TWI331958B - Method and composition providing desirable characteristics between a mold and a polymerizable composition - Google Patents

Method and composition providing desirable characteristics between a mold and a polymerizable composition Download PDF

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Publication number
TWI331958B
TWI331958B TW94141186A TW94141186A TWI331958B TW I331958 B TWI331958 B TW I331958B TW 94141186 A TW94141186 A TW 94141186A TW 94141186 A TW94141186 A TW 94141186A TW I331958 B TWI331958 B TW I331958B
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Taiwan
Prior art keywords
surfactant
composition
component
group
mold
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TW94141186A
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Chinese (zh)
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TW200626348A (en
Inventor
Frank Y Xu
Edward B Fletcher
Van N Truskett
Michael N Miller
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Molecular Imprints Inc
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Priority claimed from US11/068,174 external-priority patent/US20060108710A1/en
Priority claimed from US11/068,171 external-priority patent/US7307118B2/en
Priority claimed from US11/244,428 external-priority patent/US7837921B2/en
Application filed by Molecular Imprints Inc filed Critical Molecular Imprints Inc
Publication of TW200626348A publication Critical patent/TW200626348A/en
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Publication of TWI331958B publication Critical patent/TWI331958B/en

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  • Application Of Or Painting With Fluid Materials (AREA)
  • Moulding By Coating Moulds (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Paints Or Removers (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)

Description

九、發明說明:Nine, invention description:

C發明所屬_^技術領城;J 本發明之領域一般係有關於結構體之奈米製造。更特 別地’本發明係有關於一種於模與適用於壓印微影方法之 可聚合組成物間提供合意之濕潤及脫模特性之方法。 奈米製造涉及製造極小之結構體,例如,具有1奈米或 更多之等級之形貌。用於奈米規格製造之有潛力之方法係 稱為壓印微影術。例示之壓印微影方法係詳細描述於數種 公開文獻,諸如,美國公告專利申請案第2004-0065976號 案(以美國專利申請案第10/264,960號案申請,發明名稱”於 基材上配置形貌以複製具有最小尺寸變化之形貌之方法及 模具”);美國專利公告專利申請案第2004-0065252號案(以 美國專利申請案第10/264,926號案申請,發明名稱,,一種用 以促進製造度量標準而於基材上形成一層之方法”;及美國 公告專利申請案第2004-0046271號案(以美國專利申請案第 10/235,314號案申請,發明名稱,,於基材上配置形貌以複製 具有最小尺寸變化之形貌之方法及模具,’;所有皆讓渡給本 發明受讓人。 參考第1圖,壓印微影術背後之基本技術思想係於基材 上形成浮凸圖案,可作為蝕刻罩等,如此於基材上形成相 對應於浮凸圖案之圖案。用以形成浮凸圖案之系統1〇包含 平台11,基材12係被支撐於其上。模板μ具有模具16,其 上具有用以形成圖案之表面18。形成圖案之表面18可為實 質上平滑及/或平面狀,或可被圖案化以於其内形成一或多 個凹部。模板14與壓印頭20偶合以促進模板14之移動。流 體分配系統22被偶合以與基材12呈流體連通地被選擇性置 放,以於其上沈積可聚合之材料24。能量28之來源26被偶 合以沿路徑30導引能量28。壓印頭20及平台11係建構成使 模具16及基材12被個別地呈疊置而,且係置於路徑3〇内。 壓印頭20、平台11之任一者,或二者,改變模具16及基材 12間之距離’以於其間界定可以可聚合材料24填充之合意 體積。 典型上’可聚合材料24係於合意體積於模具丨6及基材 12間界定出之置於基材12上。但是,可聚合材料24可於合 意體積已獲得之後填充此體積。於合意體積以可聚合材料 24填充後,來源26產生能量28,其造成可聚合材料24固化 及/或交聯,形成與基材表面24及模具表面18之形狀相合之 聚合物材料。此方法之控制係藉由處理器32調節其係與 平台11、壓印頭20、流體分配系統22及來源26呈資料連通, 可於貯存於記憶體34内之電腦可讀取之裎序操作。 —於可聚合材料正確地形成圖案之—重要特性係降低 if非防止)與聚合物材料模具之黏著,且同時確保與基材適 二黏者。此被稱為較佳之脫模及黏著性質。以此方式聚 D物材料中記錄之圖案於模與其分離期間不會變形。習知 ^螫致力於改良脫模特性’其係於模具表面上使用脫模 曰此脫核層典型上係疏水性及/或具有低的表面能量。脫 模層與模具輯。提供職縣藉由使記錄於聚合物材料 特性為特徵之組成物之方法。此方法包含以—體積之含表 :活性劑之溶液塗覆模具之表面。溶液内之表面活性劑包 含基本上由數個含氟分子所組成之疏水性組份。此數個含 t分子分佈於整個體積側於置於基材上之可聚合組成物 提供合意接觸角。此接觸角係於50。或更少之範圍。 此組成物之特徵在於關於具有置於其間之壓印材料之 基材及模具係具改良之較佳黏著及職雜。此組成物促 進壓印材料分成富表面活性劑組份之次部份及位於該富表 面活性劑組份之次部份及該基材間之耗乏表面活性劑組份 之次部份。一旦固化,此富表面活性劑組份之次部份減弱 模具與壓印材料間之黏著力。一種利用此組成物特性之方 法亦被揭露。此等及其它之實施例在此被描述。 圖式簡單說明 第1圖係依據習知技藝之微影系統之代表圖; 第2圖係依據本發明之模板及置於基材上之壓印材料 之簡化立面圖; 第3圖係第2圖所示之模板及基材之簡化立面圖,且壓 印材料係以經形成圖案及固化而顯示; 第4圖係第2圖所示之壓印材料之滴液之詳細圖,其顯 示滴液分成富表面活性劑之區域及耗乏表面活性劑之區 域; 第5圖係使用旋塗技術沈積之壓印材料層之詳細圖,顯 示此層係分成富表面活性劑之區域及耗乏表面活性劑之區 、第6圖係如第4或5圖所示般沈積之與模板接觸之壓印 材料之截面圖,證明弱邊界薄板於固化壓印材料及模板間 形成;及 ' 第7圖係第6圖所示之依據本發明之模板之截面圖,其 具有置於其上之含表面活性劑溶液層。 C 方包3 發明詳細說明 參考第1及2圖,依據本發明之模具36可用於系統1〇, 且可界定具有實質上平滑或平面狀輪廓之表面(未示出)。另 外,^具36可包含藉由數個間隔之凹部38及&部40所界定 形貌此數個形貌界定原始圖案,其係欲被轉移至基材 材2可包含裸晶圓或具有一或多個置於其上之層之 晶圓。因此’模具36及基材·之距離” d”被減少。以二方 式,模具36上之形貌可壓印至基材42之適合區域,諸如, 置於呈現實質上呈平面輪扉之表面44之一部份上之壓印材 料。需瞭解壓印材料可使用任何已知技術沈積,諸如,旋 轉塗覆、浸潰塗覆等。但是,於此例子,壓印材料係以數 個間隔之_滴液做積於基肋上。M印層3锡自可選 擇性被聚合及交聯之組成物形成,而於其内記錄原始圖 案,界定記錄圖案。 特別地,於壓印材料記錄之圖案係部份藉由與模具% 之交邱糊如,電交互作用、磁交互個、熱交互作用、 機械乂互仙)而產生D子模具36與騎材料進行 機械接觸’使消液%展開,而於表面料上產生壓印材料之 鄰近形成物50。於一實施例,距離”d”減少以使壓印層^之 次部份52進入並填充凹部38。 為促進凹部38之填充,壓印材料被供以用以完全填充 凹部38同相印壓材料之鄰近形成物覆蓋表面料之必要性 質。於此實施例,與凸部40疊置之麼印層34之次部份邮 合意的(-般係最小)之距離”d”達成後被保留。此動作提供 具有具厚度t]之次部份及具厚度K次部份处形成物 50。厚度,V及’V可依應用而定為任何合意之厚度。豆後, 形成物50藉由使其曝置於適當固化劑(例如,光化輻射)而固 化。此造錢印_聚合及交聯4個枝可於環境溫度 及壓力,或於具合意之溫度及I力之環境控制室内發生。 以此方式’形成物50被固化而提供具#純具%之表面% 之形狀一致之形狀之側56。 參考第卜2及3圖’屋印材料之特性對於以所用之獨特 形成圖案之方法使基材42有效_錢案係重要的。例 如’所欲地係使壓印材料具有用以促進使模具狀形貌快 j且均勻填充之某些特性,如此,所有之厚度11係實質上均 且所有厚度t2in只質上均一。因此,所欲地係使壓印材料 點度以所用之沈積方法為基礎而建立,以達成前述特 性。如上所述’壓印材料可使用各種技術沈積於基材42上。 若壓印材料以數個個別且分隔開之滴液%沈積,所欲地係 使形成壓印材料之組成物具有相對較低之黏度,例如,0.5 [泊(cPs)之祀圍。考量麼印材料同時被展開及形成圖 案,且圖案其後藉由曝置於籍射而固化成形成物50,所欲 1331958 地係以組成物濕潤紐42及/或模具%之表面,及避免其後 於聚合反應後形成凹坑或孔洞。若壓印材料使用旋轉塗覆 技術沈積,所欲地係使用較高黏度之材料,例如,具有大 於lOcPs之黏度,且典型上,係數百至數千〇1>8。 5 除上述特性外(稱為液㈣性),對於此組成物所欲地係 提供具有某些固化相特性之壓印材料。例如,於形成物% 固化後,所欲地係較佳之黏著及脫模特性係藉由壓印材料 而證明。特別地,對於用於製造壓印树料之組成物有利地 係提供與基材42具較佳黏著及模具36具較佳脫模之形成物 10 50。以此方式,降低由於形成物50之撕開、拉伸或其它妗 構性剝蝕等而與模具3 6分離所造成之記錄圖案變形之可^ 性0 提供前述特十生之形成壓印材牙斗之構絲份可為不同。 此係從由數種不同材料形成之基材42而造成。因此,夺面 15 44之化學組成係依形成基材42之材料而改變。例如,義材C invention belongs to _^ technology leading city; J The field of the invention generally relates to the manufacture of nanostructures of structures. More particularly, the present invention relates to a method of providing desirable wetting and release properties between a mold and a polymerizable composition suitable for use in an imprint lithography process. Nanofabrication involves the fabrication of very small structures, for example, having a topography of 1 nanometer or more. The potential method for nanometer manufacturing is called imprint lithography. The exemplified embossing lithography method is described in detail in several publications, such as U.S. Patent Application Serial No. 2004-0065976 (in the name of U.S. Patent Application Serial No. 10/264,960, the title of the invention). A method and a mold for configuring a topography to reproduce a topography having a minimum dimensional change"; US Patent Publication No. 2004-0065252 (Application No. 10/264,926, the name of the invention, a type A method for forming a layer on a substrate to promote manufacturing metrics; and US Patent Application No. 2004-0046271 (Application No. 10/235,314, the name of the invention, on a substrate) The method and the mold are configured to replicate the topography with the smallest dimensional change, '; all are assigned to the assignee of the present invention. Referring to Figure 1, the basic technical idea behind the imprinting lithography is based on the substrate. Forming an embossed pattern on the etched cover or the like, so as to form a pattern corresponding to the embossed pattern on the substrate. The system 1 for forming the embossed pattern includes the platform 11, the substrate 1 2 is supported thereon. The template μ has a mold 16 having a surface 18 for patterning thereon. The patterned surface 18 can be substantially smooth and/or planar, or can be patterned therein. One or more recesses are formed. The template 14 is coupled to the stamping head 20 to facilitate movement of the template 14. The fluid dispensing system 22 is coupled to be selectively placed in fluid communication with the substrate 12 to deposit polymerizable thereon. Material 24. Source 26 of energy 28 is coupled to direct energy 28 along path 30. Imprint head 20 and platform 11 are constructed such that mold 16 and substrate 12 are individually stacked and placed in a path Within either of the embossing head 20, the platform 11, or both, the distance between the mold 16 and the substrate 12 is varied to define a desired volume therebetween that can be filled with the polymerizable material 24. Typically 'polymerizable The material 24 is placed on the substrate 12 in a desired volume defined between the mold crucible 6 and the substrate 12. However, the polymerizable material 24 can be filled with the volume after the desired volume has been obtained. The desired volume is the polymerizable material 24 After filling, source 26 produces energy 28, which causes The composite material 24 is cured and/or crosslinked to form a polymeric material that conforms to the shape of the substrate surface 24 and the mold surface 18. The control of the method is adjusted by the processor 32 to the system 11 and the stamping head 20, The fluid distribution system 22 and the source 26 are in data communication and are readable by computer readable steps stored in the memory 34. - The correct patterning of the polymerizable material - important characteristics are reduced if not prevented) and aggregated The material material is adhered to the mold and at the same time ensures the adhesion to the substrate. This is called the better release and adhesion property. In this way, the pattern recorded in the poly material is not deformed during the separation of the mold. It is known that it is intended to improve the release properties. It is used on the surface of the mold to release the mold. This nucleation layer is typically hydrophobic and/or has low surface energy. Release layer and mold set. A method of providing a composition characterized by characteristics of a polymer material is provided by a prefecture. The method comprises coating the surface of the mold with a solution of the volume: active agent. The surfactant in the solution contains a hydrophobic component consisting essentially of a plurality of fluorine-containing molecules. The plurality of t-containing molecules are distributed over the entire volume side of the polymerizable composition disposed on the substrate to provide a desired contact angle. This contact angle is at 50. Or less. The composition is characterized by improved adhesion and occupation of the substrate and mold ties having the embossed material interposed therebetween. The composition promotes the embossing material to be divided into a second portion of the surfactant-rich component and a second portion of the surfactant-free component between the second portion of the surfactant component and the substrate. Once cured, the second portion of the surfactant-rich component weakens the adhesion between the mold and the imprinted material. A method of utilizing the properties of this composition is also disclosed. These and other embodiments are described herein. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a representative diagram of a lithography system according to the prior art; FIG. 2 is a simplified elevational view of a template according to the present invention and an imprint material placed on a substrate; 2 is a simplified elevational view of the template and the substrate, and the embossed material is formed by patterning and curing; FIG. 4 is a detailed view of the drips of the embossing material shown in FIG. Shows that the droplet is divided into a surfactant-rich region and a surfactant-depleting region; Figure 5 is a detailed view of the layer of the imprinted material deposited by spin coating, showing that the layer is divided into surfactant-rich regions and consumption a region of spent surfactant, Figure 6 is a cross-sectional view of the imprinted material in contact with the template as shown in Figure 4 or 5, demonstrating that a weak boundary sheet is formed between the cured imprint material and the template; and Figure 7 is a cross-sectional view of the template according to the invention shown in Figure 6 with a layer of surfactant solution disposed thereon. C Square Package 3 DETAILED DESCRIPTION OF THE INVENTION Referring to Figures 1 and 2, a mold 36 in accordance with the present invention can be used in a system 1 and can define a surface (not shown) having a substantially smooth or planar profile. In addition, the tool 36 may include an original pattern defined by the plurality of topography defined by the plurality of spaced recesses 38 and the portion 40, which are intended to be transferred to the substrate 2 and may include a bare wafer or have One or more wafers placed on top of it. Therefore, the "distance d" between the mold 36 and the substrate is reduced. In a two-part manner, the topography on the mold 36 can be embossed to a suitable area of the substrate 42, such as an imprint material placed on a portion of the surface 44 that presents the substantially planar rim. It is to be understood that the imprint material can be deposited using any known technique, such as spin coating, dip coating, and the like. However, in this example, the embossing material is deposited on the base ribs at a plurality of intervals. The M-plated layer 3 tin is formed from a composition which is selectively polymerized and cross-linked, and the original pattern is recorded therein to define a recording pattern. In particular, the portion of the pattern recorded on the embossed material is produced by the intersection of the mold %, the electrical interaction, the magnetic interaction, the thermal interaction, the mechanical interaction, and the D sub-die 36 and the riding material. The mechanical contact is made to cause the liquid hemostatic to expand, and an adjacent formation 50 of the imprinted material is produced on the surface material. In one embodiment, the distance "d" is reduced to cause the embossed layer portion 52 to enter and fill the recess 38. To facilitate the filling of the recess 38, the embossing material is provided to completely fill the necessary properties of the adjacent formation of the in-phase stamping material of the recess 38 to cover the surface material. In this embodiment, the distance ("the smallest" distance "d" of the second portion of the embossed layer 34 overlaid with the convex portion 40 is retained. This action provides a formation 50 having a thickness t] and a thickness K portion. The thickness, V and 'V can be any desired thickness depending on the application. After the beans, the formation 50 is cured by exposure to a suitable curing agent (e.g., actinic radiation). This money-making _polymerization and cross-linking 4 branches can occur at ambient temperature and pressure, or in an environmentally controlled room with desirable temperature and I force. In this manner, the formation 50 is cured to provide a side 56 of a shape having the same shape as the surface % of the % pure %. Referring to Figures 2 and 3, the characteristics of the housing material are important for making the substrate 42 effective in a unique patterning process. For example, the embossing material is desirably provided with certain properties to promote a mold-like morphology and uniform filling, so that all thicknesses 11 are substantially uniform and all thicknesses t2in are only homogeneous. Therefore, it is desirable to establish the embossing material on the basis of the deposition method used to achieve the aforementioned characteristics. As described above, the imprint material can be deposited on the substrate 42 using a variety of techniques. If the embossed material is deposited in a plurality of individual and separated drops %, the composition forming the embossed material is desirably relatively low in viscosity, for example, 0.5 [poise (cPs). Considering that the printed material is simultaneously unfolded and patterned, and the pattern is then cured into a formation 50 by exposure to a film, and the desired 1331958 is used to wet the surface of the core 42 and/or the mold %, and to avoid Thereafter, pits or holes are formed after the polymerization. If the imprint material is deposited using a spin coating technique, a higher viscosity material is desired, for example, having a viscosity greater than 10 cPs, and typically a coefficient of a few hundred to several thousand 〇 1 > 5 In addition to the above characteristics (referred to as liquid (tetra)), an imprint material having certain curing phase characteristics is desirably provided for the composition. For example, after the formation % is cured, the desired adhesion and release properties are evidenced by the imprint material. In particular, it is advantageous for the composition used to make the embossed tree material to provide a preferred release 10b from the substrate 42 and a preferred release of the mold 36. In this way, the reliability of the recording pattern deformation caused by the separation from the mold 36 due to the tearing, stretching or other structural ablation of the formed article 50 is reduced, and the aforementioned embossing material embossing material is provided. The composition of the wire can be different. This is caused by the substrate 42 formed from several different materials. Therefore, the chemical composition of the face 15 44 varies depending on the material from which the substrate 42 is formed. For example, Yicai

