M256674 捌、新型說明： 【新型所屬之技術領域】 本新型是有關於一種迴路式散熱裝置，特別是指一種 可供設置於電子裝置之發熱元件上，並具備液汽分離設計 5 之迴路式散熱裝置。 【先則技術】 如圖1、2所示，一種以往的迴路式散熱裝置丨大體 是一圓筒狀的中空金屬管u，配合一由金屬管n 一端延 伸直至連接金屬管11另一端之散熱管12所構成。金屬管 1〇 11及散熱官12内壁皆披覆一層毛細體（wick)13(例如銅 網），金屬管11具有一輸入端U1及一輸出端112，且金 屬官11内部另置設有一由毛細結構所構成之毛細槽件 14，遠毛細槽件14具有一接近輸入端111之底壁14卜一 自底壁141朝輸出端lu方向延伸之環繞壁142、一由底 5 壁141及裱繞壁142共同界定而成之腔室143，以及一朝 向輸入端111之開口 144。特別是金屬管u内部予以抽真 空，而於腔室143内充填些許工作流體（例如冷媒、水 f)i5。金屬管η外表面另連接有一鰭片16。另外，散熱 & 12於輸入端1U及輸出端ιΐ2㈤更形成有多層彎折之散 熱區121及一冷凝區122。 在導熱時是利用鰭片16接觸一電子裝置之發埶元 件，發熱元件所產生的熱能在·鰭片16導熱下傳遞至殼體 11中此時毛細槽件14之腔冑⑷内的工作流體即受熱 產生相支化’以潛熱形式進行熱能的交換作用，換言之， M256674 由於工作流體15處在飽和狀態，故能迅速吸熱且蒸發為 氣體’並由該毛細槽件14之底壁141及環繞壁142釋出， 再經由殼體11之輸出端112進入散熱管12中，在毛細體 13的導引下，通過散熱區ι21、冷凝區122，在散熱管 的長程傳輸下氣體逐漸降溫再冷凝為液態工作流體，最後 再由、殼體11之輸入端lu回到腔室143内，如此周而復 始’所以能將發熱元件所產生的熱能透過工作流體之液汽 相蜒化傳輸至遠離發熱元件（即熱源）處，進而散逸至大氣 中。 然而因此種迴路式散熱裝置丨由於工作流體與氣體同 處於同空間内並呈現相互逆向流動之狀態，故造成二者 流動時係相互阻礙並需承受額外之流阻，導致熱傳量有所 降低，故若能消彌此流阻而增加液、汽循環之速度就能夠 U❹傳遞效果’才能因應各式散熱能日趨提高之 電T元件。此外，由於散熱管12的管路頗長，以致自散 …、s 12回流至腔室143之工作流體容易因補償不及，而 造成腔室143產生乾化現象。 【新型内容】 因此，本新型之目㈤，是在提供一種具備液汽分離設 計之迴路式散熱裝置。 於疋，本新型迴路式散熱裝i，用&導離一發熱元件 =散=之熱能，該迴路式散熱裝置包含—導熱件、一散熱 :、-毛細層、一毛細隔體、一毛細補償件，以及一工作 ㈣°導熱件具有—殼體’殼體具有-輸入端及一與該輸 M256674 入端相反之輸出端。散熱管是用以連接該輸入端與該輸出 端。毛細層則係設於該殼體及該散熱管之内壁面。而毛細 補償件係置於該殼體内且與殼體之輸入端保持一間距，使 得毛細補償件與毛細隔體共同界定出一補償室，而毛細隔 5 體即設置於此補償室中。至於工作流體亦填充於補償室 中’且月b P現溫度變化而有液、汽二相變化並循該毛細層流 動。 本新型之功效是藉由補償室之存在，使得受熱汽化之 工作流體可透過毛細隔體釋出並由殼體之輸出端輸出，而 10 冷凝液化的工作流體再由殼體之輸入端輸入並回流至補 侦至，使得Ά、液狀態之工作流體能有效分離，而能增加 液、汽循環之速度，提供較佳之熱傳遞效果。 【實施方式】 有關本新型之前述及其他技術内容、特點與功效，在 15 以下配合參考圖式之一較佳實施例的詳細說明中，將可清 楚的明白。 如圖3所示，是本新型迴路式散熱裝置3一較佳實施 例’用以導離一電子裝置上之發熱元件所散發之熱能，此 發熱元件可以例如是處理器、繪圖晶片或者其它易散出高 20 熱的電子元件。 迴路式散熱裝置3包含一導熱件31、一散熱管32、 一毛細層33、一毛細補償件34、一毛細隔體35，以及一 工作流體（圖未示）。導熱件31具有一殼體311，以及一設 置於邊设體311上之導熱塊312。而殼體311具有一輸入 ^256674 端313、一與輸入端313相反之輸出端314，以及一形成 於双體311内部且位於輸入端313與輪出端314間之容置 空間315。 政熱官32為連接於殼體311之輪入端313與輸出端 314間之中空管體，具有一連接輸出端314且呈多層彎折 之散熱部32卜及一連接於散熱部321與輸入端313間之 冷凝部322。 而毛細層33係設置於殼體311及散熱管32之内壁 面。而毛細補償件34係置於容置空間315内，且具有一 接近殼體311之輸入端313的中央部341、一自中央部341 朝叙體311輸出端314方向延伸之圍繞部342、一由中央 部341及圍繞部342共同界定而成之蒸發室343，以及一 幵y成於圍繞342端緣處且與蒸發室343相通而朝向殼體 311輸出端314的出口 344。另外，中央部341並與輸入 鳊313保持一間距，使得毛細補償件35與毛細隔牆％共 同界定出一補償室316。 毛細隔體35係設置於補償室316中，其中，毛細層 33、毛細補償件34，以及毛細隔體奶均是由毛細體所構 成，此毛細體是指具毛細力的多孔性結構物，可為銅網或 銅粉燒結而成，本例是以鋼網做說明，藉其微細結構所產 生之局毛細壓力來推動工作流體循環。至於，工作流體亦 填充於補償室316中而為毛細隔體35所吸收，且能隨溫 度變化而有液、汽二相變化並循毛細層33流動，工作流 體的種類’可以是例如水、冷媒、水銀、木精、冷束劑等 M256674 等0 迴路式散熱裝置3在導離發熱元件所散發之熱能時， 係以導熱塊312及殼體311接觸發熱元件，使得發熱元件 所產生的熱能可傳遞至殼體311内部之容置空間315中， 位於補償室316内的工作流體受熱汽化，氣體在毛細層33 之導引下進入毛細補償件34之蒸發室343内，進而由殼 體311之輸出端314輸入散熱管32之毛細層33間進行徑 向流動’由於毛細層33之毛細結構内的流動距離極短， 壓降也極小，所以在毛細結構選擇上可採用孔徑極小之毛 細結構’而不必擔心流動阻力增加的效應，如此產生的強 大毛細力，可大大提幵毛細結構的熱傳限制。氣體經過散 熱管32之散熱部321的多道彎折及冷凝部322後之長距 離路徑’使得氣體逐漸降低並冷凝回工作流體，在毛細層 33的毛細作用導引下由輸入端· 313回流至殼體311之容置 空間315中，並蓄積於毛細隔體35内，如此循環不已。 特別要注意的是，毛細隔體35的存在不僅能增加殼 體311的結構強度，且更使所吸收之液態工作流體於受熱 汽化後始能通過毛細補償件34之毛細結構進入蒸發室343 中，藉此達到液、汽分離之效應，且能增加液、汽循環之 速度，提供較佳之熱傳遞效果，使散熱效果更佳。 再者，為使氣體在通過散熱管32之散熱部321時能 加速降溫冷凝，因此，本例之迴路式散熱裝置3更可在散 熱管32之散熱部321設置一散熱鰭片座36(如圖3中假想 線所示），關於散熱鰭片座36之構造可為一座體上間隔凸 M256674 伸複數個鰭片之習見設計，另外，更可於散熱鰭片座36 一側設置一散熱風扇3 7 (如圖3中假想線所示），用以對散 熱·鰭片座36送風以產生散熱氣流，藉此利用散熱鰭片座 36導離散熱部321處之部份熱能，配合散熱風扇37之送 5 風’更可加速散熱部321内之氣體降溫冷凝，進而能提昇 散熱效率。 歸納上述，本新型迴路式散熱裝置3,藉由毛細補償 件34與導熱件31之殼體311輸入端313間設置一含有工 作流體之毛細隔體35,使得工作流體受熱汽化後始能通過 毛、、、田補俏件34之毛細結構進入蒸發室以3中，續行熱交 換作用，使得液汽能有效分離，且能增加液、汽循環之速 度，熱傳遞效果佳，並進而能提昇散熱效帛，以確實能達 到上述本新型之目的。 淮以上所述|，僅為本新型之較佳實施例而已，當不 :以此限疋本新型貫施之範圍，即大凡依本新型申請專利 粑圍及新型說明書内容所作之簡單的等效變化與修飾，皆 應仍屬本新型專利涵蓋之範圍内。 