TW201717268A - Cutting mechanism, joining mechanism, substrate processing system, substrate processing device, and substrate processing method - Google Patents

Abstract

A substrate processing system is provided with a first processing unit that continuously carries out first processing on substrates transported at a velocity (V1) and a second processing unit that transports the substrates processed by the first processing unit at a velocity (V2) and continuously carries out second processing on the substrates. When the speed relationship can be set at V1 > V2 by the performance of the first processing unit and the performance of the second processing unit, a cutting mechanism and selection input mechanism are further provided in addition to a plurality of second processing units being provided. When the speed relationship can be set at V1 < V2 by the performance of the first processing unit and the performance of the second processing unit, a joining mechanism that sequentially joins a plurality of substrates that have been processed by the first processing by the plurality of first processing units and inputs to the second processing unit is further provided in addition to a plurality of first processing units being provided.

Description

Substrate processing method, and substrate cutting or bonding device

Aspects of the present invention relate to a cutting mechanism, a bonding mechanism, a substrate processing system, a substrate processing apparatus, and a substrate processing method.

Priority is claimed on U.S. Provisional Application No. 61/650,712, filed on May 23, 2012, and on

In a large-screen display element such as a liquid crystal display device, a transparent electrode such as ITO (Indium Tin Oxide) or a semiconductor material such as Si is deposited on a flat glass substrate, and then a metal material is vapor-deposited, and a photoresist is applied and a circuit pattern is transferred. Thereafter, after the photoresist is developed, a circuit pattern or the like is formed by etching. However, as the size of the large-sized glass substrate of the display element is also increased, substrate transfer becomes difficult. Therefore, it has been proposed to form a display element on a flexible substrate (for example, a film member such as polyimide, PET, or metal foil, or an extremely thin glass sheet), and the like is called a roll-to-roll method (hereinafter, The technique described only as "reel method" (for example, refer to Patent Document 1).

Further, in Patent Document 2, it is proposed to arrange a flexible strip (substrate) that is wound around a transport roller and moved around a peripheral portion of the rotatable cylindrical mask, and the mask pattern is continuously exposed to the substrate. Technology.

Further, in Patent Document 3, it is proposed to temporarily hold a pattern forming region of a flexible long strip (substrate) conveyed by a reel on a plane stage, and to transmit light projected through the enlarged projection lens. The pattern of the mask is like a technique of scanning exposure to the pattern forming region.

Patent Document 1: International Publication No. 2008/129819

Patent Document 2: Japan Shikai Show 60-019037

Patent Document 3: Japanese Special Open 2011-22584

However, the above conventional techniques have the following problems.

When a plurality of processes are sequentially applied to the long sheet substrate, the transport speed of the substrate suitable for processing differs in each unit (each processing content) depending on the performance of each processing unit. For example, in the case of the exposure processing of Patent Document 2, the conveyance speed (working time) of the substrate is restricted by the sensitivity of the photosensitive layer applied to the surface of the substrate and the brightness of the illumination light for exposure. Further, the wet treatment such as etching or plating or the drying and heating steps after the wet treatment can be carried out by slowly transferring the substrate, thereby obtaining advantages such as downsizing of the liquid tank or the drying/heating furnace.

Further, in order to maintain high precision (fineness) and to ensure productivity while performing deposition processing of functional materials or printing or inkjet printing, there is an optimum substrate transport speed. However, these optimum substrate transport speeds are often different depending on the processing unit.

In the case of constructing such a processing unit (processing system) in which a plurality of processing units are combined and the long sheet-like substrate is sequentially passed through and continuously subjected to a series of processing, the conveying speed of the substrate (speed of the production line) has to be processed. The processing unit with the lowest substrate transfer speed.

Therefore, the processing unit with a fast processing speed transports the substrate at a slow speed although it is not fully utilized in performance. Therefore, the efficiency of the processing unit is deteriorated and it is possible that the overall yield of the production line cannot be improved.

The object of the present invention is to provide a cutting mechanism and a connection that contribute to an increase in productivity. Mechanism, substrate processing system, and substrate processing method.

Further, in Patent Document 1, a flexible sheet substrate is conveyed by a roll method, and an electronic component is formed on a sheet substrate mainly by a printing (inkjet) method. However, at the general printing site, when the remaining amount of the sheet substrate wound around the supply reel is small, that is, the printing device is temporarily stopped, the sheet substrate is cut between the printing device and the recovery reel, and will be used as a recycling reel. The wound sheet-like substrate that has been printed is sent to the next step. In this case, in the printing path from the entrance to the exit of the printing apparatus, the sheet-like substrate in the middle of printing remains, and all of this is discarded as a defective product. In the case of printing on color paper with paper or film, the printing cost is extremely low. However, in the case of forming an electronic component in a roll form, the manufacturing cost per unit length (m) of the sheet substrate is still high, and if the sheet substrate remaining in the device is discarded as in a general printing site, it is wasteful and costly. increase.

In particular, in the case where the organic EL constitutes a medium-sized, large-sized display panel formed on a sheet-like substrate, the sheet-like substrate is continuously passed through a series of processing devices, for example, a photosensitive layer printing device, an exposure device of Patent Document 3, and a wet type. After the processing device, the drying device, and the like, the film is wound around the recovery roll. Therefore, it is presumed that the sheet substrate passing through the plurality of processing apparatuses (processing steps) from the supply reel to the recovery reel is extremely long, and once the sheet substrate is stopped, a sheet substrate having a considerable distance is wasted.

Another object of the present invention is to provide a substrate processing apparatus and a substrate processing method which suppress an increase in cost and improve productivity.

A substrate processing system according to a first aspect of the present invention includes: a first processing unit that continuously applies a first process to a substrate transported at a speed V1 in a longitudinal direction; and a second processing unit that transports the first processing unit at a speed V2 The processed substrate is continuously applied to the substrate by a second process; It is characterized in that, depending on the performance of each of the first and second processing units, the relationship between the speeds can be set to V1 > V2, a plurality of second processing units are provided, and after the first processing unit, there is further provided The cutting mechanism in which the substrate of the first processing is cut at a predetermined length in the longitudinal direction and the selective input mechanism in which the substrate after cutting is input into any of the plurality of second processing units; and each of the first and second processing units In the case where the relationship between the speeds is set to V1 < V2, a plurality of first processing units are provided, and before the second processing unit, a plural number to which the first processing is applied by each of the plurality of first processing units is further provided. The substrates are sequentially joined in the longitudinal direction and are introduced into the joining mechanism of the second processing unit.

In the substrate processing method according to the second aspect of the present invention, the first processing unit continuously applies the first processing to the substrate transported at the speed V1 in the longitudinal direction, and the first processing unit performs the processing at the speed V2. The substrate is continuously applied to the substrate by the second processing unit, and the operation of the second processing unit is characterized in that the relationship between the speeds is set to V1 > V2 depending on the performance of each of the first and second processing units. A plurality of second processing units are used, and after the first processing unit, a step of cutting the substrate to which the first processing has been applied in a predetermined length in the longitudinal direction and a substrate after cutting the plurality of second processing units are further provided. Any one of the selection and input steps; depending on the performance of each of the first and second processing units, the relationship between the speeds can be set to V1 < V2, a plurality of first processing units are used, and before the second processing unit A bonding step of sequentially bonding a plurality of substrates to which the first processing is applied by the plurality of first processing units in the longitudinal direction and inputting them into the second processing unit.

