TW201734490A - Inspection jig, inspection apparatus and inspection method - Google Patents

Abstract

An inspection jig for clamping a circuit substrate FX1 in which electrodes to be inspected are formed on a substrate SB, and a protective member CL1 made of an insulating material is laminated on a surface of the substrate SB where the electrodes to be inspected are formed, the inspection jig comprising a first clamping portion 110 having a first clamping surface 113; a second clamping portion 120 having a second clamping surface 124 opposing to the first clamping surface 113 and provided with inspecting electrodes 122 on the second clamping surface 124; and an electrode distance adjusting portion 112 which adjusts a distance between the inspecting electrode 122 and the electrode EL to be inspected in order to make close contact with the inspecting electrodes 122 to the protective member CL1 when the first clamping portion 110 and the second clamping portion 120 clamp the circuit substrate FX1 therebetween so that the electrodes EL to be inspected are opposed to the inspecting electrodes 122.

Description

Inspection fixture, inspection device and inspection method

The present invention relates to an inspection jig, an inspection device, and an inspection method.

In a circuit board in which an insulating protective member (for example, an outer cover layer) is provided on a surface like a flexible substrate, the probe cannot be in contact with the electrode to be inspected to perform an energization inspection. Therefore, a non-contact inspection is performed from the previous system. In the non-contact inspection, first, the electrode to be inspected is opposed to the electrode of the sensor, and the electrode to be inspected and the electrode of the sensor are arranged to form a capacitor. Then, the probe is brought into contact with the input electrode electrically connected to the electrode to be inspected via the wiring, and an electrical signal is input to the input electrode. As a result, the charge in the electrode is inspected according to the electrical signal, and the potential of the sensor electrode changes. Therefore, by measuring the time variation of the potential of the sensor electrode, it is possible to check the presence or absence of the disconnection. In the test apparatus which is easy to measure the potential of the sensor electrode, the electrostatic capacitance between the electrode to be inspected and the sensor electrode is amplified and measured (for example, see Patent Document 1). The non-contact inspection is performed by sandwiching a circuit board with an inspection jig including a pair of nip portions. One of the clamping portions is provided with a sensor electrode. First, the circuit board is placed such that the electrode to be inspected faces the sensor electrode. Thereafter, the circuit substrate is sandwiched by one of the sensor electrodes and the other sandwiching portion. When the circuit board is held, the distance between the electrode to be inspected and the sensor electrode becomes small, and the electrodes are filled with an insulating protective member. The electrostatic capacitance of the plate capacitor is inversely proportional to the distance between the opposing electrodes, and is proportional to the dielectric constant between the electrodes and the area of the parallel plate electrode. Therefore, the electrostatic capacitance between the electrode to be inspected and the sensor electrode becomes larger. . As a result, the measurement of the potential of the sensor electrode becomes easy. [Prior Art Document] [Patent Document] [Patent Document 1] Japanese Patent Laid-Open No. Hei 8-327708

[Problems to be Solved by the Invention] The circuit board may have irregularities in the thickness direction due to differences in layer structure, material, or manufacturing. Further, the pair of holding portions are manufactured such that the respective clamping surfaces are parallel to each other and the respective clamping surfaces are as flat as possible, but the unevenness of the clamping surface cannot be completely removed. Therefore, depending on the position in the manufacturing lot or the circuit board, when the circuit board is held by the inspection jig, the unevenness of the circuit board or the unevenness of the clamping surface is caused by the unevenness of the circuit board, and the electrode between the electrode to be inspected and the sensor is formed. There is an air layer. As a result, the dielectric constant between the electrodes becomes low and the electrostatic capacitance becomes small. Further, due to the unevenness of the protective member or the unevenness of the nip surface, the distance between the electrodes sandwiching the protective member becomes unstable, and the electrostatic capacitance becomes unstable. For such reasons, problems such as a decrease in the accuracy of the inspection value or a decrease in the repeatability are caused. An object of the present invention is to provide an inspection jig, an inspection apparatus, and an inspection method capable of suppressing a decrease in the accuracy of an inspection value or a decrease in repeatability in a non-contact inspection of a circuit board. [Technical means for solving the problem] The inspection jig according to an aspect of the present invention is a circuit board in which a substrate is provided with an electrode to be inspected, and a protective member having an insulating layer is provided on an area layer of the substrate on which the electrode to be inspected is provided. a holder, and comprising: a first clamping portion having a first clamping surface; and a second clamping portion having a second clamping surface disposed facing the first clamping surface, and The second clamping surface is provided with a detecting electrode; and at least one of the first clamping portion and the second clamping portion is provided with an inter-electrode distance adjusting portion, wherein the inter-electrode distance adjusting portion is configured to When the inspection electrode and the detection electrode face each other, when the first clamping portion and the second clamping portion sandwich the circuit board, the detection electrode and the protection electrode are adjusted to be in close contact with each other to adjust the detection electrode and the Check the distance of the electrodes. In the inspection jig according to an aspect of the present invention, the inter-electrode distance adjusting unit may include an elastic member that is provided on the first nip portion so as to face the second nip. In the inspection jig according to an aspect of the present invention, the elastic member may be formed of a plurality of different materials. In the inspection jig according to an aspect of the present invention, the elastic modulus may be relatively high in a region corresponding to the elastic member corresponding to the position at which the electrode to be inspected is placed when the circuit substrate is clamped. In one member, a second member having a relatively low modulus of elasticity is disposed in the region of the elastic member other than the above. In the inspection jig according to an aspect of the present invention, the elastic member may include a first layer having a relatively high modulus of elasticity and a second layer having a relatively low modulus of elasticity. In the inspection jig according to an aspect of the present invention, the inter-electrode distance adjusting unit may include an inspection probe provided on the second clamping portion, wherein the detection electrode includes a front end of the inspection probe, and the inspection The front end of the probe protrudes from the second clamping surface and is reciprocally movable in a direction substantially orthogonal to the second clamping surface. In the inspection jig according to an aspect of the present invention, the probe pin which is pushed by the projectile member at the front end of the inspection probe may be used. An inspection apparatus according to an aspect of the present invention includes: a circuit board clamping portion including an inspection jig according to an aspect of the present invention; a test signal generating portion that generates a test signal input to the inspected electrode; and an electrical signal The measuring unit measures the electrical signal detected by the detecting electrode. An inspection method according to an aspect of the present invention includes: a clamping step of using a first clamping portion having a first clamping surface and a second clamping surface disposed opposite the first clamping surface and a second clamping portion provided with a detecting electrode on the second clamping surface, and a circuit that is provided with a protective member that is provided with an inspected electrode and is provided with an insulating layer on the surface layer of the substrate on which the electrode to be inspected is provided a substrate; a signal input step of inputting a test signal to the electrode to be inspected; and a measuring step of measuring an electrical signal detected by a detecting electrode disposed between the protective member and the electrode to be inspected; and In the holding step, the distance between the detecting electrode and the electrode to be inspected is adjusted so that the detecting electrode is in close contact with the protective member. In the inspection method according to an aspect of the present invention, in the clamping step, the detecting electrode may be adjusted by an elastic member disposed on the first clamping portion so as to face the second clamping surface. The distance from the above-mentioned electrode to be inspected. In the inspection method according to an aspect of the present invention, in the clamping step, the distance between the detecting electrode and the electrode to be inspected may be adjusted by the elastic member formed of a plurality of different materials. In the inspection method according to an aspect of the present invention, the elastic modulus may be set to be relatively high in a region corresponding to the position of the elastic member corresponding to the position at which the electrode to be inspected is placed when the circuit substrate is clamped. a second member having a relatively low modulus of elasticity in a region of the elastic member other than the member, wherein the clamping step corresponds to an arrangement position of the electrode to be inspected when the circuit board is clamped Outside the region, the elastic deformation of the above elastic member is suppressed. In the inspection method according to an aspect of the present invention, the elastic member may include a first layer having a relatively high modulus of elasticity and a second layer having a relatively low modulus of elasticity, whereby the clamping step is performed by The first layer absorbs the unevenness of the circuit board, and the second layer absorbs the inclination of the circuit board with respect to the second clamping surface. In the inspection method according to an aspect of the present invention, the detection probe may be used as the detection electrode at the front end of the inspection probe provided on the second clamping portion, and the front end of the inspection probe protrudes from the second clamping surface. And reciprocating in a direction substantially orthogonal to the second clamping surface, wherein the distance between the detecting electrode and the electrode to be inspected is adjusted in the clamping step. In the inspection method according to an aspect of the present invention, the probe end of the inspection probe may be a probe pin that is pushed by the elastic member, thereby adjusting the detection electrode and the quilt in the clamping step. Check the distance of the electrodes. [Effect of the Invention] According to the present invention, it is possible to provide an inspection jig, an inspection apparatus, and an inspection method capable of suppressing a decrease in the accuracy of an inspection value or a decrease in repeatability in a non-contact inspection of a circuit board.

