TWI451942B - 具實質平坦顆粒尖端之超研磨工具及其相關方法 - Google Patents

具實質平坦顆粒尖端之超研磨工具及其相關方法 Download PDF

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TWI451942B
TWI451942B TW100133909A TW100133909A TWI451942B TW I451942 B TWI451942 B TW I451942B TW 100133909 A TW100133909 A TW 100133909A TW 100133909 A TW100133909 A TW 100133909A TW I451942 B TWI451942 B TW I451942B
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single layer
diamond particles
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metal support
diamond
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TW201223704A (en
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Chien-Min Sung
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Ritedia Corp
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0072—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using adhesives for bonding abrasive particles or grinding elements to a support, e.g. by gluing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3732—Diamonds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Carbon And Carbon Compounds (AREA)

Description

具實質平坦顆粒尖端之超研磨工具及其相關方法
本發明係關於一種超研磨工具及其製造及使用方法。
目前半導體產業每年花費超過10億美金製造需呈現相當平整且平滑表面之矽晶片。用於製造平滑及平面化(even-surfaced)矽晶片之習知技術已是相當多樣化。最普遍相關的習知方法係為化學機械研磨(CMP)，其包括結合一研磨漿料及一研磨墊的利用。在各種化學機械研磨方法中，最主要的關鍵是能夠在許多方面表現出高效能水準，如拋光後晶片的一致性、積體電路的平滑度、生產中的移除速率、用於CMP消耗壽命之經濟性等。
本發明係關於一種超研磨工具及其製造及使用方法。在本發明之一態樣中，例如，提供一化學機械研磨墊修整器。此修整器包括：一第一單層鑽石顆粒，係設置及耦合於一金屬支撐層之一側；以及一第二單層鑽石顆粒，係設置及耦合於該金屬支撐層之該第一單層之相對一側。該第二單層鑽石顆粒係位在與該第一單層鑽石顆粒具有實質上相同分佈之位置。在另一態樣中，該第二單層鑽石顆粒係位在與該第一單層鑽石顆粒具有相同分佈之位置。在再一 態樣中，提供一剛性支撐體，可耦合於相對該第一單層之該第二單層鑽石顆粒。
可利用各種材料作為第一單層及/或第二單層鑽石顆粒，並且任何習知的鑽石顆粒材料亦可包含在本發明範疇內。鑽石顆粒材料可包括，如，鑽石材料、氮化物材料、陶瓷、及其類似物，或其組合，但不限於此。在一具體態樣中，此鑽石顆粒包括一鑽石材料。在另一具體態樣中，此鑽石顆粒包括一立方氮化硼材料。
本發明另外提供一種化學機械研磨墊修整器之製作方法，在一態樣中，一種化學機械研磨墊修整器之製作方法可包括：設置一第一單層鑽石顆粒於一金屬支撐層之一側；以及，設置一第二單層鑽石顆粒於該金屬支撐層之相對該第一單層之一側；其中，該第二單層鑽石顆粒係位在與該第一單層鑽石顆粒實質上相同分佈之位置。此製作方法更包括接合該第一單層鑽石顆粒及該第二單層鑽石顆粒於該金屬支撐層上，使在第一單層及第二單層間之對稱作用力實質上為相似的分佈，以防止金屬支撐層實質上變形。
可利用各種設想得到的技術，將此第一單層及/或第二單層鑽石顆粒耦合於金屬支撐層上。應瞭解的是，用於耦合鑽石顆粒至支撐層上之任何技術亦包含在本發明之範疇內。此技術可包括，如硬焊(brazing)、施壓加熱(pressurized heating)、燒結(sintering)、電鍍(electroplating)、聚合物接合(polymeric binding)、及其類似方法，或其組合，但不限於此。在一具體態樣中，至少一第一單層鑽石顆粒或第二 單層鑽石顆粒係利用一硬焊合金耦合於金屬支撐層。在另一具體態樣中，第一單層鑽石顆粒及第二單層鑽石顆粒兩者皆利用一硬焊合金耦合於金屬支撐層。在另一態樣中，至少一第一單層或第二單層係在加熱及加壓下接合。在再一態樣中，至少一第一單層或第二單層直接地加熱及加壓以接合於金屬支撐層。在又一態樣中，至少一第一單層或第二單層之接合更包括設置一燒結化合物(sintering compound)於金屬支撐層上，並與至少一第一單層或第二單層接觸，並燒結此燒結複合物，以接合至少一第一單層或第二單層於金屬支撐層。在此方法之一具體態樣中，亦可包括在接合過程中，以一硬焊材料熔滲入燒結化合物中。
在一態樣中，本發明之方法可更包括耦合該第二單層鑽石顆粒於一剛性支撐體。可利用各種設想得到的技術，將剛性支撐體耦合於第二單層，且任何習知技術亦包含在本發明之範疇內。此技術之態樣可包括，如熱壓(hot pressing)、硬焊(brazing)、燒結(sintering)、焊接(soldering)、電鍍(electroplating)、聚合物接合(polymeric binding)、及其組合，但不限於此。在一具體態樣中，將第二單層鑽石顆粒耦合於該剛性支撐體，係藉由聚合物接合完成。
本發明再提供一種減少化學機械研磨墊修整器在製造過程中變形之方法。在一態樣中，此方法可包括在複數個鑽石顆粒接合期間，該金屬支撐層之相對側含有實質上相等之變形作用力，其中，由於該相對側之作用力相等，使金屬支撐層在接合期間的變形減少。在一具體的態樣中， 實質上相等作用力的方式，其包括排列複數個鑽石顆粒於金屬支撐層之相對側，俾使複數個鑽石顆粒在支撐層之每一側具有實質上相同的分佈，使接合期間具有實質上相同之變形作用力。
以上係廣泛地概述本發明之各種特徵，而以下係更詳細描述使更能了解本發明，而更可理解本發明相對於習知技術之優越處。本發明之其他特徵將由本發明的詳細描述及所附的申請專利範圍變得更清晰，或可透過本發明之實施而學習。
應瞭解的是，本發明之圖示僅為解說目的之用，以更進一步了解本發明。再者，以上圖例未按比例繪製，因此尺寸、顆粒大小、及其他態樣可擴大至使圖示清晰呈現。因此，為了製造本發明之散熱片，可根據圖例所示之特定尺寸及態樣變化得之。
在詳細解釋本發明前，應了解本發明不限於在此所揭示之該特定結構、方法步驟、或材料，而可擴大延伸至其相等物，如該些具有通常相關習知技術者可推之。並且，應了解在此所用之術語僅用於描述特定實施例，而非限制本發明。
須注意的是，本發明之說明書及所附申請專利範圍中，單數形式的「一(a、an)」及「該(the)」包括複數個所指示對象，除非文中另有特別指示。因此，例如關於「一 鑽石顆粒」，其包括一個或多個此顆粒；以及關於「該層」，其包括一層或多層。
定義
在本發明之描述及申請專利範圍中，使用根據如下文所定義之專門用語。
在本文中，「修整器(conditioner)」及「修整器(dresser)」可互相交替使用，且意指用於修整或研磨一墊的工具。例如一化學機械研磨墊。
在本文中，「超研磨料(superabrasive)」用作為意指任何結晶或多晶材料、或具有莫氏硬度(Mohr’s hardness)為8或以上之混合材料。在一些態樣中，一材料可為莫氏硬度約為9.5或以上。此類材料包括，如鑽石(diamond)、多晶鑽石(polycrystalline diamond(PCD))、立方氮化硼(cubic boron nitride(cBN))、多晶立方氮化硼(polycrystalline cubic boron nitride(PcBN))、剛玉(corundum)及藍寶石(sapphire)，以及所屬技術領域中具有通常知識者已知之其他超研磨材料，但不限於此。超研磨材料可包含本發明中各種形式的態樣，其包括顆粒(particles)、砂礫(grits)、薄膜(films)、層狀物(layers)、片狀物(pieces)、片段(segments)等。
在本文中，「顆粒」意指一材料之顆粒形式。此顆粒可為各種形狀，其包括圓形、橢圓形、正方形、自形(euhedral)等，且可為單晶或多晶，並可具有各種篩孔尺寸。本技術領域中所習知之「篩孔(mesh)」意指每單位面積所具有的孔洞數目，如美國篩孔(U.S.meshes)為例。本文中所有篩孔 大小意指美國篩孔(U.S.meshes)，除非有另行註解，皆指美國篩孔大小。再者，由於具有某「篩孔大小」之顆粒實際上係具有一小的尺寸分布範圍，因此篩孔大小係指所收集得到的顆粒的平均篩孔尺寸。
在本文中，「硬焊(brazing)」之過程意指在鑽石顆粒/材料及硬焊材料的原子間形成化學鍵結。再者，「化學鍵結」意指一共價鍵結，如碳化物或硼化物鍵結，而不是機械力或較弱的原子間吸引力。因此，當以「硬焊」連接鑽石顆粒時，會形成真正的化學鍵結。然而，當一般關於金屬及金屬接和之「硬焊」，在傳統認知上此詞意指形成一冶金鍵結。因此，「硬焊」鑽石顆粒片段至此工具主體上，不需要一碳化物形成物(carbide former)的存在。
在本文中，「燒結(sintering)」意指連接兩個或以上單獨顆粒形成一連續的固態塊體(solid mass)。燒結過程包含有顆粒的凝固，以消除至少部分顆粒間的空隙。一般利用超高壓及存在碳溶劑作為鑽石燒結助劑，以促進鑽石顆粒燒結。
「金屬的(metallic)」一詞意指金屬及類金屬(metalloid)。金屬係包括一般認知為金屬(發現自過度金屬、鹼金屬、及鹼土金屬在內)的化合物。舉例而言，金屬可為銀(Ag)、金(Au)、銅(Cu)、鋁(Al)及鐵(Fe)。類金屬具體包括矽(Si)、硼(B)、鍺Ge、銻(Sb)、砷(As)及碲(Te)。金屬材料亦包括合金或混合物，其混合物包括金屬材料。此合金或混合物可更包括額外的添加物。在本發明中，可 包括以碳化物形成物(carbide former)及碳濕潤劑(carbon wetting agent)作為合金或混合物，但預期不會是唯一的金屬組成。碳化物形成元素可為如鈧(Sc)、釔(Y)、鈦(Ti)、鋯(Zr)、鉿(Hf)、釩(V)、鈮(Nb)、鉻(Cr)、鉬(Mo)、錳(Mn)、鉭(Ta)、鎢(W)及鎝(Tc)。碳濕潤劑可為如鈷(Co)、鎳(Ni)、錳(Mn)及鉻(Cr)。
在本文中，「熔滲(infiltrating)」意指當一材料加熱至其熔點，接著其液態流動經過顆粒間的間隙空洞。
在本文中，「實質上(substantially)」一詞意指一動作、特徵、特性、狀態、結構、項目、或結果具有完全的或接近完全的範圍或程度。舉例而言，一「實質上」封閉的物體意指該物體不是完全地封閉就是接近完全地封閉。相較於絕對的完整，其確切可接受之誤差程度可視文中具體情況而定。然而，一般談到接近完成可視為如同絕對及完全得到具有相同的整體結果。
「實質上(substantially)」一詞可同樣地應用於一負面含意，其意指一動作、特徵、特性、狀態、結構、項目、或結果為完全的或接近完全的缺乏。舉例而言，一組成物「實質上沒有」顆粒意指該組成物不是完全地缺乏顆粒，就是接近完全地缺乏顆粒，其影響如同完全地缺乏顆粒一樣。換句話說，一「實質上沒有」一成分或元素之組成物，只要不具有重要的影響，實際上可仍包含此項目(指該成分或元素)。
在本文中，「約(about)」一詞意指提供一數值範圍端點的彈性空間，即一給定值可以「稍微高於」或「稍微低於」此數值端點。
如本文中，複數個項目、結構元件、組成元件及/或材料可為了方便以一般的列舉呈現。然而，這些清單應被解釋為所述清單的每一列舉元件可為單獨且獨特的元件。因此，基於一般呈現而未有相對之其他描述的群組內，此列舉的單獨元件不需要單獨地被解釋為事實上相等於其他相同列舉出的元件。
在本文中，濃度、總量及其他數值資料可以一範圍形式表達或呈現。應瞭解的是此範圍形式僅為方便及簡化描述，因此應更具彈性的解釋此範圍，其不僅包含明確列舉為範圍界限的數值，且包括所述範圍內包含的所有單獨數值或子範圍，如同各數值和子範圍被明確列舉一樣。舉例而言，一數值範圍為「約1至約5」應解釋為不僅包括大約1至約5的明確列舉的值，更包括在指出的範圍內的單獨值及子範圍。因此，其在該數值範圍內包括如2、3、及4的單獨值及如自1至3、自2至4、及自3至5等的子範圍，以及分別為1、2、3、4及5。此相同的原則適用於一範圍，其僅指出一數值為一最小值或一最大值。此外，不論是範圍之幅度或特性，此解釋應適用於。
本發明
本發明係提供一種超研磨工具及其製造及使用方法。在一態樣中，此超研磨工具可包括化學機械研磨墊修整 器，其用於修整(即平滑化、研磨、修整)一化學機械研磨墊。根據本發明之態樣中的化學機械研磨墊修整器可善用在，例如修整一化學機械研磨墊，該化學機械研磨墊係用於拋光、加工或其他方式以處理半導體材料。此修整器可利用包含實質平坦尖端之鑽石顆粒而製成。傳統化學機械研磨墊修整器的製造方法，甚至許多是描述關於在固定前將鑽石顆粒尖端平坦化的技術，一般是包含在整個修整器表面上尖端高度的顯著變化。通常，將鑽石顆粒固定在化學機械研磨墊修整器支撐體之方法，會破壞各種原已完成之平坦化。例如，利用高溫及/或高壓之固定技術後，而當修整器冷卻時會造成修整器之支撐體變形。因此，除非步驟有採取避免變形，否則該鑽石顆粒無法在後續修整器冷卻過程中維持在其平坦狀態。此問題將特別攸關於硬焊技術。
此外，減少金屬支撐層的扭曲，可維持此加工工具中的鑽石顆粒尖端處在較佳的平坦程度。當利用加熱及/或施壓以製造一超研磨工具時，金屬支撐層的變形會造成尖端水平高度具有極大的變化，甚至是對於那些在加熱及/或施壓之前已平坦化的顆粒。透過鑽石顆粒的排列，在該金屬支持層的兩側上分佈有相等或實質上相等之變形作用力，依此作用力可有效地去除彼此在金屬支持層中產生之變形程度，因此可減少鑽石顆粒彼此之間相對高度的變動。
本發明之化學機械研磨墊修整器包括一含有實質平坦尖端之鑽石顆粒層，其分佈在此加工化學機械研磨墊修整器的工作面上。相較於傳統的修整器，一具有此實質平坦 尖端之排列的化學機械研磨墊修整器，由於具有更均勻的突出分佈，使該鑽石顆粒不太會將基體層拉出，進而可具有低刮傷率。另外，此修整器之更均勻的突出分佈可修整化學機械研磨墊，進而不僅能促進良好的研磨速率，同時可延長此修整器的有效工作壽命。在化學機械研磨墊中，上述之優點會受到如一致的粗糙間隙及尺寸分佈而影響。
在本發明之一態樣中，超研磨尖端的平坦化可藉以變形影響最小之方式製造化學機械研磨墊修整器而達成。例如，一化學機械研磨墊修整器之一態樣，可由至少一個二階段程序製得，其中，第一階段為減少在過程中平坦化尖端的擾亂之方法，且通常會明顯地將鑽石顆粒由一平坦化排列中移除，如，硬焊程序。而第二階段程序可進一步提升分佈在化學機械研磨墊修整器之鑽石顆粒尖端的平坦化。
具有實質平坦尖端之化學機械研磨墊修整器的各種具體結構都可被考慮。在一態樣中，例如，一化學機械研磨墊修整器可包括：一第一單層鑽石顆粒，係設置及耦合於一金屬支撐層之一側；以及一第二單層鑽石顆粒，係設置及耦合於金屬支撐層之該第一單層之相對一側。第二單層鑽石顆粒係位在與該第一單層鑽石顆粒具有實質相同分佈之位置。在一態樣中，一剛性支撐體係耦合於相對第一單層之第二單層鑽石顆粒，以提供支撐體作為修整器。一單一鑽石顆粒層設置於金屬支撐層的每一側，可減輕在一高溫製程(如，硬焊)中之熱收縮，否則會使在其中一側之 鑽石分佈變形。藉由將一超研磨層設置於金屬支撐層的每一側，在兩側上的變形作用力，如熱運動及壓力，可以為相等或實質上相等。據此，該金屬或支撐層之變形可被最小化。換而言之，造成變形之作用力為實質上相等地作用於金屬支撐層的每一側，進而減少其發生變形。
在一態樣中，如圖1所示，例如，將一第一單層鑽石顆粒12排列於一金屬支撐層14的一表面上。而將一第二單層鑽石顆粒16排列於相對第一單層之一側。以下將更進一步的討論，在一些情況下，將第一及第二單層鑽石顆粒排列，並使透過金屬支撐層對應的鑽石顆粒實質上對齊(如圖一所示)。在其他情況下，第一及第二單層鑽石顆粒具有實質上相似分佈之排列，但可透過金屬支撐層實質上彼此對齊，或彼此不對齊。
用於鑽石顆粒之各種材料都可被考慮。用於一化學機械研磨墊修整器之任何習知的超研磨粒，應包含在本發明的範疇內。鑽石顆粒材料的例子可包括如，鑽石材料、氮化物材料、陶瓷、及其類似物，但不限於此。在一態樣中，鑽石顆粒包括鑽石材料，該鑽石材料可包括天然或合成鑽石、單晶、多晶、及其類似物。在另一態樣中，該鑽石顆粒可包括立方氮化硼。另外，可使用各種大小之鑽石顆粒，包括篩孔大小如10/20、30/40、80/90、90/100、100/120、120/140、140/170、170/200、200/230、230/270、270/325、及325/400。
金屬支撐層可為任何在製造超研磨工具時能夠支撐單層鑽石之材料。金屬支撐層的材料可包括：金屬材料、金屬合金材料、硬焊合金材料、陶瓷材料、複合材料、及其類似物，或其組合，但不限於此。值得被注意的是金屬支撐層可以為各種形態。在一態樣中，例如，金屬支撐層可為固體金屬，如金屬板(metal plate)或金屬薄片(metal foil)。在另一態樣中，金屬支撐層可為壓製粉末(pressed powder)，例如，將金屬粉末可放置一模具內，並冷壓以形成一金屬支撐層。
另外，金屬支撐層可為任何能夠支持鑽石顆粒之厚度。例如，在一態樣中，金屬支撐層之厚度可為大於約10毫米。在另一態樣中，金屬支撐層之厚度可為約2毫米至約10毫米。在再一態樣中，金屬支撐層之厚度可為約1微米至約200微米。在又一態樣中，金屬支撐層之厚度可為約1微米至約100微米。在更一態樣中，金屬支撐層之厚度可為約100微米至約3毫米。在再又一態樣中，金屬支撐層之厚度可為約500微米至約2毫米。
在一些態樣中，不論是單面或雙面的鑽石顆粒可排列成一預定圖案。上述之圖案可為均勻分佈圖案或非均勻分佈圖案。此外，便於鑽石顆粒排列成預定圖案之各種技術都可被考慮。「預定」應理解為意指非隨意圖案，而是在排列鑽石顆粒前就已經預期的圖案。在一態樣中，預定圖案亦可適用於顆粒間的預定間距，該技術可包括：利用一模板排列；利用點黏排列；排列一圖案於一第一基板，隨 後將特定圖案由第一基板轉移至金屬支撐層；及其類似方式，或包括其組合，但不限於此。可利用各種技術將任一單層的鑽石顆粒暫時握持在預定圖案的位置上，其技術包括：黏著劑、在金屬支撐基體上設凹穴位置、支撐化合物(supporting compound)(如，蠟)、及其類似方式，或包括其組合，但不限於此。在一具體態樣中，利用黏著劑將鑽石顆粒暫時接著於金屬支撐層，接著在修整器的製造過程中揮發並移除。