【囷式簡單說明】 圖1是習知迴路式散熱裝置示意圖； 20 圖2是圖1之剖視線剖面圖；及 圖3是本新型迴路式散熱裝置一較佳實施例示意圖。 M256674 【圖式之主要元件代表符號說明】 3迴路式散熱裝置 31導熱件 32散熱管 33毛細層 34毛細補償件 35毛細隔體 36散熱鰭片座 37散熱風扇 311殼體 312導熱塊 3 13輸入端 314輸出端 3 1 5容置空間 316補償室 321散熱部 322冷凝部 341中央部 342圍繞部 343蒸發室 344 出口M256674 新型 Description of the new type: [Technical field to which the new type belongs] This new type relates to a loop-type heat sink, in particular a loop-type heat sink that can be installed on a heating element of an electronic device and has a liquid-vapor separation design 5. Device. [Preceding technology] As shown in Figures 1 and 2, a conventional loop-type heat sink 丨 is generally a cylindrical hollow metal pipe u matched with a heat pipe extending from one end of the metal pipe n to the other end of the metal pipe 11 Constituted by 12. The inner wall of the metal pipe 1011 and the heat sink 12 are covered with a layer of wick 13 (such as a copper mesh). The metal pipe 11 has an input terminal U1 and an output terminal 112, and a metal tube 11 is provided with a The capillary groove member 14 composed of a capillary structure, the far capillary groove member 14 has a bottom wall 14 close to the input end 111, a surrounding wall 142 extending from the bottom wall 141 toward the output end lu, a bottom 5 wall 141, and a mounting A cavity 143 is defined around the wall 142 and an opening 144 facing the input end 111. In particular, the inside of the metal pipe u is evacuated, and a small amount of working fluid (for example, refrigerant, water f) i5 is filled in the chamber 143. A fin 16 is connected to the outer surface of the metal tube η. In addition, the heat dissipation & 12 is further formed with a multi-layered bent heat dissipation area 121 and a condensation area 122 on the input end 1U and the output end ΐ2㈤. When conducting heat, the fins 16 are used to contact the hairpin element of an electronic device. The heat generated by the heating element is transmitted to the working fluid in the cavity 毛 of the capillary groove 14 at the time when the fins 16 conduct heat. That is to generate phase branching upon heating 'to exchange heat energy in the form of latent heat, in other words, M256674 can absorb heat quickly and evaporate into gas because the working fluid 15 is in a saturated state, and is surrounded by the bottom wall 141 of the capillary groove member 14 and the surrounding The wall 142 is released, and then enters the heat dissipation pipe 12 through the output end 112 of the housing 11. Under the guidance of the capillary 13, the gas passes through the heat dissipation zone 21 and the condensation zone 122, and the gas gradually cools down and condenses under the long-distance transmission of the heat dissipation pipe. It is a liquid working fluid, and finally, the input end lu of the housing 11 returns to the chamber 143, so it repeats itself, so it can transfer the heat energy generated by the heating element through the liquid vapor phase of the working fluid to the far away from the heating element ( (Ie, heat source), and then dissipate into the atmosphere. However, this kind of circuit-type heat dissipation device 丨 because the working fluid and the gas are in the same space and present a state of countercurrent flow, the flow of the two is mutually obstructed and needs to bear additional flow resistance, resulting in a reduction in heat