TWI380878B - Combined Dressing Machine and Its Making Method - Google Patents

Description

Combined dresser and its preparation method

The present invention relates to a dresser and a method of making the same, and more particularly to a combined dresser for a CMP pad and a method of making same.

Chemical Mechanical Planarization (CMP) is currently the most attractive technology in the process of flattening the surface of semiconductor wafers. In the chemical mechanical polishing process, the function of the polishing pad is to stably and uniformly transfer the polishing liquid between the wafer and the polishing pad, and to deposit a deposition layer on the wafer under the interaction of chemical etching and mechanical grinding. Remove.

In order to meet the demand for wafer processing and to maintain the stability of the quality, it is necessary to use a diamond dresser to trim the polishing pad in a timely manner during the chemical mechanical polishing process, except to remove the polishing by-products of the surface. The rough surface of the polishing pad improves its ability to hold the slurry and restores the pores on the surface of the polishing pad and its ability to hold and transport the polishing liquid. This saves the cost of the polishing pad and meets the requirements for stable quality during wafer mass production. .

The traditional diamond dresser is to fix the average particle size of the diamond particles on a metal plate. This diamond dresser is suitable for trimming hard polishing pads (such as IC1000). The function of the traditional dresser is not only to remove the waste generated when polishing the wafer, but also to cut a polishing pad to restore the roughness of the polishing pad, but this traditional type of diamond dresser is not suitable for 45 CMP process below m (nm). Since the line width of the integrated circuit is becoming smaller, for example, the process of starting 65 nanometers (nm) is started in 2006, the wafer The requirements for surface flattening and smoothness are getting higher and higher, and the requirements for trimming the polishing pad are getting higher and higher. It is expected that the 45nm process in 2010 must be polished at very low pressure to avoid wear through the nano-scale copper wire and the fragile low dielectric constant (Low K) resistance layer. Therefore, the trimmed polishing pad requires higher flatness and needs to be redesigned to meet the needs of large-size wafers. In addition to the diamond particle distribution rules of the dresser, the future diamond dresser has higher requirements for the leveling of the tip; in addition, the dresser needs to engrave a finer and more uniform engraving on the polishing pad. However, on the contrary, the dresser has a lower removal rate of the polishing pad, which is not possible with conventional dressers.

Patent application No. 1,228,066 discloses a dressing device for a polishing cloth and a dressing method for the polishing cloth used therefor, comprising a metal table provided with an adjusting mechanism for adjusting all or a part of the group of grindstone particles. The height difference of the reference plane formed by the front ends of the majority of the grindstone particles.

The diamond dresser disclosed in Taiwan Patent Publication No. 200821093 includes a different type of diamond enamel adhered to each diamond enamel bonding portion, and the diamond 黏 particle bonding portion and the dresser substrate are fixed by bolts or The adhesive is fixed.

The trimmer disclosed in U.S. Patent No. 6,054,183, the disclosure of which is incorporated herein by reference to the entire disclosure of the entire disclosure of the entire disclosure of the present disclosure.

International Patent Publication No. WO 00/64630 discloses that an abrasive layer comprises a plurality of abrasive grains comprising an organic resin and a metal salt. (Metal salt) and diamond abrasive particles interspersed between most abrasive grains.

A finisher disclosed in U.S. Patent No. 2,060,128,288, which includes a plurality of diamond particles fixed to a metal substrate by a metal bond layer.

The finisher disclosed in Japanese Laid-Open Patent Publication No. JP2006-315088 includes a disk-shaped abutment combined with a plurality of circular PCD diamond pieces.

Generally, the size of the dresser is about 108 mm (mm). Because the area is large, the amount of deformation is large. It is not easy to combine abrasive grains of various sizes, shapes and materials, and the apexes of most abrasive particles are the same. The height and the large area of the dresser are higher.

The present invention has been proposed in order to make it easier for a larger area finisher to incorporate abrasive grains of various sizes, shapes, materials, and to have the apexes of a plurality of abrasive particles at the same height.

The main object of the present invention is to provide a combined dresser and a method for manufacturing the same polishing end surface of a large substrate to combine a plurality of small substrates having abrasive grains, which makes it easier to make the cutting ends of most abrasive grains at the same height, and is easier. Combine abrasive grains of various sizes, shapes and materials.

