TWI395306B - Heat-dissipating modularized structure of a semiconductor package and method of forming the same - Google Patents

Description

Heat dissipation modular structure of semiconductor package and preparation method thereof

The invention relates to a heat dissipation modular structure and a manufacturing method thereof, in particular to a heat dissipation modular structure of a semiconductor package and a manufacturing method thereof.

In the prior art, a flexible carrier board is used as a package wafer carrier to electrically connect a wafer to a flexible substrate, which can be roughly classified into a Tape Carrier Package (TCP) and a Chip on Film (COF). Technology, such as the driver IC packaging process of the display, with the TCP carrier board and the COF soft board as the package carrier of the driver IC, is the largest application of the related technology at present.

However, the integration of the semiconductor wafer operation will be accompanied by a large amount of heat, such as the heat generated by the semiconductor wafer is not effectively dissipated, which will seriously shorten the performance and life of the semiconductor wafer.

Therefore, in order to improve the heat dissipation efficiency of the semiconductor package, the concept of adding a heat dissipation structure to the package has emerged.

In this regard, as shown in FIG. 1 , a flip-chip thin film semiconductor package structure incorporating a heat dissipating member is disclosed in US Pat. No. 6,238,954, which is mainly to attach a semiconductor wafer 11 to the wafer carrier 10, and A molding compound 12 is formed to cover both sides of the semiconductor wafer 11, and an integrally formed dissipating member 13 is attached to the surface of the semiconductor wafer 11 to dissipate heat of the semiconductor wafer 11. .

However, in this package structure, the way the heat sink is attached is limited by the package junction. The size of the structure limits its ability to dissipate heat.

Another US Patent No. 5,866,953 discloses a semiconductor package structure having a heat-dissipating adhesive material. As shown in FIG. 2, the main structure is to first connect a semiconductor wafer 21 on the wafer carrier 20 in a flip chip manner, and form An under-fill encapsulant 22 is filled between the semiconductor wafer 21 and the wafer carrier 20, and a barrier glob top 23 is formed around the semiconductor wafer 21 to seal and The semiconductor wafer 21 is protected, and a heat-dissipating glob top 24 is placed in the recess of the barrier rubber 23 to dissipate the heat of the semiconductor wafer 21.

However, in the package structure, the heat dissipation adhesive 24 is attached to the back surface of the semiconductor wafer 21, and the heat dissipation effect is still limited by the size of the semiconductor wafer 21, and the heat dissipation efficiency cannot be effectively improved, and the implementation manner is complicated.

Referring to FIG. 3, another semiconductor package structure disclosed in Japanese Patent No. 11-251483 is mainly provided with a thin heat sink 32 having an opening 320 on the back side of the semiconductor wafer 31, the opening 320. The back surface of the semiconductor wafer 31 is exposed, and the heat generated by the semiconductor wafer 31 is dissipated by the film heat sink 32 and the opening 320.

However, in such a semiconductor package structure, the heat dissipation capability is still significantly limited by the package size, and the heat generated by the semiconductor wafer 31 is not directly taken away from the semiconductor wafer 31, but is mostly indirectly transmitted through the package structure by heat conduction. The metal stiffener 33 is conductively dissipated, and its heat dissipation efficiency is obviously poor.

The heat dissipating component combined in the above semiconductor package structure is limited in size by the size of the package structure itself, and is small in size and high in the semiconductor package structure applied to the tape carrier package or the flip chip technology. The characteristics of power are often limited by the fact that the heat dissipating component area of the package structure itself is too small to achieve effective heat dissipation.

Therefore, how to propose a heat dissipation modular structure of a semiconductor package to overcome the conventional problem that the heat sink area is too small and the heat dissipation is poor due to the size of the package structure has become an urgent problem to be solved in the industry.

In view of the above-mentioned shortcomings of the prior art, it is an object of the present invention to provide a heat dissipation modular structure of a semiconductor package and a method of fabricating the same to improve heat dissipation efficiency of the semiconductor package.

Another object of the present invention is to provide a heat dissipation modular structure of a semiconductor package and a method of fabricating the same to enhance the performance of the semiconductor wafer.