42可自矽、塑料、砰化鎵、碲化汞,及其等之複合物形2 另外,基材42可包含-或多層,例如,介電層、金屬層、 半導體層、平面化層等,其上係產生形成物5〇。另外模 具36可自數種材料形成,例如,熔融矽石、石英、銦錫^ 2〇 化物、似鑽石之碳、MoSi、溶膠等。 已發現產生形成物50之壓印材料可自數種不同族群之 本體材料製造。例如,壓印材料可自乙烯基醚、甲基内烯 酸酯、環氧化物、硫醇烯及丙烯酸酯製造,僅列出數種。 用於壓印材料之例示之本體材料係如下: 11 1331958 乙烯基醚/太贈材斜 三甘醇二乙烯基醚 三(4-乙烯基氧丁基)偏苯三酸酯 光起始劑 5 第一乙烯基醚組份,三甘醇二乙烯基謎,具有下列結 構: 且包含本體材料之約67.9%(以重量計)。因此,形成物50之 機械性質主要係歸因於三甘醇二乙烯基醚。三甘醇二乙烯 10 基醚之例示來源係可得自BASF Corporation of Mount Olive, New Jersy之以DVE-3為商品名者。 第二之乙烯基醚組份’三(4-乙烯基氧丁基)偏笨三酸 酯,具有下列結構: Ο42 can be self-twisting, plastic, gallium antimonide, mercury telluride, and the like. Further, the substrate 42 can comprise - or multiple layers, for example, a dielectric layer, a metal layer, a semiconductor layer, a planarization layer, etc. On top of it, the formation 5 〇 is formed. Alternatively, the mold 36 can be formed from a variety of materials, such as molten vermiculite, quartz, indium tin oxide, diamond-like carbon, MoSi, sol, and the like. It has been discovered that the imprint material from which the formation 50 is produced can be fabricated from a plurality of different populations of bulk materials. For example, imprint materials can be made from vinyl ethers, methyl enoates, epoxides, thiols, and acrylates, just to name a few. Exemplary body materials for embossing materials are as follows: 11 1331958 Vinyl ether/too gifted slanting triethylene glycol divinyl ether tris(4-vinyloxybutyl) trimellitic acid photoinitiator 5 The first vinyl ether component, triethylene glycol divinyl mystery, has the following structure: and comprises about 67.9% by weight of the bulk material. Therefore, the mechanical properties of the formation 50 are mainly attributed to triethylene glycol divinyl ether. An exemplary source of triethylene glycol divinyl 10 alkyl ether is available from BASF Corporation of Mount Olive, New Jersy under the trade name DVE-3. The second vinyl ether component 'tris(4-vinyloxybutyl) stearic acid ester has the following structure:

15 且包含本體材料之約29.1%(以重量計)。三(4-乙烯基氧丁基) 偏笨三酸S旨組份可得自Morflex Inc. of Greensboro, North Carolina之以Vectomer 5015為商品名者。 光起始劑組份係陽離子性光起始劑,其係於丙烯碳酸 酯内之三芳基鎳六氟銻酸鹽之混合物,其具有下列結構:15 and comprises about 29.1% by weight of the bulk material. The tris(4-vinyloxybutyl)succinic acid S component is available from Morflex Inc. of Greensboro, North Carolina under the trade name Vectomer 5015. The photoinitiator component is a cationic photoinitiator which is a mixture of triarylnickel hexafluoroantimonate in propylene carbonate having the following structure:

A 12 1331958A 12 1331958

光起始劑組份包含本體材料之約3%(以重量計),且可 得自 Dow Chemical Company of Midland, Michigan之產品 名為UVI 6976者。 5 乙烯基醚2/本體材料-A2 雙(4-乙烯基氧丁基)己二酸酯 以乙烯基醚為終端之聚酯聚合物 光起始劑 第一乙烯基醚組份,雙(4-乙烯基氧丁基)己二酸酯,具 10 有下列結構:The photoinitiator component comprises about 3% by weight of the bulk material and is available from Dow Chemical Company of Midland, Michigan under the product name UVI 6976. 5 vinyl ether 2 / bulk material - A2 bis (4-vinyl oxybutyl) adipate vinyl ether terminated polyester polymer photoinitiator first vinyl ether component, double (4 -vinyloxybutyl) adipate, having 10 having the following structure:

且包含本體材料之約19.4%(以重量計)。雙(4-乙烯基氧丁基) 己二酸醋之例示來源係Morflex, Inc. of Greensboro, North Carolina之產品名為 Vectomer 4060者。 15 第二乙烯基醚組份係以乙烯基醚為終端之聚酯聚合 物,其包含本體材料之約77.6%(以重量計)。因此,形成物 50之機械性質主要係歸因於以乙烯基醚為終端之聚酯聚合 物。乙烯基_聚酷聚合物之例示來源係Morflex, Inc. of Greensboro, North Carolina之產品名為 Vectomer 1312者。光 20 起始劑包含本體材料之約3%(以重量計),且係與上述關於 13 1331958 乙稀基鍵本體材料1所述相同者:UVI 697ό。 曱基丙烯酸酯/本盤材刺_八3 有機改質之石夕酸鹽 可包含本體材料之100%之例示的有機改質之矽酸鹽 ORMOSIL係可得自 Micro Resist Technology GmbH, Berlin, Germany之Ormomer® b66。此材料係經由溶膠方法製造。 甲基丙烯基及環氧官能性係附接至此材料,且光起始劑組 份係紐由曱基丙烯基官能性而被併納以供紫外線固化。 環氧/本體材料_八4 雙酚A之二縮水甘油醚 陽離子性光起始劑 雙齡A組份之二縮水甘油_具有下列結構:And comprises about 19.4% by weight of the bulk material. An exemplary source of bis(4-vinyloxybutyl) adipic acid vinegar is the product of Morflex, Inc. of Greensboro, North Carolina under the name Vectomer 4060. The second vinyl ether component is a vinyl ether terminated polyester polymer comprising about 77.6% by weight of the bulk material. Thus, the mechanical properties of the formation 50 are primarily due to the polyester polymer terminated with vinyl ether. An exemplary source of vinyl-polycopolymer is Morflex, Inc. of Greensboro, North Carolina under the product name Vectomer 1312. The light 20 initiator comprises about 3% by weight of the bulk material and is the same as described above for the 13 1331958 ethylene bond bulk material 1 : UVI 697 ό. Thioglycidyl ester / the present material thorn _ 八 3 organically modified sulphuric acid salt can contain 100% of the bulk material exemplified organically modified bismuth oxide ORMOSIL available from Micro Resist Technology GmbH, Berlin, Germany Ormomer® b66. This material is produced by a sol method. The methacrylic and epoxy functional groups are attached to the material, and the photoinitiator component is incorporated by the mercaptopropene functionality for UV curing. Epoxy/Body Material_8 4 Bisphenol A diglycidyl ether Cationic photoinitiator Double age component A diglycidyl _ has the following structure:

且包含本體材料之約97%(以重量計)。因此,形成物5〇之機 15械性質主要係歸因於雙紛A組份之二縮水甘油_。雙紛A之 二縮水甘油謎之例示來源係Dow Chemical Company of Midland, Michigan之產品名為DER 332者。此本體材料之陽 離子性光起始劑組份包含於丙烯碳酸酯中之三芳基鎳六氟 磷酸鹽之混合物,提供下列結構: ⑧And comprises about 97% by weight of the bulk material. Therefore, the mechanical properties of the formation of 5 主要 are mainly attributed to the bis-glycidol _ of the double component A. The exemplified source of the two-glycidic mystery is the DER 332 product of the Dow Chemical Company of Midland, Michigan. The cation photoinitiator component of the bulk material comprises a mixture of triaryl nickel hexafluorophosphate in propylene carbonate, providing the following structure: 8

1331958 且包含本體材料之約3%(以重量計)。陽離子性光起始劑之1331958 and contains about 3% (by weight) of the bulk material. Cationic photoinitiator

之產品名為UVI 6992者。The product name is UVI 6992.