Another object of the present invention is to provide a combined dresser and method of making the same that saves manufacturing cost of the dresser and can vary different abrasive grains as needed.

For other purposes and functions of the present invention, please refer to the drawings and the embodiments, which are described in detail below.

As shown in FIGS. 1 and 2, the combined refiner 1 of the first embodiment of the present invention, particularly as a dresser for a CMP pad, comprises a large substrate 11, a plurality of polishing units 12, and a plurality of elastic units 13.

As shown in FIG. 2, the large substrate 11 is provided with a joint surface 110 and a ring wall 111 around the protruding joint surface 110; the joint surface 110 is provided with a plurality of grooves 112 corresponding to the grinding unit 12; the plurality of grinding units 12 and the plurality of elastic units respectively 13 are stacked and respectively placed in the plurality of grooves 112; there is an elastic unit 13 between each of the grinding units 12 and the large substrate 11; the grinding unit 12 may protrude all or part of the grooves 112.

The polishing unit 12 includes a small substrate 120 and a plurality of abrasive grains 121; one surface 122 of the small substrate 120 is combined with a plurality of abrasive grains 121; the abrasive particles 121 have a cutting end 123 for cutting a workpiece; and the small substrate 120 is provided opposite to The other surface 124 of the plurality of abrasive grains 121 contacts the elastic unit 13. The height difference between the plurality of cutting ends 123 and the large substrate 11 is adjusted to be within 20 micrometers by the plurality of elastic units 13 respectively, so that the difference between the height of the plurality of cutting ends 123 and the plane 15 is within 20 micrometers, and then by the bonding agent layer 14 The large substrate 11 and the small substrate 120 of the plurality of polishing units 12 are fixedly coupled.

As shown in FIG. 2 and FIG. 3, the manufacturing method of the combined dresser 1 of the first embodiment of the present invention comprises the following steps: 1. The plurality of elastic units 13 are respectively placed on the plurality of grooves 112 of the joint surface 110 of the large substrate 11. 2. The plurality of grinding units 12 are respectively overlapped with the plurality of elastic units 13; the plurality of elastic units 13 respectively apply the force of the plurality of grinding units to leave the large substrate 11; wherein the grinding unit 12 has a small substrate 120, a small base One side 122 of the plate 120 is provided with a plurality of abrasive grains 121; the cutting ends 123 of the plurality of abrasive grains 121 respectively protrude from the grooves 112; 3. The cutting ends 123 of the plurality of abrasive grains 121 are applied to the large substrate in the same horizontal direction. The force of 11 is equalized by the pressure applied to the grinding unit 12 of the flat plate 16 and the elastic force of the plurality of elastic units 13 pushing the grinding unit 12, so that the height difference between the plurality of cutting ends 123 and the large substrate 11 is within 20 μm. The height difference between the plurality of cutting ends 123 and a plane 15 is within 20 micrometers; 4. the large substrate 11 is fixed to the small substrate 120 of the plurality of polishing units 12 by the bonding agent layer 14, so that the plurality of cutting ends 123 are fixed. A combined dresser 1 is formed.

As shown in Figures 1, 2, 4, 5 and 6, the combined dresser 2 of the second embodiment of the present invention, the combined dresser 3 of the third embodiment, and the combined dresser 4 of the fourth embodiment are respectively The structure of the combined dresser 1 of the first embodiment described above is substantially the same except that the arrangement of the plurality of polishing units 12 in combination with the large substrate 11 is different. The plurality of grinding units 12 of the combined dresser 2 of the second embodiment have a shape having a center and a plurality of concentric rings arranged around the center, as shown in FIG. The plurality of grinding units 12 of the combined dresser 3 of the third embodiment have a matrix-arranged shape as shown in FIG. The plurality of grinding units 12 of the combined dresser 4 of the fourth embodiment have an annular array shape as shown in FIG.