A further object of the present invention is to provide a heat dissipation modular structure of a semiconductor package and a method of manufacturing the same to simplify the process and facilitate modularization.

Another object of the present invention is to provide a heat dissipation modular structure of a semiconductor package and a method of fabricating the same, which can be increased by not limited to the size of the package.

A further object of the present invention is to provide a heat dissipation modular structure of a semiconductor package and a manufacturing method thereof, which can combine a package and an external electronic device in a simple manner, and at the same time improve heat dissipation performance.

To achieve the above objective, the heat dissipation modular structure of the semiconductor package of the present invention comprises: an external electronic device; at least one semiconductor package, The semiconductor package includes a wafer carrier, a semiconductor wafer attached to the wafer carrier, and a first heat sink attached to the semiconductor wafer, the first heat sink having a first receiving groove and a surrounding connection The first accommodating groove is configured to receive the semiconductor wafer, and the semiconductor package is electrically connected to the external electronic device by a wafer carrier thereof; The at least one second heat dissipating member is disposed on the first heat dissipating member of the semiconductor package, and the second heat dissipating member has a second receiving groove and a second joint portion connected to the second receiving groove. The second accommodating groove is configured to receive the first accommodating groove, and the second heat dissipating member is assembled in the semiconductor package by combining the second bonding portion with the first bonding portion of the first heat dissipating member The first heat dissipating member has a size larger than a size of the first heat dissipating member.

The present invention discloses a heat dissipation modular structure of a semiconductor package, comprising: an external electronic device; at least one semiconductor package, the semiconductor package comprising a wafer carrier and a semiconductor wafer attached to the wafer carrier And a first heat sink attached to the semiconductor wafer, and the semiconductor package is electrically connected to the external electronic device by a wafer carrier; and at least one second heat sink is disposed on the semiconductor heat sink a first heat sink of the semiconductor package, wherein the second heat sink is larger in size than the first heat sink, and the second heat sink is connected to the semiconductor package in a one-to-multiple manner On a heat sink.

The invention discloses a method for fabricating a heat dissipation modular structure of a semiconductor package, comprising: providing at least one semiconductor wafer including a wafer carrier, attached to the wafer carrier, and being attached to the semiconductor wafer a semiconductor package of the first heat sink, wherein the first heat sink has a first receiving groove for receiving the semiconductor chip and a first joint surrounding the first receiving groove; The semiconductor package is electrically connected to an external electronic device by the chip carrier; the at least one second heat sink is disposed on the first heat sink of the semiconductor package, wherein the second heat sink has a second receiving groove for receiving the first receiving groove and a second connecting portion surrounding the second receiving groove, wherein the second heat sink is connected to the first heat sink by the second joint portion thereof A bonding portion is combined and disposed on the first heat dissipating member of the semiconductor package, wherein the second heat dissipating member has a size larger than a size of the first heat dissipating member. The semiconductor package, the first heat sink, the external electronic device and the second heat sink are combined in a modular manner to improve the heat dissipation efficiency of the semiconductor package.

The external electronic device is, for example, a liquid crystal display (LCD) panel; the semiconductor package is, for example, a tape carrier package or a flip chip semiconductor package.

The first and second heat dissipating members may be made of a metal or alloy with good heat dissipation capability, and the first and second heat dissipating members may be conveniently combined by, for example, a fitting structure with respect to the concavities and convexities, or between the first and second heat dissipating members. Adding a heat-dissipating heat-dissipating adhesive for bonding; the second heat-dissipating member can be coupled to the first heat-dissipating member of the plurality of semiconductor packages to form a heat-dissipating module structure for enhancing heat dissipation performance, and the number of the second heat-dissipating members It is not limited to a single one, and may be divided into a plurality of parts according to the actual space limitation. Of course, the second heat dissipating member may also be correspondingly connected to the first heat dissipating member of the semiconductor package, and the size of the second heat dissipating member is Greater than the size of the first heat sink to enhance heat dissipation efficacy.