transfer Therefore, if this flow resistance can be eliminated and the speed of the liquid and vapor circulation can be increased, the transmission effect can be achieved, so as to respond to various types of electric T-elements with increasing heat dissipation. In addition, since the pipeline of the heat dissipation pipe 12 is quite long, the working fluid flowing back to the chamber 143 from the self-dispersing, s 12 is likely to be dried out due to insufficient compensation. [New content] Therefore, the purpose of this new model is to provide a loop-type heat sink with a liquid-vapor separation design. Yu Yi, the new loop heat sink i uses & to conduct away from a heating element = heat = thermal energy. The loop heat sink includes-heat conducting parts, a heat sink:--capillary layer, a capillary spacer, a capillary. The compensating element and a working heat-conducting element are provided with a casing-the casing has an input terminal and an output terminal opposite to the input terminal of the M256674 input. The heat pipe is used to connect the input terminal and the output terminal. The capillary layer is disposed on the inner wall surface of the casing and the heat pipe. The capillary compensation member is placed in the casing and maintained at a distance from the input end of the casing, so that the capillary compensation member and the capillary spacer jointly define a compensation chamber, and the capillary spacer 5 body is arranged in the compensation chamber. As for the working fluid, it is also filled in the compensation chamber, and the temperature of the moon b P changes, and there are liquid and vapor two-phase changes and flows through the capillary layer. The function of the new model is that the working fluid heated and vaporized can be released through the capillary separator and output from the output end of the housing through the existence of the compensation chamber, and the working fluid condensed and liquefied is input from the input end of the housing and Backflow to make-up detection allows working fluids in the limulus and liquid states to be effectively separated, and can increase the speed of liquid and vapor circulation, providing better heat transfer effects. [Embodiment] The foregoing and other technical contents, features, and effects of the present invention will be clearly understood in the following detailed description of a preferred embodiment with reference to the drawings. As shown in FIG. 3, it is a preferred embodiment of the novel loop-type heat sink 3, which is used to dissipate thermal energy emitted by a heating element on an electronic device. The heating element may be, for example, a processor, a graphics chip, or other Electronic components that emit 20 heat. The loop heat sink 3 includes a heat conducting member 31, a heat sink 32, a capillary layer 33, a capillary compensation member 34, a capillary spacer 35, and a working fluid (not shown). The heat-conducting member 31 has a casing 311 and a heat-conducting block 312 disposed on the side-setting body 311. The housing 311 has an input terminal 313, an output terminal 314 opposite to the input terminal 313, and an accommodation space 315 formed in the double body 311 and located between the input terminal 313 and the wheel output terminal 314. The political heat officer 32 is a hollow tube body connected