1, 2, 7, 8, 9, and 10, the first polishing unit 21, the second polishing unit 22, the third polishing unit 23, and the fourth polishing unit 24 of the present invention are the same as those shown in Figs. The structure of the unit 12 is compared, except that the plurality of abrasive grains 211, 221, 231, 241, 121 are combined with the small substrates 210, 220, 230, 240, 120 exhibit different arrangement shapes, and the rest of the structure is substantially the same. The arrangement of the plurality of abrasive grains 211, 221, 231, 241, 121 may have a plurality of different arrangement shapes as needed. The plurality of abrasive grains 211 of the first polishing unit 21 have a shape radiating from the center to the periphery, as shown in FIG. The plurality of abrasive grains 221 of the second polishing unit 22 are arranged in a concentric circle shape as shown in FIG. The plurality of abrasive grains 231 of the third polishing unit 23 have a matrix arrangement shape as shown in FIG. The plurality of abrasive grains 241 of the fourth polishing unit 24 are arranged in a symmetrical arrangement as shown in FIG.

As shown in FIGS. 11 and 12, the combined refiner 5 of the fifth embodiment of the present invention, particularly as a dresser for a CMP pad, comprises a large substrate 51, a plurality of polishing units 52, and a plurality of elastic units 53.

The large substrate 51 includes a first bracket 511 and a bonding agent layer 512. The first bracket 511 is disposed in a first mold 54. The first mold 54 is provided with a plurality of grooves 541. The first bracket 511 is provided with a plurality of elastic units. a plurality of penetrating holes 513 of 53; a plurality of grinding units 52 respectively overlapping the plurality of elastic units 53 and respectively disposed in the plurality of grooves 541, such that an elastic unit 53 is provided between each of the grinding units 52 and the first die 54; The groove 541 can be protruded in whole or in part by 52. The grinding unit 52 includes a small substrate 520 in combination with a plurality of abrasive grains 521; the abrasive particles 521 have cutting ends 522 that can cut a CMP polishing pad 17. The height difference between the plurality of cutting ends 522 and the large substrate 51 is adjusted to be within 20 micrometers by the plurality of elastic units 53 respectively, so that the height difference between the plurality of cutting ends 522 and a plane 15 is within 20 micrometers, and then by the bonding agent layer 512 The first bracket 511 and the small substrate 520 of the plurality of grinding units 52 are fixedly coupled. The first bracket 511 covers the bonding agent layer 512 to increase the strength of the whole of the large substrate 51, but may not directly require the bonding layer by the first bracket 511. 512 constitutes a large substrate 51.

As shown in FIGS. 11, 12 and 13, the manufacturing method of the combined dresser 5 of the fifth embodiment of the present invention comprises the following steps: 1. placing a first bracket 511 in a first mold 54 and then making the plurality of elastics The units 53 are respectively placed in the plurality of grooves 541 of the first mold 54; 2. The plurality of grinding units 52 are respectively overlapped with the plurality of elastic units 53; the plurality of elastic units 53 respectively apply the force of the plurality of grinding units 52 to leave the first mold 54 The grinding unit 52 has a small substrate 520, and the small substrate 520 is provided with a plurality of abrasive grains 521; the cutting ends 522 of the plurality of abrasive grains 521 respectively protrude from the first bracket 511; 3. a plurality of grindings are applied to the same horizontal direction of a flat plate 16 The cutting end 522 of the pellet 521 abuts against the force of the first mold 54, and the pressure of the grinding unit 52 of the flat plate 55 and the elastic force of the plurality of elastic units 53 push the grinding unit 52 are equal, so that the plurality of cutting ends 522 and The height difference of a plane 15 is within 20 micrometers; 4. The first substrate 511 and the plurality of small substrates 520 are bonded by the bonding agent layer 512, and the large substrate 51 is fixedly coupled to the plurality of polishing units 52, so that the plurality of cutting ends 522 are fixed. Forming a combined dresser 5.