A cutting mechanism according to a third aspect of the present invention includes: a cutting portion that cuts a substrate that has been subjected to a predetermined process; and a buffer portion that can be stored in accordance with a predetermined process The conveyance amount of the board is changed, and the conveyance amount of the board|substrate conveyed to the cutting part is adjusted.

The bonding mechanism according to a fourth aspect of the present invention includes: a bonding portion that bonds a substrate to which a predetermined process is applied; and a buffer portion that can be changed in accordance with a transfer amount of the substrate to which the predetermined process is applied, and the adjustment is performed from the bonding portion to a predetermined process. The amount of substrate transported.

In the substrate processing system according to the fifth aspect of the present invention, the substrate that has been transported in the longitudinal direction passes through the first processing unit, and the second processing unit is provided with a cutting mechanism that is in the second When the conveyance speed of the substrate of the processing unit is reduced with respect to the conveyance speed of the substrate of the first processing unit, the substrate is cut between the first processing unit and the second processing unit by a predetermined length in the longitudinal direction, and the bonding mechanism is provided. In the joining mechanism, when the conveying speed of the substrate of the second processing unit is increased with respect to the conveying speed of the substrate of the first processing unit, the substrate is joined in the longitudinal direction between the first processing unit and the second processing unit.

A substrate processing apparatus according to a sixth aspect of the present invention includes: a first mounting portion that mounts a first roller on which a long substrate is wound; and a second mounting portion that mounts a second substrate on which a long tape is wound a processing unit that transports one of the first substrate and the second substrate as a processing substrate in the longitudinal direction and simultaneously applies a predetermined process; the buffer mechanism is disposed between the processing mechanism and the first mounting portion, and is driven from the first roller. The first substrate to be supplied is temporarily stored in the predetermined longest storage range, and then sent to the processing mechanism; and the substrate connection/replacement mechanism is cut off between the buffer mechanism and the first mounting portion, and is supplied from the second roller. The front end portion of the second substrate is joined to the end portion of the cut first substrate, and is sent to the buffer mechanism.

A substrate processing apparatus according to a seventh aspect of the present invention includes: a first mounting portion that mounts a first roller on which a long substrate is wound; and a second mounting portion that mounts a second substrate on which a long tape is wound The second roller; the processing means transports one of the first substrate and the second substrate as a processing substrate in the longitudinal direction and simultaneously applies a predetermined process; and the buffer mechanism is disposed between the processing mechanism and the first mounting portion, and The first substrate supplied from the first roller is temporarily stored in the predetermined longest storage range, and then sent to the processing mechanism; and the substrate connection/replacement mechanism is cut off between the buffer mechanism and the first mounting portion, and the first substrate is cut off from the first substrate. The front end portion of the second substrate supplied by the two rolls is connected to a predetermined portion on the side of the buffer mechanism of the first substrate to be cut, and is sent to the buffer mechanism.

A substrate processing apparatus according to an eighth aspect of the present invention includes: a first mounting portion that detachably mounts a first roller on which a long substrate is wound; and a holding portion that maintains the same specifications as the first substrate with a predetermined length In the second substrate, the processing means transports one of the first substrate and the second substrate as a processing substrate in the longitudinal direction and simultaneously applies a predetermined process; and the buffer mechanism is disposed between the processing mechanism and the first mounting portion, and the buffer mechanism is disposed between the processing device and the first mounting portion. The first substrate supplied from the first roller is temporarily stored in the predetermined longest storage range, and then sent to the processing mechanism; and the substrate connection/replacement mechanism is cut off between the buffer mechanism and the first mounting portion, and will be maintained. The front end portion of the second substrate supplied from the portion is connected to a predetermined portion on the side of the buffer mechanism of the first substrate that is cut, and is sent to the buffer mechanism.

In the substrate processing method according to the ninth aspect of the present invention, the long-length substrate to be loaded is transported in the longitudinal direction as a processing substrate, and a predetermined process is applied by the processing means, and the method includes: The operation of attaching the first roller to the first roller attachment portion, the operation of attaching the second roller on which the long substrate is wound to the second roller attachment portion, and the buffer mechanism disposed between the processing mechanism and the first roller attachment portion The first substrate supplied from the first roller is temporarily stored in a predetermined longest storage range, and then sent to the processing mechanism; and the temporarily stored first substrate is sent to the processing mechanism, and the buffer mechanism and the first roller are mounted. Cutting the first substrate between the parts The operation is performed by connecting the end portion of the second substrate supplied from the second roller to a predetermined portion of the buffer mechanism side of the first substrate to be cut.

In the substrate processing method according to the tenth aspect of the present invention, the long-length substrate to be loaded is transported as a processing substrate in the longitudinal direction, and a predetermined process is applied by the processing means, and the method includes: winding the long-length substrate The operation of attaching the first roller to the first roller mounting portion; the operation of holding the second substrate of the same size as the first substrate to the holding portion for a predetermined length; and the buffer mechanism disposed between the processing mechanism and the first roller mounting portion The first substrate supplied from the first roller is temporarily stored in a predetermined longest storage range, and then sent to the processing mechanism; and the temporarily stored first substrate is sent to the processing mechanism, and the buffer mechanism and the first roller are mounted. The first substrate is cut between the portions, and the front end portion of the second substrate supplied from the holding portion is connected to a predetermined portion of the buffer mechanism side of the first substrate that is cut.

In the embodiment of the present invention, the processing unit used in each of the plurality of processing steps can be efficiently utilized to increase the overall yield of the substrate processing line.

Moreover, in another aspect of the present invention, waste of the substrate can be greatly reduced, and an increase in cost can be effectively suppressed.

BF1‧‧‧1st buffer mechanism (1st buffer part, buffer mechanism)

BF2‧‧‧2nd buffer mechanism (2nd buffer part)

CSa‧‧1 first strap unit (substrate connection replacement mechanism)

CSb‧‧‧2nd strap unit (2nd board connection replacement mechanism)

CU10‧‧‧ cutting mechanism

FS‧‧‧Substrate

P‧‧‧Substrate

PK, PK2‧‧‧ introduction substrate (3rd substrate)

PU10‧‧‧ joint mechanism

RR1‧‧‧Supply Roller (1st Roll)

RR2‧‧‧Supply Roller (2nd Roller)

RR3‧‧‧Recycling roller (3rd roller)

RR4‧‧‧Recycling roller (4th roller)

RS1‧‧‧1st installation department

RS2‧‧‧Second Installation Department

RS3‧‧‧3rd Installation Department

RS4‧‧‧4th installation department

ST‧‧‧Selected input institutions

SYS‧‧‧ component manufacturing system (substrate processing device)

UA, UB, UB1~UB3, UC‧‧‧ processing unit

U1~Un‧‧‧Processing device (processing mechanism)

Fig. 1 is a view schematically showing a substrate processing system according to a first embodiment.

Fig. 2 is a schematic perspective view of the cutting mechanism of the first embodiment.

Fig. 3 is a schematic external perspective view of the first splicer portion of the first embodiment.

Fig. 4 is a schematic external perspective view of a second nipper portion of the first embodiment.

Fig. 5 is a control block diagram of the substrate processing system of the first embodiment.

Fig. 6 is a view showing a part of the configuration of the component manufacturing system of the first embodiment.

Fig. 7 is a view showing an example of a model arrangement of a plurality of processing units constituting the production line of the first embodiment.

Fig. 8 is a timing chart for explaining an increase in the working time of the production line of the first embodiment.

FIG. 9 is a view showing a partial configuration of a component manufacturing system of the substrate processing apparatus according to the second embodiment.

Fig. 10 is a view showing a schematic configuration of a first splicer unit and a first damper mechanism according to a second embodiment.

