TWI585821B - Method for manufacturing mold - Google Patents

Description

Mold manufacturing method

The present invention relates to a method for producing a mold having a fine uneven pattern on its surface, and a mold produced therewith.

Nano-imprinting is a method of pressing (imprinting) a mold (also commonly referred to as a mold, a stamper, a template) forming a concave-convex pattern onto a resist applied on a substrate to be transferred, so that the resist is mechanically generated. A technique in which a fine pattern is precisely transferred to a resist film by deformation or flow. As long as the mold is produced, the fine structure of the nanometer level can be easily and repeatedly formed. Therefore, it is economical, and it is a transfer technique with less harmful waste and less emissions. Therefore, it has been expected to be applied to various fields such as the semiconductor field in recent years. .

The mold is known to have a boss structure (hereinafter also referred to as a boss type mold) including a boss portion (the upper surface is relatively flat and higher than the surrounding portion) and the flange portion around it (for example, Patent Document 1). When the embossing is performed using a boss type mold, the contact area between the mold and the resist is reduced as compared with the case of using a flat mold, and the advantage of peeling the mold from the resist by a small force is obtained. . In addition, it also has the following advantages: for example, repeating a transfer pattern on the same transferred substrate (step by step (step And repeat)), by using a boss type mold, it is possible to avoid the mold from interfering with the previously transferred pattern when the next pattern is transferred, and the previously transferred pattern is broken.

However, the mold may be provided with an auxiliary mark such as an alignment mark or an identification mark in addition to a concave-convex pattern to be transferred, such as a semiconductor circuit pattern or a surface processing processing pattern.

Conventionally, as a method of manufacturing a mold having such an auxiliary mark, for example, methods of Patent Document 2 to Patent Document 4 are known. Patent Document 2 discloses a method of marking an identification mark onto a mold using a laser processing machine. Patent Document 3 discloses a method in which a flat master mold having a fine uneven pattern and an auxiliary mark and a flat transfer substrate are used, and a resist is applied onto the transferred substrate. A method of transferring an uneven pattern on the transferred substrate while transferring the auxiliary mark on each step of the embossing and etching. Patent Document 4 discloses a method of simultaneously transferring a concave-convex pattern and an auxiliary mark onto a flat substrate to be transferred in the same manner as in Patent Document 3, and then blocking the portion including the concave-convex pattern, and etching is included. A method of recessing other areas of the auxiliary mark.

According to the method of Patent Document 4, it is possible to manufacture a boss-type mold having a fine concavo-convex pattern on the boss portion and having an auxiliary mark on the flange portion.

[Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2009-170773

[Patent Document 2] Japanese Patent Laid-Open No. 2011-066153

[Patent Document 3] Japanese Patent Laid-Open No. 2011-063004

[Patent Document 4] Japanese Patent Laid-Open No. 2011-066238

However, in the method of Patent Document 4, since the auxiliary mark is fixed to the original mold, the auxiliary mark cannot be easily changed. Thereby, for example, even when a plurality of dies are copied from one master, it is impossible to change the identification mark for each of the copied dies. Further, in the method of Patent Document 4, it is difficult to completely maintain the shape of the auxiliary mark between the steps of etching the other region including the auxiliary mark, and the function as the auxiliary mark may be impaired.

On the other hand, as a method of manufacturing a boss-type mold having an auxiliary mark, it is considered that a boss type mold having a fine uneven pattern on the land portion is produced, and as in Patent Document 2, a laser or the like is used. A method of marking an auxiliary mark on a flange portion. However, in this method, each mold must be inscribed, and the manufacturing step is not efficient.

The present invention has been made in view of the above problems, and it is an object of the invention to provide a method for manufacturing a mold which can flexibly cope with a change in an auxiliary mark in the manufacture of a boss type mold having an auxiliary mark, and which can be manufactured more efficiently. Mold.

In order to solve the above problems, the method for producing a mold according to the present invention is a method for producing a mold having a fine uneven pattern and an auxiliary mark on the surface, and the method for manufacturing the mold includes a boss portion and a flange portion. By the droplet discharge method, a plurality of droplets containing a curable resin are placed on the boss portion, and a plurality of droplets containing a curable resin are placed on the flange portion as follows. Droplet, That is, the height of each of the plurality of droplets disposed on the flange portion is lower than the height of the land portion, and the plurality of droplets disposed on the flange portion indicate the auxiliary mark; and the concave-convex pattern of the original mold is pressed against the arrangement In the state of a plurality of droplets on the boss portion, the curable resin on the boss portion is cured to cure the curable resin on the flange portion, and the cured curable resin is used as a mask. Etching of the transfer substrate.

Further, in the method of manufacturing a mold according to the present invention, it is preferable that a contact area between a droplet of each drop of the droplet disposed on the flange portion and the flange portion is larger than each droplet disposed on the boss portion. The arrangement of the plurality of droplets described above is performed in such a manner that the droplets have a contact area with the land portion.

Further, in the method for producing a mold according to the present invention, it is preferable that the plurality of droplets on the flange portion are formed so that the width of the droplets on the contact surface of the droplets and the flange portion is 50 μm to 500 μm. Configuration.

Further, in the method of manufacturing a mold according to the present invention, it is preferable that the amount of droplets of each droplet disposed on the flange portion is larger than the amount of droplets of each droplet disposed on the boss portion. The arrangement of the above droplets is performed.

Further, in the method for producing a mold according to the present invention, it is preferable to use a substrate having a wettability of the surface of the flange portion larger than the wettability of the surface of the land portion as the substrate to be transferred. In this case, it is preferable to increase the wettability of the flange portion by a method of performing ultraviolet ozone treatment only on the flange portion or a method of forming a film having high affinity with the curable resin.

Further, in the method of manufacturing a mold of the present invention, it is preferable to arrange The arrangement of the plurality of droplets described above is performed such that the height of the droplets on the flange portion is larger than the height of the droplets disposed on the boss portion.

Further, in the method of manufacturing a mold according to the present invention, it is preferable that the arrangement of the plurality of droplets on the boss portion and the arrangement of the plurality of droplets on the flange portion are simultaneously performed.

Moreover, in the manufacturing method of the mold of the present invention, it is preferable to perform the etching so that the curable resin on the boss portion is removed and the curable resin on the flange portion remains. In this case, contrast can be imparted to the auxiliary mark by the difference in optical characteristics between the substrate to be transferred and the curable resin.

Alternatively, in the method of manufacturing a mold according to the present invention, it is preferable that the flange portion of the substrate to be transferred has a film containing a metal on at least a part of the surface of the flange portion, and the flange portion is formed on the film containing the metal. The configuration of the above droplets on the above. In this case, contrast can be imparted to the auxiliary mark by the difference in optical characteristics of the substrate to be transferred and the film containing the metal. Further, in this case, it is preferable that the film containing a metal has a fine uneven structure. Further, it is preferable that the land portion of the substrate to be transferred has a film containing a metal on the surface of the land portion, and after the etching, a curable resin or a film containing a metal is used as a mask to form a land portion. The film to be transferred is etched so that the metal-containing film is removed and the metal-containing film of the flange portion remains.