As shown in Figs. 14, 15, and 16, the manufacturing method of the combined dresser 6 of the sixth embodiment of the present invention comprises the following steps: 1. placing a fixed mold 61 and an elastic unit 62 stacked one on top of the second mold. 63; 2. The cutting end 641 of the plurality of abrasive grains 640 of the plurality of grinding units 64 The plurality of holes 611 passing through the fixed mold 61 are in contact with the elastic unit 62; wherein the grinding unit 64 has a small substrate 642, and the small substrate 642 is provided with a plurality of abrasive grains 640; 3. a plurality of abrasive grains are applied to the same horizontal direction of a flat plate 16 The cutting end 641 of the 640 penetrates into the pierceable unit 62, and the cutting end 641 can contact a bottom wall 631 of the second mold 63 such that the height difference between the plurality of cutting ends 641 and a plane 15 is within 20 micrometers, as shown in FIG. 4. The second holder 651 is fixed to the small substrate 642 of the plurality of polishing units 64 by the bonding agent layer 652, so that the plurality of cutting ends 641 are fixed; 5. The pierceable unit 62 is separated from the plurality of cutting ends 641 to form a The combined dresser 6; wherein the second bracket 651 and the bonding agent layer 652 constitute a large substrate 65, as shown in FIG.

The above step (5) can further separate the fixed mold 61 from the plurality of grinding units 64 so that the combined dresser 6 shown in Fig. 15 does not include the fixed mold 61. The pierceable unit 62 can be a double sided tape.

The combined dresser 6 of the sixth embodiment of the present invention comprises a large substrate 65, a plurality of grinding units 64 and a fixed mold 61. The large substrate 65 includes a second holder 651 and a bonding agent layer 652. The polishing unit 64 has a small substrate 642. The small substrate 642 is provided with a plurality of abrasive grains 640. The cutting ends 641 of the plurality of abrasive grains 640 respectively pass through the fixed mold 61. The hole 611; the bonding agent layer 652 fixes the second bracket 651 to the small substrate 642 of the plurality of grinding units 64, so that the plurality of cutting ends 641 are fixed and the height difference from a plane 15 is within 20 micrometers, as shown in FIG. The dresser 6 may also not include the fixed mold 61.

The material of the abrasive particles of the present invention may be artificial or non-artificial diamond, polycrystalline diamond (PCD), cubic boron nitride (CBN), polycrystalline cubic boron nitride (PCBN), hardest crystal, polycrystalline material, or The above materials are composed of a mixed material or the like.

The large substrate, the first bracket and the second bracket of the present invention may be of any shape, thickness, or material, and have the ability to support abrasive grains, and can achieve the function of supporting and fixing the abrasive grains; the substrate can be composed of a strong material. , consisting of a solid powder or gel-like material formed in the process, or composed of a resilient material; typical large substrate materials include metals, metal alloys, plastics, ceramics, carbon products, and A mixture of the above materials is preferably 316L stainless steel.

The fixed mold of the present invention can be any shape, thickness, or material, and has the ability to fix the abrasive grains, and can achieve the effect of fixing the abrasive grains; the typical fixed mold material includes metal, metal alloy, plastic material (Polymer), A ceramic material, a carbon material, and a mixture of the above materials, wherein stainless steel is representative of the embodiment.

The material of the bonding agent layer of the present invention comprises a metal, a metal alloy, a plastic material, a ceramic material, a carbon material, and a mixture of the above materials, wherein the plastic material is representative of the embodiment, and a solder alloy material may also be included.

The large substrate of the present invention may be in the form of a disk having a diameter of about 80 to 120 centimeters (mm). The small substrate may be in the form of a disk having a diameter of about 10 to 30 cm and preferably 20 cm. The size of the abrasive particles is from 100 to 500 micrometers, preferably from 160 to 200 micrometers. A preferred embodiment of the large substrate of the present invention may be made of stainless steel. Or an epoxy resin material, the large substrate is directly formed by epoxy resin without bonding the bonding layer, and the plurality of small substrates are consolidated; the preferred embodiment of the bonding agent layer may be a resin material; The preferred embodiment may be bonded by resin or by a copper-zinc alloy containing chromium or titanium; the outer surface of the small substrate has a nickel-containing plating layer. The preferred embodiment of the elastic unit may be made of a material such as a rubber material, a spring, a semi-solidified plastic, a silicone rubber, a semi-solidified glue or a foam.