Therefore, the heat dissipation modular structure of the semiconductor package of the present invention and the method for manufacturing the same are provided, at least one semiconductor package comprising a wafer carrier, a semiconductor wafer attached to the wafer carrier, and a connection a first heat sink disposed on the semiconductor wafer to electrically connect the semiconductor package to an external electronic device by using the wafer carrier, and at least one second heat sink is disposed to the semiconductor package The first heat dissipating member has a size larger than a size of the first heat dissipating member, and is coupled to the semiconductor package, the first heat dissipating member, the external electronic device, and the second heat dissipating member through a modular manner In order to improve the heat dissipation efficiency of the semiconductor package, and to ensure that its heat dissipation capability is not limited to the size of the semiconductor package, thereby improving the performance of the semiconductor wafer.

Furthermore, the heat dissipation modular structure of the semiconductor package of the present invention and the method of manufacturing the same can reduce the heat dissipation capability of the semiconductor package without being limited to the size of the semiconductor package, and can be coupled to the external space through the second heat dissipation member. Increase the heat dissipation area.

In addition, in the heat dissipation modular structure of the semiconductor package, the size of the second heat dissipation component may be set according to the heat dissipation requirement of the overall heat dissipation modular structure, and may be electrically connected to the semiconductor package of the external electronic device. The standard first heat sink is connected to the device, so that one or more semiconductor packages having different chip sizes can be combined by the first heat sink and the second heat sink without different wafer sizes. Customized, this will increase the sharing and compatibility of the first heat sink, and reduce the production cost and process complexity of the semiconductor package. Product purpose. The heat dissipation capability of the heat dissipation module structure is determined by the combination of the second heat sink after the combination of the semiconductor package and the external electronic device, so as to avoid first attaching a size larger than the semiconductor package on the semiconductor package. The second heat sink causes problems such as inconvenient packaging and handling and complicated process.

The embodiments of the present invention are described below by way of specific examples, and those skilled in the art can readily appreciate other advantages and functions of the present invention from the disclosure herein. The present invention may be embodied or applied in various other specific embodiments, and various modifications and changes can be made without departing from the spirit and scope of the invention.

Please refer to FIGS. 4A-4C , which are schematic cross-sectional views showing a heat dissipation modular structure of a semiconductor package of the present invention and a manufacturing method thereof.

As shown in FIG. 4A, at least one semiconductor package 4 is provided, the semiconductor package 4 includes: a wafer carrier 40; at least one semiconductor wafer 41 is connected and electrically connected to the wafer carrier 40; A heat sink 42 is attached to the semiconductor wafer 41 and has a first receiving groove 420 for receiving the semiconductor wafer 41 and a first joint portion 421 surrounding the first receiving groove 420.

The semiconductor package 4 is provided with a wafer carrier 40 such as a flexible board or a film, wherein the surface of the wafer carrier 40 is provided with a plurality of pads 401 for the semiconductor wafer 41 to be flip-chip soldered by solder bumps. Block 44 is electrically coupled to the wafer carrier 40. The semiconductor wafer 41 An active surface 411 and an opposite non-active surface 412 are attached to the wafer carrier 40 by solder bumps 44 on the active surface 411 thereof, and are electrically connected to the surface of the wafer carrier 40. Solder pad 401.

A gap-on-fill underfill 45 is filled in the gap between the semiconductor wafer 41 and the wafer carrier 40 to suppress a difference in thermal expansion between the semiconductor wafer 41 and the wafer carrier 40 and to reduce the solder. The stress of the bumps 44.

The first heat sink 42 is then placed on the inactive surface 412 of the semiconductor wafer 41 through a thermally conductive adhesive layer 46. The first heat sink 42 is made of a metal or alloy having a heat dissipation capability such as copper or aluminum. And the first heat sink 42 is provided with a first joint portion 421.

As shown in FIG. 4B, at least one of the semiconductor package 4 is connected and electrically connected to an external electronic device 51 through a wafer carrier 40 such as a flexible board or a film. The external electronic device 51 is, for example, LCD panel.

As shown in FIG. 4C, at least one second heat sink 52 is provided to connect the second heat sink 52 to the first heat sink 42 of the semiconductor package 4.

