1314261 - 九、發明說明： 【發明所屬之技術領域】 . 本發明涉及一種散熱器組合，特別係一種可安裝於不 ' 同架構主機板之散熱器組合。 【先前技術】 在電腦主機内安裝有電路板及各種不同的零、元件。 以現今的電腦主機而言’其主機板形式通常為ATX架構 • (Advanced technology extended，應用擴展架構）和 ΒΤχ 架 構（Balanced technology extended，可擴展平衡架構）之主機 板0 通常ATX或BTX主機板上均設置有發熱電子元件， 例如微處理晶片’為有效散發該微處理晶片産生之熱量， 通常採用的方法是將一散熱器緊密地貼設於該微處理晶片 的溢熱表面，以協助發熱電子元件散熱，保證發熱電子元 件在適當的溫度下運作。1314261 - IX. Description of the invention: [Technical field to which the invention pertains] The present invention relates to a heat sink assembly, and more particularly to a heat sink assembly that can be mounted on a motherboard that is not the same architecture. [Prior Art] A circuit board and various components and components are mounted in the mainframe. In today's computer mainframes, the main board format is usually ATX architecture (Advanced technology extended) and Balanced technology extended (scalable technology extended) motherboard 0. Usually ATX or BTX motherboard Equipped with heat-generating electronic components, such as micro-processed wafers, in order to effectively dissipate the heat generated by the micro-processed wafer, a method is generally applied to closely attach a heat sink to the heat-dissipating surface of the micro-processed wafer to assist the heat-generating electrons. The components dissipate heat to ensure that the hot electronic components operate at the proper temperature.
同時相容於ATX及BTX主機板，Also compatible with ATX and BTX motherboards,
有待進一步改進。 【發明内容】 衣這灯敢熱器，那麽這些 文或者BTX主機板，不能 例如美國專利公卷笼6 <49,41〇 結構， 有鑒於此，有必要提供— 種可安裝於不同架構主機板 6 1314261 上之散熱器組合。 一種散熱器組合，包括一基座、置於該基座上之複數 _散熱鰭片及穿過該基座之複數扣具，該基座上設有對應於 ‘扣具之槽道，該扣具可沿該槽道於第一及第二位置之間水 平滑動以適配不同架構之主機板。 相較於習知技術，該散熱器基座上設有槽道，該扣具 通過於該槽導内滑動從而改變其位置以適應不同架構之主 機板。 >【實施方式】 圖1至圖3揭示一種散熱器組合10,該散熱器組合10 可按照實際應用需求調整部分元件而分別適用於ATX主機 板20(參見圖4)或BTX主機板30(參見圖5)。 該散熱器組合10用於對置於ATX或BTX主機板20, 30上之發熱電子元件進行（圖未示）散熱，該散熱器組合10 包括一散熱器及組裝於散熱器上之四扣具15。 ► 該散熱器包括一基座12及自基座12頂面垂直向上延伸 之複數平行散熱鰭片14。該基座12具有一方形本體（圖未 標）及自該本體之四角落水平向外延伸設置之凸耳122。這 些散熱鰭片14之間形成複數散熱通道（圖未標）。第一及第 二水平延伸的直的通槽1221，1222對稱設於每一凸耳122 上，該第一通槽1221與第二通槽1222連通設置且二者之 間具有一夾角，從而使第一通槽1221與第二通槽1222形 成一 V形槽道1220，其中該第一通槽1221設於遠離散熱 鰭片14通道之一側，第二通槽1222設於靠近散熱鰭片14 7 1314261 通道之一侧。第一及第二通槽1221，1222相背離之兩端分 別形成第一及第二通孔1223, 1224。第一及第二通孔1223, • 1224均呈圓形設置且其内徑之尺寸較第一及第二通槽 1221，1222寬度之尺寸大。每一凸耳122之第一及第二通 孔1223，1224内形成一圓環形臺階部121。該第一及第二 通孔1223,1224之具體位置是根據ATX及BTX主機板20, 30之規格設計的，從而使扣具15置於第一通孔1223内時， 該散熱器組合10適合安裝於ATX主機板20上；當該扣具 * 15置於第二通孔1224内時，該散熱器組合10適合安裝於 BTX主機板30上。 每一扣具15對應於散熱器組合10之每一凸耳122，其 用於穿過凸耳122上之第一通孔1223或第二通孔1224進 而將該散熱器組合10安裝於ATX主機板20或BTX主機 板30上。該扣具15包括一螺釘16、一套置於該螺釘16 上之彈簧18及扣片19。該螺釘16包括一圓形之頭部160、 鲁一自該頭部160向下延伸設置之縱長圓柱形桿件162及形 成於該桿件162末端之螺紋部164。該頭部160頂面設有一 十字形狀凹槽1602用以供一外部工具，例如螺絲起子插入 擰動，該頭部160之外徑較第一及第二通孔1223，1224之 内徑大。桿件162中部外圍設有一縱長環形凹槽（圖未標） 以使該桿件162相應於該凹槽位置形成一配合部163,該配 合部163之外徑較桿件162之外徑及較凸耳122上之V形 槽道1220之寬度尺寸小，以便使該配合部163可沿著該槽 道1220滑動。該配合部163沿豎直方向之高度較散熱器基 8 1314261 -座12的高，扣具15安裝過程中，該配合部163可於第一 或第二通孔1223，1224内上下移動。該彈簀18套置於扣 '具15之桿件162上，其外徑較基座12之第一或第二通孔 - 1223，1224之内徑小且較臺階部121之内徑大，以便於該 散熱器組合10在安裝至ATX或BTX主機板20，30上時 彈簧1223座落於臺階部121上且對凸耳122施加一向下之 作用力。彈簧18之外徑較V形槽1220之寬度大，當彈簧 18座落於臺階部121時，可限制該扣具15沿V形槽1220 * 内之滑動。該扣片19呈圓環狀，其包括一中心孔190及與 中心孔190連通且環繞於該中心孔190外圍之凹槽192,該 凹槽192用以提供該扣片19之彈性變形。該中心孔190之 内徑較扣具15之桿件162外徑小，當扣具15穿過基座12 後，該扣片19套置於扣具15之配合部163之末端且抵靠 於與配合部163末端連接之桿件162上。 組裝時，套置有彈簧18之螺絲16穿過基座12上之第 鲁一或第二通孔1223，1224。在本實施例中，螺絲16首先穿 過第一通孔1223,彈簧18由於重力原因自由自動座落於第 一通孔1223内之臺階部121上，螺絲16之頭部160則抵 靠於彈簧18之頂端，從而使彈簧18位於螺絲16之頭部160 與第一通孔1223之臺階部121之間。請參閱圖2，此時螺 絲16之配合部163超出基座12之底面，將扣片19卡置配 合部163末端且抵靠於配合部163下方之桿件162上，該 扣片19可防止散熱器組合10在受到震動或運輸過程中而 從基座12上甩出。如此，便完成了如圖2所示之散熱器組 9 1314261 -合10的組裝，在這個位置，彈簀18與第一通孔1223内之 臺階部121接觸，扣片19位於基座12之下方且與基座12 之底面相隔一段距離。 . 請參閱圖4至圖5,使用時，將圖1中之散熱器組合 10置於ATX主機板20上，通過扣具15之螺紋部164與 ATX主機板20下面之一背板（圖未示）螺合，進而將散熱器 組合10安裝於ATX主機板20上，如圖4所示，即為散熱 器組合10安裝於ATX主機板20之立體組裝圖。