The mold of the present invention is characterized in that it is produced by the method described above.

In the method for producing a mold according to the present invention, in particular, since the droplet of the curable resin is placed by the droplet discharge method after the auxiliary mark is formed, the cured curable resin is etched as a mask, so that even When it is desired to change the auxiliary mark for each mold, not only the design change of the arrangement portion of the liquid droplet but also the auxiliary mark can be easily changed. As a result, in the manufacture of a boss type mold having an auxiliary mark, it is possible to flexibly cope with the change of the auxiliary mark and to manufacture it more efficiently.

1‧‧‧Mold

2, 5a‧‧‧ boss

2s, 3s, 5c, 5d‧‧‧ upper surface

3, 5b‧‧‧Flange

5‧‧‧Transferred substrate

6‧‧‧Metal-containing film

21, 43a‧‧‧ concave pattern

30‧‧‧Auxiliary mark

31‧‧‧ text

32‧‧‧ barcode

33‧‧‧ symbol

40‧‧‧Inkjet head

41, 42‧‧‧ droplets

43‧‧‧ original model

44, 45‧‧‧ hardening resin

46‧‧‧etching gas

H‧‧‧step

FIG. 1 is a schematic view showing an example of a boss type mold having a fine uneven pattern and an auxiliary mark.

FIG. 2 is a schematic view showing an example of an identification mark.

3 is a schematic cross-sectional view showing a procedure of a method of manufacturing a mold according to the first embodiment.

4 is a schematic cross-sectional view showing a procedure of a method of manufacturing a mold according to a second embodiment.

Fig. 5 is a schematic view showing a design change of the second embodiment.

Fig. 6 is a schematic view showing a design change of the third embodiment.

Hereinafter, embodiments of the present invention will be described using the drawings, but the present invention is not limited thereto. In addition, in order to make it easy to see, the scale of each component in a figure, etc. differs suitably from an actual thing.

"Stud type die with auxiliary mark"

First, the mold obtained by the present invention will be briefly described. FIG. 1 is a schematic view showing an example of a boss type mold having a fine uneven pattern and an auxiliary mark. Specifically, A of FIG. 1 is a plan view of the mold 1, and FIG. 1B is a front view of the mold 1. FIG. 2 is a schematic view showing an example of an identification mark.

According to the manufacturing method of the present invention, a boss type mold 1 such as that shown in Fig. 1 is manufactured. The mold 1 has a boss structure including the boss portion 2 and the flange portion 3. The upper surface 2s of the boss portion 2 is higher in height than the upper surface 3s of the flange portion 3 (Fig. 1B) ). Further, the fine concavo-convex pattern 21 is formed on the upper surface 2s of the boss portion 2, and the auxiliary mark is formed on the upper surface 3s of the flange portion 3.

The auxiliary mark is a pattern in which an alignment function, such as an alignment mark or an identification mark, does not become a target of transfer in the nanoimprint using the mold 1. The alignment mark is a pattern for assisting in the positional adjustment of the mold at the time of imprinting, and the identification mark is a pattern for identifying each mold. The identification mark represents management information of the mold, for example, by words, figures, symbols, images, barcodes, bit record patterns, or a combination thereof. The management information is, for example, the manufacturing number of the mold, the management number, the manufacturing conditions (manufacturing date, temperature, master type), specifications (thickness, flatness, parallelism, concave-convex pattern information, coordinates of the concave-convex pattern), usage history, etc. . The auxiliary mark may be composed of one or more lines, or may be composed of a plurality of dots as shown in FIG. For example, FIGS. 1 and 2 depict a subsidy mark including a character 31, a bar code 32, and a symbol 33 composed of a plurality of points. Further, the detection of the auxiliary mark can be performed by visual observation, microscopic observation, laser measurement, image recognition processing using an electronic computer, or the like.

The auxiliary mark may be formed by the uneven shape of the upper surface 3s of the flange portion 3 itself. It is also shown that a curable resin, a metal, or the like is represented by a pattern of a material different from the material constituting the flange portion 3 (or the mold 1). As described above, by patterning a material different from the material constituting the flange portion 3 (or the mold 1) on the upper surface 3s of the flange portion 3, the contrast is improved, and information is easily read. The size of the structural unit of the auxiliary mark (for example, the size of each character and each figure) is not particularly limited, and is appropriately selected in the range of, for example, the μm scale to the mm scale according to the detection method. The specific formation method of the auxiliary mark will be described in detail in each embodiment to be described later.

In addition, the auxiliary mark can be removed when the auxiliary mark is not required. For example, when the auxiliary mark is represented by a curable resin, the auxiliary mark can be removed by oxygen ashing, ultraviolet (UV) ozone treatment cleaning, and acid or alkali cleaning, and the auxiliary mark is patterned by a material containing metal. When indicated, the auxiliary mark can be removed by washing with an acid or a base.

"First embodiment"

The first embodiment of the method for producing the mold 1 and the mold produced by the method will be described. 3 is a schematic cross-sectional view showing a procedure of a method of manufacturing a mold according to the first embodiment.

As shown in FIG. 3, the method of manufacturing the mold 1 of the present embodiment uses a transfer substrate 5 (A of FIG. 3) having a boss structure including a boss portion 5a and a flange portion 5b, and an ink jet head. In an inkjet apparatus (not shown) of 40, a plurality of droplets 41 containing a curable resin are placed on the boss portion 5a by an inkjet method, and the same hardening is disposed on the flange portion 5b as follows. The plurality of droplets 42 of the resin, that is, the heights of the plurality of droplets 42 disposed on the flange portion 5b are lower than the height of the land portion 5a, and The plurality of droplets 42 disposed on the flange portion 5b indicate the auxiliary marks 30 (B of FIG. 3), and the concave-convex pattern 43a of the original mold 43 is pressed against the plurality of droplets 41 disposed on the boss portion 5a. In the state, the curable resin on the boss portion 5a and the curable resin on the flange portion 5b are cured (C in FIG. 3), and the cured curable resin 44 and the curable resin 45 are used as a mask to become The removal of the curable resin 44 on the boss portion 5a and the state in which the curable resin 45 on the flange portion 5b remains, the etching of the transferred substrate 5 is performed by the etching gas 46 (D and FIG. 3) 3 of E). After the etching is completed, for example, the mold 1 as shown in FIG. 3 (i.e., the reed of the master mold 43) can be obtained. In the present embodiment, the visibility of the auxiliary mark 30 is mainly achieved by the curable resin 45 remaining on the flange portion 5b.