將一單層之鑽石顆粒層設置於金屬支撐層的每一側，因此可調節硬焊溫度產生的熱收縮，否則排列在其中一面之鑽石顆粒的分佈會變形。藉由將一單層鋪設於金屬支撐層的每一側，在兩側面的變形作用力，如熱運動及壓力，可以為相等或實質上相等。據此，該金屬支撐層之變形可被最小化。換而言之，造成變形之作用力為實質上相等地作用於金屬支撐層的每一側，可因此至少部分地相互抵銷，進而減少變形的發生。在一些態樣中，在金屬支撐層每一側的鑽石顆粒可具有彼此相配的構形、圖案、或方向性。依照此方式，金屬支撐層每一側的鑽石顆粒可具有實質上相配的間隙排列。在另一態樣中，構形、圖案、或方向性可以彼此不相同或多變的(varied)，或為部分相配。在再一態樣中，金屬支撐層之一側的鑽石顆粒之圖案配置可實質上對齊金屬支撐層之另一側的鑽石顆粒之圖案配置，俾使顆粒位置彼此相配。在一些態樣中，在金屬支撐層一側的鑽石顆粒之空間定位與金屬支撐層另一側的鑽石 顆粒之空間定位間可直接相對應。在另一態樣中，鑽石顆粒的圖案可彼此相配或實質上相配，但在金屬支撐層之相對側可能具有偏差，使顆粒位置彼此不相配。
在另一態樣中，如圖2所示，將一第一單層鑽石顆粒22排列於一金屬支撐層24的一表面上。而將一第二單層鑽石顆粒26排列於相對第一單層之一側。以一接合材料28將第一單層及第二單層穩固於金屬支撐層24，該接合材料可以為任何能夠穩固第一及第二單層於金屬支撐層之材料。在一些態樣中，用於穩固第一單層及第二單層之接合材料可為相同，同時在其他態樣中，用於穩固第一單層及第二單層之接合材料可為不相同。接合材料可為任何能夠穩固鑽石顆粒於其中之材料。接合材料可包括：如金屬焊料、金屬焊料合金、有機基質材料、燒結材料、電鍍材料、及其類似物，或包括其組合，但不限於此。
在一態樣中，例如，鑽石顆粒可硬焊於金屬支撐層，因此接合材料可為金屬焊料或金屬焊料合金。金屬硬焊技術為本技術領域中具有通常知識者所習知的技術。一綠色硬焊材料可應用於金屬支撐層之上或鑽石顆粒之周圍。金屬焊料可適用於任何習知的結構，包括焊片、粉末、膏狀物、噴霧狀物、及其類似物，或包括其組合。一旦鋪設於金屬支撐層，焊料可被加熱並熔融塗佈於金屬支撐層的至少一部分，進而接合鑽石顆粒。加熱溫度可視所使用的硬焊材料而變化，然而在一態樣中，加熱溫度可為約700℃至約1200℃。為了減少變形，在第一及第二單層的鑽石顆 粒係如此排列，使得在加熱及冷卻過程中，施加於金屬支撐層的熱作用力(thermal force)為實質上相等。
在一非限定實施例中，可藉由以一鎳基合金硬焊，將鑽石顆粒接合於金屬支撐層，其中，鎳基合金可包含鉻或不包含鉻。在另一實施例中，為了將鑽石顆粒尖端平坦化，在硬焊可包括以一平坦陶瓷材料擠壓鑽石顆粒，且該平坦陶瓷材料不會與焊料接合。可利用各種焊接合金，如，BNi2、BNi7、及其類似物，但不限於此。
此外，在一態樣中，至少一第一及第二單層鑽石顆粒可藉由電沉積方式耦合於金屬支撐層，因此接合材料可以為一電沉積金屬材料。在一態樣中，一單層之鑽石顆粒可沉積於金屬支撐層，接著置於一包含金屬離子之離子溶液中。導入一電流於上述的離子溶液，俾使一金屬層可被電鍍在金屬支撐層，用以穩固鑽石顆粒。因此藉由上述方式，可將鑽石顆粒耦合於金屬支撐層。在電沉積程序之前及期間，一個用於定位及保持超研磨材料之適當方式，可例如使用一個包括絕緣材料之模具，其中，該絕緣材料可有效地防止電沉積材料在成型表面(molding surface)的聚集。鑽石顆粒可因此在電沉積過程中握持在模具的成型表面。據此，可防止在顆粒尖端及研磨墊修整器基板的工作表面上產生電沉積材料的聚集。上述的技術已揭示美國專利申請號11/292,938，申請日為2005年12月2日，於此納入本發明以供參考。
在另一態樣中，鑽石顆粒可藉由燒結方式接合於金屬支撐層，因此接合材料可包括一燒結材料。舉例而言，將鑽石顆粒接合於金屬支撐層可包括設置一燒結化合物於金屬支撐層，並與至少一個第一單層或第二單層接觸，並燒結該燒結化合物，以接合鑽石顆粒於金屬支撐層。適用之燒結方法可藉由本發明所屬領域之通常技藝而輕易地被理解。基本上，燒結化合物可塗佈在鑽石顆粒周圍，並與金屬支撐層接觸。該燒結化合物可為任何習知之燒結材料，其用於穩固鑽石顆粒於基材。燒結材料可包括：金屬及金屬合金粉末、陶瓷粉末、及其類似物，但不限於此。燒結化合物之具體例子係為鈷粉末，並不限於此。當燒結化合物塗佈於鑽石顆粒周圍及金屬支撐基材，接著加熱且在一些情況下可提供壓力，以進行燒結。在一些態樣中，在接合過程中，可將焊料或焊料合金熔滲入該燒結化合物，進而強化對材料基質之接合。
在另一態樣中，如圖3所示，加熱及加壓可應用於將第一單層鑽石顆粒32及/或第二單層鑽石顆粒36直接接合於該金屬支撐層34。因此，在其上面加熱及加壓後，該金屬支撐層34會軟化或部分熔融。接著，將一個或多個單層中的鑽石顆粒被擠壓入金屬支撐層。當將鑽石顆粒被擠壓入金屬支撐層時，可利用一平坦化之平坦表面施加壓力於單層上，以維持鑽石顆粒尖端的平坦性質。冷卻後，金屬支撐層任一側的鑽石顆粒分佈，其作用於金屬支撐層的熱作用力至少部分相等，並進而減少變形。此外，用於製造 此裝置之溫度及壓力可根據所用的材料及設備而變化。在一態樣中，例如，加熱溫度係為約700℃至1000℃。在另一態樣中，施加的壓力係為約10MPa至約50Mpa。
在再一態樣中，如圖4所示，一化學機械研磨墊修整器可包括一第一單層鑽石顆粒42及一第二單層鑽石顆粒46耦合於金屬支撐層44。鑽石顆粒可直接地耦合於金屬支撐層或藉由接合材料耦合於金屬支撐層。第二單層鑽石顆粒46係耦合於一剛性支撐體48。在圖4中，移除剛性支撐體48的一部分，以露出第二單層。剛性支撐體48可便於化學機械研磨墊修整器的操作及使用。藉由接合第二單層鑽石顆粒於剛性支撐體上，使第一單層鑽石顆粒在化學機械研磨墊的操作狀態時仍可維持露出。
剛性支撐體可由任何適用於研磨或修整程序之材料。其此材料可包括高分子材料、金屬材料、陶瓷材料、玻璃、複合材料、及其類似物。在一態樣中，剛性支撐體可為高分子材料，並可利用加熱、擠壓、黏著劑等方式將第二單層鑽石顆粒嵌入剛性支撐體中。在一些態樣中，剛性支撐體可為非高分子材料，如金屬材料。在上述情況下，可藉由黏著劑黏附、焊錫、硬焊、電鍍、及其類似方式，以將鑽石顆粒接合於剛性支撐體。關於硬焊技術，在加熱及冷卻過程中須注意減少或排除金屬支撐層的變形。在另一態樣中，可設置一個或多個磁性元件於剛性支撐體中，以吸引或固定化學機械研磨墊修整器於適當的位置，因此形成暫時性的附著。在使用的期間，可利用一選擇性鎖定 機制進一步固定化學機械研磨墊修整器於剛性支撐體。在一些態樣中，剛性支撐體可包括表面形態，使其著對化學機械研磨墊的旋轉運動期間，可保持修整器於適當的位置。剛性支撐體可具有與金屬支撐層大致相同的直徑、大於金屬支撐層的直徑、或一些情況下具有小於金屬支撐層的直徑。
各種高分子材料可被考慮作為剛性支撐體，適用的材料包括：胺基樹脂(amino resins)、丙烯酸酯樹脂(acrylate resins)、醇酸樹脂(alkyd resins)、聚酯樹脂(polyester resins)、聚醯胺樹脂(polyamide resins)、聚醯亞胺樹脂(polyimide resins)、聚胺基甲酸酯樹脂(polyurethane resins)、酚醛樹脂(phenolic resins)、酚醛/乳膠樹脂(phenolic/latex resins)、環氧樹脂(epoxy resins)、異氰酸酯樹脂(isocyanate resins)、異三聚氰酸樹脂(isocyanurate resins)、聚矽氧烷樹脂(polysiloxane resins)、反應性乙烯基樹脂(reactive vinyl resins)、聚乙烯樹脂(polyethylene resins)、聚丙烯樹脂(polypropylene resins)、聚苯乙烯樹脂(polystyrene resins)、苯氧基樹脂(phenoxy resins)、苝樹脂(perylene resins)、聚碸樹脂(polysulfone resins)、丙烯腈-丁二烯-苯乙烯樹脂(acrylonitrile-butadiene-styrene resins)、丙烯酸樹脂(acrylic resins)、聚碳酸酯樹脂(polycarbonate resins)、聚醯亞胺樹脂(polyimide resins)、及其混合物，但不限於此。在一具體態樣中，高分子材料 可為環氧樹脂。在另一態樣中，高分子材料可為聚醯亞胺樹脂。在再一態樣中，高分子材料可為聚胺基甲酸酯樹脂。
在使用高分子材料時，用於固化高分子材料的方法可以為本技術領域具有通常知識著所熟知的各種方法，可使高分子材料至少自柔軟狀態相轉變成剛性狀態。固化的發生可藉由將高分子材料暴露於熱、電磁輻射(如，紫外光、紅外光、及微波輻射)、顆粒衝擊(如，電子束)、有機催化劑、無機催化劑、或任何其他習知的固化方法，但不限於此。
在本發明之一態樣中，高分子材料可為熱塑性材料，分別藉由冷卻與加熱，可使熱塑性材料呈現可逆性的硬化及軟化。在一態樣中，高分子材料層可為熱固性材料，無法如同熱塑性材料呈現可逆性的硬化及軟化。換而言之，一旦發生固化，此過程基本上是不可逆的。
此外，在一態樣中，可塗佈一耦合劑或有機金屬化合物在超研磨材料的表面，藉由化學鍵以促進鑽石顆粒維持在高分子材料中。本技術領域中具有通常知識者所習知的各種有機及有機金屬化合物都可被利用。有機金屬耦合劑可於超研磨材料及高分子材料間形成化學鍵結，因此增加在第二單層鑽石顆粒與高分子材料間的接合。依照上述方式，有機金屬耦合劑可作一橋樑，以在高分子材料與超研磨材料表面間形成鍵結。在一態樣中，有機耦合劑可為鈦酸鹽(titanate)、鋯酸鹽(zirconate)、矽烷(silane)、或其混合物。有機金屬耦合劑之含量的使用可視耦合劑及超研磨 材料的表面積而定。在一態樣中，有機金屬耦合劑之含量佔高分子材料層之0.05至10重量百分比就足夠。
在本發明之另一態樣中，一種化學機械研磨墊修整器之製作方法可包括：設置一第一單層鑽石顆粒於一金屬支撐層；以及，設置一第二單層鑽石顆粒於該金屬支撐層之相對該第一單層之一側。第二單層鑽石顆粒係位在與該第一單層鑽石顆粒實質上相同分佈之位置。此製作方法可更包括接合第一單層鑽石顆粒及第二單層鑽石顆粒於金屬支撐層上，俾使在第一單層及第二單層間之對稱作用力實質上為相似之分佈，可用以防止金屬支撐層實質上變形。
在再一態樣中，設置至少一第一單層鑽石顆粒或第二單層鑽石顆粒之步驟包括：將複數個鑽石顆粒黏著至黏著轉印片(adhesive transfer sheet)，並藉由一模板(template)的空隙設置一預定圖案，接著，自將模板自黏著轉印片移除，俾使複數個鑽石顆粒以一預定圖案保持黏著於黏著轉印片。之後，將複數個鑽石顆粒隨著黏著轉印片而轉換至金屬支撐層，並將黏著轉印片由複數個鑽石顆粒中移除，進而形成至少一第一單層鑽石顆粒或第二單層鑽石顆粒。
在本發明之又一態樣中，一種減少化學機械研磨墊修整器在製造過程中變形之方法，其包括在接合複數個鑽石顆粒期間在金屬支撐層之相對側含有實質上相等之變形作用力，其中，由於相對兩側之作用力相等，使金屬支撐層在接合期間的變形減少。在一態樣中，實質上相等作用力的方式，其包括排列複數個鑽石顆粒於金屬支撐層之相對 側，俾使複數個鑽石顆粒在支撐層之每一側具有實質上相同的分佈，使接合期間具有實質上相同之變形作用力。
須注意的是，儘管上述揭露主要是指化學機械研磨墊修整器，其它精密研磨(grinding)及/或研磨(abrading)工具亦包含在本發明之範疇內。據此，本文中所揭露之技術及教導可同時應用於類似的工具中。
以下係以各種方式製作本發明之散熱器的實施例。此些實施例僅用於說明，並不會限縮本發明之範圍。
實施例 實施例1
一薄金屬層(如，100微米厚的銅)具有一黏著層(即，3M生產，25微米，易變化(即，易揮發而不會殘留碳))於每一側。將塗佈鈦的鑽石顆粒(如，約50微米)分散於兩側面以在每一側製作出單層鑽石顆粒，並移除多餘的鑽石。將層配置於覆蓋了銅粉末薄層的石墨模具內。再加另一層銅粉末薄層在該層上。然後，將此組件(assembly)在真空或惰性氣體下熱壓(如，900℃，20分鐘)，以形成具有鑽石顆粒突出於兩側的碟盤。因鈦塗層的存在，使銅與鑽石顆粒更穩固地結合。此碟盤的平整度可藉由平坦的模具表面而維持。
實施例2
如同實施例1，除了薄金屬銅層具有硬焊合金層(如，Cu-Sn-Ti或Ag-Cu-Ti)耦合至每一側。未塗佈的鑽石顆粒以 黏著劑設置於硬焊合金層之暴露側。將該組件在真空爐加熱融熔焊料，形成一銅層覆蓋於在兩側之鑽石顆粒。
實施例3
將實施例2之鑽石附著層懸浮在連接至陰極的CuSO4電解質溶液。該陽極係為一銅電極。在將電流通過電解質後，銅會被電鍍在銅層以及鑽石顆粒間的間隙，進而增強鑽石顆粒至銅金屬層之接合。
實施例4
如同實施例2，除了銅層以薄鎳層取代，且硬焊層為Ni-Cr-B-Si(BNi2，如Wall Colmonoy所生產之Nichrobraze LM)，而鑽石顆粒(如，150微米)以網狀圖案排列(如，間距為500微米)。
實施例5
將實施例4所形成之物件，對一平面基板(108毫米直徑，6.5毫米厚度)擠壓，並加熱配置於其間之一熱塑性黏著劑(如，150℃，10分鐘)。結果獲得一工具，如具有平坦表面之化學機械研磨墊修整器。該修整器的每一側之單層可調節由該硬焊溫度(如，1020℃，10分鐘)所產生的熱收縮，其中，該硬焊溫度會造成其中一側的鑽石分佈不對稱。
當然，應瞭解上述配置僅為說明本發明原理的應用。在不偏離本發明精神和範圍情況下，藉由所屬領域之技藝 可設計許多修改和替代配置，且所附申請專利範圍將要包含此等修飾和配置。於是，儘管已使用當前認為是本發明最實際且較佳的實施例來特定且詳細地在上面描述了本發明，但是顯然對所屬領域的一般技藝來說，在不偏離本文所闡明的原理和概念的情況下可進行許多修飾，所述修飾包括尺寸、材料、形狀、形式、功能和操作方式、裝配和用途的變化，但不限於這些。
12,22,32,42‧‧‧第一單層鑽石顆粒
14,24,34,44‧‧‧金屬支撐層
16,26,36,46‧‧‧第二單層鑽石顆粒
28‧‧‧接合材料
48‧‧‧剛性支撐體
圖1係根據本發明之一實施例的化學機械研磨墊修整器之側面示意圖。
圖2係根據本發明之一實施例的化學機械研磨墊修整器之側面示意圖。
圖3係根據本發明之一實施例的化學機械研磨墊修整器之側面示意圖。
圖4係根據本發明之一實施例的化學機械研磨墊修整器之側面示意圖。
12‧‧‧第一單層鑽石顆粒
14‧‧‧金屬支撐層
16‧‧‧第二單層鑽石顆粒

Claims (16)

  1. 一種化學機械研磨墊修整器，包括：一第一單層鑽石顆粒，係設置及耦合於一金屬支撐層之一側；一第二單層鑽石顆粒，係設置及耦合於該金屬支撐層之第一單層之相對側；其中，該第二單層鑽石顆粒係位在與該第一單層鑽石顆粒具有實質相同分佈之位置；以及一剛性支撐體，其耦合於相對該第一單層之該第二單層鑽石顆粒。
  2. 如申請專利範圍第1項所述之修整器，其中，至少一該第一單層鑽石顆粒或該第二單層鑽石顆粒係利用一焊料合金耦合於該金屬支撐層。
  3. 如申請專利範圍第1項所述之修整器，其中，該第一單層鑽石顆粒及該第二單層鑽石顆粒兩者皆係利用一焊料合金耦合於該金屬支撐層。
  4. 如申請專利範圍第1項所述之修整器，其中，該第二單層鑽石顆粒係位在與該第一單層鑽石顆粒具有實質相同分佈之位置。
  5. 一種化學機械研磨墊修整器之製作方法，包括：設置一第一單層鑽石顆粒於一金屬支撐層；設置一第二單層鑽石顆粒於該金屬支撐層之相對該第一單層之一側；其中，該第二單層鑽石顆粒係位在與該第一單層鑽石顆粒實質相同的分佈之位置；以及 接合該第一單層鑽石顆粒及該第二單層鑽石顆粒於該金屬支撐層，使在該第一單層及該第二單層間之對稱作用力為實質相似的分佈，以防止該金屬支撐層實質上變形；其中，至少一該第一單層或該第二單層之接合更包括：設置一燒結化合物於該金屬支撐層上，並與至少一該第一單層或該第二單層接觸；以及燒結該燒結化合物，以接合至少一該第一單層或該第二單層於該金屬支撐層。
  6. 如申請專利範圍第5項所述之製作方法，其中，至少一該第一單層或該第二單層之接合係為利用一焊料合金進行硬焊。
  7. 如申請專利範圍第5項所述之製作方法，其中，至少一該第一單層或該第二單層之接合係在加熱及加壓下進行。
  8. 如申請專利範圍第5項所述之製作方法，其更包括在接合過程中，以一硬焊材料熔滲入該燒結化合物。
  9. 如申請專利範圍第7項所述之製作方法，其中，至少一該第一單層或該第二單層直接地加熱及加壓以結合於該金屬支撐層。
  10. 如申請專利範圍第5項所述之製作方法，其中，該第二單層鑽石顆粒係位在對齊於該第一單層之該鑽石顆粒的位置。
  11. 如申請專利範圍第5項所述之製作方法，更包括耦合該第二單層鑽石顆粒於一剛性支撐體。
  12. 如申請專利範圍第11項所述之製作方法，其中，該第二單層鑽石顆粒耦合於該剛性支撐體，係利用一選自由下述技術完成，如，熱壓、硬焊、燒結、焊錫、電鍍、聚合物接合、及其組合所組成之群組。
  13. 如申請專利範圍第11項所述之製作方法，其中，該第二單層鑽石顆粒耦合於該剛性支撐體，係利用聚合物接合完成。
  14. 一種減少化學機械研磨墊修整器在製造過程中變形之方法，包括：在接合複數個鑽石顆粒於一金屬支撐層期間，在該金屬支撐層之相對側為實質上相等之變形作用力，其中，由於在相對側之為相等的作用力，使接合期間在支撐層的變形減少。
  15. 如申請專利範圍第14項所述之方法，其中，實質上相等作用力的方式，其包括排列複數個鑽石顆粒於該金屬支撐層之相對側，俾使該複數個鑽石顆粒在該支撐層之每一側具有實質相同的分佈，使接合期間具有實質上相等之變形作用力。
  16. 一種化學機械研磨墊修整器，其係使用如申請專利範圍第14至15項所述之方法而製成。
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Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9221154B2 (en) 1997-04-04 2015-12-29 Chien-Min Sung Diamond tools and methods for making the same
US9868100B2 (en) 1997-04-04 2018-01-16 Chien-Min Sung Brazed diamond tools and methods for making the same
US9238207B2 (en) 1997-04-04 2016-01-19 Chien-Min Sung Brazed diamond tools and methods for making the same
US9463552B2 (en) 1997-04-04 2016-10-11 Chien-Min Sung Superbrasvie tools containing uniformly leveled superabrasive particles and associated methods
US9199357B2 (en) 1997-04-04 2015-12-01 Chien-Min Sung Brazed diamond tools and methods for making the same
US9409280B2 (en) 1997-04-04 2016-08-09 Chien-Min Sung Brazed diamond tools and methods for making the same
US8974270B2 (en) * 2011-05-23 2015-03-10 Chien-Min Sung CMP pad dresser having leveled tips and associated methods