如果圖1 * 中組裝好之散熱器組合10要安裝於BTX主機板30上，則 需要將圖1中置於第一通孔1223中之扣具15滑移至第二 通孔1224位置處。在移動之前首先將扣具15之螺絲16連 同彈簀18 —起向上提起一段距離直至扣片19抵置基座12 之底面，此時，彈簣18之底端脫離第一通孔1223内之臺 階部121且上升至基座12之頂面位置處（請參閱圖3)，然 後使螺絲16之配合部163在V形槽道1220内滑動，直至 鲁螺絲16滑至第二通孔1224内，釋放螺絲16及彈簧18，彈 簧18自然落入第二通孔1224内且與第二通孔1224内之臺 階部121接觸，由此限制螺絲16水平移動，將滑置於第二 通孔1224内之扣具15對準BTX主機板30上相應之通孔 及BTX主機板130下面之一背板（圖未示），使扣具15之螺 紋部164與該背板相螺合，從而將該散熱器組合10固定於 BTX主機板30上。Need to be further improved. SUMMARY OF THE INVENTION The lamp or the BTX motherboard cannot be used, for example, in the U.S. Patent Coil Cage 6 <49,41〇 structure. In view of this, it is necessary to provide a host that can be installed in different architectures. Heat sink combination on board 6 1314261. A heat sink assembly includes a base, a plurality of heat sink fins disposed on the base, and a plurality of fasteners passing through the base, the base having a channel corresponding to the 'strap, the buckle A motherboard that is horizontally slidable between the first and second positions along the channel to accommodate different architectures. Compared with the prior art, the heat sink base is provided with a channel, and the buckle is changed in position by sliding in the groove guide to adapt to the main board of different architectures. <Embodiment> [FIG. 1 to FIG. 3] A heat sink assembly 10 is disclosed. The heat sink assembly 10 can be adapted to the ATX motherboard 20 (see FIG. 4) or the BTX motherboard 30 (see FIG. 4) according to actual application requirements. See Figure 5). The heat sink assembly 10 is configured to dissipate heat from a heat-generating electronic component (not shown) disposed on the ATX or BTX motherboards 20, 30. The heat sink assembly 10 includes a heat sink and four clips assembled on the heat sink. 15. ► The heat sink includes a base 12 and a plurality of parallel fins 14 extending vertically upward from the top surface of the base 12. The base 12 has a square body (not shown) and lugs 122 extending horizontally outward from the four corners of the body. A plurality of heat dissipation channels (not shown) are formed between the heat dissipation fins 14. The first and second horizontally extending straight through slots 1221, 1222 are symmetrically disposed on each of the lugs 122. The first through slots 1221 are in communication with the second through slots 1222 and have an angle therebetween, thereby The first through slot 1221 and the second through slot 1222 form a V-shaped channel 1220. The first through slot 1221 is disposed on a side away from the channel of the heat dissipation fin 14 , and the second through slot 1222 is disposed adjacent to the heat dissipation fin 14 . 7 1314261 One side of the channel. The first and second through grooves 1221, 1222 are formed at opposite ends to form first and second through holes 1223, 1224, respectively. The first and second through holes 1223, 1224 are each circularly disposed and have an inner diameter larger than the width of the first and second through grooves 1221, 1222. An annular step portion 121 is formed in the first and second through holes 1223, 1224 of each lug 122. The specific positions of the first and second through holes 1223, 1224 are designed according to the specifications of the ATX and BTX motherboards 20, 30, so that the heat sink assembly 10 is suitable when the buckle 15 is placed in the first through hole 1223. Mounted on the ATX motherboard 20; the heat sink assembly 10 is adapted to be mounted on the BTX motherboard 30 when the clip*15 is placed within the second through hole 1224. Each of the fasteners 15 corresponds to each of the lugs 122 of the heat sink assembly 10 for passing through the first through hole 1223 or the second through hole 1224 of the lug 122 to further mount the heat