(transferred substrate)

The substrate to be transferred 5 is a substrate that serves as a basis of the mold 1. In the present invention, in order to manufacture the boss type mold 1, a boss structure having a boss portion 5a and a flange portion 5b is formed in advance on the substrate 5 to be transferred. According to the boss structure, only the droplets 41 disposed on the land portion 5a of the substrate 5 to be transferred are brought into contact with the master mold 43 at the time of imprinting by the master mold 43 (C in FIG. 3), and the arrangement is prevented. The droplets 42 of the flange portion 5b are in contact with the master mold 43. The step h of the land portion 5a is preferably from 1 μm to 1000 μm, more preferably from 10 μm to 500 μm, still more preferably from 20 μm to 100 μm. The reason is that when the step h is lower than the height of the droplets 42 disposed on the flange portion 5b (about 500 nm to several μm in consideration of the normal amount of droplets), the droplet 42 may be original. The mold 43 contacts and contaminates the master mold 43. On the other hand, when the step h is too high, the distance between the droplet discharge port of the inkjet head 40 and the upper surface 5d of the flange portion is increased, and thus the droplet placement accuracy is deteriorated. on The shape of the substrate 5 to be transferred is, for example, a disk shape when the mold 1 is used for the production of an information recording medium.

When the curable resin is photocurable, and the original mold is bismuth (Si) or the like and does not have translucency, the substrate 5 to be transferred is preferably a quartz substrate in order to expose the curable resin. The quartz substrate has a light transmissive property, and is not particularly limited as long as it has a thickness of 0.3 mm or more, and can be appropriately selected depending on the purpose. For example, the transfer substrate 5 may be a surface of a quartz substrate coated with an adhesion layer such as a decane coupling agent, or a metal film containing Cr, W, Ti, Ni, Ag, Pt, Au, or the like laminated on a quartz substrate. Or a metal oxide film containing CrO ₂ , WO ₂ , TiO ₂ or the like is laminated on a quartz substrate, or a surface of the laminate is coated with an adhesion layer such as a decane coupling agent. In the present embodiment, a case where the substrate 5 to be transferred does not have a metal-containing film such as the above metal film or metal oxide film will be described. In the second embodiment and the third embodiment, a case where the transfer target substrate 5 has a film containing a metal will be described. The adhesion layer is not necessarily required, but is used in order to improve the adhesion between the curable resin and the substrate 5 to be transferred. The adhesion layer may be formed at least in the pattern formation region (the region in which the uneven pattern is formed) of the boss portion 5a.

In addition, the above-mentioned "translucent" means that the curable resin is sufficiently hardened when light is incident from the other surface of the substrate so as to be emitted from one surface of the film on which the curable resin is formed, and means The transmittance of light having a wavelength of at least 200 nm or more from the other surface to the one surface is 5% or more.

The thickness of the quartz substrate is usually preferably 0.3 mm or more. The reason is that when the thickness is 0.3 mm or less, it is easily broken by pressing in operation or imprinting.

On the other hand, when the master mold 43 is made of quartz or the like and has light transmissivity, the structure and material of the substrate 5 to be transferred are not particularly limited, and may be appropriately selected depending on the purpose. In the substrate 5 to be transferred, if the structure is a boss structure, it may have a single layer structure or a laminated structure. The material can be appropriately selected from those known as the substrate material, and examples thereof include ruthenium, nickel, aluminum, glass, and resin. These substrate materials may be used alone or in combination of two or more. The substrate to be transferred 5 may be a suitable one or a commercially available product. Alternatively, the surface may be coated with a decane coupling agent.

The thickness of the substrate 5 to be transferred (the thickness of the entire land portion) is not particularly limited, and may be appropriately selected depending on the purpose, and is preferably 0.05 mm or more, and more preferably 0.1 mm or more. If the thickness of the substrate is less than 0.05 mm, there is a possibility that deflection occurs on the substrate side at the time of imprinting, and a uniform adhesion state cannot be ensured.

(curable resin)

The curable resin is not particularly limited, and in the present embodiment, for example, a photopolymerization initiator (about 2% by mass) or a fluoromonomer (0.1% by mass to 1% by mass) may be added to the polymerizable compound. material.

Further, an antioxidant (about 1% by mass) may be added as needed. The material produced according to the above sequence can be hardened, for example, by ultraviolet light having a wavelength of 360 nm. In the case of poor solubility, it is preferred to dissolve the solvent by adding a small amount of acetone or ethyl acetate to dissolve it.

As the above polymerizable compound, in addition to benzyl acrylate (Viscoat (registered trademark) #160: manufactured by Osaka Organic Chemical Co., Ltd.), ethyl carbitol Polyester (Viscoat (registered trademark) #190: manufactured by Osaka Organic Chemical Co., Ltd.), polypropylene glycol diacrylate (ARONIX (registered trademark) M-220: manufactured by Toagosei Co., Ltd.), trimethylolpropane ring In the case of propylene oxide (Propylene Oxide, PO) modified triacrylate (ARONIX (registered trademark) M-310: manufactured by Toagosei Co., Ltd.), etc., the compound A represented by the following structural formula 1 etc. are mentioned.

Further, examples of the polymerization initiator include 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)benzene. Alkylphenone-based photopolymerization initiator such as I-butyl ketone (IRGACURE (registered trademark) 379: manufactured by Toyotsu Chemiplas Co., Ltd.).

In addition, examples of the fluoromonomer include Compound B represented by the following Structural Formula 2.

Structure 2:

For example, the curable resin has a viscosity of 8 cP to 20 cP, and the curable resin has a surface energy of 25 mN/m to 35 mN/m. Here, the viscosity of the curable resin is a value measured at 25 ° C ± 0.2 ° C using a RE-80L type rotational viscometer (manufactured by Toki Sangyo Co., Ltd.). The rotation speed at the time of measurement is 100 rpm when the viscosity is 0.5 cP or more and less than 5 cP, and 50 rpm when the viscosity is 5 cP or more and less than 10 cP, and 20 rpm when the viscosity is 10 cP or more and less than 30 cP. When the viscosity is 30 cP or more and less than 60 cP, it is set to 10 rpm. In addition, the surface energy of the curable resin is "UV nanoimprint materials: surface energies, residual layers, and imprint quality", Schmidt, etc., vacuum Journal of Science and Technology, Series B, Vol. 25, No. 3, p. 785 - p. 790, 2007 (H. Schmitt et al., J. Vac. Sci. Technol. B, Vol. 25, Issue 3, The method described in pp. 785-790, 2007). Specifically, the surface energy of the ruthenium substrate treated with the UV ozone treatment and the ruthenium substrate surface-treated with OPTOOL (registered trademark) DSX (manufactured by Daikin (DAIKIN) Co., Ltd.) was determined, and the curable resin was used. The surface energy of the curable resin was calculated from the contact angle of the two substrates.

The curable resin disposed on the boss portion 5a and the curable resin disposed on the flange portion 5b may be the same material or different materials.