The invention utilizes a combined method to first manufacture a plurality of grinding units, and the small grinding unit is relatively easy to make the cutting ends of the plurality of abrasive grains at the same height, and then combines the plurality of grinding units into a large-area combined dresser, which is easy to make large The cutting ends of the majority of the abrasive particles of the area combination dresser are at the same height. The invention has the advantages that the manufacturing of the small grinding unit is low in cost, and the combined dresser can change different abrasive grains as needed. For example, the outer ring of the combined dresser can use a larger size diamond, and the inner ring can be made smaller in size. Diamonds; or the outer ring can be used with poor cutting ability, but more wear-resistant, crystal-shaped diamonds, the inner ring can be used with good cutting ability, but not wear-resistant, crystal-shaped diamonds. The diamond particles of the same small grinding unit have the same size, shape and material, but the diamond particles of the plurality of grinding units in the combined dresser may have the same or different diamond size, shape and material. By combining a plurality of grinding units into a larger combined dresser, the cutting speed and wear rate of the combined dresser can be controlled.

The above description is only for the embodiments of the present invention, and any modifications and variations made by those skilled in the art using the present invention are the scope of the invention claimed, and are not limited to the embodiments disclosed.

1, 2, 3, 4, 5, 6‧‧‧ combined dresser

11, 51, 65‧‧‧ large substrate

110‧‧‧ joint surface

111‧‧‧Circle

112‧‧‧ Groove

12, 52, 64‧‧‧ grinding unit

120, 210, 220, 230, 240, 520, 642‧‧‧ small substrate

121, 211, 221, 231, 241, 521, 640‧‧‧ abrasive grains

122‧‧‧ Face

123, 522, 641‧‧‧ cutting end

124‧‧‧The other side

13, 53‧‧‧Flexible unit

14,512, 652‧‧‧ Bonding layer

15‧‧‧ plane

16‧‧‧ tablet

17‧‧‧CMP polishing pad

511‧‧‧First bracket

513‧‧‧through hole

54‧‧‧First mould

541‧‧‧ Groove

61‧‧‧Fixed mould

611‧‧‧through hole

62‧‧‧ pierceable unit

63‧‧‧Second mold

631‧‧‧ bottom wall

651‧‧‧second bracket

1 is a schematic view of a combined dresser according to a first embodiment of the present invention.

2 is a schematic view of the AA cross section and a flat plate of FIG. 1.

Fig. 3 is a flow chart showing the method of manufacturing the combined dresser of the first embodiment of the present invention.

4 is a schematic view of a combined dresser in accordance with a second embodiment of the present invention.

Figure 5 is a schematic illustration of a combined dresser in accordance with a third embodiment of the present invention.

Figure 6 is a schematic view of a combined dresser in accordance with a fourth embodiment of the present invention.

Figure 7 is a schematic illustration of a first polishing unit of the present invention.

Figure 8 is a schematic view of a second grinding unit of the present invention.

Figure 9 is a schematic view of a third grinding unit of the present invention.

Figure 10 is a schematic view of a fourth polishing unit of the present invention.

Figure 11 is a schematic view showing the fabrication of a combined dresser in accordance with a fifth embodiment of the present invention.

Figure 12 is a schematic view of a combined dresser and workpiece in accordance with a fifth embodiment of the present invention.

Figure 13 is a flow chart showing the method of manufacturing the combined dresser of the fifth embodiment of the present invention.

Figure 14 is a schematic view showing the manufacture of a combined dresser of a sixth embodiment of the present invention.

Figure 15 is a schematic view of a combined dresser in accordance with a sixth embodiment of the present invention.

Figure 16 is a flow chart showing the method of manufacturing a combined dresser according to a sixth embodiment of the present invention.

1‧‧‧Combined dresser

11‧‧‧ Large substrate

110‧‧‧ joint surface

111‧‧‧Circle

112‧‧‧ Groove

12‧‧‧grinding unit

120‧‧‧Small substrate

121‧‧‧ abrasive grain

122‧‧‧ Face

123‧‧‧ cutting end

124‧‧‧The other side

13‧‧‧elastic unit

14‧‧‧Binder layer

15‧‧‧ plane

16‧‧‧ tablet

Claims (33)