[First Embodiment] Hereinafter, Referring to Figures 1 to 5B, A first embodiment of the present invention will be described. FIG. 1 is a side view schematically showing the overall configuration of the circuit board inspection apparatus 10 together with the circuit board FX1 to be inspected. 2 is a plan view of the circuit board FX1. 3A and 3B are top views of the sensor substrate 121. 4 is a side view showing a state in which the circuit board FX1 is sandwiched between the first clamping portion 110 and the second clamping portion 120. 5A and 5B are views showing changes in the configuration of the elastic member 112.  (circuit board) As shown in Fig. 1 and Fig. 2, The circuit board FX1 inspected by the inspection device 10 includes: Base SB, a plurality of inspected electrodes EL, Multiple wiring LD, a plurality of input electrodes EL', And a protective member CL1.  The base SB is an insulating film having a thickness of several μm to several hundreds μm. The base SB is made of insulation, Flexible, Heat resistant material (such as polyethylenimine or PET (Polyethylene terephthalate,) Formed by polyethylene terephthalate).  Checked electrode EL, Wiring LD, The input electrode EL' (hereinafter collectively referred to as "conductor pattern") is appropriately patterned according to the use of the circuit board FX1. A conductive film having a thickness of from several μm to several hundreds of μm. The conductor pattern including the electrode to be inspected is provided in the base SB. The conductor pattern is bonded to one surface of the base SB, for example, via an epoxy resin or an acrylic resin-based adhesive. The conductor pattern is formed of, for example, a copper foil.  as shown in picture 2, Checked electrode ELa, ELb, ・・・, ELf via wiring LDa, LDb, ・・・LDf, With the input electrode ELa', ELb', ・・・, ELf' electrical connection. In Figure 1, For easy observation, Only the electrode ELa to be inspected is shown, Wiring LDa, A combination of input electrodes ELa'.  As shown in Figure 1, The protective member CL1 is laminated on the surface of the substrate SB on which the electrode to be inspected EL is provided. The protective member CL1 protects the to-be-tested electrode EL of the circuit substrate FX1 from solder, heat, The influence of moisture, etc. The protective member CL1 is formed of a material having an insulating property. It is desirable that the protective member CL1 be made flexible, Heat resistant material is formed. The protective member CL1 is formed of, for example, a plastic such as polyimide or PET. The thickness of the protective member CL1 is several μm to several hundreds μm.  As shown in Figure 1 and Figure 2, The protective member CL1 is disposed above the input electrode EL', The conductor pattern of the circuit board FX1 is covered. A gap G' is formed above the input electrode EL'. With this, The signal input mechanism 125 of the second clamping portion 120, which will be described later, can contact the input electrode EL'.  (inspection device) as shown in Figure 1, The inspection device 10 comprises: Circuit board clamping portion 11, Test signal generating unit 12, And an electrical signal measuring unit 13.  The circuit board clamping portion 11 includes an inspection jig 100 and a driving device 130. The test signal generation unit 12 includes a test signal generator 160. The electrical signal measuring unit 13 includes: Signal processing circuit 140, A/D converter 150, And the measuring mechanism 170. Test signal generator 160 is also coupled to measurement mechanism 170. With this, As described later, In the measuring mechanism 170, General control of test signal generation and electrical signal measurement.  (Inspection Fixture) The inspection jig 100 includes a first clamping portion 110 having a first clamping surface 113, And a second clamping portion 120 having a second clamping surface 124. The first clamping portion 110 and the second clamping portion 120 are disposed such that the first clamping surface 113 and the second clamping surface 124 face each other. By the driving device 130, the first clamping surface 113 and the second clamping surface 124 can be kept parallel to each other. The first clamping portion 110 and the second clamping portion 120 are moved (the moving direction is indicated by two arrows in the upper and lower directions of FIG. 1). With this, The distance between the first clamping surface 113 and the second clamping surface 124 can be changed.  (Second clamping portion) The second clamping portion 120 includes a sensor substrate 121, And a signal input mechanism 125. A plurality of sensor electrodes (detection electrodes) 122 are disposed on the sensor substrate 121 (FIG. 1 only shows the sensor electrodes 122a, 122b, 122c). The sensor electrode 122 is a conductor.  (Signal Input Mechanism) The signal input mechanism 125 is electrically connected to the test signal generator 160. The signal input mechanism 125 is, for example, a plurality of wire probes (in FIG. 1 , For easy observation, Only one wire probe is shown). When a plurality of wire probes are disposed between the first sandwiching portion 110 and the second sandwiching portion 120, the circuit board FX1 is disposed. Located at the input electrode ELa', ELb', ・・・, The upper side of each of ELf' is disposed in the second clamping portion 120.  The length of the plurality of wire probes is set to be slightly longer than the thickness of the protective member CL1 (the depth of the gap G'). With this, When the circuit board FX1 is sandwiched between the first clamping portion 110 and the second clamping portion 120 (refer to FIG. 4), Each wire probe is elastically deformed, The front end of each wire probe is directed to the corresponding input electrode ELa', ELb', ・・・, ELf' is pressurized. therefore, Each wire probe and corresponding input electrode ELa', ELb', ・・・, Electrical contact can be reliably achieved between ELf's. result, The test signal transmitted from the test signal generator 160 can be input to the input electrode ELa' of the circuit substrate FX1, ELb', ・・・, ELf'.  (sensor substrate) as shown in Figure 1, The sensor substrate 121 is disposed when the circuit board FX1 is disposed between the first clamping portion 110 and the second clamping portion 120. Covering the inspected electrode ELa from above, ELb, ・・・, The position of the ELf (the area shown by the dotted line A).  3A is a plan view of the sensor substrate 121 viewed from one side of the face on which the sensor electrode 122 is disposed. As shown in Figure 3A, When the circuit board FX1 is disposed between the first clamping portion 110 and the second clamping portion 120, Sensor electrode 122a, 122b, ・・・, 122f is respectively disposed on the electrode ELa to be inspected, ELb, ・・・, The position of the ELf opposite direction (dashed line Aa, Ab, ・・・, The area shown by Af). With this, When the circuit board FX1 is sandwiched between the first clamping portion 110 and the second clamping portion 120 (refer to FIG. 4), Checked electrode ELa, ELb, ・・・, ELf and corresponding sensor electrode 122a, 122b, ・・・, The 122f is capacitively coupled to each other.  also, A plurality of sensor electrodes 122 are electromagnetically shielded from one another. E.g, A shield electrode 123 that surrounds each of the sensor electrodes 122 is disposed on the sensor substrate 121. When the sensor substrate 121 is disposed on the second clamping portion 120, The shield electrode 123 is grounded (see Fig. 1). With this composition, Each of the sensor electrodes 122 can be prevented from being adjacent to the inspected electrode EL (eg, the inspected electrode ELa with respect to the sensor electrode 122b, ELc) capacitively couples to receive unwanted electrical signals.  3B is a plan view of the sensor substrate 121 as viewed from the opposite side of the surface on which the sensor electrodes 122 are disposed. As shown in Figure 3B, Sensor electrode 122a, 122b, ・・・, The 122f is electrically connected to each other by wiring. The plurality of sensor electrodes 122 electrically connected are electrically connected to the signal processing circuit 140. With this, The electrical signal detected by the sensor electrode 122 is sent to the signal processing circuit 140 (again, In Figure 1, For easy observation, Only the electrical connection of the sensor electrode 122a to the signal processing circuit 140 is shown).  Furthermore, The wiring of the sensor electrode 122 and the signal processing circuit 140 may also not necessarily connect all of the sensor electrodes 122 in common as shown in FIG. 3B. E.g, The sensor electrodes 122 can also be divided into groups (eg, 122a, 122b, Group of 122c, 122d, 122e, Group of 122f), The signal processing circuit 140 is wired in groups.  Go back to Figure 1, When the sensor substrate 121 is disposed on the second clamping portion 120, The surface of the sensor electrode 122 is in the same plane as the second clamping surface 124. With this composition, When performing a non-contact inspection, The surface of the sensor electrode 122 can be brought into contact with the surface of the protective member CL1.  (Drive Device) The drive device 130 causes the first clamping portion 110 and the second clamping portion 120 to be orthogonal to the first clamping surface 113 and the second clamping surface 124 (the two arrows in the upper and lower directions of FIG. 1) The direction) moves. With this, The circuit board FX1 may be disposed between the first clamping portion 110 and the second clamping portion 120 that are spaced apart from each other, after that, Approaching the first clamping portion 110 to the second clamping portion 120, The circuit board FX1 (see FIG. 4) is sandwiched between the first clamping portion 110 and the second clamping portion 120, Performing a non-contact inspection in this state, after that, Separating the first clamping portion 110 from the second clamping portion 120 again, The circuit board FX1 of the end inspection is recovered.  (Test signal generator) Return to Figure 1, Test signal generator 160 receives an indication from assay mechanism 170, Generate test signals, And sent to the signal input mechanism 125. The test signal is, for example, a pulse signal of a fixed period.  (Signal Processing Circuit) The signal processing circuit 140 receives the electrical signal detected by the sensor electrode 122. Implement signal processing such as amplification, It is sent to the A/D converter 150. The signal processing circuit 140 includes, for example, an analog signal amplifying circuit formed of an OP amplifier or the like.  (A/D Converter) The A/D converter 150 preprocesses the measurement mechanism 170 so that the electrical signal processed by the signal processing circuit 140 can be obtained. which is, The A/D converter 150 receives an analog signal processed by the signal processing circuit 140, Convert it to a digital signal, And sent to the measuring mechanism 170.  (Measuring Mechanism) The measuring mechanism 170 is formed by including a computer system. The computer system includes an arithmetic processing device such as a CPU, And memory such as memory or hard disk. The assay mechanism 170 includes an interface that can perform communications with devices external to the computer system. The measuring unit 170 performs overall control of the operations of the various devices constituting the inspection device 10.  The measuring mechanism 170 indicates to the test signal generator 160 the waveform and timing of the generated test signal. And obtaining an electrical signal that is digitally converted by the A/D converter 150.  (First Clamping Portion) The first nip portion 110 includes a support base 111 and an elastic member (inter-electrode distance adjustment unit) 112. The first clamping portion 110 has a first clamping surface 113.  (Elastic Member) The elastic member 112 is a sheet member formed of a material having elasticity. The size of the elastic member 112 is equal to the size of the sensor substrate 121, Or larger than the size of the sensor substrate 121. The thickness of the elastic member 112 is preferably a thickness that can perform elastic deformation of the upper surface of the support table 111 and the maximum stroke of the total surface of the sensor substrate 121. For example, it is 2 mm or more.  The elastic member 112 is disposed on the first clamping portion 110 so as to oppose the second clamping surface 124 . An area in which the elastic member 112 is disposed in the first clamping surface 113 is an area facing the sensor substrate 121, That is, when the first clamping surface 113 is viewed from above, at least the region of the region A of FIG. 2 is included.  The elastic member 112 is provided on the support table 111 such that its surface slightly protrudes from the first clamping surface 113. The protruding height is set as when the circuit board FX1 is clamped, The surface of the elastic member 112 is at the same plane height as the first clamping surface 113. With this, When the circuit board FX1 is clamped, The unevenness of the upper surface of the support table 111 can be absorbed by the elastic member 112.  As a material with elasticity, An elastomer such as natural rubber or synthetic rubber can be used, Or foamed plastic such as foaming urethane. As an elastomer, For example, styrene butadiene rubber can be used, Isoprene rubber, Butadiene rubber, Chloroprene rubber, Acrylonitrile butadiene rubber, Butyl rubber, Ethylene propylene rubber, Urethane rubber, Various materials such as fluororubber.  previously, As the first clamping portion 110, A support table 111 having a flat clamping surface and formed of a metal or resin material is used. however, Even if the clamping surface of the support table 111 is flattened, Perform grinding and other processing on the surface. It is also impossible to avoid local occurrence of irregularities in the thickness direction of several tens of μm.  Especially when the circuit board FX1 is a flexible substrate, When the support substrate 111 and the second clamping portion 120 are used to sandwich the circuit substrate FX1, The circuit board FX1 is in close contact with the clamping surface of the support table 111. result, A concave portion (convex portion) is partially formed on the upper surface of the protective member CL1 located directly above the concave portion (protrusion portion) of the clamping surface.  result, a position where a concave portion is formed on the upper surface of the protective member CL1, An air layer (air gap) is formed between the surface of the sensor substrate 121 and the protective member CL1. The thickness of the protective member CL1 of the circuit board FX1 is several μm to several hundreds μm. Therefore, the average dielectric constant between the inspected electrode EL and the sensor electrode 122 directly above the concave portion of the holding surface of the support table 111 becomes lower than that of the other positions. result, The electrical signal detected by the sensor electrode 122 directly above the recess of the clamping surface of the support table 111 becomes smaller than other positions. also, There is unevenness of the circuit board FX1 or unevenness of the surface of the sensor substrate 121. The same is true for the formation of an air layer (air gap).  According to the inspection apparatus 10 using the inspection jig 100 of the present embodiment, When the first clamping portion 110 and the second clamping portion 120 are used to sandwich the circuit substrate FX1, The distance between each of the sensor electrodes 122 and the corresponding inspected electrode EL is automatically adjusted by the pressurization of the sensor substrate 121.  result, That is, it is easy to generate the unevenness of the support table 111 or the unevenness of the circuit board FX1. When the unevenness of the surface of the sensor substrate 121 (hereinafter collectively referred to as "concave and convexity of the support table 111"), The sensor electrode 122 can also be in close contact with the protective member CL1. Therefore, the accuracy of the inspection value or the decrease in the repeatability can be suppressed.  More specifically, According to the inspection apparatus 10 using the inspection jig 100 of the present embodiment, When the sensor substrate 121 is pressed against the circuit board FX1, The elastic member 112 is elastically deformed by the pressurization of the sensor substrate 121. therefore, The unevenness of the support table 111 or the like is absorbed by the elastic member 112. With this, The circuit board FX1 can be suppressed from being bent by the unevenness of the support table 111 or the like. Therefore, the upper surface of the protective member CL1 is kept flat. result, The sensor electrode 122 can be closely connected to the protective member CL1, Therefore, the accuracy of the inspection value or the decrease in the repeatability can be suppressed.  Furthermore, In this embodiment, As shown in FIG. 5A and FIG. 5B, The elastic member 112 may also be formed of a plurality of different materials. With this, As described below, The sensor electrode 122 can be further adhered to the protective member CL1.  E.g, As shown in Figure 5A, The elastic member 112 may also be formed of different materials depending on the in-plane area. in particular, In the elastic member 112, It is also possible to separately configure the ELa to be inspected, ELb, ・・・, ELf location Aa, Ab, ・・・, The area corresponding to Af (the area directly below), Providing a first member 112b formed of a material having a relatively high modulus of elasticity, A second member 112a formed of a material having a relatively low modulus of elasticity is disposed in a region other than this.  Due to the configuration of the second clamping portion 120 or the mechanism of the driving device 130, A pressure distribution depending on the in-plane position of the sensor substrate 121 may occur. The pressure is distributed when the sensor substrate 121 and the elastic member 112 have a certain area. Will become more significant. In this case, When the sensor substrate 121 is pressurized toward the elastic member 112, The degree of contraction differs depending on the in-plane position of the elastic member 112. result, Even if the local concavities and convexities of the first clamping surface 113 can be absorbed by the elastic member 112, Due to the unevenness of the shrinkage of the elastic member 112, There may also be a wide range of strains. In this case, a decrease in electrostatic capacitance or instability of the electrostatic capacitance may occur. Even check the accuracy of the value or the reduction in repeatability.  According to the configuration shown in FIG. 5A, a first member 112b formed of a material having a relatively high modulus of elasticity, The area is limited to be disposed in a region corresponding to the position at which the electrode to be inspected EL is disposed. With this, The area of the material having a relatively high modulus of elasticity becomes smaller, Therefore, the pressure generated by the sensor substrate 121 pressing the elastic member 112 can be reduced. The above range of strains. result, It can be directly above the EL to be inspected, The protective member CL1 and the sensor electrode 122 are more encrypted.  Furthermore, In the example shown in FIG. 5A, Providing a first member 112b for each sensor electrode, However, the sensor electrodes 122 can also be divided into groups, for example, 122a, 122b, Group of 122c, 122d, 122e, Group of 122f), The first member 112b is set in groups.  also, E.g, As shown in Figure 5B, The elastic member 112 may be formed of different materials in the thickness direction. in particular, The first layer 112c formed of a material having a relatively high modulus of elasticity may be included, And a second layer 112d formed of a material having a relatively low modulus of elasticity. When the elastic member 112 is disposed on the first clamping portion 110, The second layer 112d is oriented toward the first clamping portion 110 side, The first layer 112c is brought into contact with the circuit board FX1.  According to the configuration shown in FIG. 5B, The layer in contact with the circuit board FX1 is set as the first layer 112c formed of a material having a relatively high modulus of elasticity, Thereby, when the circuit board FX1 is clamped, The unevenness of the circuit board FX1 can be absorbed. Simultaneously, The layer on the side of the first clamping portion 110 is set as the second layer 112d formed of a material having a relatively low modulus of elasticity, Thereby, when the circuit board FX1 is clamped, The entire absorbing circuit board FX1 is inclined with respect to the first clamping surface 113.  Furthermore, In this embodiment, The signal input mechanism 125 is disposed on the second clamping portion 120. However, it is not limited to this configuration. E.g, The signal input mechanism 125 may also be disposed on the first clamping portion 110. With this composition, That is, the input electrode EL' is disposed on the opposite side of the substrate SB from the inspection electrode EL (the lower side in FIG. 1). It is also possible to input a test signal to the input electrode EL' for non-contact inspection.  also, In this embodiment, The signal input mechanism 125 is set as a wire probe that is in contact with the input electrode EL'. However, it is not limited to this configuration. E.g, The signal input mechanism 125 can also be the same as the sensor electrode 122, It is set as the electrode which opposes the input electrode EL'. With this composition, That is, when the input electrode EL' is covered by the protective member CL1, The test signal can also be sent non-contactly from the signal input mechanism 125 capacitively coupled to the input electrode EL'. Thereby, the electrical signal is detected non-contactly by the sensor electrode 122 capacitively coupled to the electrode EL to be inspected.  also, In this embodiment, The signal input unit 125 is provided with a plurality of wire probes disposed corresponding to each of the plurality of input electrodes EL'. However, it is not limited to this configuration. E.g, The signal input mechanism 125 can also be movably disposed on the second clamping portion 120, A single wire probe can be controlled by the assay mechanism 170. With this, It is not necessary to change the members constituting the signal input mechanism 125 in accordance with the shape of the conductor pattern (the configuration of the plurality of input electrodes EL').  also, In this embodiment, It is configured that both the first clamping portion 110 and the second clamping portion 120 are movable, However, it is not limited to this configuration. Can also be set to, for example, The first clamping portion 110 is fixed and the second clamping portion 120 is movable. Or the second clamping portion 120 is fixed and the first clamping portion 110 is movable. With this, The movable part is reduced, Therefore, the manufacturing cost or maintenance cost of the device can be reduced.  