(Method of arranging droplets containing curable resin)

As a method of disposing the droplets containing the curable resin, a droplet discharge method in which a specific amount of droplets can be placed at a specific position on the substrate 5 to be transferred can be used by an inkjet method or a dispensing method. When droplets are disposed on the substrate 5, the ink jet printer or dispenser can be used separately depending on the desired amount of droplets (the amount of droplets dispensed per droplet). For example, when the amount of liquid droplets is less than 100 nl, an ink jet printer is used, and when the amount of liquid droplets is 100 nl or more, a method using a dispenser or the like is used. Further, in the present embodiment, an inkjet method is used.

Examples of the ink jet head 40 that ejects droplets from a nozzle include a piezoelectric method, a thermal method, and an electrostatic method. Among these, a piezoelectric method in which the amount of droplets or the ejection speed can be adjusted is preferable. Before the liquid droplets are placed on the substrate 5, the amount of liquid droplets or the discharge speed is adjusted in advance. For example, it is preferable that the position on the substrate 5 corresponding to the region where the spatial volume of the concave-convex pattern of the original mold 43 is large increases the amount of liquid droplets or corresponds to a region where the spatial volume of the concave-convex pattern of the original mold 43 is small. The position on the substrate 5 is adjusted so that the amount of liquid droplets is reduced. Such adjustment can be appropriately controlled in accordance with the discharge amount of the droplets (the amount of droplets per droplet at the time of ejection). For example, when the amount of liquid droplets is set to 5 pl using an ink jet head having a discharge amount of 1 pl, the same portion is discharged five times to control the amount of liquid droplets. The amount of liquid droplets is obtained, for example, by measuring the three-dimensional shape of droplets previously ejected onto the substrate 5 (or other homogeneous substrate) under the same conditions by a confocal microscope or the like, and calculating the volume based on the shape.

After adjusting the amount of droplets in the above manner, according to the specific droplet arrangement pattern, Droplets are placed on the substrate 5 to be transferred. The droplet arrangement pattern includes two-dimensional coordinate information including a lattice point group corresponding to the droplet configuration. The droplet arrangement pattern is designed according to the imprint condition and the shape or size of the auxiliary mark.

The arrangement of the droplets 42 on the flange portion 5b is performed such that the heights of the plurality of droplets 42 disposed on the flange portion 5b are lower than the height of the boss portion 5a and are disposed on the flange portion 5b. A plurality of droplets 42 represent auxiliary marks. By the height of each of the plurality of droplets 42 being lower than the height of the land portion 5a, the droplet 42 can be prevented from adhering to the master 43 when imprinted by the master 43. When the master mold 43 also has a boss structure, it is generally considered that the possibility that the liquid droplets 42 adhere to the master mold 43 is lowered. However, for example, in order to adjust the position and perform the parallel movement of the master mold 43 (the movement fixed to the distance from the substrate 5 to be transferred), the problem of adhesion of such droplets remains. Therefore, regardless of the shape of the original mold 43, as in the present invention, it is preferable that the height of each of the plurality of droplets 42 is lower than the height of the land portion 5a. Further, in the present invention, since the shape of the auxiliary mark 30 is indicated by a plurality of droplets 42, the auxiliary mark 30 can be flexibly changed by changing the arrangement of the liquid droplets.

As described above, the auxiliary mark can be represented by a line in which a plurality of droplets are combined, or can be represented by an arrangement of droplets (dot). Further, actually, since the etching step is performed, the shape of the auxiliary mark indicated by the liquid droplets may not necessarily coincide with the shape of the final auxiliary mark 30. That is, the line of the final auxiliary mark 30 becomes thinner or the dots become smaller. Therefore, in the case where the auxiliary mark is represented by the liquid droplet, in consideration of the above, in order to prevent the information transfer function of the auxiliary mark 30 by the etching step, for example, it is necessary to increase the amount of liquid droplets or thicken the line.

The arrangement of the droplets on the boss portion 5a and the arrangement of the droplets in the flange portion 5b can be performed simultaneously or separately. Here, the fact that the droplets are arranged at the same time means that the droplets are arranged on the boss portion 5a and the droplets on the flange portion 5b in one-way scanning of the droplet discharge portion such as the ink jet head. In the arrangement, the "separate" arrangement of the droplets means that only the scanning of the droplet arrangement on the boss portion 5a and the droplet placement only in the flange portion 5b are performed during the scanning movement of the droplet discharge portion. The scans are completely separate. Moreover, these respective droplet configurations can also be performed using ink jet heads different from each other. However, in the arrangement of the droplets on the boss portion 5a and the flange portion 5b, if different curable resins and different ink jet heads are used, the time required for droplet placement increases, so it is preferable to use the same The curable resin and the same ink jet head simultaneously perform droplet arrangement.

In the present invention, from the viewpoint of improving the visibility of the auxiliary mark 30, it is preferable to arrange the plurality of droplets in such a manner that the droplets 42 and the droplets of each droplet disposed on the flange portion 5b are convex. The contact area of the edge portion 5b (that is, the average value of the area of the region where the one droplet 42 is in contact with the upper surface 5d of the flange portion 5b) is larger than the droplet 41 of each droplet disposed on the boss portion 5a. The contact area with the boss portion 5a (that is, the average value of the area of the region where one drop of the liquid droplet 41 is in the upper surface 5c of the boss portion 5a). The reason is the following reasons. As a simple method of arranging droplets, it is considered that the droplet arrangement pattern is removed, and the projections are formed on the boss portion 5a under the same conditions (for example, material of the droplet, amount of discharge, amount of droplets, surface energy, etc.). The droplet arrangement is arranged with the droplets on the flange portion 5b. However, the condition of the droplet arrangement on the land portion 5a is mostly determined by the relationship with the imprint by the master mold 43, so that this is implemented. In the case of the method, the condition of the droplet arrangement on the flange portion 5b is necessarily subject to the condition of the droplet arrangement on the boss portion 5a. However, in the liquid droplet arrangement on the boss portion 5a, it is required to arrange small droplets at a high density from the viewpoint of preventing unfilled defects of the curable resin film at the time of imprinting. Therefore, if the condition for arranging the droplets on the flange portion 5b is subject to the condition of the droplets disposed on the boss portion 5a, there is a possibility that the line can represent only the fine auxiliary marks. This has a large influence on the visibility of the auxiliary mark 30 of the mold 1 of the finished body. Therefore, from the viewpoint of improving the visibility of the auxiliary mark 30, the contact area of the liquid droplets 42 on the flange portion 5b is made larger than the contact area of the liquid droplets 41 on the boss portion 5a as one standard.

In addition, the contact area of the droplet of each drop of droplets means the contact area of the droplet in a single state (that is, a state in which it is not combined with other droplets). Therefore, when the line in which the plurality of droplets are combined indicates the shape of the auxiliary mark, the contact area refers to the contact area when the individual state is assumed, which can be confirmed by a prior test. Further, when a plurality of droplets are ejected to the same portion, the whole can be considered as one droplet.