The second heat dissipating member 52 is one of a metal of copper and aluminum or an alloy thereof, and has a second accommodating groove 520 for accommodating the first accommodating groove 420 and is connected to the second accommodating portion. The second heat sink 52 is coupled to the first joint portion 420 of the first heat sink 42 to form a first heat dissipation of the semiconductor package 4 by the second joint portion 521 of the slot 520. On the member 42, and the second joint portion 521 is opposite to the first In the embodiment, the first joint portion 421 of the first heat sink 42 and the second joint portion 521 of the second heat sink 52 are opposite concave and convex fitting structures. The second heat sink 52 is combined with the first heat sink 42 of the semiconductor package 4, or a thermal adhesive (not shown) may be disposed between the first heat sink 42 and the second heat sink 52. For bonding to each other.

In addition, the size of the second heat sink 52 is greater than the size of the first heat sink 42 , so the second heat sink 52 can be designed to combine one or a plurality of first heat sinks 42 .

Referring to FIGS. 5A and 5B, which are schematic plan views of a heat dissipation modular structure of a semiconductor package of the present invention, including an external electronic device 51; a semiconductor package 4, the semiconductor package 4 is formed by a wafer thereof The carrier 40 is electrically connected to the external electronic device 51; and the second heat sink 52 is disposed on the first heat sink 42 of the semiconductor package 4, wherein the second heat sink 52 is larger than the size The size of the first heat sink 42.

In this embodiment, the external electronic device 51 is, for example, a liquid crystal display panel, and further provides a plurality of semiconductor packages 4 having a first heat sink 42 (in this embodiment, four semiconductor packages are provided, but not The semiconductor package 4 is connected and electrically connected to the external electronic device 51 by a wafer carrier 40 such as a flexible board or a film, and the second heat sink 52 is assembled to the semiconductor. The first heat sink 42 of the package 4 is on the cover.

The second heat sink 52 can be coupled to the plurality of semiconductor packages 4 A heat dissipating module structure is formed on a heat dissipating member 42, and the number of the second heat dissipating members 52 is not limited to a single one. The second heat dissipating member 52 can be set to a single one according to the actual space configuration (eg, 5A is shown or a plurality of (as shown in FIG. 5B), of course, the second heat sink 52 can also be connected one-to-one to the first heat sink 42 of the semiconductor package 4, and the second heat sink The size of the member 52 is larger than the size of the first heat sink 42 to improve heat dissipation performance.

In addition, the size of the second heat sink 52 can be set according to the heat dissipation requirement of the overall heat dissipation module structure, and the first heat dissipation can be connected to the semiconductor package 4 to be electrically connected to the external electronic device 51. The component 42 (whether or not the semiconductor wafer specifications in the semiconductor package are the same), so that one or more semiconductor packages 4 having different wafer sizes can be combined by the first heat sink 42 and the second heat sink 52 Instead of being customized for different wafer sizes, the sharing and compatibility of the first heat sink 42 is increased, and the production cost and process complexity of the semiconductor package 4 are reduced, and the modular production is achieved. purpose.

Furthermore, in the present invention, the heat dissipation capability of the heat dissipation modular structure is determined by the combination of the second heat sink 52 after the combination of the semiconductor package 4 and the external electronic device 51, so that the semiconductor package 4 can be avoided. The second heat sink having a size larger than that of the semiconductor package 4 is connected to the second heat sink, which causes inconvenience in packaging and handling, and complicated process.

Therefore, the heat dissipation modular structure of the semiconductor package of the present invention and the method for manufacturing the same are provided, wherein the semiconductor package comprises a wafer carrier, a semiconductor wafer attached to the wafer carrier, And a first heat sink disposed on the semiconductor wafer to electrically connect the semiconductor package to an external electronic device by using the wafer carrier, and at least one second heat sink is disposed to the semiconductor a first heat sink of the package, wherein the second heat sink has a size larger than a size of the first heat sink, and is coupled to the semiconductor package, the first heat sink, the external electronic device, and the second through a modular manner The heat sink is used to improve the heat dissipation efficiency of the semiconductor package while ensuring that the heat dissipation capability is not limited to the size of the semiconductor package, thereby improving the performance of the semiconductor wafer.