also, In this embodiment, The driving device 130 is configured to make the first clamping portion 110 and the second clamping portion 120, a structure that moves in a direction orthogonal to the first clamping surface 113 and the second clamping surface 124, However, it is not limited to this configuration. E.g, It may be configured to include a positioning mechanism that relatively moves the first clamping portion 110 and the second clamping portion 120 in a direction parallel to the first clamping surface 113 and the second clamping surface 124. With this, The first clamping portion 110 and the second clamping portion 120 can be positioned, A corresponding sensor electrode 122 is disposed directly above the inspected electrode EL of the circuit board FX1, Therefore, a more accurate measurement can be performed.  also, In this embodiment, An elastic member 112 is disposed on a lower side of the circuit board FX1, A sensor electrode 122 (see FIG. 1) is disposed on the upper side of the circuit board FX1. However, it is not limited to this configuration. E.g, The elastic member 112 may be disposed on the upper side of the circuit board FX1. The sensor electrode 122 is disposed on the lower side of the circuit board FX1. Also in one of the areas of the circuit board FX1, The elastic member 112 is disposed on the lower side of the circuit board FX1, The sensor electrode 122 is disposed on the upper side of the circuit board FX1, In other areas of the circuit substrate FX1, The elastic member 112 is disposed on the upper side of the circuit board FX1, The sensor electrode 122 is disposed on the lower side of the circuit board FX1. With this, That is, when the inspected electrode EL of the circuit board FX1 is disposed on the different side of the input electrode EL', Non-contact inspection is also possible. also, E.g, Since there is an obstacle such as a wiring between the surface of the circuit board FX1 and the electrode to be inspected, That is, when the sensor electrode 122 is disposed on the surface side of the circuit board FX1, accurate inspection cannot be performed. The sensor electrode 122 may be disposed on the back side of the circuit board FX1 for non-contact inspection.  (Inspection Method) Hereinafter, an inspection method using the circuit board of the inspection apparatus 10 of the present embodiment will be described. The inspection method of the circuit board using the inspection device 10 includes a configuration step, Clamping step, Signal input step, Signal processing steps, And measuring steps.  (Configuration steps) In the configuration step, The circuit board FX1 is disposed between the first sandwiching portion 110 and the second sandwiching portion 120 that are spaced apart from each other. When the inspection device 10 includes the above-described positioning mechanism, base on needs, Adjusting the position of the first clamping portion 110 or the second clamping portion 120, A corresponding sensor electrode 122 is disposed directly above the inspected electrode EL.  (clamping step) in the clamping step, The first clamping portion 110 and the second clamping portion 120 are moved by using the driving device 130, The circuit board FX1 is sandwiched between the first clamping portion 110 and the second clamping portion 120. at this time, The signal input mechanism 125 is trapped in the gap G', It is in contact with the input electrode EL'. also, Each of the sensor electrodes 122 is capacitively coupled to a corresponding inspected electrode EL.  In the clamping step, The distance between each of the sensor electrodes 122 and the corresponding inspected electrode EL is automatically adjusted by the pressurization of the sensor substrate 121. result, The sensor electrode 122 can be in close contact with the protective member CL1.  More specifically, When the sensor substrate 121 is pressed against the circuit board FX1, The elastic member 112 is elastically deformed by the pressurization of the sensor substrate 121. therefore, The unevenness of the support table 111 or the like is absorbed by the elastic member 112. With this, The circuit board FX1 can be suppressed from being bent by the unevenness of the support table 111 or the like. Therefore, the upper surface of the protective member CL1 is kept flat. result, The sensor electrode 122 is in close contact with the protective member CL1.  When the elastic member 112 is formed of a plurality of different materials, The sensor electrode 122 can be further adhered to the protective member CL1.  E.g, When the elastic member 112 is formed of different materials according to the in-plane region (refer to FIG. 5A), When the circuit board FX1 is clamped, Outside the area corresponding to the position where the EL to be inspected is disposed, The elastic deformation of the elastic member 112 is suppressed. therefore, Can suppress the generation of a wide range of strains, Therefore, the adhesion between the sensor electrode 122 and the protective member CL1 can be improved.  Another example, When the elastic member 112 is formed of different materials in the thickness direction (refer to FIG. 5B), When the circuit board FX1 is clamped, The unevenness of the circuit board FX1 can be absorbed by the first layer 112c formed of a material having a relatively high modulus of elasticity. The inclination of the entire first clamping surface 113 of the circuit board FX1 is absorbed by the second layer 112d formed of a material having a relatively low modulus of elasticity.  (Signal Input Step) The measuring unit 170 indicates the waveform or timing of the test signal to the test signal generator 160.  The test signal generator 160 generates a test signal and sends it to the signal input mechanism 125, A test signal is input to the input electrode EL'. By inputting the test signal, The capacitor formed by the inspected electrode EL and the sensor electrode 122 is stored, The voltage of the sensor electrode 122 changes.  (Signal Processing Step) The electrical signal detected by the sensor electrode 122 in the form of a voltage is received by the signal processing circuit 140. Perform signal processing such as amplification. The signaled electrical signal is sent to the A/D converter 150. The A/D converter 150 is configured to enable the measuring mechanism 170 to obtain an electrical signal obtained by signal processing. Perform preprocessing (digital conversion).  (Measurement Step) The measurement unit 170 acquires an electrical signal preprocessed by the A/D converter 150. By comparing the data of the waveform or timing of the test signal indicated to the test signal generator 160, Analyze the information of the obtained electrical signals, It is possible to check whether or not there is a disconnection between the inspected electrode EL and the input electrode EL' which are inspected.  According to the inspection method of the embodiment, The distance between each of the sensor electrodes 122 and the corresponding inspected electrode EL is automatically adjusted by the pressurization of the sensor substrate 121. result, The sensor electrode 122 can be closely connected to the protective member CL1, Therefore, it is possible to suppress the decrease in the accuracy or the repeatability of the inspection value in the non-contact inspection.  [Second embodiment] Hereinafter, referring to Figs. 6 to 10, A second embodiment of the present invention will be described. the following, For the components common to the first embodiment, Attach the same symbol, Detailed description is omitted.  Fig. 6 is a side view schematically showing the overall configuration of the circuit board inspection apparatus 20 together with the circuit board FX2 to be inspected. Fig. 7 is a plan view of the circuit board FX2. FIG. 8 is a plan view of the inspection probe support portion 221. Figure 9A is a cross-sectional view of the inspection probe, 9B to 9E are side views showing changes in the inspection probe. FIG. 10 is a side view showing a state in which the circuit board FX2 is sandwiched between the first nip 110 and the second nip 220. In Figure 6, In Figure 10, The driving device 130 which is a component common to the first embodiment, Signal processing circuit 140, A/D converter 150, Test signal generator 160, The measurement mechanism 170 is omitted from illustration.  In the present embodiment, the difference from the first embodiment is that the protective member CL2 of the circuit board FX2 to be inspected is formed thinner in the vicinity of the inspection electrode EL. And the second clamping portion 220 corresponding to the point includes the inspection probe 222. Therefore, the configuration of the protective member CL2 and the configuration of the inspection probe 222 will be mainly described below.  (circuit board) As shown in Fig. 6 and Fig. 7, The circuit board FX2 inspected by the inspection device 20 includes a substrate SB, a plurality of inspected electrodes EL, Multiple wiring LD, a plurality of input electrodes EL', And a protective member CL2.  (Protection Member) The protective member CL2 includes a first protective layer CL21 laminated on the base SB and a second protective layer CL22 laminated on the first protective layer CL21.  The first protective layer CL21 forms a base of the protective member CL2, Protecting the electrode EL to be inspected or the wiring LD from solder, heat, The influence of moisture, etc. And supporting the second protective layer CL22. The first protective layer CL21 is formed of, for example, polyimine. The thickness of the first protective layer CL21 is from several μm to several hundreds μm. The second protective layer CL22 is made of, for example, polyimine, PET and other plastics are formed. The thickness of the second protective layer CL22 is several μm to several hundreds μm. Furthermore, The second protective layer CL22 may also be formed of different wiring layers or shielding materials.  The first protective layer CL21 and the second protective layer CL22 are removed in the vicinity of the input electrode EL'. With this, Forming a gap G' having a bottom surface having an input electrode EL', The signal input mechanism 225 can be in contact with the input electrode EL'. Furthermore, The configuration of the signal input unit 225 can be the same as that of the signal input unit 125 of the first embodiment.  Near the electrode EL to be inspected, Only the second protective layer CL22 is removed, Only the first protective layer CL21 covers the electrode to be inspected EL. result, Inspected electrode EL (ELa, ELb, ・・・, The upper portion of the ELf) is formed with a gap G (Ga, which is a bottom surface of the upper surface of the first protective layer CL21) Gb, ・・・, Gf). The depth of G is equal to the thickness of the second protective layer CL22, It is several μm to several hundreds μm.  (Second Grip Portion) The inspection jig 200 of the present embodiment includes the first sandwiching portion 110 and the second sandwiching portion 220. As shown in Figure 6 and Figure 10, The second holding portion 220 is provided with a plurality of inspection probes (inter-electrode distance adjustment portions) 222 and a signal input mechanism 225. The front end (detection electrode) 223 (see FIG. 9A) of the plurality of inspection probes 222 protrudes from the second clamping surface 224 of the second clamping portion 220. The inspection probe 222 is provided on the second clamping portion 220 so as to face the inspection electrode EL when the circuit board FX2 is disposed between the first clamping portion 110 and the second clamping portion 220.  (Check Probe) The front end 223 of the inspection probe 222 can reciprocate in a direction substantially orthogonal to the second clamping surface 224. With this, The inspection probe 222 has a certain stroke, Therefore, according to the depth of the gap G, The front end 223 of the inspection probe 222 is brought into close contact with the first protective layer CL21. result, The accuracy of the inspection value in the non-contact inspection or the reduction in the repeatability can be suppressed.  