硫醇烯/太體姑斜-AS 三甘醇二乙稀基醚 1,2-雙(2-巯基乙氧基)乙烷 三烯丙基異氰脲酸酯 2,4,6-三曱基苯甲醯基苯基膦酸乙酯 乙烯基醚組份包含本體材料之約36.7%(以重量計),且 具有如上關於以產品名為DVE-3出售之產品所探討之結 構。1,2-雙(2-毓基乙氧基)乙烷組份具有下列結構:Thiolene/Termoid-AS Triethylene glycol diethyl ether 1,2-bis(2-mercaptoethoxy)ethane triallyl isocyanurate 2,4,6-triazine The ethyl benzhydrylphenylphosphonic acid ethyl ester vinyl ether component comprises about 36.7% by weight of the bulk material and has the structure discussed above for the product sold under the product name DVE-3. The 1,2-bis(2-mercaptoethoxy)ethane component has the following structure:

且包含本體材料之約47.3%(以重量計)。1,2-雙(2-巯基乙氧 基)乙烧組份之例示來源係Aldrich Chemical Company of Milwaukee, Wisconsin之產品名為DMDO者。因此,形成物 50之機械性質主要係歸因於三甘醇二乙烯基醚及1,2-雙(2-巯基乙氧基)乙烷組份。 三烯丙基異氰脲酸酯組份具有下列結構:And comprises about 47.3% by weight of the bulk material. An exemplary source of the 1,2-bis(2-mercaptoethoxy)ethyl bromide component is Aldrich Chemical Company of Milwaukee, and the product name of Wisconsin is DMDO. Therefore, the mechanical properties of the formation 50 are mainly attributed to the triethylene glycol divinyl ether and the 1,2-bis(2-mercaptoethoxy)ethane component. The triallyl isocyanurate component has the following structure:

15 133195815 1331958

且包含本體材料之約13%(以重量計)。三烯丙基異氰脲酸酯 組份之例示來源係 Aldrich Chemical Company of Milwaukee,And comprises about 13% by weight of the bulk material. An exemplary source of the triallyl isocyanurate component is Aldrich Chemical Company of Milwaukee,

Wisconsin之產品名為TAIC者。 2,4,6-三甲基苯曱醯基苯基膦酸乙酯組份包含本體材 料之約3%(以重量計),且具有下列結構:The product of Wisconsin is called TAIC. The ethyl 2,4,6-trimethylphenylnonylphenylphosphonate component comprises about 3% by weight of the bulk material and has the following structure:

2,4,6-三甲基苯曱醯基苯基膦酸乙酯組份之例示來源 係 BASK Corporation of Mount Olive, New Jersey之產品名 為TPO-L者。 丙烯酸酯/本體材料-A6 丙烯酸異冰片酯 丙烯酸正己酯 乙二醇二丙烯酸酯 2-羥基-2-甲基-1-苯基-丙-1-酮 丙烯酸酯組份,丙烯酸異冰片酯(IBOA),具有下列結 構:An exemplary source of the ethyl 2,4,6-trimethylphenylnonylphenylphosphonate component is the product of the TSK-L under the product name BASK Corporation of Mount Olive, New Jersey. Acrylate/Body Material-A6 Isobornyl acrylate hexyl acrylate ethylene glycol diacrylate 2-hydroxy-2-methyl-1-phenyl-propan-1-one acrylate component, isobornyl acrylate (IBOA) ), has the following structure:

】6 1331958】 6 1331958

且包含本體材料之約55%(以重量計),但可以2〇%至80%(包 含)之範圍存在。因此,形成物50之機械性質主要係歸因於 IBOA。IBOA之例示來源係Sartomer Company, Inc. of Exton, Pennsylvania之以產品名為SR506者獲得。 丙烯酸正己酯組份具有下列結構: 且包含本體材料之約27%(以重量計),但可以〇%至5〇%(包 含)之範圍存在。亦提供形成物50可撓性,n-HA被用以降低 習知技蟄之本體材料之黏度,如此,液相之本體材料具有 2-9厘泊(包含)範圍之黏度。n_HA組份之例示來源係AldrichIt also comprises about 55% by weight of the bulk material, but may be present in the range of from 2% to 80% (inclusive). Therefore, the mechanical properties of the formation 50 are primarily due to IBOA. An exemplary source of IBOA is available from Sartomer Company, Inc. of Exton, Pennsylvania under the product name SR506. The n-hexyl acrylate component has the following structure: and comprises about 27% by weight of the bulk material, but may be present in the range of from 〇% to 5% by weight. The formation 50 is also provided with flexibility, and the n-HA is used to reduce the viscosity of the bulk material of the prior art, such that the bulk material of the liquid phase has a viscosity in the range of 2-9 centipoise (inclusive). An exemplary source of the n_HA component is Aldrich

Chemical Company of Milwaukee, Wisconsin。 交聯劑’乙二醇二丙烯酸酯,具有下列結構:Chemical Company of Milwaukee, Wisconsin. The crosslinking agent 'ethylene glycol diacrylate has the following structure:

且包含本體材料之約15%(以重量計),且可以10%至50%(包 含)之範圍存在。EGDA亦促成模量及硬挺度之提升,且於 本體材料聚合反應期間促進n_HA及IBOA之交聯。 起始劑組份’ 2-羥基-2-曱基-1-苯基·丙-1-酮,可得自It also comprises about 15% by weight of the bulk material and may be present in the range of 10% to 50% (included). EGDA also contributes to an increase in modulus and stiffness and promotes cross-linking of n_HA and IBOA during bulk material polymerization. The initiator component '2-hydroxy-2-mercapto-1-phenyl-propan-1-one, available from

Ciba Specialty Chemical of Tarrytown,New York之商品名 為DAROUR® 1173者,且具有下列結構: 17 1331958Ciba Specialty Chemical of Tarrytown, New York is DAROUR® 1173 and has the following structure: 17 1331958

且包含本體材料之約3%(以重量計),且可以1%至5%(包含) 之範圍存在。起始劑反映藉由中壓汞燈產生之寬帶譜之紫 外線輻射。以此方式,起始劑促進本體材料組份之交聯及 5 聚合反應。 丙烯酸酯/本體材料-A7 丙烯酸異冰片酯 丙烯酸正己酯 乙二醇二丙烯酸酯 10 2-羥基-2-甲基-1-苯基-丙-1-酮 如所見般,以構成組份之同一性而言,本體材料-A7 係相同於本體材料-A6。此二材料以存在母 構成組份之百 分率而言係不同。於本體材料-A7,IBOA包含此材料之約 47%(以重量計),且n-HA及EGDA每一者包含本體材料之 15 25%(以重量計)。DAROCUR® 1173,2-羥基-2-甲基-1-苯基 -丙-1-酮組份,包含此材料之約3%(以重量計)。 丙烯酸酯/本體材料-A8 genomer 1122 丙烯酸異冰片酯 20 1,6-己烧二醇二丙烯酸酯It also comprises about 3% by weight of the bulk material and may be present in the range of from 1% to 5% (inclusive). The initiator reflects the ultraviolet radiation from the broadband spectrum produced by the medium pressure mercury lamp. In this way, the initiator promotes cross-linking and 5 polymerization of the bulk material components. Acrylate / bulk material - A7 isobornyl acrylate hexyl acrylate ethylene glycol diacrylate 10 2-hydroxy-2-methyl-1-phenyl-propan-1-one as seen, to form the same component Sexually, the bulk material -A7 is identical to the bulk material -A6. These two materials differ in the percentage of the presence of the parent component. For bulk material - A7, IBOA comprises about 47% by weight of the material, and n-HA and EGDA each comprise 15 25% by weight of the bulk material. DAROCUR® 1173, 2-hydroxy-2-methyl-1-phenyl-propan-1-one component, containing about 3% by weight of this material. Acrylate / bulk material - A8 genomer 1122 isobornyl acrylate 20 1,6-hexane diol diacrylate

2-羥基-2-曱基-1-苯基-丙-1-酮 第一丙稀酸S旨組份,genomer 1122,係可得自Rahn USA 182-Hydroxy-2-indolyl-1-phenyl-propan-1-one First acrylic acid S component, genomer 1122, available from Rahn USA 18

Corporation of Aurora,Illinois之脂族胺基曱酸酯丙烯酸 酯’且具有下列結構:Corporation of Aurora, an aliphatic urethane acrylate of Illinois, and having the following structure:

〇 0 且包含本體材料之約21%(以重量計),但可以5〇%之範圍存 在。丙烯酸酯組份,丙烯酸異冰片酯(IB〇A),係如上所述, 且包含組成物之約56重量%,但可以2〇至8〇%之範圍存在。 丙烯酸酯組份,1,6-己烷二醇二丙烯酸酯,可得自UCB Chemicals, Smyna, Georgia,且具有下列結構: Ο 且包含本體材料之約20%(以重量計),但可以〗〇%至50%(包 含)之範圍存在。起始劑組份,2-羥基-2-甲基-1-戊基-丙-1-酮,係如上所述,且包含此組成物之約3%(以重量計)。為 提供本體材料A8改良之濕潤特性,另外之氟化丙烯酸酯, 諸如’ 1H,1H-全氟-正癸基丙烯酸酯’可被包含以降低其接 觸角。此氟化丙烯酸酯可得自Exfluor Research Corporation, Round R0Ck,Texas之商標名為C10ACRY者。本體材料Ad 之一優點係其具有約11 cPs之黏度,使其適於滴液分配及旋 轉塗覆之技術。 但是’發現如上所探討之合意的較佳黏著及脫模性質 可藉由於模具36 '表面58及形成物50間產生弱邊界層,薄 1331958 板60,而達成。薄板6〇於壓印材料固化後維持。因此,模 具36及形成物50間之黏著力係最小。因此,發現有利地= 使用包含如上探討之本體材料之一與含有低表面能基之組 份(此間稱為表面活性劑組份)之組成物用於壓印材料。於沈 積壓印材料後,於段時間後,表面活性劑組份上升至空氣 液體界面,提供具有分成兩部份材料濃度之壓印材料。〇 0 and contains about 21% (by weight) of the bulk material, but can exist in the range of 5%. The acrylate component, isobornyl acrylate (IB〇A), as described above, and comprises about 56% by weight of the composition, but may be present in the range of 2% to 8% by weight. The acrylate component, 1,6-hexanediol diacrylate, is available from UCB Chemicals, Smyna, Georgia and has the following structure: Ο and comprises about 20% by weight of the bulk material, but can be 〇% to 50% (inclusive) exists. The starter component, 2-hydroxy-2-methyl-1-pentyl-propan-1-one, is as described above and comprises about 3% by weight of this composition. To provide improved wetting characteristics of bulk material A8, additional fluorinated acrylates such as '1H,1H-perfluoro-n-decyl acrylate' can be included to reduce the contact angle. This fluorinated acrylate is available from Exfluor Research Corporation, Round R0Ck, Texas under the trade name C10ACRY. One of the advantages of the bulk material Ad is that it has a viscosity of about 11 cPs, making it suitable for drop dispensing and spin coating techniques. However, it has been found that the preferred adhesion and release properties discussed above can be achieved by creating a weak boundary layer between the surface 58 of the mold 36 and the formation 50, and a thin 1331958 panel 60. The sheet 6 is maintained after the stamping material is cured. Therefore, the adhesion between the mold 36 and the formation 50 is minimal. Therefore, it has been found to be advantageous to use a composition comprising one of the bulk materials as discussed above and a component containing a low surface energy group (referred to herein as a surfactant component) for imprinting the material. After depositing the imprint material, after a period of time, the surfactant component rises to the air liquid interface, providing an imprint material having a concentration of the two portions of the material.