Fig. 11 is a view showing a schematic configuration of a second nipper portion and a second damper mechanism according to the second embodiment.

Fig. 12 is a view showing the joining/cutting operation of the substrate on the substrate supply side in the second embodiment.

Fig. 13 is a view showing the joining/cutting operation of the substrate on the substrate supply side in the second embodiment.

Fig. 14 is a view showing the joining/cutting operation of the substrate on the substrate supply side in the second embodiment.

Fig. 15 is a view showing the joining/cutting operation of the substrate on the substrate supply side in the second embodiment.

Fig. 16 is a view showing the joining/cutting operation of the substrate on the substrate supply side in the second embodiment.

Fig. 17 is a view showing the joining/cutting operation of the substrate on the substrate supply side in the second embodiment.

Fig. 18 is a view showing the joining/cutting operation of the substrate on the substrate supply side in the second embodiment.

Fig. 19 is a view showing the joining/cutting operation of the substrate on the substrate supply side in the second embodiment.

Fig. 20 is a view showing the joining/cutting operation of the substrate on the substrate recovery side in the second embodiment.

Fig. 21 is a view showing the joining/cutting operation of the substrate on the substrate recovery side in the second embodiment.

Fig. 22 is a view showing the joining/cutting operation of the substrate on the substrate recovery side in the second embodiment.

Fig. 23 is a view showing the joining/cutting operation of the substrate on the substrate recovery side in the second embodiment.

Fig. 24 is a view showing the joining/cutting operation of the substrate on the substrate recovery side in the second embodiment.

Fig. 25 is a view showing the joining/cutting operation of the substrate on the substrate recovery side in the second embodiment.

(First embodiment)

Hereinafter, embodiments of the cutting mechanism, the joining mechanism, the substrate processing system, and the substrate processing method of the present invention will be described with reference to Figs. 1 to 6 .

Fig. 1 is a view schematically showing, as an example, a substrate processing system SYS in which a sheet substrate P is sequentially passed through three processing steps A, B, and C.

The main body of the substrate processing system is a processing unit UA (first processing unit) that applies the processing A (first processing) to the substrate P as the processing unit A, and a processing unit (the first processing and the second processing) that applies the processing B (the first processing and the second processing) as the step B. UB (first processing unit, second processing unit), processing unit UC (second processing unit) that applies processing C (second processing) as step C, cutting mechanism CU10, bonding mechanism PU10, selection input mechanism ST1, ST2 The control unit CT (see Fig. 5).

The processing unit UA includes a roller attachment portion RSA for mounting the supply roller RRA, and the substrate P to which the treatment A has been applied is sent to the cutting mechanism CU10. The processing unit UB is configured by the processing units UB1 to UB3 to which the same processing B is applied, and is disposed, for example, in the upper and lower sides of the substrate transport direction of the processing unit UA in three stages or three levels.

Each of the processing units UB1 to UB3 is provided with mounting portions RSB11 to RSB31 for mounting the roller of the substrate P to which the processing A has been applied, and mounting portions RSB12 to RSB32 for mounting the roller of the substrate P to which the processing B has been applied, from the mounting portion. The substrate P of the rollers RRB11 to RRB31 of RSB11 to RSB31 (hereinafter, appropriately referred to as sub-rollers RRB11 to RRB31) is wound up to be mounted after the application of the treatment B The rollers RRB12 to RRB32 of the mounting portions RSB12 to RSB32 (hereinafter, referred to as sub-rollers RRB12 to RRB32 as appropriate).

Further, in Fig. 1, a roller RR1 for winding the substrate P to which the process A has been applied is provided after the cutting mechanism CU10 of the subsequent stage of the processing unit UA. After the roller RR1 is wound around the predetermined length of the substrate P, the substrate P is cut, and the roller RR1 is attached to any one of the attachment portions RSB11 to RSB31 of the processing units UB1 to UB3 as one of the sub-rollers RRB11 to RRB31.

The processing unit UC can mount any one of the sub-rollers RRB12 to RRB32 to which the processing B is applied by the processing units UB1 to UB3 as the roller RR2. The substrate P wound around the roll RR2 (the intermediate product to which the processes A and B have been applied) is carried into the processing unit UC through the bonding mechanism PU10, and the process C is applied. The substrate P subjected to the treatment C is wound and recovered to the recovery roller RRC mounted on the roller mounting portion RSC.

In the present embodiment, the processing speed VA of the processing A of the processing unit UA (the transport speed of the substrate P), the processing speed VB of the processing B of the processing units UB1 to UB3 (the transport speed of the substrate P), and the processing unit UC The relationship between the processing speed VC of the processing C (the transport speed of the substrate P) is as follows.

VA≒VC>VB

Further, since the transport speed of the substrate P is VA>VB between the processing unit UA and any of the processing units UB1 to UB3, the processing unit UA corresponds to the first processing unit having a higher transport speed (V1), and the processing unit UB1~ Any one of UB3 corresponds to the second processing unit having a lower transfer speed (V2). On the other hand, between the processing units UB1 to UB3 and the processing unit UC, since the transport speed of the substrate P is VB<VC, any one of the processing units UB1 to UB3 and the transport speed (V1) are lower. Corresponding to the first processing unit, the processing unit UC corresponds to the second processing unit having a higher transport speed (V2).

In the present embodiment, the processing speeds VA and VC can be set to about three times the processing speed VB. As in the past, in the case where the processing unit UB of the processing step B is one, the substrate P connected from the supply roller RRA to the recovery roller RRC sequentially passes through the processing units UA, UB, UC, so that the transport speed is the slowest. Processing speed VB is consistent. That is, the overall operating time (line speed, yield) of the production line is limited by the slowest processing unit.

In the present embodiment, the processing unit UB having a slow processing speed is doubled (here, three units are collocated), and the configuration is not limited. In order to achieve this doublet (or a plurality of sets), it is necessary to cut the substrate CU10 of the substrate P without temporarily stopping the processing step A and the processing step B after the substrate P is wound up to a predetermined length of the roller RR1.

The cutting mechanism CU10 mainly cuts the substrate P to which the processing A has been applied, and includes a first buffer mechanism (first buffer portion) BF1 and a first adapter portion CSa (cut as shown in FIGS. 1 and 2). unit). Further, the cutting mechanism CU10 further includes an interlocking control unit that interlocks the operation of the first splicer portion CSa (cutting portion) with the storage amount of the substrate P of the first buffer mechanism BF1 (first buffer portion).

The first buffer mechanism BF1 has a tension reel mechanism DR1 that is disposed between the unit UA that is the process A of the first process and the first splicer portion CSa, and that folds the substrate P back by a plurality of rollers to store a predetermined length. The storage length of the substrate P is variably adjusted by the downward movement of the tension reel mechanism DR1 or the like, and the substrate P is simultaneously carried in and out. The first buffer mechanism BF1 includes a chucking drive reel that is disposed adjacent to the downstream side of the transport direction of the substrate P of the processing unit UA and that adjusts the transport amount (or transport speed) of the substrate P carried out to the first splicer portion CSa. NR1 (refer to the figure 5). The driving of the tension reel mechanism DR1 and the driving of the nip drive reel NR1 are controlled by the control unit CT.

Here, the configuration will be described with reference to FIG. 3 showing the schematic three-dimensional appearance of the first splicer portion CSa.