As a method of increasing the contact area of the liquid droplets 42 on the flange portion 5b in the above-described manner, for example, the amount of droplets of each droplet disposed on the flange portion 5b is larger than that of the boss portion 5a. A method of the amount of droplets per drop of droplets. In addition, the method of adjusting the amount of liquid droplets is as described above. Or a substrate to be transferred which is more wettable to the liquid droplets 42 on the flange portion 5b by using the flange portion upper surface 5d than the upper surface 5c of the boss portion on the droplets 41 on the boss portion 5a. 5. The contact area of the droplets 42 can also be increased in the above manner. The reason is that the wettability is large (ie, the upper surface of the flange portion) In the case where the surface energy of 5d is large or the contact angle of the droplets is small, even if the same amount of liquid droplets, the contact area is enlarged by the effect of wet diffusion. For example, the above-described wetting of the flange portion 5b can be increased by performing a UV treatment on the flange portion 5b or a surface treatment method such as forming a film (for example, an organic molecular film) having high affinity with the curable resin. Sex.

Further, from the viewpoint of easily confirming the auxiliary mark with the naked eye, it is preferable that the width of the contact surface of the liquid droplet 42 and the flange portion 5b together with the liquid droplet (the diameter when the contact surface is approximated by a circle) The arrangement of the droplets 42 on the flange portion 5b is performed in a manner of 50 μm to 500 μm.

On the other hand, it is also effective to arrange the liquid droplets so that the height of the liquid droplets 42 disposed on the flange portion 5b is larger than the height of the liquid droplets 41 disposed on the boss portion 5a. The droplet height can also be controlled by changing the wettability (surface energy) or the amount of droplets of the substrate 5 to be transferred. For example, when the surface energy of the upper surface 5c of the boss portion is increased, the wettability is improved and the droplet height is reduced. In order to increase the surface energy, there is a method of activating only the surface of the land portion 5a by UV ozone treatment or the like, or a film having high affinity with the curable resin (for example, organic molecules) is formed only on the surface of the land portion 5a. Membrane) method. Further, the height of the liquid droplets 42 can be increased by increasing the amount of droplets of the liquid droplets 42 disposed on the flange portion 5b.

When the boss portion 5a and the flange portion 5b are subjected to surface treatment different from each other, it is preferable to protect any surface by a surface protection tape. The surface protection tape is not particularly limited as long as it is a commercially available protective tape for a semiconductor wafer. Since there is a fear of residual paste when the surface protection tape is peeled off, it is attached to the boss portion 5a to be embossed. In comparison, a method of attaching a surface protective tape to the flange portion 5b is more preferable. The unprotected portion is subjected to surface treatment by a method such as a UV ozone cleaning method, a spin coating method, a dip coating method, a spray coating method, or a vapor deposition method in a state where the surface protective tape is partially attached. After the surface treatment, the surface protective tape is peeled off, whereby the surface of the boss portion 5a and the flange portion 5b are subjected to different surface treatments.

(original model)

The master mold 43 used in the present embodiment can be manufactured, for example, in the following order. First, a polyhydroxy styrene (PHS)-based chemical amplification resist, a novolac-based resist, and a polymethyl methacrylate (Poly(methyl) are coated on a crucible substrate by spin coating or the like. A resist liquid containing a main component such as an acrylic resin such as methacrylate or PMMA) forms a resist layer. Then, the ruthenium substrate is irradiated with laser light (or an electron beam) while being modulated in accordance with a desired concave-convex pattern, and the concave-convex pattern is exposed on the surface of the resist layer. Then, the resist layer is subjected to development processing, and the pattern of the removed resist layer is used as a mask, and selective etching is performed by reactive ion etching (RIE) or the like to obtain a crucible having a specific concavo-convex pattern. Mold.

Further, in the present embodiment, a case where a boring mold is used will be described, but the original mold 43 is not limited thereto, and a quartz mold may be used. At this time, the quartz mold can be produced by the same method as the above-described method for producing a tantalum mold, or the above-described method of copying a tantalum mold. In addition, the master mold 43 may have a boss structure.

The shape of the uneven pattern 43a of the original mold 43 is not particularly limited, and can be appropriately selected depending on the use of the nanoimprint. For example, typical patterns are lines and gaps (line and Space) pattern. Further, the length of the convex portion of the line and gap pattern, the width of the convex portion, the interval between the convex portions, and the height of the convex portion from the bottom surface of the concave portion (the depth of the concave portion) can be appropriately set. For example, the width of the convex portion is 10 nm to 100 nm, more preferably 20 nm to 70 nm, the interval between the convex portions is 10 nm to 500 nm, more preferably 20 nm to 100 nm, and the height of the convex portion is 10 nm to 500 nm, and more preferably 30 nm to 100 nm. Further, the shape of the convex portion constituting the concave-convex pattern 43a may be another shape in which dots having a cross section such as a rectangle, a circle, and an ellipse are arranged.

(release agent)

In the present invention, in order to improve the mold release property of the curable resin and the master mold 43, it is preferred to perform a mold release treatment on the surface of the master mold 43. The release agent to be used for the release treatment is, for example, OPTOOL (registered trademark) DSX manufactured by Daikin Industries Co., Ltd., or Novec (registered trademark) EGC manufactured by Sumitomo 3M Co., Ltd. as a fluorine-based decane coupling agent. -1720 and so on.

Further, a known fluorine-based resin, a hydrocarbon-based lubricant, a fluorine-based lubricant, a fluorine-based decane coupling agent, or the like can be used.

Examples of the fluorine-based resin include PTFE (polytetrafluoroethylene), PFA (tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer), FEP (tetrafluoroethylene-hexafluoropropylene copolymer), and ETFE (tetrafluoroethylene- Ethylene copolymer) and the like.

Examples of the hydrocarbon-based lubricant include carboxylic acids such as stearic acid and oleic acid, esters such as butyl stearate, sulfonic acids such as octadecylsulfonic acid, and phosphates such as monooctadecyl phosphate, and stearic acid. Examples include alcohols such as alcohols and oleyl alcohols; amines such as carboxylic acid amides such as decylamine stearate; and amines such as stearylamine.

For example, a fluorine-based lubricant may be a lubricant in which a part or all of an alkyl group of the above hydrocarbon-based lubricant is substituted with a fluoroalkyl group or a perfluoropolyether.

For example, perfluoropolyether is: perfluoroformaldehyde polymer, perfluoroethylene oxide polymer, perfluoro-epoxy n-propane polymer (CF ₂ CF ₂ CF ₂ O) _n , perfluoroepoxy isopropane polymer (CF(CF ₃ )CF ₂ O) _n or a copolymer of these or the like. Here, the subscript n indicates the degree of polymerization.