於第一部份,滴液146包含比第二部份(稱為耗乏表面 活性劑組份(SCD)之次部份i 3 7)更高濃度之表面活性劑組 份,稱為富表面活性劑(SCR)之次部份136。SCD次部份η? 10係置於表面44及SCR次部份136之間。一旦固化,SCR次邛 份136減低模具及壓印材料間之黏著力。特別地,表面2性 劑組份具有相對端。當壓印材料呈液相時(即,可聚合),相 對端之-對壓印材料中所含之本體材料具有親和力。剩餘 端具有氟組份。因為對於本體材料之親和力,表面活性劑 15組份被定向化,如此’氟組份自藉由壓印材料及周圍環境 所界定之空氣-液體界面延伸。於壓印材料固化時,第一部 份之壓印材料產生薄板60,且第二部份之壓印材料固化, 即’形成物5〇顯不之聚合物材料。薄板6〇係位於形成物% 及模具36之間。綠60係因i祕存在及位於s(:r次部扮 136内而造成。薄板60避免強烈黏著力於模㈣及形成獅 間發展。特別地,形成物50具有第一及第二之相對側織 64。側62係以第一點著力盘美好4?垄jt益 , ”丞材42‘者。側64係以第二黏 著力與模具36黏著。薄板60造成第二黏著力少於第一黏著 力。因此,模具可輕易自形成物5〇移除,同時使用:變形 20 1331958 1 •ch2-c— -1 - X -CH2—ΟΙ C=〇 1」 y F(CF2CF2)mR"CH2CH20 其中,R及R,可為H或曱基;R及R,可為相同或相異。R”係 連結基,其係可為省略或為磺醯基,諸如,_S02N(R,,,,,;)_,In the first part, the drop 146 contains a higher concentration of the surfactant component than the second portion (referred to as the sub-component of the spent surfactant component (SCD) i 3 7), referred to as a rich surface. The second part of the active agent (SCR) 136. The SCD sub-portion η 10 is placed between the surface 44 and the SCR sub-portion 136. Once cured, the SCR secondary 136 reduces the adhesion between the mold and the imprint material. In particular, the surface 2 agent component has opposite ends. When the imprint material is in the liquid phase (i.e., polymerizable), the opposite end has an affinity for the bulk material contained in the imprint material. The remaining end has a fluorine component. Because of the affinity for the bulk material, the surfactant 15 component is oriented such that the 'fluoro component' extends from the air-liquid interface defined by the imprint material and the surrounding environment. When the imprint material is cured, the first portion of the imprint material produces a thin sheet 60, and the second portion of the imprint material is cured, i.e., the formation material is not a polymer material. The thin plate 6 is located between the formation % and the mold 36. The green 60 system is caused by the existence of i secret and located in s (: r sub-dress 136. The thin plate 60 avoids strong adhesion to the mold (4) and the formation of lions. In particular, the formation 50 has the first and second relative Side weave 64. Side 62 is the first point to force the plate to be good, and the coffin is 42. The side 64 is adhered to the mold 36 with a second adhesive force. The thin plate 60 causes the second adhesive force to be less than the second. Therefore, the mold can be easily removed from the formation 5〇 while using: deformation 20 1331958 1 •ch2-c— -1 - X -CH2—ΟΙ C=〇1” y F(CF2CF2)mR"CH2CH20 Wherein R and R may be H or a thiol group; R and R may be the same or different. R" is a linking group which may be omitted or is a sulfonyl group, such as _S02N(R,,,, ,;)_,

且R 係Cl至C6烷基,且典型上係(:!至(:4烷基。組份 (0R’’’)Z係聚(氧烷撐基)’典型上包含具有2至4個碳原子之 基’諸如 -CH2CH2- ' -CH2CH2CH2- ' -CH(CH3)CH2- > 或-OKCHdCtKCH3)-。R’’,’係甲基、11或〇1至〇4烷基之端 基,且典型上係Η或曱基。X對y之比例範圍係1:2至3:1,且 更佳係1:1至2:1之範圍。 10 需瞭解聚(氧烧撑基)内之氧烧撐基可為相同,如,聚(氧And R is a Cl to C6 alkyl group, and typically is a group of (:! to (:4 alkyl. Component (0R''') Z-system poly(oxyalkylene)' typically comprises from 2 to 4 carbons The base of an atom such as -CH2CH2-'-CH2CH2CH2-'-CH(CH3)CH2-> or -OKCHdCtKCH3)-.R'', 'end of methyl, 11 or 〇1 to 〇4 alkyl, Typically, it is a ruthenium or osmium group. The ratio of X to y ranges from 1:2 to 3:1, and more preferably from 1:1 to 2:1. 10 It is necessary to understand the poly(oxyalkylene) Oxygen burnt groups can be the same, such as poly (oxygen)

乙撐基),或二或更多之不同烷撐基單元可不規則地分佈於 聚(氧烷撐基)。更特別地,聚(氧烷撐基)可由直鏈或分支之 鏈氧丙撐基單元單獨地或氧乙撐基單元單獨地組成,或直 鏈或分支之氧丙撐基單元及氧乙撐基單元可以交替嵌段存 15在。於氧乙撐基及氧丙撐基之交替嵌段之情況,氧乙樓基 對氧丙樓基之比例係於2.0-0.5比1之範圍。再者,聚(氧烧撑 基)之未附接嵌段可存在於聚合物基質内。鏈轉移劑(諸如, 辛基硫醇)亦可存在。 可使用之例示的非離子性氟化表面活性劑組份係如美 2〇 國專利第 3,403,122、3,787,351、4,803,145、4,835,084、 4,845,008、5,380,644、5,747,234,及6,664,354號案所示之 22 1331958 活性劑組份。剩餘之表面活性劑組份可為一或多種之以矽 氧烧為主之表面活性劑及/或以烴為主之表面活性劑。以石夕 氧院為主之表面活性劑之例子可得自Dow Corning ofEthylene groups, or two or more different alkylene units may be irregularly distributed in the poly(oxyalkylene) group. More particularly, the poly(oxyalkylene) group may be composed of a linear or branched chain oxypropylene unit alone or an oxyethylene unit, or a linear or branched oxypropylene unit and an oxyethylene group. The base unit can be alternately blocked. In the case of alternating blocks of oxyethylene and oxypropylene groups, the ratio of oxyethylene to oxypropene is in the range of 2.0 to 0.5 to 1. Further, the unattached blocks of the poly(oxyalkylene) may be present in the polymer matrix. Chain transfer agents such as octyl mercaptan may also be present. Exemplary non-ionic fluorinated surfactant components which can be used are those disclosed in U.S. Patent Nos. 3,403,122, 3,787,351, 4,803,145, 4,835,084, 4,845,008, 5,380,644, 5,747,234, and 6,664,354. Active ingredient component. The remaining surfactant component can be one or more surfactants based on oxy-oxygenation and/or hydrocarbon-based surfactants. An example of a surfactant based on Shi Xi Oxygen is available from Dow Corning of

Midland,Michigan之商標名為Q2-5211 及SYLGARD® 309 5 者’二者皆係三矽氧烷型之表面活性劑組份。矽氧烷聚醚 型式亦可被使用。 適用於本發明之烴表面活性劑組份包含任何促進提供 具低”動態”表面張力之組成物及/或增加氟化表面活性劑於 本體材料内之可溶性者。例示之烴表面活性劑組份可得自 10 BASF of Ontario, Canada之商標名為TETRONIC®,例如, TETR〇NIC®701,其被認為係丙稀化氧、乙稀化氧及乙二 胺之四官能性嵌段共聚物。其它之烴表面活性劑組份可得 自 Dow Chemical Company of Midland,Michigan之商標名 為TERGITOL®及TRITON®者,例如,TERGITOL® NP-10、 15 TRITON® X-100及TRITON® X-45。TERGITOL®表面活性Midland, Michigan, under the trade names Q2-5211 and SYLGARD® 309 5, are both trioxane type surfactant components. A polyoxyalkylene polyether type can also be used. The hydrocarbon surfactant component suitable for use in the present invention comprises any composition which promotes the provision of a low "dynamic" surface tension and/or increases the solubility of the fluorinated surfactant in the bulk material. Exemplary hydrocarbon surfactant components are available from 10 BASF of Ontario, Canada under the trade name TETRONIC®, for example, TETR® NIC® 701, which is believed to be propylene oxide, ethylene oxide, and ethylenediamine. A tetrafunctional block copolymer. Other hydrocarbon surfactant components are available from Dow Chemical Company of Midland, Michigan under the tradenames TERGITOL® and TRITON®, for example, TERGITOL® NP-10, 15 TRITON® X-100, and TRITON® X-45. TERGITOL® surface active

劑組份係烷基聚乙烯化氧,且TRITON®表面活性劑組份係 院基苯基聚乙稀化氧。Uniqema Americas of New Castle, Delaware亦提供含有聚乙氧基化醇及酯之適合烴表面活性 劑組份,其商標名為BRIJ®,例如,BRIJ® 30。含乙炔聚 20 乙稀化氧之烴表面活性劑組份可得自Air Product and Chemicals, Inc· of Allentown,Pennsylvania之商標名為 SULFYNOL®及DYNOL®者,例如,SULFYNOL® 104、 SULFYNOL® 440、SULFYNOL® 2502,及DYNOL® 604。 典型上,使用上述本體材料形成之組成物包含一含量 25 1331958 之表面活性劑組份,或表面活性劑組份之混合物,範圍係 組成物之0.05%至5%(以重量計),且更特別係〇 25%至 2%(以重量計)。組成物之剩餘部份包含一或多種如上所述 之本體材料。典型上,製造壓印材料之組成物係於室溫及 5於以氦軋吹掃之環境(例如,以氦飽和之氛圍)存在中使用滴 液分配技術塗敷。滴液分配技術係用於在室溫時具有^❽ cPs範圍之黏度之組成物。對於較高黏度之組成物,例如, 於10-500,000 cps之範圍,但更特別地,於室溫時為 10-20,000 cPs之組成物,旋轉塗覆技術可被使用。 10 為證明於壓印材料中藉由上述表面活性劑組份之存在 而提供之改良之較佳黏著及較佳脫模,上述之包含本體材 料及表面活性劑組份之數種組成物被測試。特別地,下列 表面活性劑組份被使用: S1 15 FC-4430 如上所述’表面活性劑FC-4430可得自3M Company ofThe agent component is an alkyl polyoxygenated oxygen and the TRITON® surfactant component is a hospital based phenylpolyethoxylated oxygen. Uniqema Americas of New Castle, Delaware also offers suitable hydrocarbon surfactant components containing polyethoxylated alcohols and esters under the trade name BRIJ®, for example, BRIJ® 30. The hydrocarbon surfactant component containing acetylene poly 20 ethylene oxide can be obtained from Air Product and Chemicals, Inc. of Allentown, Pennsylvania under the trade names SULFYNOL® and DYNOL®, for example, SULFYNOL® 104, SULFYNOL® 440, SULFYNOL® 2502, and DYNOL® 604. Typically, the composition formed using the above bulk material comprises a surfactant component in an amount of 25 1331958, or a mixture of surfactant components, ranging from 0.05% to 5% by weight of the composition, and more In particular, it is 25% to 2% by weight. The remainder of the composition contains one or more of the bulk materials as described above. Typically, the composition from which the embossed material is made is applied at room temperature and 5 using a dispensing technique in the presence of a rolling purge (e.g., in a saturated atmosphere). Drop dispensing techniques are used for compositions having a viscosity in the range of ❽ cPs at room temperature. For higher viscosity compositions, for example, in the range of 10-500,000 cps, but more specifically, a composition of 10-20,000 cPs at room temperature, spin coating techniques can be used. 10 In order to demonstrate improved adhesion and better release provided by the presence of the surfactant component in the embossed material, the above-described compositions comprising the bulk material and the surfactant component were tested. . In particular, the following surfactant components were used: S1 15 FC-4430 as described above 'Surfactant FC-4430 is available from 3M Company of

St. Paul 之 NOVEC® 氟表面活性劑 fc-4430。NOVEC® FC4430氟表面活性劑係含有全氟丁烷磺酸酯(PFBS)區段之 以非離子性丙烯共聚物為主之氟化學表面活性劑。 20 S2 FS-1230 表面活性劑FS-1230被認為係源自日Asahi Glass,且 由 Mason Chemical of Arlington Heights,Illinois以產品名 MASURF® FS-1230於美國供銷,且具有下列通式: 26 表面活性劑SURFYNOL® 104係一種以乙炔烴為主之 表面活性劑,其具有化學名稱2,4,7,9-四曱基-5-癸炔-4,7-二 醇。表面活性劑SURFNOL®係可得自Air Products and Chemicals, Inc. of Allentown, Pennsylvania,且具有下列結St. Paul's NOVEC® fluorosurfactant fc-4430. NOVEC® FC4430 fluorosurfactant is a fluorochemical surfactant based on a non-ionic propylene copolymer containing a perfluorobutane sulfonate (PFBS) segment. 20 S2 FS-1230 Surfactant FS-1230 is believed to be derived from Asahi Glass and supplied by Mason Chemical of Arlington Heights, Illinois under the product name MASURF® FS-1230 and has the following general formula: 26 Surface activity SURFYNOL® 104 is an acetylene-based surfactant having the chemical name 2,4,7,9-tetradecyl-5-decyne-4,7-diol. The surfactant SURFNOL® is available from Air Products and Chemicals, Inc. of Allentown, Pennsylvania and has the following knots.