US8678878B2 (en) 2009-09-29 2014-03-25 Chien-Min Sung System for evaluating and/or improving performance of a CMP pad dresser
US8622787B2 (en) 2006-11-16 2014-01-07 Chien-Min Sung CMP pad dressers with hybridized abrasive surface and related methods
US9724802B2 (en) 2005-05-16 2017-08-08 Chien-Min Sung CMP pad dressers having leveled tips and associated methods
US9138862B2 (en) * 2011-05-23 2015-09-22 Chien-Min Sung CMP pad dresser having leveled tips and associated methods
US8393934B2 (en) 2006-11-16 2013-03-12 Chien-Min Sung CMP pad dressers with hybridized abrasive surface and related methods
US9011563B2 (en) 2007-12-06 2015-04-21 Chien-Min Sung Methods for orienting superabrasive particles on a surface and associated tools
WO2012040374A2 (en) 2010-09-21 2012-03-29 Ritedia Corporation Superabrasive tools having substantially leveled particle tips and associated methods
JP2013115083A (ja) * 2011-11-25 2013-06-10 Fujitsu Semiconductor Ltd 半導体装置及びその製造方法
TWI466347B (zh) * 2012-07-13 2014-12-21 Nat Univ Chung Hsing A light-emitting element having a high heat dissipation characteristic, and a light-emitting element manufactured by the method
TWI530361B (zh) * 2012-11-07 2016-04-21 中國砂輪企業股份有限公司 化學機械研磨修整器及其製法
TWI568538B (zh) * 2013-03-15 2017-02-01 中國砂輪企業股份有限公司 化學機械硏磨修整器及其製法
CN104726735B (zh) * 2013-12-23 2017-02-08 北京有色金属研究总院 一种具有复合式结构的高定向导热材料及其制备方法
RU2552810C1 (ru) * 2013-12-30 2015-06-10 Федеральное государственное бюджетное учреждение науки Институт физико-технических проблем Севера им. В.П. Ларионова Сибирского отделения Российской академии наук Сплав для соединения монокристалла алмаза с металлами
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US20220157691A1 (en) * 2020-11-18 2022-05-19 Benjamin K. Sharfi Diamond-based thermal cooling devices methods and materials

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5178643A (en) * 1991-05-21 1993-01-12 Sunnen Products Company Process for plating super abrasive materials onto a honing tool
US5832360A (en) * 1997-08-28 1998-11-03 Norton Company Bond for abrasive tool
US5855314A (en) * 1997-03-07 1999-01-05 Norton Company Abrasive tool containing coated superabrasive grain
TW436375B (en) * 1999-11-16 2001-05-28 Asia Ic Mic Process Inc Formation method for dresser of chemical mechanical polishing pad
TWI228066B (en) * 2002-09-09 2005-02-21 Read Co Ltd Abrasive cloth dresser and method for dressing an abrasive cloth with the same
TWI286097B (en) * 2004-12-31 2007-09-01 Kinik Co Polishing tool and method for making the same
TWI290337B (en) * 2005-08-09 2007-11-21 Princo Corp Pad conditioner for conditioning a CMP pad and method of making the same
TW200806432A (en) * 2006-05-17 2008-02-01 Chien-Min Sung Superabrasive tools having improved caustic resistance

Family Cites Families (401)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US296756A (en) * 1884-04-15 Car-coupling
USRE20660E (en) 1938-02-22 Method of coaxing and apparatus
US187593A (en) 1877-02-20 Improvement in emery grinding-wheels
US238946A (en) * 1881-03-15 Heel-restorer
US5642779A (en) 1909-06-30 1997-07-01 Sumitomo Electric Industries, Ltd. Heat sink and a process for the production of the same
US1382080A (en) 1919-09-18 1921-06-21 William Haas Company Radiator-valve
US2307461A (en) * 1928-05-02 1943-01-05 Minnesota Mining & Mfg Sheeted abrasive
US2027307A (en) 1928-07-30 1936-01-07 Behr Manning Corp Method of coating and apparatus therefor and product
US2027087A (en) 1928-10-03 1936-01-07 Behr Manning Corp Abrasive sheet and process of making the same
US2318570A (en) 1930-01-20 1943-05-04 Minnesota Mining & Mfg Manufacture of abrasives
US1854071A (en) 1930-07-14 1932-04-12 Behr Manning Corp Method of manufacturing abrasives
US1988065A (en) 1931-09-26 1935-01-15 Carborundum Co Manufacture of open-spaced abrasive fabrics
US2187624A (en) 1932-10-10 1940-01-16 Carborundum Co Apparatus for the manufacture of coated webs
US2035521A (en) 1932-10-26 1936-03-31 Carborundum Co Granular coated web and method of making same
US2184348A (en) 1932-10-27 1939-12-26 Carborundum Co Coating apparatus
US2194253A (en) 1932-10-27 1940-03-19 Carborundum Co Coating apparatus
US2281558A (en) 1933-03-06 1942-05-05 Minnesota Mining & Mfg Manufacture of abrasive articles and apparatus therefor
US2078354A (en) 1935-04-25 1937-04-27 Norton Co Abrasive article
US2075354A (en) * 1935-06-10 1937-03-30 Monier Namee Collapsible game table
US2033991A (en) 1935-07-09 1936-03-17 Carborundum Co Coating apparatus
US2268663A (en) 1939-09-19 1942-01-06 J K Smit & Sons Inc Abrasive tool
US2334572A (en) 1941-12-29 1943-11-16 Carborundum Co Manufacture of abrasive materials
US2612348A (en) 1949-09-14 1952-09-30 Wheel Trueing Tool Co Diamond set core bit
US2652951A (en) 1951-03-13 1953-09-22 Esposito Augustus Salt and pepper shaker
US2952951A (en) 1952-07-28 1960-09-20 Simpson Harry Arthur Abrasive or like materials and articles
US2876086A (en) 1954-06-21 1959-03-03 Minnesota Mining & Mfg Abrasive structures and method of making
US2725693A (en) 1954-12-15 1955-12-06 Smith Joseph Leigh Abrasive roll and method of making
US2867086A (en) 1954-12-20 1959-01-06 Emmett L Haley Portable pressure fluid power devices
LU37663A1 (zh) 1955-08-29
US2811960A (en) 1957-02-26 1957-11-05 Fessel Paul Abrasive cutting body
US3067551A (en) 1958-09-22 1962-12-11 Bethlehem Steel Corp Grinding method
US3127715A (en) 1960-04-27 1964-04-07 Christensen Diamond Prod Co Diamond cutting devices
US3146560A (en) 1960-06-14 1964-09-01 Rexall Drug Chemical Abrasive products
US3121981A (en) 1960-09-23 1964-02-25 Rexall Drug Chemical Abrasive wheels and method of making the same
ES272672A1 (es) 1961-12-04 1962-05-01 The Osborn Manufacturing Company Mejoras en ruedas pulimentadoras
US3276852A (en) 1962-11-20 1966-10-04 Jerome H Lemelson Filament-reinforced composite abrasive articles
US3293012A (en) 1962-11-27 1966-12-20 Exxon Production Research Co Process of infiltrating diamond particles with metallic binders
DE1502642A1 (de) 1963-05-13 1969-06-04 Naradi Narodni Podnik Diamantformwerkzeug
US3372010A (en) 1965-06-23 1968-03-05 Wall Colmonoy Corp Diamond abrasive matrix
US3416560A (en) 1965-08-23 1968-12-17 Bruno Peter Fluid leak monitoring apparatus
US3625666A (en) 1968-06-19 1971-12-07 Ind Distributors 1946 Ltd Method of forming metal-coated diamond abrasive wheels
US3574580A (en) 1968-11-08 1971-04-13 Atomic Energy Commission Process for producing sintered diamond compact and products
US3608134A (en) 1969-02-10 1971-09-28 Norton Co Molding apparatus for orienting elongated particles
JPS4823595B1 (zh) 1969-06-17 1973-07-14
US3630699A (en) 1969-09-02 1971-12-28 Remington Arms Co Inc Method for producing armored saber saws
US3678995A (en) 1970-06-22 1972-07-25 Rca Corp Support for electrical components and method of making the same
US3829544A (en) 1970-12-09 1974-08-13 Megadiamond Corp Method of making a unitary polycrystalline diamond composite and diamond composite produced thereby
US3852078A (en) 1970-12-24 1974-12-03 M Wakatsuki Mass of polycrystalline cubic system boron nitride and composites of polycrystalline cubic system boron nitride and other hard materials, and processes for manufacturing the same
US3913280A (en) 1971-01-29 1975-10-21 Megadiamond Corp Polycrystalline diamond composites
US3905571A (en) * 1971-03-26 1975-09-16 Joseph Lombardo Nursing bottle holder
ZA713105B (en) 1971-05-12 1972-09-27 De Beers Ind Diamond Diamond and the like grinding wheels
US3743489A (en) 1971-07-01 1973-07-03 Gen Electric Abrasive bodies of finely-divided cubic boron nitride crystals
US3767371A (en) 1971-07-01 1973-10-23 Gen Electric Cubic boron nitride/sintered carbide abrasive bodies
IL39936A (en) 1971-07-30 1975-04-25 De Beers Ind Diamond A diamond particle particularly for use in heat sinks
US3894673A (en) 1971-11-04 1975-07-15 Abrasive Tech Inc Method of manufacturing diamond abrasive tools
US4018576A (en) 1971-11-04 1977-04-19 Abrasive Technology, Inc. Diamond abrasive tool
US3819814A (en) 1972-11-01 1974-06-25 Megadiamond Corp Plural molded diamond articles and their manufacture from diamond powders under high temperature and pressure
GB1382080A (en) 1972-12-01 1975-01-29 Inst Fiziki Vysokikh Davleny Method of preparing a diamond-metal compact
US3912500A (en) 1972-12-27 1975-10-14 Leonid Fedorovich Vereschagin Process for producing diamond-metallic materials