sink assembly 10 to the ATX mainframe. Board 20 or BTX motherboard 30. The clip 15 includes a screw 16, a spring 18 and a cleat 19 disposed on the screw 16. The screw 16 includes a circular head portion 160, a longitudinal cylindrical member 162 extending downwardly from the head portion 160, and a threaded portion 164 formed at the end of the rod member 162. The top surface of the head portion 160 is provided with a cross-shaped recess 1602 for an external tool, such as a screw driver, to be screwed. The outer diameter of the head portion 160 is larger than the inner diameter of the first and second through holes 1223, 1224. A longitudinal annular groove (not labeled) is disposed on a periphery of the middle portion of the rod member 162 such that the rod member 162 forms a fitting portion 163 corresponding to the position of the groove. The outer diameter of the engaging portion 163 is smaller than the outer diameter of the rod member 162. The V-shaped channel 1220 on the lug 122 has a smaller width dimension so that the mating portion 163 can slide along the channel 1220. The height of the engaging portion 163 in the vertical direction is higher than that of the radiator base 8 1314261 - the seat 12, and the engaging portion 163 can move up and down in the first or second through holes 1223, 1224 during the mounting of the buckle 15. The magazine 18 is placed on the rod member 162 of the buckle 15 with an outer diameter smaller than the inner diameter of the first or second through holes - 1223, 1224 of the base 12 and larger than the inner diameter of the step portion 121. In order for the heat sink assembly 10 to be mounted to the ATX or BTX motherboards 20, 30, the springs 1223 are seated on the step portion 121 and exert a downward force on the lugs 122. The outer diameter of the spring 18 is larger than the width of the V-shaped groove 1220. When the spring 18 is seated on the step portion 121, the sliding of the buckle 15 in the V-shaped groove 1220* can be restricted. The cleat 19 has an annular shape and includes a central hole 190 and a groove 192 communicating with the central hole 190 and surrounding the periphery of the central hole 190 for providing elastic deformation of the cleat 19. The inner diameter of the central hole 190 is smaller than the outer diameter of the rod 162 of the buckle 15. When the buckle 15 passes through the base 12, the buckle 19 is sleeved at the end of the engaging portion 163 of the buckle 15 and abuts against The rod member 162 is connected to the end of the fitting portion 163. When assembled, the screw 16 that is spring loaded 18 passes through the first or second through holes 1223, 1224 on the base 12. In this embodiment, the screw 16 first passes through the first through hole 1223, and the spring 18 is freely automatically seated on the step portion 121 in the first through hole 1223 due to gravity, and the head 160 of the screw 16 abuts against the spring. The top end of the 18 is such that the spring 18 is located between the head 160 of the screw 16 and the step 121 of the first through hole 1223. Referring to FIG. 2, the engaging portion 163 of the screw 16 is beyond the bottom surface of the base 12, and the buckle 19 is clamped to the end of the engaging portion 163 and abuts against the rod 162 below the engaging portion 163. The cleat 19 can be prevented. The heat sink assembly 10 is ejected from the base 12 during shock or transportation. Thus, the assembly of the heat sink assembly 9 1314261 - 10 as shown in FIG. 2 is completed. In this position, the magazine 18 is in contact with the step portion 121 in the first through hole 1223, and the buckle 19 is located at the base 12. Below and at a distance from the bottom