此組合表面活性劑 S8係50%之FSO-100及50%之 SURFYNOL® 104。 如上所述之表面活性劑組份及本體材料被用以配製成 10額外組成物,以產生關於如上所探討之十二種組成物及八 種本體材料之較佳黏著及較佳脫模性質之比較數據。組成 物及/或本體材料於二玻片間沈積,然後固化。每一玻片係 約1mm厚’ 75 X 25 mm之側向尺寸。流體壓印材料之滴液 被置於玻片上’第二玻片係以交叉方向之圖案疊置。壓印 15材料其後被固化。四點彎曲壓縮力被施加以使玻片分離。 藉此’四點彎曲失具被用於黏著測試及技術,其係相似於,, 壓P技術之模具及光可固化樹脂間之黏著力測量,,,日本應 用物理期刊,第41冊(2002),第4194-4197頁所述者。最大 力里/載重係作為黏著值。上下二點之軸距係60 mm。載重 20係以a5mm/分鐘之速度施加。組成物及測試結果係如下: 29 1331958 包含本體材料- A 1之壓印材料 ο (赘笼众γ^This combination surfactant S8 is 50% FSO-100 and 50% SURFYNOL® 104. The surfactant component and bulk material as described above are used to formulate 10 additional compositions to provide better adhesion and better release properties for the twelve compositions and eight bulk materials discussed above. Comparison data. The composition and/or bulk material is deposited between the two slides and then cured. Each slide is approximately 1 mm thick with a lateral dimension of '75 X 25 mm. A drop of fluid imprint material is placed on the slide. The second slide is stacked in a pattern of intersecting directions. The embossed 15 material is then cured. A four-point bending compression force is applied to separate the slides. The 'four-point bending loss is used for adhesion testing and technology, which is similar to, the measurement of the adhesion between the mold and the photocurable resin of the pressure P technology, Japanese Journal of Applied Physics, Vol. 41 (2002) ), as described on pages 4194-4197. The maximum force/load system is used as the adhesion value. The wheelbase of the upper and lower points is 60 mm. The load 20 was applied at a speed of a5 mm/min. The composition and test results are as follows: 29 1331958 Contains bulk material - A 1 imprint material ο (赘笼众γ^

A1-NS A1-S1 A1-S2 於A1看出,使具有置於其間之自本體材料A1及表面活 性劑S2組成物(如A1-S2所示)形成之固化壓印材料之疊置 5 玻片(未示出)分離僅需3.4磅之分離力量。此係遠少於用以 分離自約99.5%本體材料A1及約0.5%表面活性劑S1之組成 物(以AhSl所示)形成之固化壓印材料所需之7.5磅之分離 力量。另言之,當與用以分離具有置於其間之固化本體材 料A1(其内不具有表面活性劑,以A1-NS表示)之疊置玻片 10 (未示出)所需之分離力量相比時,實現於分離力量降低 61%。A1-NS、A1-S1及A1-S2組成物每一者具有約8 cPs之 室溫黏度,且係於室溫使用滴液分配技術沈積。A1-S2組成 物係由約9 9.5 %之本體材料A1及0.5 %之表面活性劑S 2所組 成。A1-S1組成物係由約99.5%之本體材料A1及0.5%之表面 15 活性劑S 1組成。 30 1331958 包含本體材料-A2之壓印材料 (^〕twA韹令 ¥蛸A1-NS A1-S1 A1-S2 is seen in A1, with a stack of cured imprinting materials formed from the bulk material A1 and the surfactant S2 composition (shown as A1-S2) placed therebetween. The separation of the sheets (not shown) requires only 3.4 pounds of separation force. This system is much less than the 7.5 lb. separation force required to separate the cured imprint material formed from about 99.5% of the bulk material A1 and about 0.5% of the surfactant S1 (shown as AhSl). In addition, the separation force force required for the laminated slide 10 (not shown) having the solidified bulk material A1 interposed therebetween (indicated without A surfactant, denoted by A1-NS) is used. When compared to the time, the separation force is reduced by 61%. The A1-NS, A1-S1, and A1-S2 compositions each have a room temperature viscosity of about 8 cPs and are deposited at room temperature using a drop dispensing technique. The composition of A1-S2 consists of about 99.5 % of bulk material A1 and 0.5% of surfactant S 2 . The A1-S1 composition consists of about 99.5% of the bulk material A1 and 0.5% of the surface 15 active agent S1. 30 1331958 Imprint material containing bulk material - A2 (^] twA韹 Order ¥蛸

A2-NS A2-S3 A2-S4 由關於本體材料A2之分離數據看出,分離具有固化壓 印材料之疊置玻片(未示出)需要1.7磅之分離力量。含有本 5 體材料A2及表面活性劑S3之組成物(以A2-S3表示)被用以 形成固化壓印材料。此所需之分離力量係遠小於自本體材 料A2及表面活性劑S4之組成物(以A2-S4表示)形成之固化 壓印材料存在中所需之2.6磅之分離力量。另言之,當與用 以分離具有置於其間之固化本體材料A 2且缺乏表面活性劑 10 (以A2-NS表示)之疊置玻片(未示出)所需之分離力量相比 時,實現減少50%之分離力量。A2-NS、A2-S3及A2-S4組 成物之每一者具有約300 cPs之室溫黏度,且於室溫使用旋 塗技術沈積。A2-S3組成物由約99.5%之本體材料A2及0.5% 之表面活性劑S3組成。A2-S4組成物由約99.5%之本體材料 15 A2及0.5%之表面活性劑S4所組成。 31 1331958 息·1·本體材料-A3之壓印钟料 8,0 -, 7·6-5-4-3- (赘)制穴簸众¥噃 ο ο ο 2·10-A2-NS A2-S3 A2-S4 As seen from the separation data for bulk material A2, separation of the stacked slides (not shown) with cured imprint material requires a separation force of 1.7 pounds. The composition (indicated by A2-S3) containing the bulk material A2 and the surfactant S3 is used to form a cured imprint material. The required separation force is much less than the separation force of 2.6 pounds required in the presence of the cured imprint material formed from the composition of bulk material A2 and surfactant S4 (denoted as A2-S4). In addition, when compared to the separation force required to separate a laminated slide (not shown) having a cured bulk material A 2 disposed therebetween and lacking surfactant 10 (represented by A2-NS) , to achieve a 50% separation power. Each of the A2-NS, A2-S3, and A2-S4 compositions had a room temperature viscosity of about 300 cPs and was deposited using a spin coating technique at room temperature. The A2-S3 composition consisted of about 99.5% of bulk material A2 and 0.5% of surfactant S3. The A2-S4 composition consists of about 99.5% of the bulk material 15 A2 and 0.5% of the surfactant S4. 31 1331958 息·1· Body material-A3 imprinted clock material 8,0 -, 7·6-5-4-3- (赘) 簸穴簸众¥噃 ο ο ο 2·10-

10 由關於本體材料A3之分離數據看出,分離具有置於其 間之固化壓印材料之疊置玻片(未示出)僅需2.0磅之分離力 量。固化之壓印材料係含有本體材料A3及表面活性劑S4之 組成物(以A2-S4表示)形成。此係遠少於自本體材料A3及表 面活性劑S1之組成物(以A3-S1表示)形成之固化壓印材料 存在中所需之3.0碎之分離力量。與八3 §4有關之分離力量 亦少於自本體材料A3及表面活性劑53之組成物(以八3_53表 不)形成之固化壓印材料存在中所需之分離力量。另言之, 當與用以分離具有置於其間之固化本體材料A3且缺乏表面 活性劑(以A3-NS表示)之疊置玻月(未示出)所需之分離力量 相比時,實現減少72%之分離力量。A3-NS、A3-S1、A3-S3 及A3-S4組成物之每—者具有約1〇 〇〇〇至12 〇〇〇 cPs(包含) 之至/廉黏度,且於室溫使用旋塗技術沈積。A3_si組成物由 約99.5%之本體材料A3及0.5%之表面活性劑S1組成。A3-S4 組成物由約99.5%之本體材料A3及〇 5%之表面活性劑S4所 (S) 32 15 成 組10 From the separation data for the bulk material A3, it is only a separation force of 2.0 pounds to separate the laminated slides (not shown) having the cured imprint material placed therebetween. The cured imprint material is formed of a composition of the bulk material A3 and the surfactant S4 (indicated by A2-S4). This system is much less than the separation force of 3.0 pieces required in the presence of the cured imprint material formed from the bulk material A3 and the composition of the surfactant S1 (indicated by A3-S1). The separation force associated with VIII 3 § 4 is also less than the separation force required in the presence of the cured imprint material formed from the bulk material A3 and the composition of surfactant 53 (depicted in 八三53). In addition, when compared to the separation force required to separate the laminated glass moon (not shown) having the cured bulk material A3 interposed therebetween and lacking the surfactant (indicated by A3-NS), Reduce the separation power by 72%. Each of the A3-NS, A3-S1, A3-S3, and A3-S4 compositions has a viscosity of about 1 〇〇〇〇 to 12 〇〇〇cPs (inclusive) and is used for spin coating at room temperature. Technical deposition. The A3_si composition consisted of about 99.5% of bulk material A3 and 0.5% of surfactant S1. The A3-S4 composition is composed of about 99.5% of the bulk material A3 and 5% of the surfactant S4 (S) 32 15

I 息含太體材斜-A4之壓印 9.Q e.o. 7.0- 6.0 . 5.0 . 4.0 . 3.0 - 2.0 . 1‘0 . 〇.0 ·I. Contains too much body slant-A4 embossing 9.Q e.o. 7.0- 6.0 . 5.0 . 4.0 . 3.0 - 2.0 . 1'0 . 〇.0 ·

A4-NS M-S3 A4-S4 10 由關於本體材料A4之分離數據看出,分離具有置於其 之含有本體材料A4及表面活性劑S4之固化組成物(以 )之疊置破片(未示出)所需之力量降低,僅需5.0碎。 系^於對於本體材料A4及表面活性劑S3之組成物(以 M'S3表示)所需之5.4磅之分離力量。另言之,當與用以分 具有置於其間之固化本體材料A4且缺乏表面活性劑(以 ♦ NS表不)之疊置玻片(未示出)所需之分離力量相比時’ 見減少40%之分離力量。A4-NS、A4-S3及A4-S4組成物 之每〜 15 由關於本體材料八4之分離數據看出 者具有約5,〇〇〇 cps之室溫黏度,且於室溫使用旋塗 衧此積。A4-S1組成物由約99.5%之本體材料八4及〇.5%之 、面居性劑si組成。A4_S3組成物由約99 5%之本體材料A4 •5%之表面活性劑S3所組成。a4 S4組成物由約99 5%之 本體材料A4及0.5%之表面活性劑以所組成。 (S) 33A4-NS M-S3 A4-S4 10 As seen from the separation data on the bulk material A4, the laminated fragments having the cured composition (including) containing the bulk material A4 and the surfactant S4 are separated (not shown). The required power is reduced by only 5.0. The separation force of 5.4 pounds required for the composition of bulk material A4 and surfactant S3 (expressed as M'S3). In addition, when compared to the separation force required to separate a laminated slide (not shown) having a cured bulk material A4 interposed therebetween and lacking a surfactant (not shown by NS), see Reduce the separation power by 40%. Each of the A4-NS, A4-S3, and A4-S4 compositions is 15° from the separation data for the bulk material VIII, and has a room temperature viscosity of about 5, 〇〇〇cps, and is spin-coated at room temperature. This product. The composition of A4-S1 consists of about 99.5% of the bulk material 八4 and 〇.5% of the surfactant. The A4_S3 composition consists of about 99% of the bulk material A4 • 5% of surfactant S3. The a4 S4 composition consists of about 99% of the bulk material A4 and 0.5% of the surfactant. (S) 33

A5-NS A5-S3 A5*S4 A5-S1 由關於本體材料A5之分離數據看出,分離具有置於其 間之固化壓印材料之疊置玻片(未示出)所需之分離力量僅 5 0.62磅。固化之壓印材料係自本體材料A5及表面活性劑S3 之組成物(以A5-S3表示)形成。此係少於對於自本體材料A5 及表面活性劑S1(以A5-S1表示)或本體材料A5及表面活性 劑S4(以A5-S4)之組成物形成之固化壓印材料所需之分離 力量。另言之,當與用以分離具有置於其間之固化本體材 10 料A5且缺乏表面活性劑(以A5-NS表示)之疊置玻片(未示出) 所需之分離力量相比時,實現減少72%之分離力量。 A5-NS、A5-S1、A5-S3及A5-S4組成物之每一者具有約20 至30 cPs(包含)之室溫黏度,且於室溫使用旋塗技術沈積。 A 5 - S1組成物由約9 9 · 5 %之本體材料A 5及0,5 %之表面活性 15 劑S1組成。A5-S3組成物由約99.5%之本體材料A5及0.5%之 表面活性劑S3所組成。A5-S4組成物由約99.5%之本體材科 A5及0.5%之表面活性劑S4所組成。 34 1331958 包含本體材料-A6之壓印材料 7 - (赘)彻A黎令¥蜞A5-NS A5-S3 A5*S4 A5-S1 As seen from the separation data for the bulk material A5, the separation force required to separate the stacked slides (not shown) with the cured imprint material placed therebetween is only 5 0.62 lbs. The cured imprint material is formed from a composition of the bulk material A5 and the surfactant S3 (indicated by A5-S3). This is less than the separation force required for the cured imprint material formed from the bulk material A5 and the surfactant S1 (represented by A5-S1) or the bulk material A5 and the surfactant S4 (as A5-S4). . In addition, when compared to the separation force required to separate a laminated slide (not shown) having a cured body material A5 disposed therebetween and lacking a surfactant (indicated by A5-NS) , achieving a separation power of 72%. Each of the A5-NS, A5-S1, A5-S3, and A5-S4 compositions has a room temperature viscosity of about 20 to 30 cPs (inclusive) and is deposited using a spin coating technique at room temperature. The A 5 -S1 composition consists of about 9 9 % of the bulk material A 5 and 0,5 % of the surface active 15 dose S1. The A5-S3 composition consisted of about 99.5% of bulk material A5 and 0.5% of surfactant S3. The A5-S4 composition consisted of about 99.5% of the bulk material A5 and 0.5% of the surfactant S4. 34 1331958 Imprint material containing bulk material -A6 7 - (赘)彻阿黎令¥蜞