The first splicer portion CSa includes a slider 2 that has a suction pad 1 formed of, for example, a porous material, and that is movable in a transport direction (hereinafter, simply referred to as a transport direction) of the substrate P, and transports the slider 2 The elevating table 3 with the rails movably supported in the direction, the driving unit 4 for elevating and lowering the elevating table 3, and the elevating table 3 are moved in the width direction of the substrate P and can be adsorbed on the adsorption pad 1 of the slider 2 The cutter portion 5 on which the substrate P is cut, the adhesive portion 6 to which the adhesive tape TP is adhered to the substrate P, and the winding roller 1 for the roller RR1 which is disposed above the lift table 3 and which is wound around the substrate P to which the process A has been applied is wound on both sides. The holding portion 8 of the shaft 7 (can be moved up and down).

Further, the winding shaft 7 is adhered to a resin film or material having a high adhesive force on one portion (or the entire circumferential surface) of the outer peripheral surface thereof, and the end portion of the substrate P is brought into contact with the outer peripheral surface of the winding shaft 7 by the front end of the substrate P. Rotating around the shaft 7 automatically winds the substrate P.

The sliders 2, the lifting table 3, the driving unit 4, the cutter unit 5, the bonding unit 6, and the holding unit 8 are configured as an integrated workstation unit SN, and can be placed on a caster table or the like and can be positioned at a predetermined position. .

The driving of the slider 2, the driving unit 4, the cutter unit 5, and the bonding unit 6 is controlled by the control unit CT (see Fig. 5).

Further, the workstation unit SN includes a moving portion that can move the substrate P and moves in the longitudinal direction, and includes the slider 2, the lifting table 3, the driving unit 4, and the like, and moves the moving portion to the cutting mechanism CU10. A movement control unit of the area or the joint area of the joint mechanism PU10.

Further, in the adhesive portion 6 in the present embodiment, the substrate P is bonded by the adhesive tape TP, but other adhesive means (mechanism) may be used. For example, when the adhesive agent is applied in a strip shape in the width direction orthogonal to the conveyance direction of the substrate P and pressure-bonded, and the substrate P is a resin film or the like, the bonding portion of the substrate P is heated and crimped. Or the method of ultrasonic bonding or the like.

Further, the adsorption pad 1 provided on the upper surface of the slider 2 holds the substrate P by vacuum pressure, but the substrate P is locked on the upper surface of the slider 1 by a mechanical opening and closing mechanism (opening or closing hand) other than vacuum pressure. Also.

Further, the selective input mechanism ST1 shown in FIG. 1 is a sub-roller by rolling the roll RR1 (hereinafter referred to as a sub-roller RR1) on which the substrate P to which the process A has been applied is wound under the control of the control unit CT. Any one of the RRB 11, the RRB 21, and the RRB 31 is selectively inserted into the mounting portions RSB11 to RSB31, and the preparatory winding shaft 7 is transported to the holding portion 8 of the first splicer portion CSa from which the sub-roller RR1 is carried out and vacated. .

In the present embodiment, the processing speeds VA and VC are approximately three times the processing speed VB, and three processing units UB are provided. Therefore, the sub-rollers RR1 (that is, the sub-rollers RRB11 to RRB31, RRB12 to RRB32, and RR2 described later) are wound. The length of the substrate P is set to be about 1/3 of the length of the substrate P wound around the supply roller RRA which is the pro-roller.

In other words, the cutting mechanism CU10 cuts the substrate P by a predetermined length that substantially equals the entire length of the substrate P wound around the supply roller RRA.

Further, the selection input mechanism ST2 of FIG. 1 selects the substrate P to be wound by a predetermined length by applying the processing B to any one of the processing units UB1 to UB3 under the control of the control unit CT. In any one of the sub-rollers RRB12 to RRB32 of the mounting portions RSB12 to RSB32, the joining mechanism PU10 (roller conveying) is inserted, and the winding portions of the mounting portions RSB12 to RSB32 that are vacated by any one of the sub-rollers RRB12 to RRB32 are mounted. axis.

The bonding mechanism PU10 mainly connects any one of the sub-rollers RRB12 to RRB32 to which the process B is applied and is used as the sub-roller RR2, and is joined to the vicinity of the terminal to which the substrate to be cut is previously placed. As shown in FIG. 1, the second pick-up portion CSb is provided. (joining portion) and second buffer mechanism (second buffer portion) BF2. Further, the bonding mechanism PU10 includes the second taper portion CSb (joining portion) for bonding the substrate to which the process B has been applied, and the amount of storage of the substrate to be changed according to the amount of transfer of the substrate to which the process B is applied, and the adjustment is made from the joint portion. The second buffer mechanism (buffer portion) BF2 that handles the transport amount of the substrate of B.

As shown in FIG. 4, the second splicer portion CSb is provided in a state in which the transport direction of the substrate P is reversed in the station portion SN provided in the first splicer portion CSa. In other words, the second adapter unit CSb includes a slider 2 having a suction pad 1 on the upper surface and a movable guide 2 movable in the conveyance direction, and a lifting platform 3 for movably supporting the slider 2 in the conveyance direction. When the driving portion 4 for lifting and lowering is moved to the width direction of the substrate P when the lifting table 3 is at the rising position, the cutter portion 5 which is attached to the substrate P of the adsorption pad 1 of the slider 2 can be cut, and the adhesive tape can be adhered to the substrate P. The TP bonding portion 6 and the holding portion 8 of the winding shaft 7 for the sub-roller RR2 for winding the substrate P to which the processing B has been applied are held above the elevating table 3.

The second buffer mechanism BF2 is configured in the same manner as the first buffer mechanism BF1, and the substrate P carried in the processing unit UC is variably stored in the range of the adjustable length, and is disposed adjacent to the upstream side in the transport direction of the substrate P of the processing unit UC.

The second buffer mechanism BF2 includes a tension reel mechanism DR2 that variably adjusts the storage amount of the substrate P in a plurality of reels adjacent to each other in the transport direction of the substrate P, and an adjustment from the second retractor The conveyance amount (transport speed) of the substrate P conveyed by the portion CSb to the tension reel mechanism DR2 is held by the drive reel NR2 (see FIG. 5). The driving of the tension reel mechanism DR2 and the driving of the nip drive reel NR2 are controlled by the control unit CT.

FIG. 5 is a control block diagram of the substrate processing system shown in FIGS. 1 to 4.

As shown in FIG. 5, the control unit CT controls the operations of the processing units UA, UB (UB1 to UB3), UC, and collectively controls the slider 2, the drive unit 4, and the cutters provided in each of the cutting mechanism CU10 and the engagement mechanism PU10. The portion 5, the bonding portion 6, the selection of the input mechanisms ST1, ST2, the tension reel mechanisms DR1, DR2, and the driving of the driving reels NR1, NR2 and the like. In addition, the control unit CT counts the rotation of the supply roller RRA, the recovery roller RRC, and the transport length of the substrate P in each step (each processing unit), and counts and manages the remaining amount of the substrate on the supply side of the substrate P. The substrate winding amount of each of the rolls on the recovery side of the substrate P is also managed by the management of the overall operation time of the processing steps A to C, the presence or absence of problems in the processing of each of the rolls, and the degree or location of the defective condition. The control unit CT includes an interlocking control unit that interlocks the operation of the cutting mechanism CU10 with the storage amount of the substrate P of the first buffer unit BF1. Similarly, the control unit CT includes an interlocking control unit that interlocks the operation of the bonding mechanism PU10 with the storage amount of the substrate P in the second buffer unit BF2.

Next, the operation of the substrate processing system having the above configuration will be described.