In addition, the heat dissipation modular structure and the manufacturing method thereof of the semiconductor package of the present invention can reduce the heat dissipation capability of the semiconductor package without being limited to the size of the semiconductor package, and can increase the heat dissipation area by combining the external device space.

Furthermore, since the present invention provides a first bonding portion and a second bonding portion, for example, a fitting structure on the first heat sink of the semiconductor package and the second heat sink, the user can easily use the second The heat sink is assembled to the first heat sink of the semiconductor package.

The above-described embodiments are merely illustrative of the principles of the invention and its effects, and are not intended to limit the invention. Modifications and variations of the above-described embodiments can be made by those skilled in the art without departing from the spirit and scope of the invention. Therefore, the scope of protection of the present invention should be as set forth in the scope of the claims described below.

10,20,40‧‧‧ wafer carrier

11,21,31,41‧‧‧ semiconductor wafer

22‧‧‧Bottom fill

23‧‧‧Resistance adhesive

24‧‧‧heating adhesive

32‧‧‧film heat sink

320‧‧‧ openings

33‧‧‧Metal reinforcement

4‧‧‧Semiconductor package

401‧‧‧ solder pads

411‧‧‧ active face

412‧‧‧Inactive surface

42‧‧‧First heat sink

420‧‧‧First accommodating slot

421‧‧‧ First Joint Department

44‧‧‧ solder bumps

45‧‧‧Fladding bottom filling

46‧‧‧ Thermal adhesive layer

51‧‧‧External electronic devices

52‧‧‧second heat sink

520‧‧‧Second accommodating slot

521‧‧‧Second junction

Figure 1 is a schematic cross-sectional view of a semiconductor device incorporating a heat sink disclosed in U.S. Patent No. 6,258,954, the disclosure of which is incorporated herein by reference. FIG. 3 is a schematic cross-sectional view of a semiconductor device disclosed in Japanese Patent No. 11-221483; and FIGS. 4A to 4C are a heat dissipating modular structure of a semiconductor package of the present invention and a method for manufacturing the same FIG. 5A and FIG. 5B are schematic plan views showing the heat dissipation modular structure of the semiconductor package of the present invention.

4‧‧‧Semiconductor package

40‧‧‧ wafer carrier

401‧‧‧ solder pads

41‧‧‧Semiconductor wafer

42‧‧‧First heat sink

420‧‧‧First accommodating slot

421‧‧‧ First Joint Department

44‧‧‧ solder bumps

45‧‧‧Fladding bottom filling

51‧‧‧External electronic devices

52‧‧‧second heat sink

520‧‧‧Second accommodating slot

521‧‧‧Second junction

Claims (22)