US3872496A (en) 1973-09-13 1975-03-18 Sperry Rand Corp High frequency diode having simultaneously formed high strength bonds with respect to a diamond heat sink and said diode
US3982358A (en) 1973-10-09 1976-09-28 Heijiro Fukuda Laminated resinoid wheels, method for continuously producing same and apparatus for use in the method
US3949263A (en) 1974-12-20 1976-04-06 Raytheon Company Diamond brazing method for slow wave energy propagating structures
US4287168A (en) 1975-01-27 1981-09-01 General Electric Company Apparatus and method for isolation of diamond seeds for growing diamonds
US4028576A (en) * 1975-07-21 1977-06-07 David Wofsey Sonic spark plug
US4273561A (en) 1975-08-27 1981-06-16 Fernandez Moran Villalobos Hum Ultrasharp polycrystalline diamond edges, points, and improved diamond composites, and methods of making and irradiating same
US4211924A (en) 1976-09-03 1980-07-08 Siemens Aktiengesellschaft Transmission-type scanning charged-particle beam microscope
US4078906A (en) 1976-09-29 1978-03-14 Elgin Diamond Products Co., Inc. Method for making an abrading tool with discontinuous diamond abrading surfaces
US4188194A (en) 1976-10-29 1980-02-12 General Electric Company Direct conversion process for making cubic boron nitride from pyrolytic boron nitride
GB1591491A (en) 1977-01-18 1981-06-24 Daichiku Co Ltd Laminated rotary grinder and method of fabrication
ZA771270B (en) 1977-03-03 1978-07-26 De Beers Ind Diamond Abrasive bodies
US4228214A (en) 1978-03-01 1980-10-14 Gte Products Corporation Flexible bilayered sheet, one layer of which contains abrasive particles in a volatilizable organic binder and the other layer of which contains alloy particles in a volatilizable binder, method for producing same and coating produced by heating same
US4224380A (en) 1978-03-28 1980-09-23 General Electric Company Temperature resistant abrasive compact and method for making same
US4211294A (en) 1978-04-21 1980-07-08 Acker Drill Company, Inc. Impregnated diamond drill bit
US4149881A (en) 1978-06-28 1979-04-17 Western Gold And Platinum Company Nickel palladium base brazing alloy
US4182628A (en) 1978-07-03 1980-01-08 GTE Sylvania Products, Inc. Partially amorphous silver-copper-indium brazing foil
IE48798B1 (en) 1978-08-18 1985-05-15 De Beers Ind Diamond Method of making tool inserts,wire-drawing die blank and drill bit comprising such inserts
US4231195A (en) 1979-05-24 1980-11-04 General Electric Company Polycrystalline diamond body and process
US4289503A (en) 1979-06-11 1981-09-15 General Electric Company Polycrystalline cubic boron nitride abrasive and process for preparing same in the absence of catalyst
US4355489A (en) 1980-09-15 1982-10-26 Minnesota Mining And Manufacturing Company Abrasive article comprising abrasive agglomerates supported in a fibrous matrix
US4378233A (en) 1981-07-24 1983-03-29 Norton Company Metal bonded grinding wheel containing diamond or CBN abrasive
US4525179A (en) 1981-07-27 1985-06-25 General Electric Company Process for making diamond and cubic boron nitride compacts
US4712552A (en) 1982-03-10 1987-12-15 William W. Haefliger Cushioned abrasive composite
US4518659A (en) 1982-04-02 1985-05-21 General Electric Company Sweep through process for making polycrystalline compacts
US4544540A (en) 1982-06-25 1985-10-01 Sumitomo Electric Industries, Ltd. Diamond single crystals, a process of manufacturing and tools for using same
US4425195A (en) 1982-11-10 1984-01-10 Martin Marietta Corporation Method of fabricating a diamond heat sink
US4534773A (en) 1983-01-10 1985-08-13 Cornelius Phaal Abrasive product and method for manufacturing
US4629373A (en) 1983-06-22 1986-12-16 Megadiamond Industries, Inc. Polycrystalline diamond body with enhanced surface irregularities
US4617181A (en) 1983-07-01 1986-10-14 Sumitomo Electric Industries, Ltd. Synthetic diamond heat sink
US4776861A (en) 1983-08-29 1988-10-11 General Electric Company Polycrystalline abrasive grit
US4828582A (en) 1983-08-29 1989-05-09 General Electric Company Polycrystalline abrasive grit
GB8325320D0 (en) 1983-09-21 1983-10-26 Plessey Co Plc Diamond heatsink assemblies
US4780274A (en) 1983-12-03 1988-10-25 Reed Tool Company, Ltd. Manufacture of rotary drill bits
US4565034A (en) 1984-01-03 1986-01-21 Disco Abrasive Systems, Ltd. Grinding and/or cutting endless belt
US4610699A (en) 1984-01-18 1986-09-09 Sumitomo Electric Industries, Ltd. Hard diamond sintered body and the method for producing the same
US4632817A (en) 1984-04-04 1986-12-30 Sumitomo Electric Industries, Ltd. Method of synthesizing diamond
US4874398A (en) 1984-08-24 1989-10-17 Ringwood Alfred E Diamond compacts and process for making same
US4551195A (en) 1984-09-25 1985-11-05 Showa Denko Kabushiki Kaisha Method for growing boron nitride crystals of cubic system
US4547257A (en) 1984-09-25 1985-10-15 Showa Denko Kabushiki Kaisha Method for growing diamond crystals
US4649992A (en) 1984-10-05 1987-03-17 Plessey Overseas Limited Diamond heatsink assemblies
GB8508621D0 (en) 1985-04-02 1985-05-09 Nl Petroleum Prod Rotary drill bits
US4797241A (en) 1985-05-20 1989-01-10 Sii Megadiamond Method for producing multiple polycrystalline bodies
US4664705A (en) 1985-07-30 1987-05-12 Sii Megadiamond, Inc. Infiltrated thermally stable polycrystalline diamond
JPS6287407A (ja) 1985-10-12 1987-04-21 Res Dev Corp Of Japan フイルム状グラフアイト層間化合物及びその製造方法
DE3545308A1 (de) 1985-12-20 1987-06-25 Feldmuehle Ag Schleifscheibe mit daempfung
US4949511A (en) 1986-02-10 1990-08-21 Toshiba Tungaloy Co., Ltd. Super abrasive grinding tool element and grinding tool
US4662896A (en) 1986-02-19 1987-05-05 Strata Bit Corporation Method of making an abrasive cutting element
US4680199A (en) 1986-03-21 1987-07-14 United Technologies Corporation Method for depositing a layer of abrasive material on a substrate
CA1305324C (en) 1986-04-17 1992-07-21 Sumitomo Electric Industries, Ltd. Wire incrusted with abrasive grain and method for producing the same
US5030276A (en) 1986-10-20 1991-07-09 Norton Company Low pressure bonding of PCD bodies and method
US5116568A (en) 1986-10-20 1992-05-26 Norton Company Method for low pressure bonding of PCD bodies
US4943488A (en) 1986-10-20 1990-07-24 Norton Company Low pressure bonding of PCD bodies and method for drill bits and the like
EP0264674B1 (en) 1986-10-20 1995-09-06 Baker Hughes Incorporated Low pressure bonding of PCD bodies and method
AU1215788A (en) 1987-02-27 1988-09-01 Diabrasive International Ltd. Flexible abrasives
US5195404A (en) 1987-06-18 1993-03-23 Notter Theo A Drill bit with cutting insert
US4770907A (en) 1987-10-17 1988-09-13 Fuji Paudal Kabushiki Kaisha Method for forming metal-coated abrasive grain granules
US5022895A (en) 1988-02-14 1991-06-11 Wiand Ronald C Multilayer abrading tool and process
US4908046A (en) 1989-02-14 1990-03-13 Wiand Ronald C Multilayer abrading tool and process
CA1298980C (en) 1988-02-26 1992-04-21 Clyde D. Calhoun Abrasive sheeting having individually positioned abrasive granules
US5273730A (en) 1988-03-08 1993-12-28 Sumitomo Electric Industries, Ltd. Method of synthesizing diamond
US5151107A (en) 1988-07-29 1992-09-29 Norton Company Cemented and cemented/sintered superabrasive polycrystalline bodies and methods of manufacture thereof
US4916869A (en) 1988-08-01 1990-04-17 L. R. Oliver & Company, Inc. Bonded abrasive grit structure
US4849602A (en) 1988-08-12 1989-07-18 Iscar Ltd. Method for fabricating cutting pieces
AU605995B2 (en) 1988-08-31 1991-01-24 De Beers Industrial Diamond Division (Proprietary) Limited Manufacture of abrasive products
US5008737A (en) * 1988-10-11 1991-04-16 Amoco Corporation Diamond composite heat sink for use with semiconductor devices
US5130771A (en) 1988-10-11 1992-07-14 Amoco Corporation Diamond composite heat sink for use with semiconductor devices
US4883500A (en) 1988-10-25 1989-11-28 General Electric Company Sawblade segments utilizing polycrystalline diamond grit
US5024680A (en) 1988-11-07 1991-06-18 Norton Company Multiple metal coated superabrasive grit and methods for their manufacture
US5043120A (en) 1988-11-10 1991-08-27 The General Electric Company Process for preparing polycrystalline CBN ceramic masses
US6413589B1 (en) 1988-11-29 2002-07-02 Chou H. Li Ceramic coating method
US4923490A (en) 1988-12-16 1990-05-08 General Electric Company Novel grinding wheels utilizing polycrystalline diamond or cubic boron nitride grit