For example, the fluorine-based decane coupling agent is one having at least one, preferably one to ten alkoxyalkylene groups or chlorodecyl groups in the molecule, and preferably having a molecular weight of from 200 to 10,000. Examples of the alkoxyalkylene group include a -Si(OCH ₃ ) ₃ group and a -Si(OCH ₂ CH ₃ ) ₃ group. Examples of the chloroalkyl group include a -Si(Cl) ₃ group. Specifically: heptafluoro-1,1,2,2-tetrahydroindoletrimethoxydecane, pentafluorophenylpropyldimethylchlorodecane, and tridecafluoro-1,1,2,2-tetra a compound such as hydrogenoctyltriethoxydecane or tridecafluoro-1,1,2,2-tetrahydrogenyltrimethoxydecane.

(imprint method)

Before the master mold 43 is brought into contact with the curable resin, the residual gas is reduced by setting the environment between the master mold 43 and the substrate 5 to a reduced pressure or a vacuum environment. However, the curable resin before curing in a high vacuum environment volatilizes, and it may be difficult to maintain a uniform film thickness. Therefore, it is preferable to reduce the residual gas by setting the environment between the master 43 and the substrate 5 to a helium (He) environment or a reduced pressure He environment. He passes through the quartz substrate, so the residual gas (He) incorporated is slowly reduced. The passage of He takes time, so it is better to set it as a decompression He environment. The reduced pressure environment is preferably from 1 kPa to 90 kPa, and particularly preferably from 1 kPa to 10 kPa.

The pressing pressure of the original mold 43 is 100 kPa or more and 10 MPa or less. Within the scope. When the pressure is high, the flow of the curable resin is promoted, and the compression of the residual gas, the dissolution of the residual gas in the curable resin, and the transmission of He in the quartz substrate are promoted, and the removal rate is improved. However, if the pressing force is too strong, the original mold 43 and the substrate 5 may be damaged if the foreign matter is bitten when the original mold 43 is in contact. Therefore, the pressing pressure of the master mold 43 is preferably 100 kPa or more and 10 MPa or less, more preferably 100 kPa or more and 5 MPa or less, and particularly preferably 100 kPa or more and 1 MPa or less. The reason is that when the pressing pressure is 100 kPa or more, when the embossing is performed in the atmosphere, when the original mold 43 and the substrate 5 are filled with the liquid, the original mold 43 and the substrate 5 can be added by atmospheric pressure (about 101 kPa). Pressure.

The exposure of the curable resin on the boss portion 5a is performed in a state where the uneven pattern 43a of the master mold 43 is pressed against the liquid droplets 41 disposed on the boss portion 5a. Thereby, the droplet 41 becomes a curable resin film to which the uneven pattern 43a is transferred. The curable resin on the flange portion 5b is also hardened by the shape at the time of droplet arrangement by exposure. At this time, the exposure of the boss portion 5a and the flange portion 5b may be performed simultaneously or separately.

The method of forming the curable resin film by pressing against the original mold 43 and then peeling it off is, for example, holding the outer edge portion of the master mold 43 or the substrate 5, and sucking and holding the other substrate 5 or the master mold 43 In the state of the back surface, the holding portion of the outer edge or the holding portion of the back surface is moved in a direction opposite to the pressing direction to be peeled off.

(etched)

The etching of the substrate 5 to be transferred is performed by using the cured curable resin 44 and the curable resin 45 as a mask. Thereby, the upper surface 5c of the boss portion of the substrate 5 to be transferred A pattern corresponding to the concave-convex pattern of the original mold 43 is formed, and the auxiliary mark 30 is formed on the flange surface upper surface 5d of the substrate 5 to be transferred. In the present embodiment, etching is performed so that the curable resin 44 on the boss portion 5a is removed and the curable resin 45 on the flange portion 5b remains (E in FIG. 3). When the curable resin remains on the auxiliary mark 30, the contrast is improved by the difference in optical characteristics between the transfer substrate and the curable resin, and the visibility of the auxiliary mark 30 is improved. In general, the film thickness of the embossed curable resin 44 (including the thickness of the entire convex portion of the so-called residual film portion) is less than 1 μm. Therefore, when the height of the curable resin 45 is adjusted to be larger than the film thickness of the curable resin 44, the above state can be realized by the timing at which the etching is completed. For example, the film thickness of the curable resin 44 obtained in the test, the height of the curable resin 45, the etching rate of the curable resin 44 and the curable resin 45, and the like can be considered, and an appropriate etching time can be obtained. In addition, as a material in which the curable resins respectively disposed on the boss portion 5a and the flange portion 5b are different from each other, the above state can be realized by a difference in etching rate.

The etching is not particularly limited as long as it can form a concave-convex pattern on the substrate, and may be appropriately selected depending on the purpose, and examples thereof include an ion polishing method, reactive ion etching (RIE), and sputtering etching. Among these, ion milling method and RIE are particularly preferable.

The ion milling method is also called ion beam etching, and an inert gas such as Ar is introduced into the ion source to generate ions. The ions are accelerated by the gate electrode and are etched by colliding with the sample substrate. Examples of the ion source include a Kaufman type, a high frequency type, an electron impact type, a duoplasmatron type, and Freeman. Type, electron cyclotron resonance (ECR) type, etc.

As the process gas in ion beam etching, Ar gas can be used, and as an etchant of RIE, a fluorine-based gas or a chlorine-based gas can be used.

As described above, in the method for producing a mold according to the present embodiment, the droplets of the curable resin are placed by the droplet discharge method after the auxiliary marks are formed, and then the curable resin is etched as a mask, so that even When the auxiliary mark is to be changed for each mold, the auxiliary mark can be easily changed by designing only the arrangement of the liquid droplets. As a result, in the manufacture of a boss type mold having an auxiliary mark, it is possible to flexibly cope with the change of the auxiliary mark and to manufacture it more efficiently.

<design change>

According to the above-described embodiment, even when the auxiliary mark formed once is removed, the droplet of the curable resin can be placed only on the flange portion, and the curable resin can be cured to form the auxiliary mark 30. . That is, in the mold 1 manufactured by the manufacturing method of the present invention, the information can be updated by the elimination and addition of the auxiliary mark 30.

In the above-described embodiment, the curable resin 44 on the boss portion 5a is removed and the curable resin 45 on the flange portion 5b remains. However, all of the curable resin may be removed. At this time, the auxiliary mark 30 is indicated by the unevenness of the flange portion itself.

In the above embodiment, the case where the curable resin has photocurability has been described, but the present invention is not limited thereto. That is, in the present invention, for example, a thermosetting resin can also be used.

Further, in the method of indicating the auxiliary mark by the liquid droplet, if a master having a boss structure is used, it can be applied to a flat substrate to be transferred which does not have a land structure.

"Second embodiment"

Next, a second embodiment of a method of manufacturing a mold will be described. Fig. 4 is a schematic cross-sectional view showing the procedure of a method of manufacturing a mold according to the embodiment. This embodiment differs from the first embodiment in that the flange portion 5b of the transfer substrate 5 has a film 6 containing a metal on its surface. Therefore, the same configurations as those of the first embodiment are not described in detail unless otherwise specified.