The front end 223 of the inspection probe 222 is a probe pin 2223 that is ejected, for example, by a spring (pushing member) 2222. As shown in Figure 9A, The inspection probe 222 has a pair of probe pins 2223 that are ejected, for example, by a spring 2222, The structure of the 2224 is mounted in the cylindrical casing 2221. With this, When the inspection probe 222 is subjected to pressure in the up and down direction, The spring 2222 contracts, a pair of probe pins 2223, 2224 is close to each other. Spring 2222 and a pair of probe pins 2223, 2224 is formed of a conductive material such as a metal. With this, One probe pin 2223 and another probe pin 2224 are electrically connected via a spring 2222.  The probe pin 2223 has a cross-sectional diameter of several tens of μm to several hundreds of μm. As shown in FIG. 9B to FIG. 9E, The probe pins 2223 can take a variety of shapes. The probe pin 2223 is pushed by the spring 2222. Therefore, the first protective layer CL21 is pressurized. which is, The distance between each of the probe pins 2223 (front end 223) of the inspection probe 222 and the corresponding non-inspection electrode EL is automatically adjusted by the application pressure of the spring (the spring pushing member) 2222. result, The probe pin 2223 (front end 223) can be surely adhered to the first protective layer CL21.  If the electrostatic capacitance of the parallel plate capacitor is proportional to the area of the electrode, In order to increase the electrostatic capacitance of the capacitor formed by the probe pin 2223 and the electrode to be inspected, It is desirable to maximize the bottom area of the front end of the probe pin 2223. E.g, As shown in Figure 9B, Consider forming the probe pin 2223 into a cylindrical shape (in this case, In order to prevent the corner of the probe pin 2223 from damaging the protective member CL2, It is desirable to chamfer to the extent that the flatness is not impaired).  usually, The area of the electrode EL to be inspected is the same as the cross-sectional diameter of the probe pin 2223, Therefore, the configuration of Fig. 9B is an optimum configuration. however, If a large area of the inspection electrode EL is inspected by a probe pin 2223, Then consider, for example, as shown in Figure 9C. The probe pin 2223 is formed into a piston shape. Further, the area opposed to the electrode EL to be inspected is expanded.  Even if it is the circular shape of Figure 9D or the needle shape of Figure 9E, To some extent, capacitively coupled to the electrode being inspected, It can therefore be used for non-contact inspection. however, In order to prevent the corner portion from damaging the protective member CL2, It is more desirable to have the shape of FIG. 9D than FIG. 9E.  Furthermore, A lead wire connected to the signal processing circuit 140 is connected to the probe pin 2224 as will be described later. therefore, The shape of the probe pin 2224 can also be needle-shaped.  Returning to Figures 6 and 10, The inspection probe 222 is supported by the inspection probe support portion 221 provided on the lower side of the second clamping portion 220. The inspection probe support portion 221 is a plate-like member formed of, for example, an insulator such as plastic. The inspection probe 222 is mounted in a manner that penetrates the thickness direction.  Check probe 222a, 222b, ・・・, The length of the protrusion 222f protruding from the inspection probe support portion 221 is set to be larger than that formed on the electrode EL to be inspected, ELb, ・・・, The gap Ga above the ELf, Gb, ・・・, The depth of Gf is slightly longer. The stroke of the inspection probe 222 is set to a length corresponding to the depth of the gap G. With this, When the circuit board FX2 is held by the first clamping surface 113 and the second clamping surface 224, As shown in Figure 10, The front end 223 of the inspection probe 222 is capacitively coupled to the to-be-tested electrode EL via the first protective layer CL21. result, Electrical signals can be detected without contact.  As shown in Figure 8, When the probe support portion 221 is inspected, The inspection probe 222a attached to the inspection probe support portion 221, 222b, ・・・, 222f is respectively included in the to-be-tested electrode ELa of the circuit board FX2 disposed between the first clamping part 110 and the second clamping part 220, ELb, ・・・, Area Aa where ELf is located, Ab, ・・・, Configured in the way of Af.  Furthermore, When the distance between the adjacent inspection probes 222 is short, The inspection probe 222 is also capacitively coupled to the adjacent inspection electrode EL. Receive the use of unwanted electrical signals. To prevent this, A plurality of inspection probes 222 are electromagnetically shielded from each other. E.g, A shield electrode 226 that surrounds each of the inspection probes 222 is provided in the inspection probe support portion 221. When the probe support portion 221 is disposed in the second clamping portion 220, The shield electrode 226 is grounded (see Fig. 6).  As shown in Figure 6, Mounted on the inspection probe 222 of the inspection probe support portion 221, A lead wire is attached to the probe pin 2224 on the opposite side of the circuit board FX2. The wires are connected to signal processing circuit 140. With this, The electrical signal detected by the probe pin 2223 (front end 223) passes through the spring 2222 of the inside of the inspection probe 222. Probe pin 2224, It is sent to the signal processing circuit 140.  Furthermore, The wiring of the probe pin 2224 and the signal processing circuit 140 need not be connected in common to all of the probe pins 2224. E.g, The probe pins 2224 can also be divided into several groups. The signal processing circuit 140 is wired in groups.  also, The configuration in which the probe pin 2224 is connected to the signal processing circuit 140 is not limited to the above. E.g, When the inspection probe support portion 221 to which the inspection probe 222 is attached is disposed in the second clamping portion 220, An auxiliary electrode connected to the signal processing circuit 140 is disposed at a position where the probe pin 2224 protrudes. With this, When the inspection probe support portion 221 is disposed in the second clamping portion 220, The probe pin 2224, which is pushed by the spring 2222, pressurizes the auxiliary electrode. Therefore, it is possible to surely obtain electrical contact between each of the inspection probes 222 and the corresponding auxiliary electrodes.  According to the inspection apparatus 20 using the inspection jig 200 of the present embodiment, The front end 223 (probe pin 2223) of the inspection probe 222 which is inserted into the gap G formed above the inspection electrode EL is used as a detection electrode, Therefore, the detecting electrode can be in close contact with the first protective layer CL21. Capacitively coupled to the electrode being inspected. result, When the circuit board FX2 is held by the jig, An air layer (gap G) exists between the detecting electrode and the electrode EL to be inspected, Therefore, the electrostatic capacitance between the two electrodes can be prevented from being reduced. The accuracy of the check value is reduced.  According to the inspection apparatus 20 using the inspection jig 200 of the present embodiment, In the vicinity of the sensor electrode 122 of the first embodiment, there is a case where the elastic member 112 cannot follow the step difference. That is, only the elastic member 112 cannot make the sensor electrode 122 and the protective member close to each other. The probe pin (detection electrode) 2223 may be in close contact with the first protective layer CL21. therefore, The accuracy of the inspection value in the non-contact inspection or the reduction in the repeatability can be suppressed.  Furthermore, In this embodiment, Checking the electrode to be inspected by a probe pin, However, it is not limited to this configuration. E.g, In order to configure a plurality of probe pins in the area for a large area electrode, The inspection probe 222 is supported by the inspection probe support portion 221. and then, The inspection probes 222 are electrically connected to each other. With this composition, The electrical signals detected by the large area electrodes can be sent to the signal processing circuit 140 along with the electrical signals detected by the probe pins. Further, since the same probe pin (for example, the shape of FIG. 9B) is changed according to the area of the electrode, Therefore, it is not necessary to make probe pins of different shapes according to the area of different electrodes (for example, FIG. 9C). result, The manufacturing cost or maintenance cost of the inspection device can be reduced.  [Third Embodiment] A third embodiment of the present invention will be described below with reference to Figs. 11 and 12 . the following, Right with the first, a common component of the second embodiment, Attach the same symbol, Detailed description is omitted.  FIG. 11 is a side view schematically showing the overall configuration of the circuit board inspection device 30 together with the circuit board FX2 to be inspected. FIG. 12 is a side view showing a state in which the circuit board FX2 is sandwiched between the first clamping portion 310 and the second clamping portion 220. In Figures 11 and 12, The driving device 130 which is a component common to the first embodiment, Signal processing circuit 140, A/D converter 150, Test signal generator 160, The measurement mechanism 170 is omitted from illustration.  Non-contact inspection is sometimes performed in a high temperature environment (for example, 50 to 150 ° C). In this case, If the first clamping portion is provided with an elastic member formed of an elastic body, Then, an elastic member or an adhesive for fixing the elastic member to the first holding portion is melted, Damage to the inspection fixture.  The inspection jig 300 of the present embodiment includes a first holding portion 310 and a second holding portion 220. The first clamping portion 310 does not use an elastic member. The first holding portion 310 is, for example, a metal support stand that flattens the upper surface. In this case, As described in the first embodiment, Sometimes, the upper surface of the first holding portion 310 may have irregularities of about several tens of μm. however, Regardless of the presence or absence of bumps, When the inspection probe provided in the second clamping portion 220 presses the second clamping portion 220 against the circuit board FX2 (refer to FIG. 12), Elongate the probe pins appropriately. It is in close contact with the protective member directly above the corresponding electrode to be inspected. therefore, The accuracy of the inspection value in the non-contact inspection or the reduction in the repeatability can be suppressed.  According to the inspection apparatus 30 using the inspection jig 300 of the present embodiment, When inspecting the circuit board FX2 in a high temperature environment, Can not use elastic members, Use only the inspection probe to make the sensor electrode and the protective member in close contact. In this case, Not only can the heating heat source be brought close to the first clamping portion 310, The second clamping portion 220 can also be accessed. Therefore, the heating efficiency is high, The temperature can be easily controlled.  the above, The preferred embodiment of the present invention has been described with reference to the accompanying drawings. The present invention is of course not limited to the related examples. Each shape or combination of the constituent members shown in the above examples is an example. Various changes can be made based on design requirements and the like within the scope of the gist of the invention.

