TWI571888B - Connection lines for semiconductor devices - Google Patents

Connection lines for semiconductor devices Download PDF

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Publication number
TWI571888B
TWI571888B TW104130999A TW104130999A TWI571888B TW I571888 B TWI571888 B TW I571888B TW 104130999 A TW104130999 A TW 104130999A TW 104130999 A TW104130999 A TW 104130999A TW I571888 B TWI571888 B TW I571888B
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TW
Taiwan
Prior art keywords
bonding wire
concentration
bonding
mass
alloy
Prior art date
Application number
TW104130999A
Other languages
English (en)
Chinese (zh)
Other versions
TW201707009A (zh
Inventor
Daizo Oda
Motoki Eto
Kazuyuki Saito
Teruo Haibara
Ryo Oishi
Takashi Yamada
Tomohiro Uno
Original Assignee
Nippon Micrometal Corp
Nippon Steel & Sumikin Materials Co Ltd
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Filing date
Publication date
Application filed by Nippon Micrometal Corp, Nippon Steel & Sumikin Materials Co Ltd filed Critical Nippon Micrometal Corp
Publication of TW201707009A publication Critical patent/TW201707009A/zh
Application granted granted Critical
Publication of TWI571888B publication Critical patent/TWI571888B/zh

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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/04—Alloys based on a platinum group metal
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
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    • H01L2924/156—Material
    • H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
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MY162048A (en) 2015-06-15 2017-05-31 Nippon Micrometal Corp Bonding wire for semiconductor device
EP3136435B1 (en) 2015-07-23 2022-08-31 Nippon Micrometal Corporation Bonding wire for semiconductor device
MY162884A (en) * 2015-08-12 2017-07-20 Nippon Micrometal Corp Bonding wire for semiconductor device
JP6452661B2 (ja) * 2016-11-11 2019-01-16 日鉄マイクロメタル株式会社 半導体装置用ボンディングワイヤ
JP6371932B1 (ja) * 2017-02-22 2018-08-08 新日鉄住金マテリアルズ株式会社 半導体装置用ボンディングワイヤ
WO2018155283A1 (ja) * 2017-02-22 2018-08-30 新日鉄住金マテリアルズ株式会社 半導体装置用ボンディングワイヤ
EP3667710B1 (en) * 2017-08-09 2022-01-05 NIPPON STEEL Chemical & Material Co., Ltd. Cu ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE
CN110998814B (zh) 2017-08-09 2021-04-23 日铁化学材料株式会社 半导体装置用Cu合金接合线
JP7036838B2 (ja) * 2017-12-28 2022-03-15 日鉄マイクロメタル株式会社 半導体装置用ボンディングワイヤ
JP2021098886A (ja) * 2019-12-20 2021-07-01 Ｊｘ金属株式会社 積層造形用金属粉末及び該金属粉末を用いて作製した積層造形物

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TW201140718A (en) * 2010-02-03 2011-11-16 Nippon Steel Materials Co Ltd Copper bonding wire for semiconductor, and bonding structure of the copper bonding wire

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