A combined dresser, which is a dresser for a CMP polishing pad, comprising: a large substrate provided with a joint surface; the joint surface is provided with a plurality of grooves; a plurality of elastic units are respectively placed in the plurality of grooves; a unit, the plurality of grinding units respectively have a small substrate; one side of the plurality of small substrates is respectively provided with a plurality of abrasive grains; the plurality of abrasive grains respectively have a cutting end; and the plurality of small substrates are opposite to the other side of the plurality of abrasive grains Separatingly contacting the plurality of elastic units to elastically adjust the cutting end of the plurality of abrasive grains to protrude the height of the large substrate; and fixing the large substrate and the small substrate of the plurality of polishing units by a bonding agent layer The combination; wherein the cutting ends of the plurality of abrasive grains respectively differ from the height of a plane by 20 microns. The combination dresser of claim 1, wherein the cutting end of the plurality of abrasive grains protrudes from the same height of the large substrate. The combination dresser of claim 1, wherein the material of the large substrate comprises one of a metal, a metal alloy, a plastic material, a ceramic product, a carbon product, and a mixture of the above materials. The combination dresser of claim 3, wherein the material of the large substrate is 316L stainless steel material. The combination dresser of claim 1, wherein the plurality of abrasive grains and the small substrate are fixed by resin bonding or by one of copper-zinc alloys. The combined dresser of claim 5, wherein the copper and zinc The alloy contains one of chromium or titanium. The combination dresser of claim 6, wherein the outer surface of the small substrate has a plating layer. The combination dresser of claim 7, wherein the plating layer contains nickel. The combination dresser of claim 1, wherein the small substrate is disc-shaped and has a diameter of 10-30 cm. The combination dresser of claim 9, wherein the small substrate has a diameter of 20 cm. The combination dresser of claim 1, wherein the plurality of abrasive grains have a shape that radiates from the center to the periphery. The combination dresser of claim 1, wherein the plurality of abrasive grains are arranged in a concentric arrangement. The combination dresser of claim 1, wherein the plurality of abrasive grains are arranged in a matrix. The combination dresser of claim 1, wherein the plurality of abrasive grains have a symmetrical arrangement shape. The combination dresser of claim 1, wherein the plurality of elastic units are respectively made of one of a rubber material, a spring, a semi-solidified plastic, a silicone rubber, a semi-solidified glue or a foam. The combination dresser of claim 1, wherein the large substrate is disc-shaped and has a diameter of 80-120 cm. The combination dresser of claim 1, wherein the abrasive particles have a size of from 100 to 500 microns. The combination dresser of claim 17, wherein the abrasive particles have a size of from 160 to 200 microns. The combination dresser of any one of claims 1 to 18, wherein the plurality of grinding units are in a shape having a center and a plurality of concentric rings around the center, in a matrix arrangement or in a ring shape. One of the shapes of the shape. A combined dresser comprising: a large substrate; a plurality of grinding units each having a small substrate; one side of the plurality of small substrates respectively provided with a plurality of abrasive grains; the plurality of abrasive grains respectively having cutting ends; the plural And contacting the plurality of elastic units with respect to the other surface of the small substrate, wherein the plurality of elastic units are elastically adjusted by the plurality of elastic units to protrude the cutting end of the plurality of abrasive grains; wherein the large substrate comprises a first a bracket and a bonding agent layer; the first bracket is provided with a plurality of penetrating holes for receiving the plurality of elastic units; the bonding agent layer is fixedly coupled to the first bracket and the plurality of small substrates; and the cutting ends of the plurality of abrasive grains are respectively The height difference of a plane is within 20 microns. The combination dresser of claim 20, wherein the plurality of grinding units are in the shape of a center and a plurality of concentric rings around the center, in a matrix arrangement or in a ring shape. One of them. A combined dresser comprising: a large substrate; a plurality of grinding units each having a small substrate; one side of the plurality of small substrates respectively provided with a plurality of abrasive grains; the plurality of abrasive grains respectively having cutting ends; The plurality of grinding units are respectively fixedly coupled to the large substrate; the difference between the cutting ends of the plurality of abrasive grains and a plane is within 20 micrometers; Wherein the large substrate is combined with a fixed mold; the fixed mold is provided with a plurality of holes; the cutting ends of the plurality of abrasive grains respectively pass through the plurality of holes. The combined dresser of claim 22, wherein