As shown in Fig. 4, the method of manufacturing the mold 1 of the present embodiment uses a boss structure having a boss portion 5a and a flange portion 5b, and the flange portion 5b has a film 6 containing a metal on its surface. The substrate 5 (A of FIG. 4) and an inkjet apparatus (not shown) including the inkjet head 40 are provided with a plurality of droplets 41 containing a curable resin on the boss portion 5a by an inkjet method, and In the flange portion 5b, a plurality of droplets 42 containing the same curable resin are disposed, that is, the heights of the plurality of droplets 42 disposed on the flange portion 5b are lower than the height of the boss portion 5a, and are disposed on the flange portion 5b. The plurality of droplets 42 on the flange portion 5b indicate the auxiliary mark 30 (B of FIG. 4), and the concave-convex pattern 43a of the original mold 43 is pressed against the plurality of droplets 41 disposed on the boss portion 5a. The curable resin on the boss portion 5a and the curable resin on the flange portion 5b are cured (C in FIG. 4), and the cured curable resin 44 and the curable resin 45 are used as a mask to be convex. In the state in which the curable resin 44 on the land portion 5a is removed and the curable resin 45 on the flange portion 5b remains, the transfer substrate 46 is transferred by the etching gas 46. Engraved (D of FIG. 4 and E of FIG. 4), the curable resin 45 remaining on the flange portion 5b is removed (F of FIG. 4). After the curable resin is removed, for example, a mold 1 as shown in FIG. 4F (i.e., a refill of the master mold 43) can be obtained. In the present embodiment, the visibility of the auxiliary mark 30 is mainly achieved by the metal-containing film 6 patterned on the flange portion 5b.

(film containing metal)

The metal-containing film is a film containing a material mainly composed of a metal such as a metal or a metal compound. The term "main component" means that the composition ratio in the material is 50% by mass or more. As in the present embodiment, the auxiliary mark 30 is represented by the film 6 containing metal, and the visibility of the auxiliary mark is improved. From the viewpoint of improving visibility, the reflectance of the metal-containing film is preferably 30% or more, more preferably 50% or more, and particularly preferably 70% or more at a wavelength of 365 nm. The thickness of the metal-containing film is usually 2 nm to 30 nm, preferably 5 nm to 20 nm. The reason is that, in particular, when the thickness exceeds 30 nm, the UV transmittance is lowered, and the curing failure of the curable resin is likely to occur. The metal-containing film can be formed, for example, by a film formation method such as a vacuum deposition method or a sputtering method. Examples of the material of the metal-containing film include Cr, W, Ti, Ni, Ag, Pt, Au, CrO ₂ , WO ₂ , and TiO ₂ . Further, the metal-containing film 6 before etching may constitute a predetermined surface of at least the auxiliary mark 30 formed on the upper surface 5d of the flange portion.

Further, when an auxiliary mark including a fine pattern having a resolution exceeding the resolution of the droplet placement drawing is to be formed, a pattern formed by a usual photolithography technique and a droplet arrangement pattern can be combined to form an identification mark. For example, FIG. 5 is a view showing that the film 6 containing metal has a larger size than the droplets. A schematic view of the manufacturing steps in the case of a finer uneven structure. In A of Fig. 5, for example, a black portion of the metal-containing film 6 indicates a convex portion, and a white portion indicates a concave portion. The fine uneven structure of the metal-containing film 6 is formed in advance by, for example, photolithography. In this case, the droplet 41 is placed on the boss portion 5a of the substrate 5 to be transferred, and the droplet 42 is placed on the flange portion 5b (B of FIG. 5), and the process proceeds to the etching step. As a result, the auxiliary mark 30 having a fine uneven structure as shown in FIG. 5C is formed.

(Removal method of curable resin)

The method of removing the curable resin may be, for example, a wet process such as washing with an acid or an alkali according to the state of E in Fig. 4, or a dry process such as UV ozone treatment or oxygen ashing.

As described above, in the method for producing a mold according to the present embodiment, the droplets of the curable resin are placed by the droplet discharge method after the auxiliary marks are formed, and the curable resin is etched as a mask. The same effects as those of the first embodiment are obtained.

Further, in the present embodiment, since the auxiliary mark is represented by the metal-containing film patterned on the flange portion 5b, the visibility can be improved.

Further, when the film containing a metal has a concavo-convex structure that is finer than the size of the droplets, an auxiliary mark including a fine pattern having a resolution exceeding the resolution of the droplet arrangement drawing can be formed.

"Third embodiment"

Next, a third embodiment of the method for producing a mold will be described. Fig. 6 is a schematic cross-sectional view showing the procedure of a method of manufacturing a mold according to the embodiment. This implementation The form is different from the second embodiment in that the boss portion 5a of the transfer substrate 5 also has a film 6 containing a metal on its surface. Therefore, the same configurations as those of the first embodiment and the second embodiment will not be described in detail unless otherwise specified.

As shown in Fig. 6, the method of manufacturing the mold 1 of the present embodiment uses a boss structure including a boss portion 5a and a flange portion 5b, and the boss portion 5a and the flange portion 5b have a metal-containing film on the surface thereof. 6 of the substrate 5 to be transferred (A in FIG. 6) and an inkjet device (not shown) including the inkjet head 40, and a plurality of droplets containing a curable resin are placed on the boss portion 5a by an inkjet method. The droplet 41 is placed on the flange portion 5b in such a manner that a plurality of droplets 42 containing the same curable resin are disposed, that is, the heights of the plurality of droplets 42 disposed on the flange portion 5b are lower than those of the boss portion 5a. The plurality of droplets 42 disposed at the height of the flange portion 5b indicate auxiliary marks (B of FIG. 6), and the concave-convex pattern 43a of the original mold 43 is pressed against the plurality of droplets disposed on the boss portion 5a. In the state of 41, the curable resin on the boss portion 5a and the curable resin on the flange portion 5b are cured (C in Fig. 6), and the cured curable resin 44, the curable resin 45, or the metal-containing material are cured. The film 6 is a mask, and is a state in which the metal-containing film 6 of the boss portion 5a is removed and the metal-containing film 6 of the flange portion 5b remains. The body 46 performs etching of the substrate 5 to be transferred (D of FIG. 6 to F of FIG. 6). Then, a mold 1 (i.e., a layup of the master mold 43) as shown in Fig. 6F can be obtained. In the present embodiment, the visibility of the auxiliary mark 30 is mainly achieved by the metal-containing film 6 patterned on the flange portion 5b as in the second embodiment.

(etched)

The etching in this embodiment is carried out, for example, by the following two-stage etching. most The initial etching is an etching suitable for etching the film 6 containing the metal using the curable resin 44 as a mask, and the subsequent etching is suitable for etching the transferred substrate by using the processed metal-containing film 6 as a mask. 5 conditions of etching. Further, the curable resin is removed as needed. By such etching, a pattern of higher precision can be transferred.

[Examples]

The embodiment of the method of manufacturing the mold of the present invention is shown below.