10‧‧‧Inspection device
11‧‧‧Circuit board clamping unit
12‧‧‧Test Signal Generation Department
13‧‧‧Electrical Signal Measurement Department
20‧‧‧Checking device
30‧‧‧Inspection device
100‧‧‧Check fixture
110‧‧‧First clamping section
111‧‧‧Support Desk
112‧‧‧Elastic members (interelectrode distance adjustment unit)
112a‧‧‧Second component
112b‧‧‧ first component
112c‧‧‧ first floor
112d‧‧‧ second floor
113‧‧‧First clamping surface
120‧‧‧Second clamping section
121‧‧‧Sensor substrate
122 (122a, 122b, ..., 122f) ‧ ‧ sensor electrodes (detection electrodes)
123‧‧‧Shield electrode
124‧‧‧Second clamping surface
125‧‧‧Signal input mechanism
130‧‧‧ drive
140‧‧‧Signal Processing Circuit
150‧‧‧A/D converter
160‧‧‧Test signal generator
170‧‧‧Measurement agency
200‧‧‧Check fixture
220‧‧‧Second clamping section
221‧‧‧Check probe support
222 (222a, 222b, ..., 222f) ‧ ‧ inspection probe (inter-electrode distance adjustment unit)
223 (223a, 223b, ..., 223f) ‧ ‧ front end (detection electrode)
224‧‧‧Second clamping surface
225‧‧‧Signal input mechanism
226‧‧‧Shield electrode
300‧‧‧Check fixture
310‧‧‧First clamping section
2221‧‧‧shell
2222‧‧‧ Spring (elastic member)
2223‧‧‧ probe pin
2224‧‧‧ probe pin
Aa, Ab, ..., Af‧‧‧ dotted line
CL1‧‧‧protective components
CL2‧‧‧protective components
CL21‧‧‧ first protective layer
CL22‧‧‧Second protective layer
EL (ELa, ELb, ..., ELf) ‧ ‧ inspection electrode
EL'(ELa',ELb', ..., ELf') ‧ ‧ input electrode
FX1‧‧‧ circuit board
FX2‧‧‧ circuit board
G (Ga, Gb, ..., Gf) ‧ ‧ gap
G'‧‧‧ gap
LD (LDa, LDb, ..., LDf) ‧‧‧ wiring
SB‧‧‧ base

