TWI602651B - A Compound Chemical Mechanical Dresser - Google Patents

Description

Composite chemical mechanical polishing dresser

The invention relates to a chemical mechanical polishing dresser, in particular to a compound chemical mechanical polishing dresser which has both deglazing and roughening.

In the semiconductor wafer manufacturing process, the wafer is polished using a chemical mechanical polish (CMP) process to planarize the surface of the wafer. A common CMP process uses a polishing pad (or polishing pad) attached to a rotating table to contact and apply a wafer to a spin-on carrier. The rotating table will rotate and provide a polishing slurry to the polishing pad. In general, due to the pressure and velocity movement (Preston equation), the high grinding point on the polishing pad will produce a high temperature glazing phenomenon, and the debris caused by the grinding will accumulate in the holes in the polishing pad, causing it to crystallize The round grinding effect is reduced, so a Conditioner is required to remove the glaze spots on the polishing pad and residual debris.

The high-performance chemical mechanical polishing dresser includes a substrate, a bonding layer and a plurality of abrasive particles, and the bonding layer is disposed on the substrate, as disclosed in the applicant's patent application publication No. 201532734. The abrasive particles are directly fixed on the substrate by the bonding layer, each of the abrasive particles is disposed on a metal fixing base, and the substrate has a plurality of grooves or a plurality of through holes, so that the metal fixing seat And the metal fixing seat is fixed on the substrate by the bonding layer, wherein the abrasive particles are processed through a surface to make the abrasive particles have a specific The cutting edge angle, the crystal structure, the tip height, and the tip orientation, or the abrasive particles are unprocessed abrasive particles.

In addition, the Chinese Patent Publication No. 201143979 discloses a chemical mechanical polishing pad conditioner having a mixed trimming function, which comprises a support substrate, a plurality of smooth superabrasive particles, and a plurality of rough superabrasive particles, the smooth superabrasive a particle system disposed on the support substrate, the plurality of smooth superabrasive particles being operable to cut a large roughness on a polishing pad, the rough superabrasive particles being disposed on the support substrate, the plurality of coarse superabrasive particles being usable The plurality of large roughness portions cut a plurality of polishing liquid channels, wherein the plurality of polishing liquid channels are used to promote the movement of the polishing liquid throughout the plurality of large roughness portions in the chemical mechanical polishing process.

In addition, the Chinese Patent Application No. 104135197, filed by the applicant of the present application, discloses a hybrid chemical mechanical polishing dresser comprising a base, a first grinding unit and a plurality of second grinding units, the first grinding The unit is disposed on the base, and includes a first bonding layer fixed on the base, a polishing unit substrate disposed on the first bonding layer, and an abrasive layer disposed on the polishing unit substrate. The polishing layer is a diamond coating formed by a chemical vapor deposition method, and the diamond coating surface has a plurality of polishing tips, and the second polishing unit is disposed on the base and includes a fixing on the base. a second bonding layer, a carrier column disposed on the second bonding layer, an abrasive particle disposed on the carrier column, and an abrasive bonding layer disposed between the carrier column and the abrasive particle.

In the above prior art, the Republic of China Patent Publication No. 201532734 discloses that the abrasive particles have a specific cutting edge angle, a crystal structure, a tip height and a tip orientation, but since the abrasive particles have only a single state, the trimmed Limited functionality. The Republic of China Patent Publication No. 201143979 and the application No. 104135197 both disclose a hybrid chemical mechanical polishing dresser having two types of grinding units, but it does not have a more detailed definition of the structural design therein, so it is difficult to achieve the claimed It has the functions of deglazing and roughening. It can be seen from the above that the structural design of the chemical mechanical polishing dresser still needs to be improved.

The main object of the present invention is to solve the problem of the conventional chemical mechanical polishing dresser, which is difficult to combine the functions of deglazing and roughening.

To achieve the above object, the present invention provides a composite chemical mechanical polishing dresser for trimming a surface of a polishing pad, the composite chemical mechanical polishing dresser comprising a base, a plurality of first grinding units, and a plurality of a second grinding unit, the base includes a first receiving groove and a second receiving groove, the first grinding unit includes a first carrier column fixed to the first receiving groove, and a first mounting column a first bonding layer on the carrying column and a pointed abrasive particle disposed on the first bonding layer and fixed to the first carrier through the first bonding layer, the second polishing unit including a fixed a second supporting column of the second receiving groove, a second bonding layer disposed on the second supporting column, and a flat head disposed on the second bonding layer and fixed to the second supporting column through the second bonding layer The abrasive particles, wherein the pointed abrasive particles have a height that is higher than the level of the flat abrasive particles, the height being a distance from an upper surface of the base to a tip end of the pointed abrasive particle.