Here, as shown in FIG. 1, the sub-roller RRB12 is transported to the holding portion 8 of the second splicer portion CSb by the selective input mechanism ST2 one time after the processing B of the processing unit UB1 is completed. Further, in the processing unit UB2, the process B is applied to the substrate P drawn from the sub-roller RRB21 attached to the mounting portion RSB21. In addition, the processing unit UB3 waits until the sub-roller RRB31 to be next processed is attached to the mounting portion RSB31.

In the following description, since the operation of each component device is controlled by the control unit CT, the description thereof will be omitted.

First, after the substrate P to which the process A has been applied is wound with a predetermined length in the sub-roller RR1 held by the holding portion 8 of the first splicer portion CSa, the drive roller NR1 is held by the first damper mechanism BF1 to stop driving. The supply of the substrate P to the first splicer portion CSa is stopped. At this time, the processing unit UA continues the processing A, and the substrate P is sent to the first buffer mechanism BF1. Therefore, the tension reel mechanism DR1 of the first buffer mechanism BF1 is driven in a direction in which the storage amount of the substrate P is increased.

The supply of the substrate P from the first buffer mechanism BF1 is stopped, and the cutting process of the substrate P is performed in the first splicer portion CSa.

Specifically, first, after the slider 2 is moved to a position facing the cutter portion 5, the lift table 3 is lifted together with the slider 2 by the operation of the drive portion 4. By the rise of the slider 2, the adsorption pad 1 sucks and holds the substrate P from the back surface (lower surface), and positions the cutting position of the cutter portion 5. Thereafter, the cutter portion 5 moves in the width direction of the substrate P and cuts the substrate P. After the substrate P is cut, the input mechanism ST1 is selected to put the sub-roller RR1 as the sub-roller RRB31 into the mounting portion RSB31 of the processing unit UB3. Moreover, the holding mechanism ST1 is loaded with the preparatory winding shaft 7 in the holding portion 8 of the first splicer portion CSa which is empty after the sub-roller RR1 is discharged.

In the first splicer portion CSa, after the winding shaft 7 is attached to the holding portion 8, the slider 2 is moved (while the nip roller NR1 is also rotated synchronously) so that the suction is held on the slider 2 The front end portion of the substrate P is positioned below the winding shaft 7, and the holding portion 8 for supporting the winding shaft 7 is lowered by a predetermined distance, and the front end portion of the substrate P is adhered to the adhesive portion of the outer peripheral surface of the winding shaft 7. As described above, the front end portion of the substrate P extending from the side of the first buffer mechanism BF1 is connected to the new winding shaft 7, and the adsorption holding of the suction pad 1 is released. Then, the holding portion 8 returns to the original height position, and the driving portion 4 is returned. The action causes the lifting platform 3 to descend together with the slider 2.

Thereafter, the rotational driving of the grip driving reel NR1 and the new winding shaft 7 is resumed, the supply of the substrate P from the first buffer mechanism BF1 is resumed, and the substrate P is wound up to the new winding shaft 7. After the supply of the substrate P is resumed, the driving drive reel NR1 is slightly faster than the conveying speed of the substrate P corresponding to the processing speed VA of the processing unit UA (that is, the speed at which the substrate P is sent to the first buffer mechanism BF1). The speed of rotation. The tension reel mechanism DR1 is driven in a direction to reduce the amount of storage of the substrate P in accordance with the driving of the nip drive reel NR1.

After the length of the substrate P stored in the first buffer mechanism BF1 is substantially minimum, the chuck driving reel NR1 is driven at the same speed as the conveyance speed of the substrate P of the processing unit UA.

On the other hand, the substrate P is taken out from the sub-roller RRB31 attached to the mounting portion RSB31 of the processing unit UB3, transported and applied at a speed corresponding to the processing speed VB, and wound up to the sub-roller RRB32 attached to the mounting portion RSB32.

In the processing unit UB3, while the process B is applied to the substrate P drawn from the sub-roller RRB31, the processing B of the substrate P taken out from the sub-roller RRB21 is completed in the processing unit UB2, and the sub-roller RRB2 around which the substrate P is wound is mounted. The RSB22 is in standby.

By selecting the input mechanism ST2, the pair is attached as the sub-roller RR2 After the processing C of the processing unit UC of the substrate P of the sub-roller RRB12 of the bonding mechanism PU10 is completed, the driving of the clamping drive reel NR2 of the second buffer mechanism BF2 of the bonding mechanism PU10 is stopped, and the substrate P of the tension reel mechanism DR2 is stopped. Supply stopped.

At this time, the processing C is continued in the processing unit UC. Therefore, the tension reel mechanism DR2 is actuated to send the substrate P stored in the second buffer mechanism BF2 to the processing unit UC at a constant speed corresponding to the conveyance amount (processing speed VC) of the substrate P of the processing unit UC.

In the second splicer portion CSb, similarly to the cutting process of the first splicer portion CSa, the slider 2 is moved to a position facing the tool portion 5, and then the driving portion 4 is actuated to cause the lifting table. 3 rises together with the slider 2. By the rise of the slider 2, the adsorption pad 1 sucks and holds the substrate P from the sub-roller RRB12 from the back surface (lower surface), and positions the cutting position of the cutter portion 5. Thereafter, the cutter portion 5 moves in the width direction of the substrate P and cuts the substrate P. After the substrate P is cut, the input mechanism ST2 selects the winding shaft 7 around which the sub-roller RR2 (RRB12) is wound, and the empty holding portion 8 is attached to the sub-roller RRB22 in which the mounting portion RSB22 stands by as the sub-roller RR2.

As the sub-roller RR2, after the sub-roller RRB22 is attached to the holding portion 8 of the second belt connector portion CSb, the front end portion of the substrate P taken out from the sub-roller RR2 and the rear end of the substrate P on the side of the second buffer mechanism BF2 that has been cut before. When the portions are aligned, the two substrates P are all held by the adsorption pad 1. In this state, the two substrates P are joined by the adhesive tape TP. After the substrate P is joined, the adsorption holding of the adsorption pad 1 is released, and thereafter, the lifting table 3 is lowered together with the slider 2 by the operation of the driving portion 4. Thereafter, by driving the nip drive reel NR2, the supply of the substrate P from the second splicer portion CSb to the second damper mechanism BF2 is resumed.

After the supply of the substrate P is started again, the driving drive reel NR2 is clamped to be more The processing speed of the processing unit VC is rotated at a speed slightly faster than the transport speed of the substrate P. The tension reel mechanism DR2 is driven in a direction in which the amount of storage of the substrate P is increased in accordance with the driving of the nip drive reel NR2.

After the length of the substrate P stored in the second buffer mechanism BF2 is substantially the maximum, the chuck driving reel NR2 is driven at the same speed as the conveyance speed of the substrate P of the processing unit UC. Next, the substrate P drawn from the sub-roller RRB22 (sub-roller RR2) that has been transported to the processing unit UC through the second buffer mechanism BF2 is subjected to the processing speed VC application process C.

As described above, the substrate P after the processing A is applied by the processing unit UA, and is wound into the sub-rollers RR1 of the length divided by the number of the processing units UB, and then sequentially processed into the processing units UB1 to UB3 and applied with the processing B, and then the processing unit UB1 to UB3 are sequentially supplied to the processing unit UC as the sub-rollers RR2 and the process C is applied. Regarding the processing unit UB whose processing speed VB is slower than the processing speed VC, three units are provided in accordance with the processing speed ratio, so apparently, processing is applied from the three processing units UB1 to UB3 at a processing speed equal to three times the processing speed VB. The sub-roller RR2 is put into the processing unit VC in the same cycle after B.