US5190568B1 (en) 1989-01-30 1996-03-12 Ultimate Abrasive Syst Inc Abrasive tool with contoured surface
US5094985A (en) 1989-01-30 1992-03-10 Kazunori Kijima Kyoto Sintered silicon carbide body with high thermal conductivity and process of producing the same
US4925457B1 (en) 1989-01-30 1995-09-26 Ultimate Abrasive Syst Inc Method for making an abrasive tool
US5049165B1 (en) 1989-01-30 1995-09-26 Ultimate Abrasive Syst Inc Composite material
US4945686A (en) 1989-02-14 1990-08-07 Wiand Ronald C Multilayer abrading tool having an irregular abrading surface and process
US5133782A (en) 1989-02-14 1992-07-28 Wiand Ronald C Multilayer abrading tool having an irregular abrading surface and process
US4954139A (en) 1989-03-31 1990-09-04 The General Electric Company Method for producing polycrystalline compact tool blanks with flat carbide support/diamond or CBN interfaces
EP0391418B2 (en) 1989-04-06 1998-09-09 Sumitomo Electric Industries, Ltd. A diamond for a dresser
US5224017A (en) 1989-05-17 1993-06-29 The Charles Stark Draper Laboratory, Inc. Composite heat transfer device
US5011513A (en) 1989-05-31 1991-04-30 Norton Company Single step, radiation curable ophthalmic fining pad
US4968326A (en) 1989-10-10 1990-11-06 Wiand Ronald C Method of brazing of diamond to substrate
AU634601B2 (en) 1989-12-11 1993-02-25 General Electric Company Single-crystal diamond of very high thermal conductivity
US5096465A (en) 1989-12-13 1992-03-17 Norton Company Diamond metal composite cutter and method for making same
US5000273A (en) 1990-01-05 1991-03-19 Norton Company Low melting point copper-manganese-zinc alloy for infiltration binder in matrix body rock drill bits
US5203881A (en) 1990-02-02 1993-04-20 Wiand Ronald C Abrasive sheet and method
US5131924A (en) 1990-02-02 1992-07-21 Wiand Ronald C Abrasive sheet and method
US5164247A (en) 1990-02-06 1992-11-17 The Pullman Company Wear resistance in a hardfaced substrate
GB9006703D0 (en) 1990-03-26 1990-05-23 De Beers Ind Diamond Abrasive product
JP2940099B2 (ja) 1990-08-09 1999-08-25 住友電気工業株式会社 高熱伝導性ダイヤモンド単結晶の合成方法
US5045972A (en) 1990-08-27 1991-09-03 The Standard Oil Company High thermal conductivity metal matrix composite
US5120495A (en) 1990-08-27 1992-06-09 The Standard Oil Company High thermal conductivity metal matrix composite
AU644213B2 (en) 1990-09-26 1993-12-02 De Beers Industrial Diamond Division (Proprietary) Limited Composite diamond abrasive compact
CA2054050C (en) 1990-11-16 1998-07-07 Louis K. Bigelow Method and apparatus for making grit and abrasive media
EP0488623B1 (en) 1990-11-26 1996-02-21 De Beers Industrial Diamond Division (Proprietary) Limited Cutting insert for a rotary cutting tool
US5197249A (en) 1991-02-07 1993-03-30 Wiand Ronald C Diamond tool with non-abrasive segments
US5070936A (en) 1991-02-15 1991-12-10 United States Of America As Represented By The Secretary Of The Air Force High intensity heat exchanger system
GB9104366D0 (en) 1991-03-01 1991-04-17 De Beers Ind Diamond Composite cutting insert
CA2065581C (en) 1991-04-22 2002-03-12 Andal Corp. Plasma enhancement apparatus and method for physical vapor deposition
US5380390B1 (en) 1991-06-10 1996-10-01 Ultimate Abras Systems Inc Patterned abrasive material and method
AU647941B2 (en) 1991-07-12 1994-03-31 De Beers Industrial Diamond Division (Proprietary) Limited Diamond synthesis
US5820721A (en) 1991-07-17 1998-10-13 Beane; Alan F. Manufacturing particles and articles having engineered properties
JP2546558B2 (ja) 1991-07-22 1996-10-23 住友電気工業株式会社 ダイヤモンド砥粒の合成方法
US5247765A (en) 1991-07-23 1993-09-28 Abrasive Technology Europe, S.A. Abrasive product comprising a plurality of discrete composite abrasive pellets in a resilient resin matrix
US5492774A (en) 1991-07-23 1996-02-20 Sony Corporation Perpendicular magnetic recording medium and process for production of the same
US5194071A (en) 1991-07-25 1993-03-16 General Electric Company Inc. Cubic boron nitride abrasive and process for preparing same
US5266236A (en) 1991-10-09 1993-11-30 General Electric Company Thermally stable dense electrically conductive diamond compacts
US5295402A (en) 1991-10-15 1994-03-22 General Electric Company Method for achieving high pressure using isotopically-pure diamond anvils
US5246884A (en) 1991-10-30 1993-09-21 International Business Machines Corporation Cvd diamond or diamond-like carbon for chemical-mechanical polish etch stop
US5437754A (en) 1992-01-13 1995-08-01 Minnesota Mining And Manufacturing Company Abrasive article having precise lateral spacing between abrasive composite members
US5314513A (en) 1992-03-03 1994-05-24 Minnesota Mining And Manufacturing Company Abrasive product having a binder comprising a maleimide binder
US5176155A (en) 1992-03-03 1993-01-05 Rudolph Jr James M Method and device for filing nails
JPH0639729A (ja) 1992-05-29 1994-02-15 Canon Inc 精研削砥石およびその製造方法
US5443032A (en) 1992-06-08 1995-08-22 Air Products And Chemicals, Inc. Method for the manufacture of large single crystals
US5243790A (en) 1992-06-25 1993-09-14 Abrasifs Vega, Inc. Abrasive member
US5264011A (en) 1992-09-08 1993-11-23 General Motors Corporation Abrasive blade tips for cast single crystal gas turbine blades
US5271547A (en) 1992-09-15 1993-12-21 Tunco Manufacturing, Inc. Method for brazing tungsten carbide particles and diamond crystals to a substrate and products made therefrom
US5985228A (en) 1992-12-22 1999-11-16 General Electric Company Method for controlling the particle size distribution in the production of multicrystalline cubic boron nitride
US6238454B1 (en) 1993-04-14 2001-05-29 Frank J. Polese Isotropic carbon/copper composites
US5674572A (en) 1993-05-21 1997-10-07 Trustees Of Boston University Enhanced adherence of diamond coatings employing pretreatment process
GB9310500D0 (en) 1993-05-21 1993-07-07 De Beers Ind Diamond Cutting tool
US5681612A (en) 1993-06-17 1997-10-28 Minnesota Mining And Manufacturing Company Coated abrasives and methods of preparation
ES2109709T3 (es) 1993-06-17 1998-01-16 Minnesota Mining & Mfg Articulos abrasivos con diseño y metodos de fabricacion y empleo de los mismos.
US5382314A (en) 1993-08-31 1995-01-17 At&T Corp. Method of shaping a diamond body
WO1995006544A1 (en) 1993-09-01 1995-03-09 Speedfam Corporation Backing pad for machining operations
KR100269924B1 (ko) 1993-10-08 2000-11-01 하지메 히토추야나기 합성 다이아몬와 그 제조방법
US5453106A (en) 1993-10-27 1995-09-26 Roberts; Ellis E. Oriented particles in hard surfaces
US5542471A (en) 1993-11-16 1996-08-06 Loral Vought System Corporation Heat transfer element having the thermally conductive fibers
US5486131A (en) 1994-01-04 1996-01-23 Speedfam Corporation Device for conditioning polishing pads
US5454343A (en) 1994-01-18 1995-10-03 Korea Institute Of Science And Technology Method for production of diamond particles
US5547417A (en) 1994-03-21 1996-08-20 Intel Corporation Method and apparatus for conditioning a semiconductor polishing pad
ZA9410384B (en) 1994-04-08 1996-02-01 Ultimate Abrasive Syst Inc Method for making powder preform and abrasive articles made therefrom
US5518443A (en) 1994-05-13 1996-05-21 Norton Company Superabrasive tool
US6264882B1 (en) 1994-05-20 2001-07-24 The Regents Of The University Of California Process for fabricating composite material having high thermal conductivity
US6466446B1 (en) 1994-07-01 2002-10-15 Saint Gobain/Norton Industrial Ceramics Corporation Integrated circuit package with diamond heat sink
MY112145A (en) 1994-07-11 2001-04-30 Ibm Direct attachment of heat sink attached directly to flip chip using flexible epoxy
US5536202A (en) 1994-07-27 1996-07-16 Texas Instruments Incorporated Semiconductor substrate conditioning head having a plurality of geometries formed in a surface thereof for pad conditioning during chemical-mechanical polish
US5551959A (en) 1994-08-24 1996-09-03 Minnesota Mining And Manufacturing Company Abrasive article having a diamond-like coating layer and method for making same
US5492771A (en) * 1994-09-07 1996-02-20 Abrasive Technology, Inc. Method of making monolayer abrasive tools
WO1996010471A1 (en) 1994-09-30 1996-04-11 Minnesota Mining And Manufacturing Company Coated abrasive article, method for preparing the same, and method of using
EP0712941B1 (en) 1994-11-18 2004-05-19 Agency Of Industrial Science And Technology Diamond sinter, high-pressure phase boron nitride sinter, and processes for producing those sinters
JP3401107B2 (ja) 1995-01-23 2003-04-28 松下電器産業株式会社 パッケージｉｃのモジュール