A6-NS A6-NS B/8 A6-S3 A6-S5 關於缺乏表面活性劑之本體材料A6於二疊置轉移層間 固化之分離力量數據係以A6-NS B/B表示。特別地,此二疊 置玻片(未不出)之每一者具有形成於其上之DUV30J層。 DUV30J係可得自 Brewer Science, Inc. of Rolla, Missouri。所 10 欲地係使固化本體材料八6與轉移層(未示出)充份黏著,且 自壓印模板(未示出)輕易脫離。亦顯示關於缺乏表面活性劑 之本體材料A6(其係於二疊置玻片(未示出)間固化,且其上 不具先前之層)之分離力量數據,以A6-NS表示。 由關於本體材料A6之分離數據看出,用以分離無上述 轉移增存在且具有置於其間之含有本體材料A6及表面活性 劑S3之固化組成物(以A6-S3表示)之疊置玻片(未示出)所需 之分離力置僅需〇·95碎。此係少於用於本體材料A6及表面 活性劑S5之組成物(以A6-S5表示)所需分離力量或用於 A6-NS B/B所需之分離力量之磅數。易言之,當與用以分離 具有固化本體材料A6-NS之疊置玻片(未示出)所需之分離 35 15 力量相比時,實現減少84%之分離力罝。 數據暗示選擇性之黏著已達成。雖然S3及S5具有全氟 疏水性基,S3似乎於降低黏著係比S5更有效。因此,相信 氟化添加劑之結構變化對於脫模性質具有顯著衝擊。例 5 如,S3具有含有疏水性尾部及親水性頭部之表面活性劑分 子,其如所示提供合意之脫模特性。A6-NS、A6-S3及A6-S5 組成物具有約4 cPs之室溫黏度,且於室溫使用滴液分配技 術沈積。A6-S3組成物係由約99.5%之本體材料A6及0.5%之 表面活性劑S3組成。A6-S5組成物係由約99.5%之本體材料 10 A6及0.5%之表面活性劑S5組成。 包含本體材料-A7之壓印材料 7 6 5 4 3 2 1 r- ft. .ft 霸ΙΒΏ 圍 ______ A7-NS A7-NS A7-S3 A7-S4 A7-S1 A7-S6 A7-S7 A7-S8A6-NS A6-NS B/8 A6-S3 A6-S5 The separation force data for the solidification of the bulk material A6 lacking the surfactant between the two stacks is indicated by A6-NS B/B. In particular, each of the two stacked slides (not shown) has a DUV 30J layer formed thereon. The DUV30J line is available from Brewer Science, Inc. of Rolla, Missouri. The cured body material VIII is sufficiently adhered to the transfer layer (not shown) and is easily detached from the embossing stencil (not shown). The separation force data for the bulk material A6 lacking the surfactant (which is cured between two stacked slides (not shown) and having no previous layer thereon) is also shown, indicated by A6-NS. As seen from the separation data for the bulk material A6, a laminated slide for separating the cured composition containing the bulk material A6 and the surfactant S3 (indicated by A6-S3) without the above-mentioned transfer enhancement is provided. The separation force required (not shown) is only required to be broken. This is less than the separation force required for the composition of bulk material A6 and surfactant S5 (indicated by A6-S5) or the fraction of separation force required for A6-NS B/B. In other words, a separation force reduction of 84% is achieved when compared to the separation force required to separate the laminated slides (not shown) having the cured bulk material A6-NS. The data suggests that the adhesion of selectivity has been achieved. Although S3 and S5 have a perfluorohydrophobic group, S3 appears to be more effective at lowering the adhesion system than S5. Therefore, it is believed that the structural change of the fluorinated additive has a significant impact on the release properties. Example 5 For example, S3 has a surfactant molecule comprising a hydrophobic tail and a hydrophilic head which provides desirable release properties as shown. The A6-NS, A6-S3, and A6-S5 compositions have a room temperature viscosity of about 4 cPs and are deposited using a drop dispensing technique at room temperature. The A6-S3 composition consisted of about 99.5% of bulk material A6 and 0.5% of surfactant S3. The A6-S5 composition consisted of about 99.5% of the bulk material 10 A6 and 0.5% of the surfactant S5. Imprint material comprising bulk material - A7 7 6 5 4 3 2 1 r- ft. .ft ΙΒΏ 围 ______ A7-NS A7-NS A7-S3 A7-S4 A7-S1 A7-S6 A7-S7 A7- S8