As described above, in the present embodiment, depending on the performance of each of the processing units UA, UB, the processing speed VA > the processing speed VB can be set, and the relationship between the number n of processing units UA and the number m of processing units UB can be set. When n<m, the substrate P is cut into sub-rollers having a length corresponding to the number m, and is selectively supplied to any one of the m processing units UB1 to UBm. Therefore, it is not limited to the low processing speed VB, and the entire line can be processed, and the substrate P can be processed at the processing speed VA.

Further, depending on the performance of each of the processing units UB, UC, the processing speed VB<the processing speed VC can be set, and the processing B is applied to the plurality of (m) processing units UB1 to UBm. The substrate P of the succeeding sub-roller RR2 is sequentially joined and placed in n (n < m) processing units UC. Therefore, the waiting time until the substrate P is carried from the processing unit UB to the processing unit UC can be substantially suppressed.

Therefore, the situation is not limited to the low processing speed VB, and the substrate P can be processed at the processing speed VC (≒VA).

Therefore, in the present embodiment, even if a plurality of processes A to C having different processing speeds are sequentially applied, the yield can be improved. Further, in the present embodiment, the number of processing units UB is set in accordance with the ratio of the processing speeds. Therefore, high-efficiency substrate processing can be realized without excessively setting the device. Further, in the present embodiment, in the case where the multi-line processing units UB1 to UB3 are provided in a plurality of stages in the vertical direction, high-efficiency substrate processing can be performed without increasing the footprint.

Further, in the present embodiment, the cutting mechanism CU10 with the buffer mechanism and the joining mechanism PU10 with the buffer mechanism are provided in common with each of the cutting and joining, and are provided as the workstation unit SN. Therefore, it is not necessary to separately set different types of devices, and the cost of the production equipment can also be reduced.

That is, if the processing speed of the processing unit on the downstream side is lower than the processing unit on the upstream side of the transport direction of the substrate P among the adjacent processing units among the plurality of processing units, the workstation portion is disposed therebetween. When the SN is the cutting mechanism CU10, the relationship between the processing speeds is reversed, and the workstation unit SN may be provided between the adjacent processing units as the bonding mechanism PU10.

In other words, in the substrate processing system of the present embodiment, the substrate P of the processing unit (first processing unit) on the upstream side in the transport direction of the substrate P is transported between adjacent processing units among the plurality of processing units. Speed, the processing unit on the downstream side (second processing unit) When the transport speed of the substrate P is lowered, the cutting mechanism CU10 that cuts the substrate P by a predetermined length in the long-band direction is provided between the first processing unit and the second processing unit, and the substrate P of the first processing unit is When the conveyance speed is increased and the conveyance speed of the substrate P of the second processing unit is increased, the bonding mechanism PU10 that joins the substrate P in the longitudinal direction is provided between the first processing unit and the second processing unit.

(Component Manufacturing System)

Next, a component manufacturing system to which the above substrate processing system is applied will be described with reference to FIG.

Fig. 6 is a view showing the constitution of a part of a component manufacturing system (flexible display production line) as a substrate processing system. Here, the flexible substrate P (sheet, film, etc.) drawn from the supply roller RR1 is sequentially passed through the n processing apparatuses U1, U2, U3, U4, ... Un to the recovery roll RR2. The upper control unit CONT (control unit) collectively controls the processing units U1 to Un constituting the production line.

In addition, the processing apparatuses U1 to Un shown in FIG. 6 may be any one of the processing units UA to UC shown in FIG. 1, and two or more consecutive processing apparatuses of the processing apparatuses U1 to Un may be associated with the processing unit. Any of UA~UC can also be used.

In FIG. 6, the orthogonal coordinate system XYZ is set such that the surface (or the back surface) of the substrate P is perpendicular to the XZ plane, and the width direction orthogonal to the transport direction (long strip direction) of the substrate P is set to the Y-axis direction. In addition, the substrate P may be modified in advance by a predetermined pre-treatment, or a fine partition structure (concave-convex structure) for precise patterning may be formed on the surface.

The substrate P wound up to the supply roller RR1 is taken out by the driven drive reel DR10 and conveyed to the processing apparatus U1. The center of the Y-axis direction (width direction) of the substrate P is by the side The edge position controller EPC1 performs servo control so as to be in the range of ±10 μm to several tens of μm with respect to the target position.

The processing device U1 is a photosensitive functional liquid (photoresist, photosensitive decane coupling material, photosensitive coupling material, photosensitive dia liquid modifier, photosensitive plating) in the transfer direction (longitudinal direction) of the substrate P by printing. A coating device that applies a reducing agent, a UV-curing resin solution, or the like to the surface of the substrate P continuously or selectively. The processing device U1 is provided with a coating mechanism Gp1 and a drying mechanism Gp2 for rapidly removing the solvent or moisture contained in the photosensitive functional liquid applied to the substrate P, and the coating mechanism Gp1 includes a pressing body roll around which the substrate P is wound. The cylinder DR20 is a coating roll in which the photosensitive functional liquid is uniformly applied to the surface of the substrate P, or a photosensitive functional liquid is used as a relief or intaglio plate roll of the ink printing pattern.

The processing device U2 is a heating device that heats the substrate P conveyed from the processing device U1 to a predetermined temperature (for example, several tens to 120 ° C) and stably fixes the photosensitive functional layer applied to the surface. In the processing apparatus U2, a plurality of reels and an air rotating rod for folding and transporting the substrate P, and a heating chamber portion HA1 for heating the loaded substrate P are provided, and the temperature of the substrate P after heating is lowered to a subsequent step. (Processing device U3) The cooling chamber portion HA2 having the same ambient temperature and the driven driving drum DR3 and the like.

The processing device U3 is an exposure device that irradiates the photosensitive functional layer of the substrate P transferred from the processing device U2 with the patterned light of ultraviolet rays corresponding to the circuit pattern for the display or the wiring pattern. The processing device U3 is provided with an edge position controller EPC that controls the center of the substrate P in the Y-axis direction (width direction) to a certain position, the clamped drive reel DR4, and partially winds the substrate P at a predetermined tension and The pattern exposed portion on the substrate P is supported in a uniform cylindrical shape The rotating cylinder DR5 and the two sets of driving reels DR6, DR7 and the like which impart a predetermined slack (void) DL to the substrate P.

Further, in the processing apparatus U3, a transmissive cylindrical mask DM, an illumination mechanism IU provided in the cylindrical mask DM and illuminating a mask pattern formed on the outer peripheral surface of the cylindrical mask DM, and a pair are provided. The quasi-microscopes AM1, AM2, the alignment microscopes AM1, AM2, in order to make the image of a portion of the mask pattern of the cylindrical mask DM and the substrate P in a portion of the substrate P supported by the rotating cylinder DR5 in a cylindrical shape The alignment is performed, and an alignment mark or the like formed in advance on the substrate P is detected.

The processing apparatus U4 is a wet processing apparatus which performs at least one of various wet processing such as wet development processing and electroless plating processing on the photosensitive functional layer of the substrate P transferred from the processing apparatus U3. In the processing apparatus U4, three processing tanks BT1, BT2, BT3 which are layered in the Z-axis direction, a plurality of reels which are conveyed by bending the substrate P, and a driving reel DR8 which is sandwiched are provided.