US5527424A (en) 1995-01-30 1996-06-18 Motorola, Inc. Preconditioner for a polishing pad and method for using the same
JPH08222669A (ja) 1995-02-10 1996-08-30 Fuji Dies Kk ヒートシンク及びその製法
JPH08337498A (ja) 1995-04-13 1996-12-24 Sumitomo Electric Ind Ltd ダイヤモンド粒子、ダイヤモンド合成用粒子及び圧密体並びにそれらの製造方法
US5801073A (en) 1995-05-25 1998-09-01 Charles Stark Draper Laboratory Net-shape ceramic processing for electronic devices and packages
US5816891A (en) 1995-06-06 1998-10-06 Advanced Micro Devices, Inc. Performing chemical mechanical polishing of oxides and metals using sequential removal on multiple polish platens to increase equipment throughput
US6478831B2 (en) 1995-06-07 2002-11-12 Ultimate Abrasive Systems, L.L.C. Abrasive surface and article and methods for making them
US5560754A (en) 1995-06-13 1996-10-01 General Electric Company Reduction of stresses in the polycrystalline abrasive layer of a composite compact with in situ bonded carbide/carbide support
US5609286A (en) 1995-08-28 1997-03-11 Anthon; Royce A. Brazing rod for depositing diamond coating metal substrate using gas or electric brazing techniques
DE19536463C2 (de) 1995-09-29 2002-02-07 Infineon Technologies Ag Verfahren zum Herstellen einer Mehrzahl von Laserdiodenbauelementen
US5660894A (en) 1995-10-16 1997-08-26 National Science Council Process for depositing diamond by chemical vapor deposition
DE69629651T2 (de) 1995-12-21 2004-02-26 Element Six (Pty) Ltd. Diamantsynthese
US5725421A (en) 1996-02-27 1998-03-10 Minnesota Mining And Manufacturing Company Apparatus for rotative abrading applications
JP3111892B2 (ja) 1996-03-19 2000-11-27 ヤマハ株式会社 研磨装置
US5834337A (en) 1996-03-21 1998-11-10 Bryte Technologies, Inc. Integrated circuit heat transfer element and method
JPH106218A (ja) 1996-06-27 1998-01-13 Minnesota Mining & Mfg Co <3M> ドレッシング用研磨材製品
US5719441A (en) 1996-07-11 1998-02-17 Larimer; William R. Transistor package with integral heatsink
US6371838B1 (en) 1996-07-15 2002-04-16 Speedfam-Ipec Corporation Polishing pad conditioning device with cutting elements
US6284315B1 (en) 1996-07-29 2001-09-04 Aurburn University Method of polishing diamond films
US6544599B1 (en) 1996-07-31 2003-04-08 Univ Arkansas Process and apparatus for applying charged particles to a substrate, process for forming a layer on a substrate, products made therefrom
US5833519A (en) 1996-08-06 1998-11-10 Micron Technology, Inc. Method and apparatus for mechanical polishing
US5851138A (en) 1996-08-15 1998-12-22 Texas Instruments Incorporated Polishing pad conditioning system and method
US5779743A (en) 1996-09-18 1998-07-14 Minnesota Mining And Manufacturing Company Method for making abrasive grain and abrasive articles
US6206942B1 (en) 1997-01-09 2001-03-27 Minnesota Mining & Manufacturing Company Method for making abrasive grain using impregnation, and abrasive articles
WO1998016347A1 (fr) 1996-10-15 1998-04-23 Nippon Steel Corporation Appareil ebarbeur pour tampon de polissage de substrat semi-conducteur, son procede de fabrication et procede de polissage chimico-mecanique au moyen dudit appareil ebarbeur
US6167948B1 (en) 1996-11-18 2001-01-02 Novel Concepts, Inc. Thin, planar heat spreader
US5976205A (en) 1996-12-02 1999-11-02 Norton Company Abrasive tool
US5746931A (en) 1996-12-05 1998-05-05 Lucent Technologies Inc. Method and apparatus for chemical-mechanical polishing of diamond
GB9626221D0 (en) 1996-12-18 1997-02-05 Smiths Industries Plc Diamond surfaces
US5916011A (en) 1996-12-26 1999-06-29 Motorola, Inc. Process for polishing a semiconductor device substrate
US5895972A (en) 1996-12-31 1999-04-20 Intel Corporation Method and apparatus for cooling the backside of a semiconductor device using an infrared transparent heat slug
JP3617232B2 (ja) 1997-02-06 2005-02-02 住友電気工業株式会社 半導体用ヒートシンクおよびその製造方法ならびにそれを用いた半導体パッケージ
US7404857B2 (en) 1997-04-04 2008-07-29 Chien-Min Sung Superabrasive particle synthesis with controlled placement of crystalline seeds
US6679243B2 (en) 1997-04-04 2004-01-20 Chien-Min Sung Brazed diamond tools and methods for making
US6286498B1 (en) 1997-04-04 2001-09-11 Chien-Min Sung Metal bond diamond tools that contain uniform or patterned distribution of diamond grits and method of manufacture thereof
US6368198B1 (en) 1999-11-22 2002-04-09 Kinik Company Diamond grid CMP pad dresser
US7368013B2 (en) 1997-04-04 2008-05-06 Chien-Min Sung Superabrasive particle synthesis with controlled placement of crystalline seeds
US6039641A (en) 1997-04-04 2000-03-21 Sung; Chien-Min Brazed diamond tools by infiltration
TW394723B (en) 1997-04-04 2000-06-21 Sung Chien Min Abrasive tools with patterned grit distribution and method of manufacture
US6884155B2 (en) * 1999-11-22 2005-04-26 Kinik Diamond grid CMP pad dresser
US9868100B2 (en) 1997-04-04 2018-01-16 Chien-Min Sung Brazed diamond tools and methods for making the same
US7323049B2 (en) 1997-04-04 2008-01-29 Chien-Min Sung High pressure superabrasive particle synthesis
US7124753B2 (en) 1997-04-04 2006-10-24 Chien-Min Sung Brazed diamond tools and methods for making the same
US7491116B2 (en) * 2004-09-29 2009-02-17 Chien-Min Sung CMP pad dresser with oriented particles and associated methods
US6497853B1 (en) 1997-04-17 2002-12-24 Moosa Mahomed Adia Diamond growth
US5921855A (en) 1997-05-15 1999-07-13 Applied Materials, Inc. Polishing pad having a grooved pattern for use in a chemical mechanical polishing system
JP3244454B2 (ja) 1997-06-05 2002-01-07 理化学研究所 切削研削両用工具
US5961373A (en) 1997-06-16 1999-10-05 Motorola, Inc. Process for forming a semiconductor device
US5885137A (en) 1997-06-27 1999-03-23 Siemens Aktiengesellschaft Chemical mechanical polishing pad conditioner
US6054183A (en) 1997-07-10 2000-04-25 Zimmer; Jerry W. Method for making CVD diamond coated substrate for polishing pad conditioning head
US5921856A (en) 1997-07-10 1999-07-13 Sp3, Inc. CVD diamond coated substrate for polishing pad conditioning head and method for making same
US6024824A (en) 1997-07-17 2000-02-15 3M Innovative Properties Company Method of making articles in sheet form, particularly abrasive articles
US6093280A (en) 1997-08-18 2000-07-25 Lsi Logic Corporation Chemical-mechanical polishing pad conditioning systems
JP3893681B2 (ja) 1997-08-19 2007-03-14 住友電気工業株式会社 半導体用ヒートシンクおよびその製造方法
DE69808324T2 (de) 1997-09-05 2003-05-22 Frenton Ltd., Douglas Verfahren zur herstellung eines diamant-siliciumcarbid-siliciumkomposits und ein nach diesem verfahren hergestelltes komposit
US6027659A (en) 1997-12-03 2000-02-22 Intel Corporation Polishing pad conditioning surface having integral conditioning points
US6196911B1 (en) 1997-12-04 2001-03-06 3M Innovative Properties Company Tools with abrasive segments
ATE220345T1 (de) 1997-12-11 2002-07-15 De Beers Ind Diamond Kristallwachstum
JP4623774B2 (ja) 1998-01-16 2011-02-02 住友電気工業株式会社 ヒートシンクおよびその製造方法
US6335863B1 (en) 1998-01-16 2002-01-01 Sumitomo Electric Industries, Ltd. Package for semiconductors, and semiconductor module that employs the package
CA2261491C (en) 1998-03-06 2005-05-24 Smith International, Inc. Cutting element with improved polycrystalline material toughness and method for making same
US6001174A (en) 1998-03-11 1999-12-14 Richard J. Birch Method for growing a diamond crystal on a rheotaxy template
US6123612A (en) 1998-04-15 2000-09-26 3M Innovative Properties Company Corrosion resistant abrasive article and method of making
JP3295888B2 (ja) 1998-04-22 2002-06-24 株式会社藤森技術研究所 ケミカルマシンポリッシャの研磨盤用研磨ドレッサ
KR19990081117A (ko) 1998-04-25 1999-11-15 윤종용 씨엠피 패드 컨디셔닝 디스크 및 컨디셔너, 그 디스크의 제조방법, 재생방법 및 세정방법
US6077601A (en) 1998-05-01 2000-06-20 3M Innovative Properties Company Coated abrasive article
US6354918B1 (en) 1998-06-19 2002-03-12 Ebara Corporation Apparatus and method for polishing workpiece
US6258418B1 (en) 1998-06-24 2001-07-10 Ronald A. Rudder Method for producing diamond-tiled cooking utensils and other workpieces for durable stick-resistant surfaces
US6299508B1 (en) 1998-08-05 2001-10-09 3M Innovative Properties Company Abrasive article with integrally molded front surface protrusions containing a grinding aid and methods of making and using
US6280496B1 (en) 1998-09-14 2001-08-28 Sumitomo Electric Industries, Ltd. Silicon carbide based composite material and manufacturing method thereof
US6447852B1 (en) 1999-03-04 2002-09-10 Ambler Technologies, Inc. Method of manufacturing a diamond composite and a composite produced by same