A method for fabricating a heat dissipation modular structure of a semiconductor package, comprising: providing at least one semiconductor wafer including a wafer carrier, attached to the wafer carrier, and a first heat sink attached to the semiconductor wafer The semiconductor package has a first receiving groove for receiving the semiconductor chip and a first bonding portion surrounding the first receiving groove; the semiconductor package is used by the semiconductor package The chip carrier is electrically connected to an external electronic device; and the at least one second heat sink is disposed on the first heat sink of the semiconductor package, wherein the second heat sink has a a second accommodating groove accommodating the groove and a second joint portion connected to the second accommodating groove, the second heat dissipating member is combined with the first joint portion of the first heat dissipating member by the second joint portion thereof The first heat sink is disposed on the first heat sink of the semiconductor package, and the second heat sink is larger in size than the first heat sink. The method for manufacturing a heat dissipation modular structure of a semiconductor package according to claim 1, wherein the external electronic device is a display panel. The method for fabricating a heat dissipation modular structure of a semiconductor package according to claim 1, wherein the wafer carrier is provided with a plurality of pads for the semiconductor wafer to be flip-chip mounted on the wafer carrier. The method for manufacturing a heat dissipation modular structure of a semiconductor package according to claim 1, wherein the semiconductor package is a tape carrier package (Tape Carrier Package, TCP) and one of chip-on-film (COF) semiconductor packages. The method for manufacturing a heat dissipation modular structure of a semiconductor package according to claim 1, wherein the first and second heat dissipation members are one of copper, aluminum and an alloy thereof. The method for manufacturing a heat dissipation modular structure of a semiconductor package according to claim 1, wherein the wafer carrier is one of a soft board and a film. The heat-dissipating modular structure of the semiconductor package of claim 1, wherein the first heat-dissipating member and the second heat-dissipating member are provided with a thermal conductive adhesive for bonding to each other. The method for manufacturing a heat dissipation modular structure of a semiconductor package according to claim 1, wherein the second heat dissipation member is selectively connected to the first heat dissipation member of the semiconductor package in a one-to-one or one-to-many manner. . The method for manufacturing a heat dissipation modular structure of a semiconductor package according to claim 1, wherein the first heat dissipation member and the second heat dissipation member have opposite first and second bonding portions. The method for manufacturing a heat dissipation modular structure of a semiconductor package according to claim 9, wherein the first and second bonding portions of the first and second heat dissipating members are opposite concave and convex fitting structures. The method for manufacturing a heat dissipation modularized structure of a semiconductor package according to claim 1, wherein the external electronic device is electrically connected to the plurality of semiconductor packages, and each of the semiconductor packages has a semiconductor chip of a different size and is connected Standardized first heat sink for each of the semiconductors The body package is coupled to the second heat sink by the first heat sink. A heat dissipation modular structure of a semiconductor package includes: an external electronic device; at least one semiconductor package including a wafer carrier, a semiconductor wafer attached to the wafer carrier, and a connection a first heat dissipating member having a first receiving groove and a first bonding portion connected to the first receiving groove, the first receiving groove for receiving the semiconductor a semiconductor chip is electrically connected to the external electronic device by a chip carrier; and at least one second heat sink is disposed on the first heat sink of the semiconductor package, the second The heat dissipating member has a second receiving groove and a second connecting portion connected to the second receiving groove, wherein the second receiving groove is for receiving the first receiving groove, and the second heat dissipating member is The second bonding portion is combined with the first bonding portion of the first heat dissipating member to be disposed on the first heat dissipating member of the semiconductor package, wherein the second heat dissipating member has a size larger than a size of the first heat dissipating member. A heat dissipation modular structure of a semiconductor package includes: an external electronic device; at least one semiconductor package including a wafer carrier, a semiconductor wafer attached to the wafer carrier, and a connection a first heat sink on the semiconductor wafer, and the semiconductor package is electrically connected to the external electronic device by a wafer carrier; The at least one second heat dissipating member is disposed on the first heat dissipating member of the semiconductor package, wherein the second heat dissipating member has a size larger than a size of the first heat dissipating member, and the second heat dissipating member is a The multi-mode is mounted on the first heat sink of the semiconductor package. The heat dissipation modular structure of the semiconductor package of claim 12 or 13, wherein the external electronic device is a display panel. The heat-dissipating modular structure of the semiconductor package of claim 12 or 13, wherein the wafer carrier is provided with a plurality of pads for the semiconductor wafer to be flip-chip mounted on the wafer carrier. The heat dissipation modular structure of the semiconductor package of claim 12 or 13, wherein the semiconductor package is one of a tape carrier package and a flip chip semiconductor package. The heat dissipating modular structure of the semiconductor package of claim 12 or 13, wherein the first and second heat dissipating members are one of copper, aluminum and alloys thereof. The heat dissipation modular structure of the semiconductor package of claim 12 or 13, wherein the wafer carrier is one of a soft board and a film. The heat dissipating modular structure of the semiconductor package of claim 12 or 13, wherein the first heat dissipating member and the second heat dissipating member are provided with a thermal conductive adhesive for bonding to each other. The heat dissipating modular structure of the semiconductor package of claim 12 or 13, wherein the first heat dissipating member and the second heat dissipating member have opposite first and second bonding portions. The heat dissipation modular structure of the semiconductor package of claim 20, wherein the first and second bonding portions of the first and second heat dissipating members are opposite concave and convex fitting structures. The heat-dissipating modular structure of the semiconductor package of claim 12 or 13, wherein the external electronic device is electrically connected to the plurality of semiconductor packages, and each of the semiconductor packages has a semiconductor chip of a different size and is connected The first heat sink is standardized for the semiconductor package to be combined with the second heat sink by the first heat sink.