The processing apparatus U5 is a heating and drying apparatus that heats the substrate P conveyed from the processing apparatus U4 and adjusts the moisture content of the substrate P wetted by the wet process to a predetermined value, but detailed description thereof will be omitted. Thereafter, the substrate P passing through several processing apparatuses and passing through the last processing apparatus Un of the series of processes is wound up to the recovery reel RR2 through the nip drive DR10. At the time of winding, the center of the Y-axis direction (width direction) of the substrate P or the substrate end of the Y-axis direction is not deviated in the Y-axis direction, and the drive position reel DR10 is sequentially modified by the edge position controller EPC2. The position relative to the Y-axis direction of the recovery reel RR2.

In the component manufacturing system of FIG. 6 described above, corresponding to the processing speed of each processing device U1, U2, U3, U4, U5, ... Un, the processing unit with a slow processing speed is doubled and juxtaposed, and is set before the processing device. Cutting mechanism CU10, configured to put the substrate into a plurality of processes Any one of the devices is selected to be input to the mechanism ST1.

Further, after the plurality of processing apparatuses that are slow in processing speed, the bonding mechanism PU10 that sequentially joins the plurality of substrates carried out from the processing apparatuses is provided, and even if a plurality of processing processes having substantially different processing speeds are sequentially applied, Limited by the processing steps with the lowest processing speed, the yield can be improved.

In the case of the production line shown in Fig. 6, the processing device U2 that performs the heat treatment suppresses the transfer speed of the substrate P as much as possible, and the volume of the chamber portions HA1 and HA2 can be reduced, and accordingly, the power can be reduced and the power can be reduced. The advantage of reducing the set area of the device settings.

On the other hand, in the case of the processing device U1 immediately before the processing device U2, the photosensitive functional liquid is patterned and printed on the surface of the substrate P, and the plate (gravure or relief) roll for pattern printing is used. After the cylinder is coated with the photosensitive functional liquid as an ink, the substrate P is brought into contact with the plate cylinder to transfer the pattern. In this case, in order to make the pattern transfer characteristics from the plate roll to the substrate P good, it is necessary to transport the substrate P at a certain speed.

As described above, in the processing device U1 and the processing device U2, the substrate transfer speed (process speed) which is likely to be desired depending on the device performance is largely different. Therefore, in this case, the processing device U1 is set as the processing unit UA in FIG. 1, and the processing device U2 is doubled as in the processing units UB1 to UB3 in FIG. 1, so that high efficiency and high yield can be constructed. production line.

Here, in the case of the processing system (production line) of the previous FIG. 1, compared with the conventional single-line processing, how much work time is expected to be improved, according to the model example shown in FIG. 7, referring to the timing chart of FIG. Be explained.

Figure 7 (a) shows the processing unit that causes each of the three steps A, B, and C to be processed. A model example of a case where each of UA, UB, and UC is single-line processing. Here, the substrate P having a total length of 1200 m is wound around the supply roller RRA. Further, the performance of the devices of the respective processing units UA to UC assumes the following processing capabilities. That is, the processing unit UA has the ability to transport and process the substrate P at a maximum of 15 cm/s, the processing unit UB has the ability to transport and process the substrate P at a maximum of 5 cm/s, and the processing unit UC has a substrate transported at a maximum of 15 cm/s. P and the ability to process.

In the case of the above-described single-line, the transport speed of the substrate P of the entire production line is the same as the speed of the slowest processing unit UB of 5 cm/s, so the production operation time (the time for applying the steps A, B, and C to the substrate of 1200 m) Become 400 points (6 hours and 40 minutes).

On the other hand, Fig. 7(b) shows a model example of a production line which is doubled as in the previous Fig. 1. The performance of each processing unit UA, UB (UB1 to UB3), UC is the same as that described in Fig. 7(a). Similarly to the above-described FIG. 1, the processing unit UB of the processing step B is doubled, three processing units UB1 to UB3 are provided, and the cutting processing time of the cutting unit CU10 including the processing unit UA is performed with the selection input mechanism ST1. The preparation time of the sub-roller replacement time or the like is 3 minutes, and the preparation time including the joining processing time of the joining mechanism PU10 before the processing unit UC and the sub-roller changing time by the selective input mechanism ST2 is set to 3 minutes.

Further, as shown in Fig. 7(b), since the processing unit UB having a slow processing speed is doubled, the processing units UA, UC are set to transport the substrate P at a maximum speed of 15 cm/s guaranteed by the respective performances.

The timing chart of Fig. 8 estimates the operation time of the model example of Fig. 7(b), and the production lines S1, S2, and S3 are assumed to correspond to each of the three processing units UB1 to UB3, and the respective processing times are displayed. At the beginning of the process, the substrate P from the supply roller RRA is processed by the processing unit UA, but The substrate P is divided into 1/3 of a total length of 1200 m in the cutting mechanism CU10. Therefore, the first 400 m of the substrate put into the processing unit UA is processed at about 44.4 minutes as indicated by the production line S1, and then sent to the processing unit UB1 after the cutting mechanism CU10 has passed the preparation time of 3 minutes.

The processing unit UB1 processes the substrate P of 400 m for a working time of 133.3 minutes. After that, after about three minutes as a predetermined preparation time (mounting of the sub-roller, etc.), the first 400 m substrate is put into the processing unit UC, and the processing is performed at a conveying speed of 15 cm/s. The working time of the 400 m substrate of the processing unit UC was 44.4 minutes.

During this period, as indicated by the production line S2, the processing unit UA continues the processing of the second 400 m substrate of about 44.4 minutes, and then, as shown by the production line S3, the third 400 m which is about 44.4 minutes at a conveying speed of 15 cm/s. The processing of the substrate. The second 400 m substrate is transported to the processing unit UB2 after the preparation time of the cutting mechanism CU10 for 3 minutes, where the processing is about 133.3 minutes.

In the processing unit UC, the processing of the first 400 m substrate is completed after 228.1 minutes from the start point. However, before this, the processing of the second 400m substrate is completed in the processing unit UB2, and the second 400m substrate is bonded to the first 400m through the bonding mechanism PU10 and the selection input mechanism ST2 after about 3 minutes of preparation time. The terminal portion of the substrate.

Thereafter, the processing unit UC continuously processed the second 400 m substrate bonded to the first 400 m substrate at a transport speed of 15 cm/s.

Similarly, as shown in the production line S3, the third (last) 400 m substrate cut by the cutting mechanism CU10 is processed into the processing unit UB3, and then wound into the sub-process after 133.3 minutes. Roller RRB32. The third 400 m substrate is processed in the processing unit UB3 before the processing of the second 400 m substrate in the processing unit UC is completed.

While the second 400 m substrate of the processing unit UC is being processed, the third 400 m substrate transmission bonding mechanism PU10 and the selective input mechanism ST2 are bonded to the terminal portion of the second 400 m substrate after about three minutes of preparation time. Thereafter, the processing unit UC continuously processed the third 400 m substrate bonded to the second 400 m substrate at a transport speed of 15 cm/s.

As described above, by repeating the unit of the processing step B, the processing of the substrate P of 1200 m is completed at 317 minutes (5 hours and 17 minutes). Compared with the model example of the single-line processing shown in Fig. 7(a), the working time is increased by about 20% (the production time is shortened).

In the model example shown in Fig. 7 (b), the total length of the substrate P wound up to the supply roller RRA as the pro-roller is 1200 m, but even if it is a longer length, the cutting mechanism CU10 is performed every 400 m. By dividing the substrate, the substrate placed on the production line can be continuously conveyed continuously to the final processing step C.

Further, in the model example shown in FIG. 7(b), although the three processing units UB1 to UB3 are operated together at the same processing speed (5 cm/s), the transfer speed of the substrates of the respective units UB1 to UB3 is adjustable in the adjustable range. Minor is also different.