surface of the base 12. Referring to FIG. 4 to FIG. 5, in use, the heat sink assembly 10 of FIG. 1 is placed on the ATX main board 20, through the threaded portion 164 of the buckle 15 and one of the bottom plates of the ATX main board 20 (not shown). The heat sink assembly 10 is mounted on the ATX motherboard 20 as shown in FIG. 4, which is an assembled view of the heat sink assembly 10 mounted on the ATX motherboard 20. If the assembled heat sink assembly 10 of Fig. 1 is to be mounted on the BTX motherboard 30, the clip 15 placed in the first through hole 1223 of Fig. 1 needs to be slid to the position of the second through hole 1224. Before the movement, the screw 16 of the buckle 15 is first lifted up together with the magazine 18 until the buckle 19 abuts against the bottom surface of the base 12. At this time, the bottom end of the magazine 18 is separated from the first through hole 1223. The step portion 121 is raised to the top surface position of the susceptor 12 (refer to FIG. 3), and then the fitting portion 163 of the screw 16 is slid in the V-shaped channel 1220 until the screw 16 is slid into the second through hole 1224. , the screw 16 and the spring 18 are released, and the spring 18 naturally falls into the second through hole 1224 and contacts the step portion 121 in the second through hole 1224, thereby restricting the horizontal movement of the screw 16 and sliding the second through hole 1224 The inner buckle 15 is aligned with the corresponding through hole on the BTX main board 30 and one back plate (not shown) of the BTX main board 130, so that the threaded portion 164 of the buckle 15 is screwed with the back plate, thereby The heat sink assembly 10 is affixed to the BTX motherboard 30.
如是，本發明之散熱器組合10通過改變扣具15之位置 可同時滿足ATX或BTX架構之主機板，進而對該ATX或BTX 10 1314261 主機板上之電子元件進行散熱。 ‘ 綜上所述，本發明符合發明專利要件，爰依法提出專 .利申請。惟’以上該者僅為本發明之較佳實施例，舉凡孰 悉本案技藝之人士，在爰依本發明精神所作之等效修錦或 變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖1係本發明散熱器組合之部分立體組合圖。If so, the heat sink assembly 10 of the present invention can simultaneously dissipate the electronic components of the ATX or BTX 10 1314261 motherboard by changing the position of the clip 15 to simultaneously satisfy the motherboard of the ATX or BTX architecture. ‘ In summary, the present invention complies with the requirements of the invention patent, and the patent application is filed according to law. However, the above is only a preferred embodiment of the present invention, and those skilled in the art will be able to cover the equivalents of the invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a partial perspective assembled view of a heat sink assembly of the present invention.
圖2係圖1組裝後之側視圖，其中彈簧座落於基座上。 圖3係圖1組裝後之側_，其巾彈簧與扣具被提高一 圖4係圖1中之散熱器組合安裝於Ατχ主機板上之立 體組合圖。Figure 2 is a side elevational view of the assembled Figure 1 with the spring seated on the base. Fig. 3 is the assembled side of Fig. 1, and the towel spring and the buckle are improved. Fig. 4 is a perspective view of the combination of the heat sink of Fig. 1 mounted on the Ατχ main board.
5係圖1中之散熱器組合安裝於Βτχ主機板上之立 圖 組合圖。 主要元件符號說明】 散熱器組合 10 臺階部 121 槽道 1220 第二通槽 1222 苐二通孔 1224 扣具 15 頭部 160 桿件 162 基座 12 凸耳 122 弟一通槽 1221 弟一通孑L 1223 散熱鰭片 14 螺釘 16 凹槽 1602 配合部 163 11 1314261 螺紋部 164 彈簧 18 扣片 19 中心孔 190 凹槽 192 125 is a combination diagram of the heat sink combination of Figure 1 installed on the Βτχ motherboard. Main component symbol description] Radiator combination 10 Step portion 121 Channel 1220 Second through slot 1222 苐 Two through hole 1224 Snap 15 Head 160 Rod 162 Base 12 Lug 122 Brother one through slot 1221 Brother one 孑 L 1223 Cooling Fin 14 Screw 16 Groove 1602 Mating portion 163 11 1314261 Threaded portion 164 Spring 18 Clasp 19 Center hole 190 Groove 192 12