(production of the original model)

A resist liquid containing a PHS (polyhydroxy styrene) chemical amplification resist or the like as a main component is applied onto the Si substrate by spin coating to form a resist layer. Then, while scanning the Si substrate on the XY stage, the electron beam modulated in accordance with the specific pattern was irradiated, and the entire surface of the resist layer in the range of 10 mm square was exposed. Then, the resist layer was subjected to development treatment to remove the exposed portion, and the pattern of the removed resist layer was used as a mask, and selective etching was performed by RIE so as to have a groove depth of 100 nm to obtain a Si mold. The mold surface was demolded by OPTOOL DSX by dip coating.

The uneven pattern was formed in a 10 mm square region of the center portion of the Si substrate. The concavo-convex pattern is a line and gap pattern having a length of 10 mm, a width of 50 nm, a pitch of 100 nm, and a depth of 100 nm.

(transferred substrate)

The substrate was a quartz substrate of 152 mm square and 6.35 mm thick. First, a land portion of 10 mm square and 30 μm in height was formed by wet etching in the transfer region of the center portion of the substrate. Then, a decane coupling agent excellent in adhesion to a resist Namely, KBM-5103 (manufactured by Shin-Etsu Chemical Co., Ltd.), the surface of the quartz substrate was subjected to surface treatment. Specifically, KBM-5103 was diluted to 1% by mass by PGMEA (propylene glycol monomethyl ether acetate) and applied to the surface of the substrate by spin coating. Next, the coated substrate was annealed on a hot plate at 150 ° C for 5 minutes to bond the decane coupling agent to the surface of the substrate.

(film containing metal)

A Cr film having a thickness of 30 nm was formed on the flange portion by a sputtering method to form a film containing a metal. Further, a concave-convex structure of a square lattice pattern in which 1 μm square dots are arranged at a pitch of 2 μm is formed on the Cr film by a usual photolithography technique.

(resist)

A resist containing 48% by mass of Compound A, 48% by mass of ARONIX M220, 3% by mass of IRGACURE 379, and 1% by mass of Compound B was prepared.

(coating step of resist)

DMP-2838 manufactured by FUJIFILM Dimatix Co., Ltd., which is a piezoelectric inkjet printer. The ink jet head uses a dedicated 10 pl head, DMC-11610. The ejection conditions were adjusted in advance so that the amount of droplets was 10 pl. The droplet arrangement pattern was set to a zigzag lattice in which the droplet interval was set to 400 μm, and droplets were placed on the entire surface of the transfer region on the land portion in accordance with the droplet arrangement pattern. Further, the characters shown in Fig. 2 are drawn by the dot arrangement on the flange portion.

(nano imprint method)

The master mold is brought close to the quartz substrate until the gap is at a position of 0.1 mm or less, and these alignments are performed.

Next, the space between the master mold and the quartz substrate was replaced by 99% by volume or more of He gas, and the pressure was reduced to 20 kPa or less after He replacement. The master mold was brought into contact with a droplet containing a resist under reduced pressure He conditions.

After the contact, the pressure was applied for 5 seconds by a pressing pressure of 1 MPa, and the exposure was performed by exposing the ultraviolet light having a wavelength of 360 nm to an exposure amount of 300 mJ/cm ² to cure the resist.

The outer periphery of the quartz substrate and the master is mechanically held, and the quartz substrate or the master is relatively moved in a direction opposite to the pressing, whereby the master is peeled off from the resist.

(Evaluation results)

The auxiliary mark obtained in the above examples was examined by a microscope. It was confirmed that the character can be easily discriminated at a magnification of 10 times.

1‧‧‧Mold

2‧‧‧Boss

2s, 3s‧‧‧ upper surface

3‧‧‧Flange

21‧‧‧ concave pattern

31‧‧‧ text

32‧‧‧ barcode

33‧‧‧ symbol

H‧‧‧height

Claims (12)

A method for producing a mold for manufacturing a mold having a fine concavo-convex pattern and an auxiliary mark on a surface thereof, the method for manufacturing the mold characterized by using a substrate to be transferred having a boss structure including a boss portion and a flange portion a plurality of droplets containing a curable resin are placed on the boss portion by a droplet discharge method, and a plurality of droplets containing a curable resin are disposed on the flange portion as follows. The height of each of the plurality of droplets on the flange portion is lower than the height of the boss portion, and the plurality of droplets disposed on the flange portion indicate the auxiliary mark; and the concave-convex pattern of the original mold is pressed against The curable resin on the boss portion is cured in a state in which the plurality of droplets are placed on the boss portion, and the curable resin on the flange portion is cured; The curable resin is used as a mask to etch the substrate to be transferred. The method of manufacturing a mold according to claim 1, wherein a contact area between the droplet of each droplet of the droplet disposed on the flange portion and the flange portion is larger than that disposed on the boss portion The arrangement of the plurality of droplets described above is performed in such a manner that the droplets of the droplets of each drop are in contact with the land portion. The method for producing a mold according to the first aspect of the invention, wherein the contact surface of the liquid droplet and the flange portion together with the liquid droplet is 50 μm to 500 μm so as to be on the flange portion. The configuration of the above multiple droplets. The system for manufacturing a mold according to any one of claims 1 to 3 In the method of disposing the plurality of droplets so that the amount of droplets of each droplet disposed on the flange portion is larger than the amount of droplets of each droplet disposed on the boss portion . The method for producing a mold according to any one of claims 1 to 3, wherein, as the substrate to be transferred, the wettability of the surface of the flange portion is greater than that of the surface of the boss portion. Sexual substrate. The method for producing a mold according to claim 5, wherein the method of performing ultraviolet ozone treatment only on the flange portion or a method of forming a film having high affinity with the curable resin is used to increase the above-mentioned method. Wettability of the flange portion. The method for producing a mold according to any one of the preceding claims, wherein the height of the liquid droplets disposed on the flange portion is greater than the height of the liquid droplets disposed on the boss portion. In the manner of performing the above-described configuration of a plurality of droplets. The method for producing a mold according to any one of the preceding claims, wherein the arrangement of the plurality of droplets on the boss portion and the plurality of the flange portions are simultaneously performed The configuration of the droplets. The method for producing a mold according to any one of the first aspect, wherein the curable resin on the boss portion is removed and the curable resin on the flange portion is removed. The etching is performed in a manner of remaining states. The method for producing a mold according to any one of the first to third aspect, wherein the flange portion of the substrate to be transferred has a film containing a metal on at least a part of a surface of the flange portion. The arrangement of the plurality of droplets on the flange portion is performed on the metal-containing film. The method for producing a mold according to claim 10, wherein the metal-containing film has a fine uneven structure. The method of manufacturing a mold according to claim 10, wherein the boss portion of the substrate to be transferred has the metal-containing film on a surface of the boss portion, and after the etching, the curable resin is used. Or the metal-containing film is used as a mask to etch the substrate to be transferred so that the metal-containing film of the land portion is removed and the metal-containing film of the flange portion remains. .