8/B 關於缺乏表面活性劑之本體材料A7於二疊置轉移層間 固化之分離力量數據係以A7-NS B/B表示。特別地,此二疊 15 置玻片(未示出)之每一者具有形成於其上之如上所論及之 DUV30J層。亦顯示有關於缺乏表面活性劑之本體材料A7 於二疊置玻片(未示出)間固化且其上不具有先前層之分離 36 力量數據,以A7-NS表示。如自回顧先前數據所預期,表 面活性劑組份之存在對於包含本體材料A7之壓印材料組成 物係提供經重大改良之脫模性質。亦證明混合表面活性劑 組份(諸如,S7及S8)於成功地降低所需之分離力量。 A7-NS、A7-S1、A7-S3、A7-S4、A7-S5、A7-S6 ' A7-S7及 A7-S8植成物每一者具有約4 cps之室溫黏度,且於室溫使 用滴液分配技術沈積。A7-S1組成物係由約99.5%之本體材 料A7及〇·5%之表面活性劑S1組成。A7-S3組成物係由約 99.5%之本體材料A7及0.5%之表面活性劑S3組成。A7-S4組 成物係由約9 9 · 5 %之本體材料a 7及0.5 %之表面活性劑s 4組 成。A7-S5組成物係由約99.5%之本體材料A7及0.5%之表面 活性劑S5組成。A7-S6組成物係由約99.5%之本體材料八7及 0.5%之表面活性劑S6組成。A7_S7組成物係由約99 5%之本 體材料A7及0.5%之表面活性劑S7組成。A7 S8組成物係由 約99.5%之本體材料八7及〇 5%之表面活性劑S8組成。 參考第2圖’提供表面活㈣之—考量储其引入壓印 材料内會增加填充模具36形貌所需之時間。如上所述,層 7_由於與壓印材料接觸造成於表面%上形成4面活性 』提供之脫模性質係自其疏水性造成,此與欲用以快速覆 蓋模具36之外貌之濕㈣性相衝突。特別地相信於分子 内包含氟原子之表面活性劑之情況,分子内太大數量之含 氟分子及與太大數量之含氟分子偶合造成含教分子群集產 生。此等群集(特別是具有自空氣·液體界面延伸之CP;端基 者)被認為提供具有會大量影響關於表面58之壓工材料之 濕潤特性之非所欲疏水性分佈之層7 0。 相k藉由使氣肩子適S为佈於表面活性劑分子内,及 使含氟分子分佈於整個層70之體積(因此,統稱為氟原子分 佈於整個體積),"5J*達成可接受之親水性分佈。於層7〇内之 表面活性劑分子及含氟分子内達成合意之氟原子分佈,薄 板層60被供以最佳之乳遗度,以提供合意之較佳脫模及黏 著’且不會藉由壓印材料不當地限制表面58之濕潤性。因 此,壓印方法被提供令人滿思之填充及脫模性質。此典型 上係於具有約1 nm厚度之薄板層60發生。 決定氟原子於表面活性劑分子及含氟分子内之合意分 佈存在之一方式係涉及測量壓印材料與表面58接觸之接觸 角。因此,測角儀被用於接觸角測量。自熔凝矽石形成之 模具56於piranha溶液内清理,且貯存於以氮氣吹掃之環境 内。Piranha溶液係由2份濃縮Η4〇4及u>H2〇2於室溫混合 而組成。然後,模具以表面活性劑組份異丙醇(IpA)混合物 (例如,含有0.01 %表面活性劑組份且其餘係基本上由〗p A組 成之IPA混合物)沖洗。沖洗後’模具%接受氮流體(例如, 氮氣)以將其吹。再次地,模具36被曝置於相同之IpA混合 物,然後直接曝置於氮流體流。然後,壓印材料之滴液係 以約2 # 1至5 // 1範圍之體積沈積於模具36上。測量於表面% 上位於各種不同位置之數個不同滴液之接觸角。於此實施 例,接觸角測量係使用測角儀相對應於模具36上之7個不同 位置為之。七個接觸角測量之平均值被用以獲得最後之接 觸角數值。考量層70於每次與基材上之壓印材料接觸時被 再裝填’前述實驗被認為正確測定不同壓印材料組成物之 相對濕潤性質。 接觸角、表面活性劑處理溶液,及填充性能係如下所 示0 5 本體材料A 7 -1之濕潤特性 表面活性 劑 FSO-100 FC-4430 & FC-4432 FC-4430 & R-08 R-08 R-08& FS-1230 接觸角 43.2° 20.2。 13.8° 17.3° 22.7。 以構成組份之同一性而言,本體材料A7-1係與本體材 料-A7相同,但添加表面活性劑組份。此二材料以存在之每 一構成組份之百分率而言係不同。於本體材料A7-1,組成 物約46.875%(以重量計)係IBOA ’組成物之24.875%(以重量 10 計)係1^八’組成物之24.875%(以重量計)係丑00八,組成物 之2.875%(以重量計)係Darocur 1173 ;且組成物之約〇·5%係 表面活性劑組份。特別地,以本體材料A7-1之0.5%由表面 活性劑FSO-100組成,最少之合意濕潤特性被提供。接觸 角於43.2°係最大。比較於由0.5%之組合表面活性劑r_〇8及 15 FC-4430組成之本體材料A7-1上提供之13.8°之接觸角,其 中,R-08及FC-4430每一者包含本體材料A7_l之0.25%。因 此’填充模具3 6形貌所需時間對於包含組合表面活性劑 R-08及FC-4430之層70係少於包含FSO-100之層70。對於剩 餘之測量,當組合表面活性劑FC-4430及FC-4432包含於本 20 體材料A7-1時接觸角係20.2°C,其中,FC-4430包含組成物 之約0.333%(以重量計),且FC-4432包含組成物之約 0.167%(以重量計)。另一由R-08及FS-1230組成之表面活性 劑組合物呈現約22.7°之接觸角,其中,R-08包含本體材料 39 1331958 A7-1之約0.4%(以重量計),且FS-1230包含本體材料A7-1之 約0.1%(以重量計)。 本體材料A8-1之濕潤特性 表面活 性劑 FSO-100 FC-4432 FC-4430 FS-2000 R-08 S-222N 接觸角 49.7° 26_5。 17.2° 21.4° 18.2。 19.2。 以構成組份之同一性而言,本體材料A8-1係與本體材 5 料-A8相同’但添加表面活性劑組份。以存在之每一構成組 份而言’此二材料係不同。於本體材料A8-1,組成物之約 20.875%(以重量計)係丙浠酸醋組份Genomer 1122,且組成 物之55.875%(以重量計)係迅0八。丙烯酸酯組份11000八係 約19.875重量%,且Darocur 1173係組成物之約2.875%(以重 10 量計)。組成物之剩餘0.5%係表面活性劑組份。特別地,以 0.5%之本體材料由FS0-100組成,最少之合意濕潤特性被提 供。接觸角於49.7。係最大。比較由0.5%表面活性劑FC-4430 纽成之本體材料A8-1上提供之17.2。之接觸角。因此,填充 模具36之形貌所需之時間對於包含表面活性劑FC_443〇之 15 層7〇係少於包含FSO-100之層70。對於剩餘測量,約18.2。 之接觸角係於R-08表面活性劑包含於本體材料八8-1内時呈 現。以包含於本體材料A8-1内之表面活性劑s_222N,呈現 19_2之接觸角,且21.4。之接觸角係於表面活性劑1^-2〇〇〇 被包含於本體材料A8-1内時呈現。26·5。之接觸角係於表面 20活性劑FC-4432被包含於本體材料Α8-1内時呈現。 需瞭解具合意濕润特性之較佳黏著及脫模之相似益處 可藉由改變模具36上或本體材料内或二者之表面活性劑組 成而達成。例如,增加本體材料Α8-]内之表面活性劑濃度 40 1331958 至組成物之0.7%(以重量計)且〇 2%包含Tergit〇i np_丨〇且 0.5%係FS-2000,係藉由約17 ^之接觸角證實呈現第二最 佳濕湖特性。需注意對於此測量,約〇丨2%之如上所述之IPA 混合物(由表面活性劑混合物FS_2〇〇〇及Tergit〇l Np_丨〇組成) 5替代溶液之0.01%。於此例子’其間使用含氟及不含氟之表 面活性劑之表面活性劑混合物被使用^ Tergitol NP-10係烴 表面活性劑’其具有比氟化表面活性劑(諸如,FS 2〇〇〇)更 快之動態速度。 另外,表面活性劑組成物可藉由於層7〇中使用與模具 10 接觸之壓印材料内所包含者不同之表面活性劑而改質。例 如, 本體材料A7-2 表面活 性劑 FC-4430 FC屬2 FC-4430 R-08 FC-4430 & FC-4432 R-08& FC4430 接觸角 43.2° 26。 18.1° 20.0° 22。 14.7° 本體材料A7-2包含材料A7-1之所有構成組份,且包含 表面活性劑FSO-100。於本體材料A7-2,組成物之約 15 46.875%(以重量計)係IBOA ’組成物之24.875%(以重量計) 係11^1八,組成物之24.875%(以重量計)係£00八,組成物之 2.875%(以重量計)係0訂(^111:1173;且其約 0.5%係 FSO-100。特別地’表面58以包含FS〇-100之IPA混合物塗 覆,最少之合意濕潤特性被提供,且接觸角於43_2°係最 2〇 大。藉由以組合表面活性劑R-⑽及FC-4430(其每一者包含 IPA混合物之0.5%)塗覆之表面’呈現之接觸角係14.7。。 對於剩餘之測量,約18.1°之接觸角係於表面58以FC-4430 ⑧ 41 表面活性劑塗覆時呈現,且約20°之接觸角於表面58以R-08 表面活性劑塗覆時呈現。當表面58以包含FC-4430之組合表 面活性劑塗覆且FC-4432沈積於層70時,呈現約22°之接觸 角。FC-4430包含IPA混合物之0.333%且FC-4432包含IPA混 5 合物之0.167%(以重量計)。當表面58以缺乏任何其它表面 活性劑之FC-4432塗覆時,呈現約26.0°之接觸角。因此, 可看出,藉由於每一本體材料中適當選擇表面活性劑組 份,合意之濕潤特性可與合意之較佳黏著及脫模特性一起 被獲得。 10 如上所述之本發明實施例被例示。許多變化及改質可 對上述揭露内容為之,且同時保持於本發明範圍内。因此, 本發明之範圍不應參考上述描述内容而決定,但替代地, 係應參考所附申請專利範圍與其等化物之完整範圍而決 定。 15 【圖式簡單說明】 第1圖係依據習知技藝之微影系統之代表圖; 第2圖係依據本發明之模板及置於基材上之壓印材料 之簡化立面圖; 第3圖係第2圖所示之模板及基材之簡化立面圖,且壓 20 印材料係以經形成圖案及固化而顯示; 第4圖係第2圖所示之壓印材料之滴液之詳細圖,其顯 示滴液分成富表面活性劑之區域及耗乏表面活性劑之區 域; 第5圖係使用旋塗技術沈積之壓印材料層之詳細圖,顯 42 1331958 示此層係分成富表面活性劑之區域及耗乏表面活性劑之區 域; 第6圖係如第4或5圖所示般沈積之與模板接觸之壓印 材料之截面圖,證明弱邊界薄板於固化壓印材料及模板間 ' 5 形成;及 第7圖係第6圖所示之依據本發明之模板之截面圖,其 具有置於其上之含表面活性劑溶液層。 【主要元件符號說明】 10". ,.,糸統 34.· ----記憶體 11... ...平台 36·. ....模具 12... …紐 38.. ....凹部 14... …模板 40.. …石部 16... ...模具 42·. …·紐 18... ...形成圖案之表面 44.. ....表面 20... ...壓印頭 46.. ...•滴液 22... ...流體分配糸統 50.. ....形成物 24... ...可聚合之材料 52.. …·次部份 26... ...能量來源 54·. …·次部份 28... ...能量 56·. •…側 30... …路徑 58·· ..表面 32... ...處理器 60·. •…薄板 43 1331958 62,64.., 側 146... ...滴液 70•…·· 層 236… ...富表面活性劑之次部份 136..... ..富表面活性劑之次部份 237… ...耗乏表面活性劑之次部 137….. ..耗乏表面活性劑組份之 份 次部份8/B The separation force data for the solidification of the bulk material A7 lacking the surfactant between the two stacked transfer layers is indicated by A7-NS B/B. In particular, each of the two stacks of slides (not shown) has a DUV 30J layer as described above formed thereon. It is also shown that the bulk material A7 lacking the surfactant cures between the two stacked slides (not shown) and has no separation of the previous layers thereon. 36 Force data, indicated by A7-NS. The presence of the surfactant component provides a significantly improved release properties for the imprint material composition comprising bulk material A7, as expected from reviewing previous data. Mixed surfactant components such as S7 and S8 have also been shown to successfully reduce the required separation force. A7-NS, A7-S1, A7-S3, A7-S4, A7-S5, A7-S6 'A7-S7 and A7-S8 plants each have a room temperature viscosity of about 4 cps, and at room temperature Deposition using drop dispensing techniques. The A7-S1 composition consisted of about 99.5% of the bulk material A7 and 5% 5% of the surfactant S1. The A7-S3 composition consisted of about 99.5% of the bulk material A7 and 0.5% of the surfactant S3. The A7-S4 composition consists of about 99.5% of the bulk material a7 and 0.5% of the surfactant s4. The A7-S5 composition consisted of about 99.5% of the bulk material A7 and 0.5% of the surfactant S5. The A7-S6 composition consists of about 99.5% of the bulk material VIII and 0.5% of the surfactant S6. The A7_S7 composition consists of about 99% of the bulk material A7 and 0.5% of the surfactant S7. The A7 S8 composition consists of about 99.5% of the bulk material VIII and 5% of the surfactant S8. Referring to Figure 2, which provides surface activity (4), it is considered that the time required to store the introduced embossed material increases the time required to fill the topography of the mold 36. As described above, the release property of the layer 7_ due to contact with the imprinting material to form a 4-sided activity on the surface % is caused by its hydrophobicity, which is intended to quickly cover the wetness of the mold 36. Conflict. Particularly conceivable in the case of a surfactant containing a fluorine atom in the molecule, a large amount of fluorine-containing molecules in the molecule and coupling with a too large number of fluorine-containing molecules cause clustering of the teaching molecules. Such clusters (especially those having an extension from the air-liquid interface; end groups) are believed to provide a layer 70 having an undesired hydrophobic distribution that would greatly affect the wetting characteristics of the press material with respect to surface 58. The phase k is achieved by arranging the gas shoulders in the surfactant molecules and distributing the fluorine molecules in the volume of the entire layer 70 (hence, collectively referred to as fluorine atoms distributed throughout the volume), "5J* Accept the hydrophilic distribution. The desired distribution of fluorine atoms in the surfactant molecules and fluorine-containing molecules in the layer 7〇, the thin layer 60 is provided with the best milk degree to provide a desirable better release and adhesion 'and will not borrow The wettability of the surface 58 is unduly restricted by the embossing material. Therefore, the imprint method is provided with a thoughtful filling and demolding property. This typically occurs with a thin layer 60 having a thickness of about 1 nm. One way to determine the desired distribution of fluorine atoms in the surfactant molecules and fluorine-containing molecules involves measuring the contact angle of the imprinted material with the surface 58. Therefore, the goniometer is used for contact angle measurement. The mold 56 formed from the fused vermiculite was cleaned in a piranha solution and stored in an environment purged with nitrogen. The Piranha solution consisted of 2 parts of concentrated Η4〇4 and u>H2〇2 mixed at room temperature. The mold is then rinsed with a surfactant component isopropanol (IpA) mixture (e.g., an IPA mixture containing 0.01% of the surfactant component and the remainder consisting essentially of <p>A). After rinsing, the mold accepts a nitrogen fluid (e.g., nitrogen) to blow it. Again, mold 36 is exposed to the same IpA mixture and then directly exposed to the nitrogen fluid stream. Then, the drip of the imprint material is deposited on the mold 36 in a volume ranging from about 2 #1 to 5 //1. The contact angles of several different drops at various locations on the surface % were measured. In this embodiment, the contact angle measurement is performed using a goniometer corresponding to seven different positions on the mold 36. The average of the seven contact angle measurements was used to obtain the final contact angle value. The consideration layer 70 is refilled each time it comes into contact with the imprint material on the substrate. The foregoing experiments were considered to correctly determine the relative wetting properties of the different imprint material compositions. Contact angle, surfactant treatment solution, and filling properties are as follows. 0 5 Wetting properties of bulk material A 7 -1 Surfactant FSO-100 FC-4430 & FC-4432 FC-4430 & R-08 R -08 R-08& FS-1230 Contact angle 43.2° 20.2. 13.8° 17.3° 22.7. In terms of the identity of the constituent components, the bulk material A7-1 is the same as the bulk material -A7, but a surfactant component is added. These two materials differ in the percentage of each of the constituent components present. For the bulk material A7-1, the composition is about 46.875% by weight. 24.875% (by weight 10) of the composition of the IBOA' is 24.875% (by weight) of the composition of the 1^8'. 2.875% by weight of the composition is Darocur 1173; and about 5% of the composition is a surfactant component. Specifically, 0.5% of the bulk material A7-1 is composed of the surfactant FSO-100, and the least desirable wet characteristics are provided. The contact angle is the largest at 43.2°. Comparing to a contact angle of 13.8° provided on a bulk material A7-1 consisting of 0.5% of the combination surfactants r_〇8 and 15 FC-4430, wherein each of R-08 and FC-4430 comprises a bulk material 0.25% of A7_l. Therefore, the time required to fill the mold 3 6 is less than the layer 70 containing the FSO-100 layer 70 comprising the combined surfactants R-08 and FC-4430. For the remaining measurements, when the combination of surfactants FC-4430 and FC-4432 is included in the present bulk material A7-1, the contact angle is 20.2 ° C, wherein FC-4430 comprises about 0.333% by weight of the composition. And FC-4432 comprises about 0.167% by weight of the composition. Another surfactant composition consisting of R-08 and FS-1230 exhibits a contact angle of about 22.7°, wherein R-08 comprises about 0.4% by weight of bulk material 39 1331958 A7-1, and FS -1230 comprises about 0.1% by weight of bulk material A7-1. Wetting characteristics of bulk material A8-1 Surfactant FSO-100 FC-4432 FC-4430 FS-2000 R-08 S-222N Contact angle 49.7° 26_5. 17.2° 21.4° 18.2. 19.2. In terms of the identity of the constituent components, the bulk material A8-1 is the same as the bulk material - A8, but the surfactant component is added. In the case of each of the constituent components present, the two materials are different. About bulk material A8-1, about 20.875% by weight of the composition was Genomer 1122, and the composition was 55.875% by weight. The acrylate component 11000 was about 19.875 wt%, and about 2.875% (by weight 10) of the Darocur 1173 system composition. The remaining 0.5% of the composition is the surfactant component. Specifically, 0.5% of the bulk material is composed of FS0-100, and the minimum desirable wettability is provided. The contact angle is at 49.7. The department is the largest. The 17.2 provided on the bulk material A8-1 made of 0.5% surfactant FC-4430 was compared. Contact angle. Therefore, the time required to fill the topography of the mold 36 is less than the layer 70 comprising the surfactant FC_443, which is less than the layer 70 comprising the FSO-100. For the remaining measurements, approximately 18.2. The contact angle is exhibited when the R-08 surfactant is contained in the bulk material 8-8. With the surfactant s_222N contained in the bulk material A8-1, a contact angle of 19_2 was exhibited, and 21.4. The contact angle is exhibited when the surfactant 1^-2〇〇〇 is contained in the bulk material A8-1. 26·5. The contact angle is attached to the surface 20 when the active agent FC-4432 is contained within the bulk material Α8-1. It is to be understood that the similar benefits of preferred adhesion and demolding with desirable wetting characteristics can be achieved by varying the composition of the surfactant on or in the bulk material or both. For example, increasing the surfactant concentration in the bulk material Α8-] 40 1331958 to 0.7% (by weight) of the composition and 〇2% comprises Tergit〇i np_丨〇 and 0.5% FS-2000 by A contact angle of about 17^ confirms the second best wet lake characteristic. Note that for this measurement, about 2% of the IPA mixture (composed of surfactant mixture FS_2〇〇〇 and Tergit〇l Np_丨〇) as described above was substituted for 0.01% of the solution. In this example, a surfactant mixture in which a fluorine-containing and fluorine-free surfactant is used is used as a Tergitol NP-10 hydrocarbon surfactant, which has a fluorinated surfactant (such as FS 2 〇〇〇). ) Faster dynamic speed. Alternatively, the surfactant composition may be modified by the use of a surfactant which is different from the one contained in the imprint material in contact with the mold 10 in the layer 7 crucible. For example, bulk material A7-2 surfactant FC-4430 FC is 2 FC-4430 R-08 FC-4430 & FC-4432 R-08& FC4430 contact angle 43.2° 26. 18.1° 20.0° 22. 14.7° The bulk material A7-2 contains all of the constituent components of material A7-1 and contains the surfactant FSO-100. For the bulk material A7-2, about 15 46.875% by weight of the composition is 24.875% by weight of the composition of the IBOA ', 11 of 18, and 24.875% by weight of the composition. 00 VIII, 2.875% (by weight) of the composition is 0 (11111:1173; and about 0.5% of it is FSO-100. In particular, the surface 58 is coated with an IPA mixture containing FS〇-100, at least The desired wetting characteristics are provided, and the contact angle is at most 2 〇 at 43 2°. By coating the surface of the surfactants R-(10) and FC-4430 (each of which contains 0.5% of the IPA mixture) The contact angle exhibited was 14.7. For the remaining measurements, a contact angle of about 18.1° was present when surface 58 was coated with FC-4430 8 41 surfactant, and a contact angle of about 20° was at surface 58 with R- 08 Surfactant when applied. When surface 58 is coated with a combination surfactant comprising FC-4430 and FC-4432 is deposited on layer 70, it exhibits a contact angle of about 22°. FC-4430 contains 0.333 of IPA mixture. % and FC-4432 comprises 0.167% by weight of the IPA blend. When surface 58 is coated with FC-4432 lacking any other surfactant, It has a contact angle of about 26.0. Therefore, it can be seen that by appropriately selecting the surfactant component in each bulk material, the desired wetting property can be obtained together with the desired better adhesion and release properties. The embodiments of the present invention are exemplified. Many variations and modifications may be made to the above disclosure while remaining within the scope of the present invention. Therefore, the scope of the present invention should not be determined with reference to the above description, but instead The drawings should be determined with reference to the scope of the appended claims and the full scope of the equivalents. 15 [Simple description of the drawings] Figure 1 is a representative diagram of a lithography system according to the prior art; Figure 2 is a template according to the present invention and A simplified elevational view of the embossed material placed on the substrate; Figure 3 is a simplified elevational view of the stencil and substrate shown in Figure 2, and the embossed 20 is shown as being patterned and cured; Figure 4 is a detailed view of the drip of the imprint material shown in Figure 2, which shows that the drip is divided into a surfactant-rich region and a surfactant-depleted region; Figure 5 is deposited using spin coating techniques. Imprint A detailed view of the layer, shown in pp. 13 1331958, shows that the layer is divided into a surfactant-rich region and a surfactant-depleting region; Figure 6 is an impression of the template deposited as shown in Figure 4 or Figure 5. a cross-sectional view of the material, demonstrating that the weak boundary sheet is formed between the cured imprint material and the stencil; and a cross-sectional view of the stencil according to the present invention shown in Fig. 6 having the surface on which it is placed Active agent solution layer. [Main component symbol description] 10". ,., 34 34.· ----Memory 11... Platform 36·. .... Mold 12... 38.. ....recess 14...template 40.....stone 16...mold 42·....new 18...formed surface 44.. ... Surface 20...imprint head 46.....•drop 22...fluid distribution system 50.....formation 24...polymerizable Material 52.....·Second part 26... Energy source 54·....Second part 28... Energy 56·. •... Side 30... Path 58·· .. Surface 32... Processor 60·. •... Sheet 43 1331958 62, 64.., Side 146... Drops 70•...·· Layer 236 ...the second part of the rich surfactant 136......the second part of the surfactant-rich 237...the second part of the surfactant is consumed 137..... Part of the component

