having alternate electrical paths |
USD466093S1 (en) | 2001-04-27 | 2002-11-26 | Taiyo Yuden Co., Ltd. | Hybird integrated circuit board |
USD471167S1 (en) | 2001-04-27 | 2003-03-04 | Taiyo Yuden Co., Ltd. | Hybrid integrated circuit board |
US6753482B1 (en) * | 2002-05-06 | 2004-06-22 | Micron Technology, Inc. | Semiconductor component with adjustment circuitry |
USD485536S1 (en) | 2003-03-10 | 2004-01-20 | Pulse Engineering, Inc. | Electronics component assembly |
US20060097374A1 (en) | 2004-11-10 | 2006-05-11 | Yoshimi Egawa | Multi chip package |
USD601520S1 (en) | 2005-01-14 | 2009-10-06 | Panasonic Corporation | Electric circuit board |
USD612347S1 (en) | 2005-01-14 | 2010-03-23 | Panasonic Corporation | Electric circuit board |
USD540272S1 (en) | 2005-04-18 | 2007-04-10 | Murata Manufacturing Co., Ltd. | Semiconductor module |
USD547371S1 (en) | 2005-10-22 | 2007-07-24 | Karl Frederick Miller | Reminder form |
US7709292B2 (en) * | 2006-09-29 | 2010-05-04 | Sadwick Laurence P | Processes and packaging for high voltage integrated circuits, electronic devices, and circuits |
US20090004776A1 (en) * | 2007-06-28 | 2009-01-01 | Ning Ye | Method of fabricating a memory card using sip/smt hybrid technology |
USD633450S1 (en) | 2009-07-28 | 2011-03-01 | Panasonic Electric Works Co., Ltd. | Electro luminescence module |
USD633054S1 (en) | 2009-07-28 | 2011-02-22 | Panasonic Electric Works Co., Ltd. | Electro luminescence module |
USD638810S1 (en) | 2010-05-14 | 2011-05-31 | Panasonic Corporation | Substrate for light source of light emitting diode |
USD638809S1 (en) | 2010-05-14 | 2011-05-31 | Panasonic Corporation | Substrate for light source of light emitting diode |
USD684547S1 (en) | 2011-08-30 | 2013-06-18 | Panasonic Corporation | Fixing base for an electroluminescence module |
USD690277S1 (en) | 2011-09-07 | 2013-09-24 | Panasonic Corporation | Electroluminescence module |
USD694200S1 (en) | 2011-09-07 | 2013-11-26 | Panasonic Corporation | Electroluminescence module |
USD690672S1 (en) | 2011-10-04 | 2013-10-01 | Kabushiki Kaisha Yaskawa Denki | Encoder optical module |
US20140070381A1 (en) * | 2012-09-12 | 2014-03-13 | Kabushiki Kaisha Toshiba | Semiconductor memory card |
USD699201S1 (en) | 2012-10-01 | 2014-02-11 | Gemalto M2M Gmbh | Pad arrangement of a circuit module |
US20140099805A1 (en) * | 2012-10-10 | 2014-04-10 | Motorola Mobility Llc | Electronic connector capable of accepting a single subscriber identity mopdule or a memory card |
US20140106621A1 (en) * | 2012-10-11 | 2014-04-17 | Carry Technology Co., Ltd. | Memory card adapter device |
USD708595S1 (en) | 2013-01-11 | 2014-07-08 | Panasonic Corporation | Electroluminescence module |
USD708594S1 (en) | 2013-01-11 | 2014-07-08 | Panasonic Corporation | Panel board for electroluminescence module |
USD754083S1 (en) * | 2013-10-17 | 2016-04-19 | Vlt, Inc. | Electric terminal |
USD730304S1 (en) | 2014-05-15 | 2015-05-26 | Kabushiki Kaisha Toshiba | Substrate for an electronic circuit |
USD736213S1 (en) | 2014-07-01 | 2015-08-11 | Samsung Electronics Co., Ltd. | Memory card |
USD736216S1 (en) | 2014-07-30 | 2015-08-11 | Samsung Electronics Co., Ltd. | Memory card |
Non-Patent Citations (4)
Title |
---|
Mitsubishi Electric Corporation, Release No. 2647, Mitsubishi Electric Launches 1200V/50A Large-Type Dual In-Line Package Intelligent Power Module, Jan. 26, 2012, 2 pages. |
Protek Devices, Package Outline, 16 Pin Drip Package, 2000, 2 pages. |
US Notice of Allowance for U.S. Appl. No. 29/470,060, mailed Dec. 4, 2015, 13 pages. |
US Office Action for U.S. Appl. No. 29/470,060, mailed Sep. 17, 2015, 10 pages. |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD834548S1 (en) * | 2013-10-17 | 2018-11-27 | Vlt, Inc. | Electric terminal |
USD877708S1 (en) * | 2013-10-17 | 2020-03-10 | Vlt, Inc. | Electrical terminal |
USD942406S1 (en) | 2013-10-17 | 2022-02-01 | Vicor Corporation | Electric terminal |
USD814431S1 (en) * | 2015-05-15 | 2018-04-03 | Mitsubishi Electric Corporation | Power semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
USD942406S1 (en) | 2022-02-01 |
USD775092S1 (en) | 2016-12-27 |
USD775093S1 (en) | 2016-12-27 |
USD834548S1 (en) | 2018-11-27 |
USD754083S1 (en) | 2016-04-19 |
USD877708S1 (en) | 2020-03-10 |
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