1 is a side view schematically showing an inspection apparatus for a circuit board according to a first embodiment of the present invention together with a circuit board to be inspected. Fig. 2 is a plan view showing the circuit board shown in Fig. 1. 3A and 3B are plan views showing the sensor substrate shown in Fig. 1. 4 is a side view showing a state in which the circuit board shown in FIG. 1 is sandwiched between the first nip portion and the second nip portion. 5A and 5B are a plan view showing a first modification of the elastic member shown in Fig. 1 and a cross-sectional view showing a second modification. Fig. 6 is a side view schematically showing the inspection apparatus of the circuit board according to the second embodiment of the present invention together with the circuit board to be inspected. Fig. 7 is a plan view showing the circuit board shown in Fig. 6. Fig. 8 is a plan view showing the inspection probe supporting portion shown in Fig. 6. Fig. 9A is a cross-sectional view showing the inspection probe shown in Fig. 6. 9B, 9C, 9D, and 9E are side views showing a modified example of the inspection probe shown in Fig. 9A. Fig. 10 is a side view showing a state in which the circuit board shown in Fig. 6 is sandwiched between the first holding portion and the second holding portion. FIG. 11 is a side view schematically showing the inspection apparatus of the circuit board according to the third embodiment of the present invention together with the circuit board to be inspected. Fig. 12 is a side view showing a state in which the circuit board shown in Fig. 11 is sandwiched between the first holding portion and the second holding portion.