the large substrate comprises a second bracket and a bonding agent layer; the bonding agent layer is fixedly coupled to the second bracket and the plurality of small substrates. The combination dresser of claim 22 or 23, wherein the plurality of grinding units are in the shape of a center and a plurality of concentric rings around the center, in a matrix arrangement or in a ring shape. One of them. A method for manufacturing a combined dresser, comprising the steps of: (1) placing a plurality of elastic units in a plurality of grooves of a joint surface of a large substrate; (2) overlapping the plurality of grinding units with the plurality of elastic units The plurality of elastic units respectively apply the force of the plurality of polishing units to leave the large substrate; (3) the force of the same horizontal direction of the cutting end of the plurality of abrasive grains toward the large substrate, by the flat plate Applying the pressure of the plurality of grinding units and the elastic force of the plurality of elastic units to push the plurality of grinding units to be equal, so that the difference between the height of the plurality of cutting planes and a plane is within 20 micrometers; (4) by the layer of the bonding agent The large substrate is fixedly coupled to the plurality of grinding units such that the plurality of cutting ends are fixed to form the combined dresser. The method of manufacturing a combined dresser according to claim 25, wherein the plurality of grinding units respectively have a small substrate; one side of the plurality of small substrates is respectively provided with a plurality of abrasive grains; the plurality of abrasive grains respectively have cutting ends; The cutting ends of the plurality of abrasive grains respectively protrude the large substrate. A method for manufacturing a combined dresser includes the following steps: (1) placing the plurality of elastic units in a plurality of grooves of a first mold; (2) overlapping the plurality of grinding units with the plurality of elastic units; respectively, applying the plurality of elastic units to the first plurality of grinding units to leave the first The force of the mold; (3) the force of the flat end of the plurality of abrasive grains applied to the first mold in the same horizontal direction, and the pressure of the plurality of grinding units and the plurality of elastic units are respectively applied by the flat plate The elastic forces of the ejector grinding units are respectively in an equal state, so that the height difference between the plurality of cutting ends and a plane is within 20 micrometers; (4) combining a large substrate with the plurality of grinding units, so that the plurality of cutting ends are fixed The combined dresser is formed. The method of manufacturing a combined dresser according to claim 27, wherein the plurality of grinding units respectively have a small substrate; one side of the plurality of small substrates is respectively provided with a plurality of abrasive grains; the plurality of abrasive grains respectively have cutting ends; The cutting ends of the plurality of abrasive grains respectively protrude the large substrate. The method of manufacturing the combined dresser of claim 28, wherein the large substrate comprises a first bracket and a bonding agent layer; the first bracket is provided with a plurality of penetration holes for receiving the plurality of elastic units; The first bracket is disposed in the first mold; the bonding agent layer is fixedly coupled to the first bracket and the plurality of small substrates. A method for manufacturing a combined dresser comprising the steps of: (1) placing a fixed mold and a pierceable unit in a second mold; and (2) cutting end of a plurality of abrasive grains of the plurality of grinding units Passing through the plurality of holes of the fixed mold to contact the pierceable unit; (3) causing the cutting ends of the plurality of abrasive grains to respectively penetrate the bottom wall of the pierceable unit contacting the second mold, so that the plurality of cutting The height of the end and the plane are respectively The difference is within 20 micrometers; (4) combining a large substrate with the plurality of polishing units and the fixed mold to fix the plurality of cutting ends; (5) separating the elastic unit from the plurality of cutting ends to form the combined type Dresser. The method of manufacturing the combined dresser according to claim 30, wherein the plurality of grinding units respectively have a small substrate; one side of the plurality of small substrates is respectively provided with a plurality of abrasive grains; the plurality of abrasive grains respectively have cutting ends; The cutting ends of the plurality of abrasive grains respectively protrude the large substrate. The method of manufacturing a combined dresser according to claim 31, wherein the large substrate comprises a second support and a layer of bonding agent; and the cutting end of the plurality of abrasive grains is applied by a flat plate in the same horizontal direction. The piercing unit is inserted; the bonding agent layer is fixedly coupled to the second bracket and the plurality of small substrates. The method of manufacturing a combination dresser according to claim 32, wherein the pierceable unit is a double-sided tape.