In an embodiment, the first grinding unit further includes a first carrier-bonding layer disposed between the first receiving slot and the first carrier, the first carrier is coupled through the first carrier The layer is fixed to the first receiving groove.

In one embodiment, the composition of the first carrier pillar bonding layer is selected from the group consisting of ceramic materials, brazing materials, plating materials, metal materials, and polymer materials.

In an embodiment, the second grinding unit further includes a second bearing column bonding layer disposed between the second receiving groove and the second bearing column, and the second bearing column is coupled through the second bearing column. The layer is fixed to the second receiving groove.

In one embodiment, the composition of the second carrier-bonding layer is selected from the group consisting of ceramic materials, brazing materials, plating materials, metal materials, and polymer materials.

In one embodiment, the material of the pedestal is selected from the group consisting of stainless steel, metal materials, plastic materials, and ceramic materials.

In one embodiment, the materials of the first carrier column and the second carrier column are selected from the group consisting of stainless steel, metal materials, plastic materials, and ceramic materials.

In one embodiment, the composition of the first bonding layer and the second bonding layer is selected from the group consisting of ceramic materials, brazing materials, plating materials, metal materials, and polymer materials.

In one embodiment, the tip apex of the pointed abrasive particle and a flat top mask of the flat abrasive particle have a height difference of between 10 [mu]m and 200 [mu]m.

In one embodiment, the tip apex of the pointed abrasive particle and a flat top mask of the flat abrasive particle have a height difference of between 10 μm and 100 μm.

In one embodiment, the tip apex of the pointed abrasive particle and a flat top mask of the flat abrasive particle have a height difference of between 10 μm and 50 μm.

In an embodiment, the ratio of the first polishing unit to the second polishing unit is between 1:4 and 4:1.

A flat planar top surface of the abrasive particles in a first embodiment, positioned on the base having a range between 10000μm ² to 160000μm ² area.

In one embodiment, the number of the flat abrasive particles is between 10 and 200.

In one embodiment, the number of the flat abrasive particles is preferably between 20 and 40.

In one embodiment, the flat abrasive particles are in the shape of a hexahedron or a hexahedral structure.

In one embodiment, the flat abrasive particles have a negative bevel or a 0 degree angle.

In an embodiment, the negative bevel angle is between 0 degrees and -35 degrees.

In contrast to the prior art described above, such as the hybrid polishing pad conditioner disclosed in the Republic of China Invention Patent Publication No. 201143979 and the application No. 104135197, the pointed abrasive particles of the present invention are at a height from the flat abrasive particles. In contrast, the present invention combines the pointed abrasive particles with the flat-head abrasive particles on a single base as compared to the Republic of China Patent Publication No. 201532734. Wherein the flat-head abrasive particles are used to provide the functions of triming and deglazing, and the pointed abrasive particles can provide a roughening effect to create a bulge on the surface of the polishing pad, thus Overall, it will provide excellent finishing effects.

The detailed description and technical content of the present invention will now be described as follows:

Please refer to FIG. 1 and FIG. 2 respectively, which are respectively a schematic top view of an embodiment of the present invention and a side view of the AA direction of FIG. 1 . As shown, the present invention is a composite chemistry. The mechanical polishing dresser includes a base 10, a plurality of first grinding units 20, and a plurality of second grinding units 30. The base 10 includes a first receiving groove 11 and a second receiving groove 12, In one embodiment of the invention, the base 10 is made of stainless steel, a metal material, a plastic material, a ceramic material or a combination thereof.

The first bonding unit 20 includes a first loading post 21, a first bonding layer 22, and a pointed abrasive particle 23, and the first carrier column 21 is fixed on the first receiving groove 11, the first bonding The layer 22 is disposed on the first carrier 21 , and the tip abrasive particles 23 are disposed on the first bonding layer 22 and fixed to the first carrier 21 through the first bonding layer 22 . The second polishing unit 30 includes a second loading post 31, a second bonding layer 32, and a flat grinding particle 33. The second loading post 31 is fixed on the second receiving groove 12, and the second bonding layer is 32 is disposed on the second carrier column 31. The flat head abrasive particles 33 are disposed on the second bonding layer 32 and are fixed to the second carrier column 31 through the second bonding layer 32. In the embodiment, the first grinding unit 20 further includes a first bearing column bonding layer 24 disposed between the first receiving groove 11 and the first bearing column 21 . The first carrier column 21 is fixed to the first receiving groove 11 through the first carrier column bonding layer 24; the second grinding unit 30 further includes a second carrier column bonding layer 34, and the second carrier column bonding layer 34 The second receiving post 31 is fixed to the second receiving slot 12 through the second receiving post bonding layer 34.