10‧‧‧Inspection device

11‧‧‧Circuit board clamping unit

12‧‧‧Test Signal Generation Department

13‧‧‧Electrical Signal Measurement Department

100‧‧‧Check fixture

110‧‧‧First clamping section

111‧‧‧Support Desk

112‧‧‧Elastic members (interelectrode distance adjustment unit)

113‧‧‧First clamping surface

120‧‧‧Second clamping section

121‧‧‧Sensor substrate

122 (122a, 122b, 122c) ‧ ‧ sensor electrodes (detection electrodes)

123‧‧‧Shield electrode

124‧‧‧Second clamping surface

125‧‧‧Signal input mechanism

130‧‧‧ drive

140‧‧‧Signal Processing Circuit

150‧‧‧A/D converter

160‧‧‧Test signal generator

170‧‧‧Measurement agency

FX1‧‧‧ circuit board

SB‧‧‧ base

CL1‧‧‧protective components

EL (ELa, ELb, ELc) ‧‧‧Inspected electrodes

LDa (LD)‧‧‧ wiring

G'‧‧‧ gap

EL', ELa'‧‧‧ input electrode

Claims (15)

An inspection jig for holding a circuit board on which a substrate is provided with an inspected electrode and having an insulating layer as an area layer of the substrate on which the electrode to be inspected is provided, and comprising: a first clip a holding portion having a first clamping surface; and a second clamping portion having a second clamping surface disposed facing the first clamping surface, and a detecting electrode disposed on the second clamping surface; Further, at least one of the first clamping portion and the second clamping portion is provided with an inter-electrode distance adjusting portion that is configured to face the inspected electrode and the detecting electrode. When the circuit board is sandwiched between the first nip portion and the second nip portion, the distance between the detecting electrode and the electrode to be inspected is adjusted so that the detecting electrode and the protective member are in close contact with each other. The inspection jig according to claim 1, wherein the inter-electrode distance adjusting portion includes an elastic member that is provided on the first nip portion so as to face the second nip. The inspection jig of claim 2, wherein the elastic member is formed of a plurality of different materials. The inspection jig according to claim 3, wherein the first member having a relatively high elastic modulus is provided in a region of the elastic member corresponding to an arrangement position of the inspected electrode when the circuit substrate is clamped, respectively A second member having a relatively low modulus of elasticity is disposed in the region of the elastic member other than the above. The inspection jig of claim 3, wherein the elastic member comprises a first layer having a relatively high modulus of elasticity and a second layer having a relatively low modulus of elasticity. The inspection jig according to claim 1, wherein the inter-electrode distance adjusting unit includes an inspection probe provided in the second clamping portion; the detection electrode includes a front end of the inspection probe; and the inspection probe front end is from the above The two clamping surfaces protrude and reciprocate in a direction substantially orthogonal to the second clamping surface. The inspection jig of claim 6, wherein the front end of the inspection probe is a probe pin that is pushed by a spring pushing member. An inspection apparatus comprising: a circuit board clamping portion comprising the inspection jig according to any one of claims 1 to 7; a test signal generating portion that generates a test signal input to the electrode to be inspected; and an electrical signal measurement And measuring an electrical signal detected by the detecting electrode. An inspection method comprising: a clamping step of using a first clamping portion having a first clamping surface, and a second clamping surface disposed opposite the first clamping surface and at the second a second clamping portion provided with a detecting electrode on the clamping surface, and a circuit board that is provided with a protective member having an insulating layer on the surface of the substrate on which the substrate to be inspected is provided with the electrode to be inspected; And inputting a test signal to the electrode to be inspected; and measuring a step of measuring an electrical signal detected by the detecting electrode disposed between the protective member and the electrode to be inspected; and in the clamping step The detection electrode is brought into close contact with the protective member to adjust the distance between the detection electrode and the inspection target electrode. The inspection method of claim 9, wherein in the clamping step, the detecting electrode and the inspected electrode are adjusted by an elastic member disposed on the first clamping portion so as to face the second clamping surface The distance. The inspection method of claim 10, wherein in the niping step, the distance between the detecting electrode and the electrode to be inspected is adjusted by the elastic member formed of a plurality of different materials. The inspection method of claim 11, wherein the first member having a relatively high modulus of elasticity is provided in a region of the elastic member corresponding to an arrangement position of the inspected electrode when the circuit board is clamped, and a second member having a relatively low modulus of elasticity is disposed in the region of the elastic member, wherein the elastic portion is outside the region corresponding to the position at which the electrode to be inspected is placed when the circuit board is clamped in the clamping step The elastic deformation of the member is suppressed. The inspection method of claim 11, wherein the elastic member comprises a first layer having a relatively high modulus of elasticity and a second layer having a relatively low modulus of elasticity, whereby the first layer absorbs the above by the first layer in the clamping step The unevenness of the circuit board absorbs the inclination of the circuit board with respect to the second clamping surface by the second layer. The inspection method of claim 9, wherein the front end of the inspection probe provided on the second clamping portion is used as the detecting electrode, and the front end of the inspection probe protrudes from the second clamping surface, The second clamping surface reciprocates in a direction substantially orthogonal to the distance between the detecting electrode and the electrode to be inspected in the clamping step. The inspection method of claim 14, wherein the front end of the inspection probe is a probe pin that is pushed by the elastic member, whereby the distance between the detection electrode and the inspection electrode is adjusted in the clamping step.