between the wheel inlet end 313 and the output end 314 of the housing 311, and has a heat dissipation portion 32 connected to the output end 314 and having multiple layers of bending and a heat dissipation portion 321 and Condensing section 322 between input terminals 313. The capillary layer 33 is provided on the inner wall surfaces of the casing 311 and the heat dissipation pipe 32. The capillary compensation member 34 is placed in the accommodation space 315, and has a central portion 341 close to the input end 313 of the housing 311, a surrounding portion 342 extending from the central portion 341 toward the output end 314 of the narrative body 311, a The evaporation chamber 343 defined by the central portion 341 and the surrounding portion 342 and an outlet 344 formed at the edge of the surrounding portion 342 and communicating with the evaporation chamber 343 toward the output end 314 of the casing 311. In addition, the central portion 341 is kept at a distance from the input 鳊 313, so that the capillary compensation member 35 and the capillary partition wall% jointly define a compensation chamber 316. The capillary spacer 35 is arranged in the compensation chamber 316. The capillary layer 33, the capillary compensation member 34, and the capillary spacer milk are all composed of a capillary body. This capillary body refers to a porous structure with capillary force. It can be sintered with copper mesh or copper powder. This example uses steel mesh as an example to promote the circulation of working fluid by the local capillary pressure generated by its microstructure. As for the working fluid, it is also filled in the compensation chamber 316 and absorbed by the capillary spacer 35, and can change in liquid and vapor with the temperature change and flow through the capillary layer 33. The type of the working fluid may be, for example, water, Refrigerant, mercury, wood spirit, cooling agent, M256674, etc. 0 circuit-type heat sinks 3 When conducting the thermal energy emitted from the heating element, the thermal block 312 and the casing 311 contact the heating element, so that the thermal energy generated by the heating element It can be transferred to the accommodating space 315 inside the casing 311. The working fluid in the compensation chamber 316 is heated and vaporized, and the gas is guided into the evaporation chamber 343 of the capillary compensation member 34 under the guidance of the capillary layer 33. The output end 314 is input to the capillary layer 33 of the heat pipe 32 for radial flow. 'Since the flow distance in the capillary structure of the capillary layer 33 is extremely short and the pressure drop is also very small, a capillary structure with a very small aperture can be used in the selection of the capillary structure. 'Without having to worry about the effect of increased flow resistance, the powerful capillary force thus generated can greatly increase the heat transfer limitation of the capillary structure. The long-distance path of the gas after the multiple bends of the heat dissipation section 321 of the heat dissipation pipe 32 and the condensation section 322 causes the gas to gradually decrease and condense back to the working fluid, guided by the capillary action of the capillary layer 33, and returned from the input terminal 313. It is stored in the