4444

Claims (1)

1331958 第94M1186號專利申請案申請專利範圍修正本 99.7.19 十、申請專利範圍:^n 1 一鍤於且亡 __桷充1 •徑有—表面之模具及可聚合組成物間提供合意濕 潤及脫模舰之料,财法包含: 以體積之含表面活性劑之溶液在該表面形成塗覆 5層,且該表面活性劑包含一說化疏水性組份,其中該塗覆 層不是一先驗脫模層(a priori release layer): 使x模〃與該可聚合組成物接觸其中該塗覆層提供 # 一接觸角,該接觸角相對於該可聚合組成物具有少於50。之 數值》 1〇 2·如”專利範圍第1項之方法,其中,該接觸角之大小係 少於20°。 3·如申請專利範圍第1項之方法,其中,該含表面活性劑之 溶液及該可聚合組成物係自相同構成組份形成。 4.如申請專利範圍第㈣之方法,其中,該含表面活性劑之 15 纟液及該可聚合組成物係自不同構成組份形成。 • 5.如申請專利範圍第1項之方法,其中,該氟化疏水性組份 包含CF3及CF2基團。 6. -種降低基材及模具間之黏著力之方法,該方法包含: 使壓印材料置放於該模具及該基材之間,其中該壓印 2〇材料包含-表面活性劑組份以及本體材料,且該壓印材料 具有富表面活性劑組份之次部份及位於該富表面活性劑組 份次部份與該基材間之耗乏表面活性劑組份之次部份; 使該壓印材料與該模具接觸; 固化於該模具以及該基材之間的壓印材料且該模具不 45 1331958 具有一先驗脫模層;以及 使該模具從經固化之墨印材料分離,致使該經固化之 壓印材料仍然黏附於該基材。 7. 如申請專利範圍第6項之方法,其中,將該壓印材料置放 5 t步驟進—步包含形成·"空氣液體界面,該表面活性劑 組份具有多數個相對端,且該表面活性劑组份之該等相 對鈿之一者對該本體材料具有親和性,且剩餘端具有氟 組份,且該氟組份自該空氣·液體界面延伸。 8. 如申明專利範圍第6項之方法,其中,將該壓印材料置放 10 《步驟進—步包含沈積數個該壓印材料之滴液於該基材 上。 9. 如申凊專利範圍第6項之方法,其中,將該壓印材料置放 的步驟進一步包含於該基材上旋塗該壓印材料。 10. 如申請專利範圍第6項之方法,進一步包含固化該壓印 15 材料以形成固化形成物及置於該模具及該固化形成物間 之薄板。 11·如申請專利範圍第6項之方法,其中該模具包含一材 料,其選自於由熔融矽石、石英、銦錫氧化物 '似鑽石 之碳、MoSi及溶膠所組成之材料群組。 2〇 12. 一種界定空氣-液體界面之組成物,該組成物包含: 可聚合之本體材料;及 表面活性劑,其具有多數個相對端,其—端係對該本 體材料具有親和性’且剩餘端具有氟組份,該表面活性劑 具有下列化學式: 46 1331958 七巧士七Η2~Ά 〒=〇 f—(OR …)z—R,"· F(CF2CF2)mR"CH2CH20 O 其中R及R,係相同或不同的且係選自於由H及甲基所組成 之組群;其中R”係選擇性的磺醯基連接基團-s〇2N(R’’’”), 且R,,,,,係選自於由(:丨至(:6烷基所組成之組群;其中(〇R’’’)z係1331958 Patent Application No. 94M1186 Application for Patent Scope Amendment 99.7.19 X. Patent Application Range: ^n 1 锸 且 亡 亡 • • • • • • • • • 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面 表面And the material of the demolishing ship, the method comprising: forming a coating of 5 layers on the surface by a volume of the surfactant-containing solution, and the surfactant comprises a hydrophobic component, wherein the coating layer is not a A priori release layer: The x die is contacted with the polymerizable composition wherein the coating provides a contact angle having less than 50 relative to the polymerizable composition. The method of claim 1, wherein the contact angle is less than 20°. 3. The method of claim 1, wherein the surfactant is included And the polymerizable composition is formed from the same component. 5. The method of claim 1, wherein the fluorinated hydrophobic component comprises CF3 and CF2 groups. 6. A method of reducing adhesion between a substrate and a mold, the method comprising: An embossing material is placed between the mold and the substrate, wherein the embossed material comprises a surfactant component and a bulk material, and the embossed material has a second portion of the surfactant-rich component And a second portion of the spent surfactant component between the second portion of the rich surfactant component and the substrate; contacting the imprint material with the mold; curing between the mold and the substrate Imprinted material and the mold is not 45 1331958 a pre-release layer; and separating the mold from the cured ink-printing material such that the cured imprint material remains adhered to the substrate. 7. The method of claim 6 wherein The embossing material is placed in a 5 t step further comprising forming an "air liquid interface, the surfactant component having a plurality of opposite ends, and one of the relative enthalpy of the surfactant component The bulk material has an affinity, and the remaining end has a fluorine component, and the fluorine component extends from the air/liquid interface. 8. The method of claim 6, wherein the imprint material is placed 10 The step further comprises depositing a plurality of drops of the imprinting material on the substrate. 9. The method of claim 6, wherein the step of placing the imprinting material is further included in the base The embossing material is spin-coated. 10. The method of claim 6, further comprising curing the embossing 15 material to form a cured formation and a sheet disposed between the mold and the cured formation. Such as applying for a patent The method of claim 6, wherein the mold comprises a material selected from the group consisting of molten vermiculite, quartz, indium tin oxide, diamond-like carbon, MoSi, and sol. 2〇12. a composition defining an air-liquid interface, the composition comprising: a polymerizable bulk material; and a surfactant having a plurality of opposite ends, the ends having an affinity for the bulk material and the remaining ends having a fluorine group The surfactant has the following chemical formula: 46 1331958 七巧士七Η2~Ά 〒=〇f—(OR ...)z—R,"· F(CF2CF2)mR"CH2CH20 O where R and R are the same Or different and selected from the group consisting of H and methyl; wherein R" is a selective sulfonyl linking group -s〇2N(R'''"), and R,,,, , selected from the group consisting of (: 丨 to (: 6 alkyl groups; wherein (〇R''') z series 一聚(氧烷撐基),其包含至少一類型之氧烷撐基單元;其中 R’,,’係一端基,其選自於由Η、甲基以及(^至(:4烷基所組成 之組群;其中該X比y之比例係於1:2至3:1的範圍内;且其中 ni為包含2至10之範圍中的整數。 13. 如申請專利範圍第12項之組成物,其中,該氟組份係自 10 該空氣-液體界面延伸。 14. 如申請專利範圍第12項之組成物,其進一步包含一額外 的表面活性劑,該額外之表面活性劑組份係選自於由離 φ 子性、非離子性、陽離子性及兩性表面活性劑所組成之 組群。 15 15.如申請專利範圍第12項之組成物,其進一步包含一額外 之表面活性劑組份具有下列化學式: f(cf2cf2)x,ch2ch2o(r,,,,,’〇)Y,R,,,,,,, 其中,(R”,,,,0)Y=係聚(氧院縣),其包含具有2至4個碳原 子之基團,且尺,,,,,,,係11或(:|至(:4烷基之端基,且父,及” 20 包含2至10之範圍中之整數。 16.如申請專利範圍第12項之組成物,其進一步包含—額外 47 1331958 之表面活性劑組份具有下列結構: F(CF2CF2)X,-烷基-N+R,’ ’ ’·’,3cr 其中,X’係包含1至7之範圍之整數。 17.如申請專利範圍第12項之組成物,其進一步包含一額外 5 之表面活性劑組份具有下列結構:a poly(oxyalkylene) group comprising at least one type of oxyalkylene unit; wherein R',' is an end group selected from the group consisting of hydrazine, methyl and (^ to (: 4 alkyl) a group consisting of; wherein the ratio of X to y is in the range of 1:2 to 3:1; and wherein ni is an integer in the range of 2 to 10. 13. The composition of claim 12 And the fluorine component is extended from the air-liquid interface. 14. The composition of claim 12, further comprising an additional surfactant, the additional surfactant component a group selected from the group consisting of π, nonionic, cationic and amphoteric surfactants. 15 15. The composition of claim 12, further comprising an additional surfactant group The formula has the following chemical formula: f(cf2cf2)x, ch2ch2o(r,,,,,'〇)Y,R,,,,,,,,,(R",,,,0)Y=systematic County), which contains a group having 2 to 4 carbon atoms, and a ruler,,,,,,, a system of 11 or (:| to (:4 alkyl) And the parent, and "20" contains an integer in the range of 2 to 10. 16. The composition of claim 12, which further comprises - an additional 47 1331958 surfactant component having the following structure: F(CF2CF2 X, -alkyl-N+R, ' ' '·, 3cr wherein X' contains an integer ranging from 1 to 7. 17. The composition of claim 12, further comprising an additional The surfactant component of 5 has the following structure: Η 其中,X’係包含0至6之範圍中之整數,且y’係包含0至15之 範圍中之整數。 18. 如申請專利範圍第12項之組成物,其進一步包含一額外 10 的表面活性劑組份具有下列結構: 〇 S [CF3CF2{CF2CF2 ^.CH2CH20] x-P(OH)y. 其中,X’係具有1至2數值之整數;y’係具有2至1數值之整 數;z’係具有包含0至6的範圍中之數值之整數。 19. 如申請專利範圍第12項之組成物,其進一步包含一額外 15 的表面活性劑,該額外之表面活性劑包含氟及矽原子。 20. 如申請專利範圍第12項之組成物,其進一步包含一額外 的表面活性劑,且該額外之表面活性劑組份係選自於由 以矽為主之表面活性劑、以烴為主之表面活性劑,及氟 化表面活性劑所組成之組群。 48 1331958 21. 如申請專利範圍第15項之組成物,其中(R’’”’O)Y,係一 聚(氧烷撐基)基團,該基團包括CH2CH2-、 -CH2CH2CH2-、-CH(CH3)CH2-,或-CH(CH3)CH(CH3)-。 22. 如申請專利範圍第15項之組成物,其中係氫或甲 5 基。 49Wherein X' contains an integer in the range of 0 to 6, and y' contains an integer in the range of 0 to 15. 18. The composition of claim 12, further comprising an additional 10 surfactant component having the structure: 〇S [CF3CF2{CF2CF2 ^.CH2CH20] xP(OH)y. wherein, the X' system An integer having a value of 1 to 2; y' is an integer having a value of 2 to 1; z' has an integer containing a value in the range of 0 to 6. 19. The composition of claim 12, further comprising an additional 15 surfactant comprising fluorine and deuterium atoms. 20. The composition of claim 12, further comprising an additional surfactant, and the additional surfactant component is selected from the group consisting of surfactants based on ruthenium and hydrocarbons. a group of surfactants, and fluorinated surfactants. 48 1331958 21. The composition of claim 15, wherein (R''"'O)Y is a poly(oxyalkylene) group, the group comprising CH2CH2-, -CH2CH2CH2-, - CH(CH3)CH2-, or -CH(CH3)CH(CH3)-. 22. The composition of claim 15 which is hydrogen or alpha-5.
TW94141186A 2004-11-24 2005-11-23 Method and composition providing desirable characteristics between a mold and a polymerizable composition TWI331958B (en)

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US63102904P 2004-11-24 2004-11-24
US1237404A 2004-12-15 2004-12-15
US1237504A 2004-12-15 2004-12-15
US6839705A 2005-02-28 2005-02-28
US11/068,174 US20060108710A1 (en) 2004-11-24 2005-02-28 Method to reduce adhesion between a conformable region and a mold
US11/068,171 US7307118B2 (en) 2004-11-24 2005-02-28 Composition to reduce adhesion between a conformable region and a mold
US11/244,428 US7837921B2 (en) 2004-01-23 2005-10-05 Method of providing desirable wetting and release characteristics between a mold and a polymerizable composition

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