US6709747B1 (en) 1998-09-28 2004-03-23 Skeleton Technologies Ag Method of manufacturing a diamond composite and a composite produced by same
US6346202B1 (en) 1999-03-25 2002-02-12 Beaver Creek Concepts Inc Finishing with partial organic boundary layer
JP2002532914A (ja) * 1998-12-15 2002-10-02 パーカー−ハニフイン・コーポレーシヨン 相変化熱的インターフェース材料の塗布方法
US6605798B1 (en) 1998-12-22 2003-08-12 Barry James Cullen Cutting of ultra-hard materials
US6258237B1 (en) 1998-12-30 2001-07-10 Cerd, Ltd. Electrophoretic diamond coating and compositions for effecting same
US6309277B1 (en) 1999-03-03 2001-10-30 Advanced Micro Devices, Inc. System and method for achieving a desired semiconductor wafer surface profile via selective polishing pad conditioning
JP2000303126A (ja) 1999-04-15 2000-10-31 Sumitomo Electric Ind Ltd ダイヤモンド−アルミニウム系複合材料およびその製造方法
EP1044938A1 (de) 1999-04-16 2000-10-18 Misapor AG Fliessfähige und aushärtbare Gussmasse, insbesondere Leichtbeton, Element oder Bauteil, sowie ein Verfahren zur Herstellung von strukturierten Oberflächen an solchen
CA2309289C (en) 1999-05-24 2007-10-30 Honda Giken Kogyo Kabushiki Kaisha Cutting tip and manufacturing method thereof
JP3387851B2 (ja) 1999-05-28 2003-03-17 株式会社ノリタケスーパーアブレーシブ 研削砥石およびその製造方法
US6517221B1 (en) 1999-06-18 2003-02-11 Ciena Corporation Heat pipe heat sink for cooling a laser diode
US6319108B1 (en) 1999-07-09 2001-11-20 3M Innovative Properties Company Metal bond abrasive article comprising porous ceramic abrasive composites and method of using same to abrade a workpiece
US6755720B1 (en) 1999-07-15 2004-06-29 Noritake Co., Limited Vitrified bond tool and method of manufacturing the same
US6215661B1 (en) 1999-08-11 2001-04-10 Motorola, Inc. Heat spreader
US6281129B1 (en) 1999-09-20 2001-08-28 Agere Systems Guardian Corp. Corrosion-resistant polishing pad conditioner
US6627168B1 (en) 1999-10-01 2003-09-30 Showa Denko Kabushiki Kaisha Method for growing diamond and cubic boron nitride crystals
TW467802B (en) 1999-10-12 2001-12-11 Hunatech Co Ltd Conditioner for polishing pad and method for manufacturing the same
US6325709B1 (en) 1999-11-18 2001-12-04 Chartered Semiconductor Manufacturing Ltd Rounded surface for the pad conditioner using high temperature brazing
US7201645B2 (en) 1999-11-22 2007-04-10 Chien-Min Sung Contoured CMP pad dresser and associated methods
US6337513B1 (en) 1999-11-30 2002-01-08 International Business Machines Corporation Chip packaging system and method using deposited diamond film
US20020023733A1 (en) 1999-12-13 2002-02-28 Hall David R. High-pressure high-temperature polycrystalline diamond heat spreader
US6293980B2 (en) 1999-12-20 2001-09-25 Norton Company Production of layered engineered abrasive surfaces
JP3527448B2 (ja) 1999-12-20 2004-05-17 株式会社リード Ｃｍｐ研磨布用ドレッサー及びその製造方法
TW452956B (en) 2000-01-04 2001-09-01 Siliconware Precision Industries Co Ltd Heat dissipation structure of BGA semiconductor package
US6448642B1 (en) 2000-01-27 2002-09-10 William W. Bewley Pressure-bonded heat-sink system
US6517424B2 (en) * 2000-03-10 2003-02-11 Abrasive Technology, Inc. Protective coatings for CMP conditioning disk
US6534792B1 (en) 2000-05-18 2003-03-18 The Boeing Company Microelectronic device structure with metallic interlayer between substrate and die
US6749485B1 (en) 2000-05-27 2004-06-15 Rodel Holdings, Inc. Hydrolytically stable grooved polishing pads for chemical mechanical planarization
JP2001354492A (ja) 2000-06-07 2001-12-25 Sumitomo Electric Ind Ltd ダイヤモンド膜の形成方法および成膜装置
EP1309732B1 (en) 2000-08-08 2005-04-20 Element Six (PTY) Ltd Method of producing an abrasive product containing diamond
US6407922B1 (en) 2000-09-29 2002-06-18 Intel Corporation Heat spreader, electronic package including the heat spreader, and methods of manufacturing the heat spreader
US20020042200A1 (en) 2000-10-02 2002-04-11 Clyde Fawcett Method for conditioning polishing pads
US6390181B1 (en) 2000-10-04 2002-05-21 David R. Hall Densely finned tungsten carbide and polycrystalline diamond cooling module
US6551176B1 (en) 2000-10-05 2003-04-22 Applied Materials, Inc. Pad conditioning disk
EP1770142A3 (en) 2000-10-06 2008-05-07 3M Innovative Properties Company A method of making agglomerate abrasive grain
CN1249194C (zh) 2000-10-12 2006-04-05 六号元素(控股)公司 多晶磨料
US7132309B2 (en) * 2003-04-22 2006-11-07 Chien-Min Sung Semiconductor-on-diamond devices and methods of forming
US20030207659A1 (en) 2000-11-03 2003-11-06 3M Innovative Properties Company Abrasive product and method of making and using the same
CN100344410C (zh) 2000-11-07 2007-10-24 中国砂轮企业股份有限公司 化学－机械抛光软垫的修磨器及其制造方法
CN1273212C (zh) 2000-11-09 2006-09-06 六号元素(控股)公司 制造超硬磨粒的方法
US8545583B2 (en) 2000-11-17 2013-10-01 Wayne O. Duescher Method of forming a flexible abrasive sheet article
RU2206502C2 (ru) 2000-11-21 2003-06-20 Акционерное общество закрытого типа "Карбид" Композиционный материал
US6482248B1 (en) 2000-11-28 2002-11-19 Magnum Research, Inc. Aluminum composite for gun barrels
US6653730B2 (en) 2000-12-14 2003-11-25 Intel Corporation Electronic assembly with high capacity thermal interface
US20040072510A1 (en) 2000-12-21 2004-04-15 Toshiya Kinoshita Cmp conditioner, method for arranging rigid grains used for cmp conditioner, and method for manufacturing cmp conditioner
US6672943B2 (en) 2001-01-26 2004-01-06 Wafer Solutions, Inc. Eccentric abrasive wheel for wafer processing
US6541115B2 (en) 2001-02-26 2003-04-01 General Electric Company Metal-infiltrated polycrystalline diamond composite tool formed from coated diamond particles
US6409580B1 (en) 2001-03-26 2002-06-25 Speedfam-Ipec Corporation Rigid polishing pad conditioner for chemical mechanical polishing tool
US20020139680A1 (en) * 2001-04-03 2002-10-03 George Kosta Louis Method of fabricating a monolayer abrasive tool
US6538892B2 (en) 2001-05-02 2003-03-25 Graftech Inc. Radial finned heat sink
DE10139762A1 (de) 2001-08-13 2003-02-27 Hilti Ag Schleifscheibe
US6616725B2 (en) 2001-08-21 2003-09-09 Hyun Sam Cho Self-grown monopoly compact grit
US6692547B2 (en) * 2001-08-28 2004-02-17 Sun Abrasives Corporation Method for preparing abrasive articles
KR100442695B1 (ko) 2001-09-10 2004-08-02 삼성전자주식회사 열 방출판이 부착된 플립칩 패키지 제조 방법
KR100428947B1 (ko) 2001-09-28 2004-04-29 이화다이아몬드공업 주식회사 다이아몬드 공구
US6394886B1 (en) 2001-10-10 2002-05-28 Taiwan Semiconductor Manufacturing Company, Ltd Conformal disk holder for CMP pad conditioner
EP2428590B1 (en) 2001-11-09 2018-08-15 Sumitomo Electric Industries, Ltd. Sintered diamond having high thermal conductivity and method for producing the same and heat sink employing it
US6758263B2 (en) 2001-12-13 2004-07-06 Advanced Energy Technology Inc. Heat dissipating component using high conducting inserts
US20030168731A1 (en) 2002-03-11 2003-09-11 Matayabas James Christopher Thermal interface material and method of fabricating the same
US6872127B2 (en) 2002-07-11 2005-03-29 Taiwan Semiconductor Manufacturing Co., Ltd Polishing pad conditioning disks for chemical mechanical polisher
US6899592B1 (en) 2002-07-12 2005-05-31 Ebara Corporation Polishing apparatus and dressing method for polishing tool
AU2003298561A1 (en) 2002-08-23 2004-05-13 Jonathan S. Dahm Method and apparatus for using light emitting diodes
US6915796B2 (en) 2002-09-24 2005-07-12 Chien-Min Sung Superabrasive wire saw and associated methods of manufacture
US20060113546A1 (en) 2002-10-11 2006-06-01 Chien-Min Sung Diamond composite heat spreaders having low thermal mismatch stress and associated methods
US7173334B2 (en) 2002-10-11 2007-02-06 Chien-Min Sung Diamond composite heat spreader and associated methods
US20050189647A1 (en) 2002-10-11 2005-09-01 Chien-Min Sung Carbonaceous composite heat spreader and associated methods
WO2005038912A1 (en) 2002-10-11 2005-04-28 Chien-Min Sung Carbonaceous heat spreader and associated methods
US20080019098A1 (en) 2002-10-11 2008-01-24 Chien-Min Sung Diamond composite heat spreader and associated methods
JP2004146413A (ja) 2002-10-22 2004-05-20 Sumitomo Electric Ind Ltd 半導体素子収納用パッケージおよび半導体装置
TWI241939B (en) 2002-10-25 2005-10-21 Alex C Long Producing method and structure of cutting and polishing plate
JP2004142083A (ja) 2002-10-28 2004-05-20 Elpida Memory Inc ウエハ研磨装置およびウエハ研磨方法
US7067903B2 (en) * 2002-11-07 2006-06-27 Kabushiki Kaisha Kobe Seiko Sho Heat spreader and semiconductor device and package using the same
JP2004175626A (ja) 2002-11-28 2004-06-24 Sumitomo Electric Ind Ltd 高熱伝導性ダイヤモンド焼結体とそれを用いた半導体搭載用ヒートシンク及びその製造方法