accommodation space 315 of the casing 311 and accumulated in the capillary spacer 35, and the circulation is endless. It should be particularly noted that the presence of the capillary spacer 35 not only increases the structural strength of the housing 311, but also allows the absorbed liquid working fluid to enter the evaporation chamber 343 through the capillary structure of the capillary compensation member 34 after being heated and vaporized. In this way, the effect of liquid and vapor separation can be achieved, and the speed of liquid and vapor circulation can be increased to provide better heat transfer effect and better heat dissipation effect. Furthermore, in order to accelerate the cooling and condensing of gas when passing through the heat-dissipating portion 321 of the heat-dissipating tube 32, the loop-type heat-dissipating device 3 of this example can further provide a heat-dissipating fin base 36 (such as As shown by the imaginary line in FIG. 3), the structure of the heat sink fin base 36 may be a conventional design of a spaced convex M256674 extending a plurality of fins. In addition, a heat sink fan may be provided on the side of the heat sink fin base 36 3 7 (as shown by the imaginary line in FIG. 3), which is used to supply air to the heat dissipation and fin base 36 to generate a heat dissipation airflow, thereby utilizing the heat dissipation fin base 36 to conduct a part of the thermal energy at the discrete heat portion 321 to cooperate with the heat dissipation fan. 37 of 5 winds can accelerate the cooling and condensation of the gas in the heat sink 321, which can improve the heat dissipation efficiency. To sum up, in the novel loop heat sink 3, a capillary spacer 35 containing a working fluid is provided between the capillary compensation member 34 and the input 313 of the housing 311 of the heat conducting member 31, so that the working fluid can pass through the wool after being heated and vaporized. The capillary structure of Tianbuqian 34 enters into the evaporation chamber 3 to continue the heat exchange effect, which can effectively separate the liquid and vapor, and increase the speed of liquid and vapor circulation. The heat transfer effect is good, and the heat dissipation efficiency can be improved. Alas, in order to achieve the above-mentioned purpose of the new model. The above || is only the preferred embodiment of the new model, but it is not: to limit the scope of the new model, that is, the simple equivalent of the patent application and the new manual content Changes and modifications should still fall within the scope of this new patent. [Brief description of the loop type] Fig. 1 is a schematic diagram of a conventional loop type heat sink; 20 Fig. 2 is a sectional view taken along the line of Fig. 1; and Fig. 3 is a schematic diagram of a preferred embodiment of the novel loop type heat sink. M256674 [Description of the main components of the diagram] 3 loop type heat sink 31 heat transfer member 32 heat pipe 33 capillary layer 34 capillary compensation member 35 capillary spacer 36 heat sink fin seat 37 heat sink fan 311 housing 312 heat conduction block 3 13 input End 314 output end 3 1 5 accommodating space 316 compensation chamber 321 heat radiation portion 322 condensation portion 341 central portion 342 surrounding portion 343 evaporation chamber 344 exit