In one embodiment of the invention, the number of the flat abrasive particles 33 on the susceptor 10 is between 10 and 200. In a preferred embodiment, the flat abrasive particles 33 are on the pedestal. The number on 10 is between 20 and 40. In this embodiment, the first polishing unit 20 and the second polishing unit 30 are on the base 10 in a ratio of 1:4 to 4:1, and are arranged in a pattern, wherein the patterned arrangement can be They are arranged in a matrix, in a radial arrangement or in a honeycomb arrangement. Further, "FIG. 1" is for illustrative purposes only, and does not present the actual number and arrangement of the flat abrasive particles 33 and the pointed abrasive particles 23, which can be adjusted according to actual needs and arranged. It is limited to the example of Figure 1.

In an embodiment of the invention, the material of the first carrier column 21 and the second carrier column 31 may be stainless steel, metal material, plastic material, ceramic material or the combination thereof. The material of the first bonding layer 22, the second bonding layer 32, the first carrier pillar bonding layer 24 and the second carrier pillar bonding layer 34 may be ceramic materials, brazing materials, plating materials, metal materials or polymers. a material, wherein the brazing material may be iron, cobalt, nickel, chromium, manganese, lanthanum, aluminum, boron, carbon metal or alloy. In one embodiment, the brazing material may be an alloy of Nicrobraz LM. The composition is 7 wt.% Cr, 3.1 wt.% B, 4.5 wt.% Si, 3.0 wt.% Fe, 0.06 wt% C, and the balance Ni. The polymer material may be an epoxy resin, a polyester resin, a polyacryl resin or a phenol resin. In the present invention, the susceptor 10, the first carrier 21 and/or the second carrier 31 are preferably made of stainless steel, but the invention is not limited thereto, and the user can arbitrarily change according to requirements. . The first carrier pillar bonding layer 24 and the second carrier pillar bonding layer 34 are preferably a polymer material, such as an epoxy resin or an acrylic resin; the first bonding layer 22 and the second bonding layer 32 are relatively Good ground is a brazing material or a polymer material.

In the present invention, the pointed abrasive particle 23 has a tip apex 231 having a flat top surface 331 having a height h above the flat abrasive particle 33, the height h is a distance from an upper surface 101 of the susceptor 10 to the tip apex 231 of the pointed abrasive particle 23, the tip apex 231 being at a height difference d from the flat top surface 331. In one embodiment of the present invention, the flat head of the flat top surface of the abrasive particles having a 33,133 between 10000μm ² 160000μm ² to the area here means the area of the flat head positioned all abrasive particles 10 on the base The surface area of the flat top surface 331 of 33. In one embodiment, the height difference d is between 10 μm and 200 μm. In a preferred embodiment, the height difference d is between 10 μm and 100 μm. In a preferred embodiment, the height is The difference d is between 10 μm and 50 μm.

Please refer to FIG. 3 to FIG. 6 , which are schematic diagrams showing the first aspect, the second aspect, the third aspect and the fourth aspect of the pointed abrasive particles in an embodiment of the invention. The shape of the pointed abrasive particles 23 may be an octahedron, as shown in FIG. 3 . However, the pointed abrasive particles 23 of the shape of FIG. 3 are not easy to obtain in practice, and thus are relatively easy to obtain. The pointed abrasive particles 23 in the shape of a six-octahedron, as shown in FIG. 4 to FIG. 6, wherein the first aspect, the second aspect, the third aspect, and the fourth aspect are The pointed abrasive particles 23 had V(100)/V(111) of 1.65, 1.30, 1.155, and 1.00, respectively, and α was 2.85, 2.25, 2.00, and 1.73, respectively. The above is merely illustrative, and the pointed abrasive particles 23 referred to in the present invention should include any abrasive particles having the tip apex 231. Please refer to FIG. 7 to FIG. 10 respectively, which are schematic diagrams showing the first aspect, the second aspect, the third aspect and the fourth aspect of the flat-polished abrasive particles according to an embodiment of the present invention. The shape of the flat-head abrasive particles 33 may be a hexahedron, as shown in FIG. 7. However, the flat-head abrasive particles 33 of the shape of FIG. 7 are not easily obtained in practice, and thus the shape that can be easily obtained is selected. The flat-head abrasive particles 33 of the six-octahedron, as shown in FIG. 8 to FIG. 10, wherein the flat-surface abrasive particles of the first state, the second state, the third state, and the fourth aspect V(100)/V(111) of 33 is 0.60, 0.70, 0.80, and 0.87, respectively, and α is 1.04, 1.21, 1.39, and 1.50, respectively. In the present embodiment, the flat-head abrasive particles 33 in the "Fig. 2" are made of the flat-head abrasive particles 33 having a shape of a six-octahedron as shown in Fig. 8. The above is merely illustrative, and the flat abrasive particles 33 referred to in the present invention should include any abrasive particles having the flat top surface 331.