JP2004200346A (ja) 2002-12-18 2004-07-15 Sumitomo Electric Ind Ltd 半導体素子収納用パッケージ、その製造方法及び半導体装置
US20040192178A1 (en) 2003-03-28 2004-09-30 Barak Yardeni Diamond conditioning of soft chemical mechanical planarization/polishing (CMP) polishing pads
US7367872B2 (en) 2003-04-08 2008-05-06 Applied Materials, Inc. Conditioner disk for use in chemical mechanical polishing
US7014093B2 (en) 2003-06-26 2006-03-21 Intel Corporation Multi-layer polymer-solder hybrid thermal interface material for integrated heat spreader and method of making same
US20050019114A1 (en) 2003-07-25 2005-01-27 Chien-Min Sung Nanodiamond PCD and methods of forming
US20050025973A1 (en) 2003-07-25 2005-02-03 Slutz David E. CVD diamond-coated composite substrate containing a carbide-forming material and ceramic phases and method for making same
US7160178B2 (en) 2003-08-07 2007-01-09 3M Innovative Properties Company In situ activation of a three-dimensional fixed abrasive article
KR200339181Y1 (ko) 2003-09-13 2004-01-31 장성만 화학적-기계적-연마 패드용 다이아몬드 전착 컨디셔너
US20050060941A1 (en) 2003-09-23 2005-03-24 3M Innovative Properties Company Abrasive article and methods of making the same
JP2005262341A (ja) 2004-03-16 2005-09-29 Noritake Super Abrasive:Kk Ｃｍｐパッドコンディショナー
US20050260939A1 (en) 2004-05-18 2005-11-24 Saint-Gobain Abrasives, Inc. Brazed diamond dressing tool
US6945857B1 (en) 2004-07-08 2005-09-20 Applied Materials, Inc. Polishing pad conditioner and methods of manufacture and recycling
US7658666B2 (en) 2004-08-24 2010-02-09 Chien-Min Sung Superhard cutters and associated methods
US7762872B2 (en) 2004-08-24 2010-07-27 Chien-Min Sung Superhard cutters and associated methods
US7384436B2 (en) 2004-08-24 2008-06-10 Chien-Min Sung Polycrystalline grits and associated methods
US20060258276A1 (en) 2005-05-16 2006-11-16 Chien-Min Sung Superhard cutters and associated methods
US20070060026A1 (en) 2005-09-09 2007-03-15 Chien-Min Sung Methods of bonding superabrasive particles in an organic matrix
US7150677B2 (en) 2004-09-22 2006-12-19 Mitsubishi Materials Corporation CMP conditioner
US7066795B2 (en) 2004-10-12 2006-06-27 Applied Materials, Inc. Polishing pad conditioner with shaped abrasive patterns and channels
KR100636793B1 (ko) 2004-12-13 2006-10-23 이화다이아몬드공업 주식회사 Ｃｍｐ 패드용 컨디셔너
US7169029B2 (en) 2004-12-16 2007-01-30 3M Innovative Properties Company Resilient structured sanding article
US7258708B2 (en) 2004-12-30 2007-08-21 Chien-Min Sung Chemical mechanical polishing pad dresser
US7413918B2 (en) 2005-01-11 2008-08-19 Semileds Corporation Method of making a light emitting diode
US20060185836A1 (en) 2005-02-24 2006-08-24 Scott Garner Thermally coupled surfaces having controlled minimum clearance
KR100693251B1 (ko) 2005-03-07 2007-03-13 삼성전자주식회사 연마 속도와 연마 패드의 조도를 향상시킬 수 있는 패드 컨디셔너 및 이를 이용하는 화학기계적 연마 장치
US7595507B2 (en) 2005-04-13 2009-09-29 Group4 Labs Llc Semiconductor devices having gallium nitride epilayers on diamond substrates
US20060254154A1 (en) 2005-05-12 2006-11-16 Wei Huang Abrasive tool and method of making the same
US8393934B2 (en) 2006-11-16 2013-03-12 Chien-Min Sung CMP pad dressers with hybridized abrasive surface and related methods
US8398466B2 (en) 2006-11-16 2013-03-19 Chien-Min Sung CMP pad conditioners with mosaic abrasive segments and associated methods
US20110275288A1 (en) 2010-05-10 2011-11-10 Chien-Min Sung Cmp pad dressers with hybridized conditioning and related methods
US8622787B2 (en) 2006-11-16 2014-01-07 Chien-Min Sung CMP pad dressers with hybridized abrasive surface and related methods
US7300338B2 (en) 2005-09-22 2007-11-27 Abrasive Technology, Inc. CMP diamond conditioning disk
US8541876B2 (en) * 2005-09-30 2013-09-24 Intel Corporation Microelectronic package having direct contact heat spreader and method of manufacturing same
US7594845B2 (en) 2005-10-20 2009-09-29 3M Innovative Properties Company Abrasive article and method of modifying the surface of a workpiece
US20070128994A1 (en) 2005-12-02 2007-06-07 Chien-Min Sung Electroplated abrasive tools, methods, and molds
US7494404B2 (en) * 2006-02-17 2009-02-24 Chien-Min Sung Tools for polishing and associated methods
US20070232074A1 (en) 2006-03-31 2007-10-04 Kramadhati Ravi Techniques for the synthesis of dense, high-quality diamond films using a dual seeding approach
US7498191B2 (en) * 2006-05-22 2009-03-03 Chien-Min Sung Semiconductor-on-diamond devices and associated methods
US20080271384A1 (en) * 2006-09-22 2008-11-06 Saint-Gobain Ceramics & Plastics, Inc. Conditioning tools and techniques for chemical mechanical planarization
US20080096479A1 (en) 2006-10-18 2008-04-24 Chien-Min Sung Low-melting point superabrasive tools and associated methods
US20080292869A1 (en) 2007-05-22 2008-11-27 Chien-Min Sung Methods of bonding superabrasive particles in an organic matrix
US20080296756A1 (en) * 2007-05-30 2008-12-04 Koch James L Heat spreader compositions and materials, integrated circuitry, methods of production and uses thereof
US7791188B2 (en) 2007-06-18 2010-09-07 Chien-Min Sung Heat spreader having single layer of diamond particles and associated methods
WO2009010762A1 (en) 2007-07-19 2009-01-22 Photonstar Led Limited Vertical led with conductive vias
US9011563B2 (en) 2007-12-06 2015-04-21 Chien-Min Sung Methods for orienting superabrasive particles on a surface and associated tools
US20100022174A1 (en) * 2008-07-28 2010-01-28 Kinik Company Grinding tool and method for fabricating the same
TW201035396A (en) 2008-10-24 2010-10-01 Carnegie Inst Of Washington Enhanced optical properties of chemical vapor deposited single crystal diamond by low-pressure/high-temperature annealing
KR101501599B1 (ko) 2008-10-27 2015-03-11 삼성전자주식회사 그라펜 시트로부터 탄소화 촉매를 제거하는 방법 및 그라펜시트의 전사 방법
US20100186479A1 (en) 2009-01-26 2010-07-29 Araca, Inc. Method for counting and characterizing aggressive diamonds in cmp diamond conditioner discs
US20100203811A1 (en) 2009-02-09 2010-08-12 Araca Incorporated Method and apparatus for accelerated wear testing of aggressive diamonds on diamond conditioning discs in cmp
US20100213175A1 (en) 2009-02-22 2010-08-26 General Electric Company Diamond etching method and articles produced thereby
US7892881B2 (en) 2009-02-23 2011-02-22 Raytheon Company Fabricating a device with a diamond layer
US7851819B2 (en) 2009-02-26 2010-12-14 Bridgelux, Inc. Transparent heat spreader for LEDs
US20100212727A1 (en) 2009-02-26 2010-08-26 Ji Ung Lee Apparatus and methods for continuously growing carbon nanotubes and graphene sheets
KR101413030B1 (ko) 2009-03-24 2014-07-02 생-고벵 아브라시프 화학적 기계적 평탄화 패드 컨디셔너로 사용되는 연마 공구
US20100261419A1 (en) 2009-04-10 2010-10-14 Chien-Min Sung Superabrasive Tool Having Surface Modified Superabrasive Particles and Associated Methods
WO2012040374A2 (en) 2010-09-21 2012-03-29 Ritedia Corporation Superabrasive tools having substantially leveled particle tips and associated methods

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5178643A (en) * 1991-05-21 1993-01-12 Sunnen Products Company Process for plating super abrasive materials onto a honing tool
US5855314A (en) * 1997-03-07 1999-01-05 Norton Company Abrasive tool containing coated superabrasive grain
US5832360A (en) * 1997-08-28 1998-11-03 Norton Company Bond for abrasive tool
TW436375B (en) * 1999-11-16 2001-05-28 Asia Ic Mic Process Inc Formation method for dresser of chemical mechanical polishing pad
TWI228066B (en) * 2002-09-09 2005-02-21 Read Co Ltd Abrasive cloth dresser and method for dressing an abrasive cloth with the same
TWI286097B (en) * 2004-12-31 2007-09-01 Kinik Co Polishing tool and method for making the same
TWI290337B (en) * 2005-08-09 2007-11-21 Princo Corp Pad conditioner for conditioning a CMP pad and method of making the same
TW200806432A (en) * 2006-05-17 2008-02-01 Chien-Min Sung Superabrasive tools having improved caustic resistance

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US20140235018A1 (en) 2014-08-21
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US20120244790A1 (en) 2012-09-27
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WO2012040373A3 (en) 2012-06-21
TWI464839B (zh) 2014-12-11
CN103299418A (zh) 2013-09-11
TW201223704A (en) 2012-06-16
US20120241943A1 (en) 2012-09-27
US20150072601A1 (en) 2015-03-12
US8777699B2 (en) 2014-07-15
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WO2012040373A2 (en) 2012-03-29

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