Further, in an embodiment of the invention, the flat abrasive particles 33 have a negative bevel or a 0 degree angle, wherein the negative bevel angle is between 0 and -35 degrees. Please refer to FIG. 11 , which is a schematic view showing a cutting angle of a negative oblique angle according to an embodiment of the present invention. The flat abrasive particle 33 has a cutting surface 332 , and the cutting surface 332 is performed on a surface of a polishing pad 40 . A trimming angle θ is formed during trimming, and the negative bevel angle is when the cutting angle θ is greater than 90 degrees. As shown in FIG. 11 , when the cutting angle θ is less than 90 degrees, it is a positive oblique angle. When the cutting angle θ is equal to 90 degrees, it is the 0 degree angle.

In actual operation, the wafer is planarized by the polishing pad 40 in the semiconductor process. When the polishing pad 40 is used multiple times, the scribe on the polishing pad 40 is gradually passivated and generated. Debris, the polishing pad 40 needs to be trimmed by a dresser. When the composite CMP abrasive dresser of the present invention is used, the tip apex 231 of the pointed abrasive particle 23 contacts the surface of the polishing pad 40 to create a ridge on the surface, and the polishing pad 40 is applied to the polishing pad 40. The function of causing roughening; on the other hand, the flat top surface 331 of the flat abrasive particles 33 causes a removal effect on the uneven portion of the polishing pad 40, and a function of deglazing the polishing pad 40.

In summary, the effect of the present invention over the prior art is that the pointed abrasive particles provide a roughening trimming effect, creating a ridge on the surface of the polishing pad that provides trimming and deglazing a trimming function to remove debris of the surface of the polishing pad, thereby making the composite chemical mechanical polishing dresser excellent by integrating the pointed abrasive particles and the flat abrasive particles on a single base Trimming effect.

The present invention has been described in detail above, but the foregoing is only a preferred embodiment of the present invention, and is not intended to limit the scope of the invention. That is, the equivalent changes and modifications made by the scope of the present application should remain within the scope of the patent of the present invention.

10‧‧‧ Pedestal
101‧‧‧ upper surface
11‧‧‧First accommodating slot
12‧‧‧Second accommodating slot
20‧‧‧First grinding unit
21‧‧‧First load-bearing column
22‧‧‧First bonding layer
23‧‧‧ pointed abrasive particles
231‧‧‧ tip apex
24‧‧‧First bearing column bonding layer
30‧‧‧Second grinding unit
31‧‧‧Second load column
32‧‧‧Second bonding layer
33‧‧‧ Flat head grinding particles
331‧‧‧flat top surface
332‧‧‧cut face
34‧‧‧Second bearing column bonding layer
40‧‧‧ polishing pad
H‧‧‧height
D‧‧‧height difference θ‧‧‧cutting angle

FIG. 1 is a schematic plan view of an embodiment of the present invention. "Fig. 2" is a side view of the A-A direction of "Fig. 1". FIG. 3 is a schematic view showing the first aspect of the pointed abrasive particles in an embodiment of the present invention. FIG. 4 is a schematic view showing a second aspect of the pointed abrasive particles in an embodiment of the present invention. FIG. 5 is a schematic view showing a third aspect of the pointed abrasive particles in an embodiment of the present invention. Fig. 6 is a schematic view showing a fourth aspect of the pointed abrasive particles in an embodiment of the present invention. Fig. 7 is a schematic view showing the first aspect of the flat-polished abrasive particles in an embodiment of the present invention. Figure 8 is a schematic view showing the second aspect of the flat-head abrasive particles in an embodiment of the present invention. Fig. 9 is a schematic view showing a third aspect of the flat-polished abrasive particles in an embodiment of the present invention. Figure 10 is a schematic view showing a fourth aspect of the flat-head abrasive particles in an embodiment of the present invention. FIG. 11 is a schematic view showing a cutting angle of a negative oblique angle in an embodiment of the present invention.

10‧‧‧ Pedestal

101‧‧‧ upper surface

11‧‧‧First accommodating slot

12‧‧‧Second accommodating slot

20‧‧‧First grinding unit

21‧‧‧First load-bearing column

22‧‧‧First bonding layer

23‧‧‧ pointed abrasive particles

231‧‧‧ tip apex

24‧‧‧First bearing column bonding layer

30‧‧‧Second grinding unit

31‧‧‧Second load column

32‧‧‧Second bonding layer

33‧‧‧ Flat head grinding particles

331‧‧‧flat top surface

34‧‧‧Second bearing column bonding layer

H‧‧‧height

D‧‧‧ height difference

Claims (17)

A composite chemical mechanical polishing dresser for trimming a surface of a polishing pad, the composite chemical mechanical polishing dresser comprising: a base comprising a first receiving groove and a second receiving groove; The first grinding unit includes a first supporting post fixed to the first receiving groove, a first bonding layer disposed on the first receiving post, and a first bonding layer disposed on the first bonding layer and transmitting the first bonding layer a plurality of second grinding units are fixed to the first bearing column; and a plurality of second grinding units are disposed on the second receiving column. a second bonding layer and a flat-head abrasive particle disposed on the second bonding layer and fixed to the second carrier through the second bonding layer; wherein the pointed abrasive particle has a higher abrasive grain than the flathead Height, the height is a distance from an upper surface of the base to a tip apex of the pointed abrasive particle, and the ratio of the first grinding unit to the second grinding unit is between 1:4 and 4: Between 1. The composite chemical mechanical polishing dresser of claim 1, wherein the first grinding unit further comprises a first bearing column bonding layer disposed between the first receiving groove and the first bearing column. The first carrier column is fixed to the first receiving groove through the first carrier column bonding layer. The composite chemical mechanical polishing dresser according to claim 2, wherein the composition of the first carrier-bonding layer is selected from the group consisting of ceramic materials, brazing materials, plating materials, metal materials and polymer materials. Group. The composite chemical mechanical polishing conditioner according to claim 1, wherein the second grinding unit further comprises a second bearing column bonding layer disposed between the second receiving groove and the second bearing column. The second carrier column is fixed to the second receiving groove through the second carrier column bonding layer. The composite chemical mechanical polishing conditioner according to claim 4, wherein the composition of the second carrier-bonding layer is selected from the group consisting of ceramic materials, brazing materials, plating materials, metal materials and polymer materials. Group. The composite chemical mechanical polishing conditioner according to claim 1, wherein the material of the base is selected from the group consisting of stainless steel, metal materials, plastic materials and ceramic materials. The composite chemical mechanical polishing conditioner according to claim 1, wherein the material of the first carrier column and the second carrier column is selected from the group consisting of stainless steel, metal materials, plastic materials and ceramic materials. . The composite chemical mechanical polishing conditioner according to claim 1, wherein the first bonding layer and the second bonding layer are selected from ceramic materials, brazing materials, plating materials, metal materials, and polymers. A group of materials. The composite chemical mechanical polishing conditioner of claim 1, wherein the tip apex of the pointed abrasive particle and a flat top mask of the flat abrasive particle have a height difference of between 10 μm and 200 μm. The composite chemical mechanical polishing conditioner of claim 1, wherein the tip apex of the pointed abrasive particle and a flat top mask of the flat abrasive particle have a height difference of between 10 μm and 100 μm. The composite chemical mechanical polishing conditioner of claim 1, wherein the tip apex of the pointed abrasive particle and a flat top mask of the flat abrasive particle have a height difference of between 10 μm and 50 μm. The scope of the patent application according to item 1 composite chemical mechanical polishing conditioner, which is located in a flat planar top surface of the head of the abrasive particles on a base having between 10000μm ² to 160000μm ² area. The composite chemical mechanical polishing conditioner according to claim 1, wherein the number of the flat abrasive particles is between 10 and 200. The composite chemical mechanical polishing conditioner according to claim 1, wherein the number of the flat abrasive particles is between 20 and 40. The composite chemical mechanical polishing conditioner according to claim 1, wherein the flat abrasive particles have a hexahedral or six-octahedral shape. The composite chemical mechanical polishing conditioner of claim 1, wherein the flat abrasive particles have a negative bevel or a 0 degree angle. The composite chemical mechanical polishing conditioner according to claim 16, wherein the negative oblique angle is between 0 degrees and -35 degrees.