The preferred embodiments of the present invention have been described above with reference to the drawings, but the present invention is not limited thereto. The shapes, combinations, and the like of the respective constituent members shown in the above examples are merely examples, and various modifications can be made according to design requirements and the like without departing from the gist of the invention.

For example, in the above-described embodiment, the configuration of the three processing units UB1 to UB3 is provided. However, it is also possible to provide two or four or more units depending on the ratio of the processing speeds.

Further, in the above embodiment, one of the steps of the production line composed of a single wire is doubled. However, even the original production line (production of the same product, type) from the initial step to In the case where the final step is doubled, the configuration of the above embodiment may be applied.

For example, in the case where the production line of the single-line processing of Fig. 7(a) is juxtaposed, the cutting mechanism CU10 (CU101, CU102) is set after each of the two processing units UA (UA1, UA2), and the second two are low. The processing unit UB of the work time adds three units as the five units UB1 to UB5 and doubles, and then sets two joint mechanisms PU10 (PU101, PU102), and then sets two processing units UC (UC1, UC2). Also.

In the above configuration, the substrate having a unit length (for example, 400 m) cut by any one of the cutting mechanisms CU101 and CU102 is transported to any one of the five processing units UB1 to UB5, thereby constituting the selective input mechanism ST2. The selective input mechanism ST2 is configured such that each of the bonding mechanisms PU101 and PU102 receives a substrate having a unit length (for example, 400 m) passing through any one of the five processing units UB1 to UB5.

Further, in the processing of the first processing units UA1, UA2, in order to cause the processing unit UA to process the substrate from the supply roller RRA by the processing unit UA by a unit length (for example, 400 m), the processing from the substrate of the supply roller RRA is started, and the time difference is intentionally given. Preferably.

In this way, it is possible to avoid the roller replacement operation (producing a temporary interruption of production) of the pro-roller (RRA) at the same time in each of the two processing units UA1, UA2, and to operate the processing units efficiently.

(Second embodiment)

Hereinafter, embodiments of the substrate processing apparatus and the substrate processing method of the present invention will be described with reference to Figs. 9 to 25 . In the present embodiment, the same components as those in the above-described embodiments are denoted by the same reference numerals, and the description thereof will be simplified or omitted.

FIG. 9 is a view showing a configuration of a part of a component manufacturing system (flexible display production line) SYS of the substrate processing apparatus of the embodiment. Here, the component manufacturing system SYS is provided with the first mounting portion RS1 on which the supply roller (first roller) RR1 is attached, the second mounting portion RS2 (holding portion) on which the supply roller (second roller) RR2 is attached, and the mounting. The third mounting portion RS3 of the collecting roller (third roller) RR3, and the fourth mounting portion RS4 to which the collecting roller (fourth roller) RR4 is attached, the flexible substrate P drawn from one of the supply rollers RR1 and RR2 (sheet, The film or the like passes through the first splicer portion (substrate connection replacement mechanism) CSa, the first buffer mechanism BF1, the n processing devices U1, U2, U3, U4, U5, ... Un, and the second buffer mechanism BF2. The 2 splicer portion (second substrate splicing replacement mechanism) CSb is wound around one of the recovery rollers RR3 and RR4.

In the present embodiment, the substrate into which the first and second buffer mechanisms BF1, BF2 and the processing devices U1 to Un are processed as the processing substrate is appropriately referred to as a substrate P. The substrate taken out from the supply rolls RR1, RR2 before being input is appropriately referred to as a substrate P1, P2. After the processing apparatus U1...Un is processed, the recovery rolls RR3 and the substrates recovered by RR4 are appropriately referred to as substrates P3 and P4.

The upper control unit CONT (control unit, second control unit) collectively controls the processing units U1 to Un and the first and second adapter units CSa and CSb and the first and second buffer units BF1 and BF2 that constitute the production line. Further, the upper control device CONT controls the rotational driving of the motor shaft MT1 attached to the supply roller RR1 in the first mounting portion RS1 and the rotational driving of the motor shaft MT2 attached to the supply roller RR2 in the second mounting portion RS2. Further, the higher-level control device CONT includes an interlocking control unit that interlocks the cutting operation of the substrate P1 (first substrate) with the storage amount of the substrate P1 of the first buffer mechanism BF1 (buffer mechanism). Further, the upper control device CONT includes cutting off the substrate P (processing substrate) The interlocking control unit is operated in conjunction with the storage amount of the substrate P of the second buffer mechanism BF2.

Further, as shown in FIG. 10, a supply sensor S1 that detects the supply state of the substrate P1 on the supply roller RR1 is provided in the vicinity of the first mounting portion RS1. The supply sensor S1 outputs an end signal to the upper control unit CONT when it detects that the supply of the substrate P1 is completed. Similarly, a supply sensor S2 that detects the supply state of the substrate P2 on the supply roller RR2 is provided in the vicinity of the second mounting portion RS2. The supply sensor S2 outputs an end signal to the upper control unit CONT when it detects that the supply of the substrate P2 is completed.

In FIG. 9, the orthogonal coordinate system XYZ is set such that the surface (or the back surface) of the substrate P is perpendicular to the XZ plane, and the width direction orthogonal to the transport direction (long strip direction) of the substrate P is set to the Y-axis direction. In addition, the substrate P may be modified in advance by a predetermined pre-treatment, or a fine partition structure (concave-convex structure) for precise patterning may be formed on the surface.

FIG. 10 is a view showing a schematic configuration of the first splicer portion CSa and the first damper mechanism BF1.

The first splicer portion CSa takes the substrate that is taken out from one of the supply rollers RR1 and RR2 and is sent out to the first buffer mechanism BF1, and is replaced by a substrate that is taken out from the other of the supply rollers RR1 and RR2, and has a nip drive NR1. The joint units CU1 and CU2 are cut off. In addition, the first tape connector portion CSa (substrate connection replacement mechanism) is provided with a substrate P1 (first substrate) joined to the front end portion of the substrate P2 (second substrate) supplied from the supply roller RR2 (second roller) After the terminal portion is positioned, the substrate P1 (first substrate) is cut, and the control unit for the cutting operation and the joining operation is controlled.

Holding the drive reel NR1, under the control of the upper control device CONT, holding the substrate P1 or the substrate P2 and transporting it to the first buffer mechanism BF1 or stopping the transport of the substrate P, in Z The axial direction is disposed at a substantially intermediate position between the first mounting portion RS1 and the second mounting portion RS2.

The cutting joining unit CU1 and CU2 are arranged symmetrically in the Z-axis direction around the virtual joint surface VF1 which is parallel to the XY plane passing through the position of the Z-axis direction of the nip drive spool NR1. The cutting and joining unit CU1 is provided with a suction pad 1A, a cutter 2A, and a tension reel 3A at a position facing the virtual joint surface VF1. Further, the cutting and joining unit CU1 is rotated by a mechanism (not shown), and the joint position of the cutting joining unit CU2 and the suction pad 1A shown by the solid line in FIG. 10 is shown by the two-dot chain line in FIG. The suction pad 1A is rotationally moved (oscillated) between the attachment positions of the first mounting portion RS1 and the first mounting portion RS1. Further, the cutting unit CU1 is moved in a direction away from/close to the virtual joint surface VF1 (that is, the cut joint unit CU2) by a moving mechanism (not shown) at the joint position. The suction pad 1A is disposed on the downstream side (+X-axis side) of the substrate P (substrate P1) in the transport direction of the cutter 2A when the cutting and joining unit CU1 is at the joint position.

Similarly, the cutting and joining unit CU2 is provided with the suction pad 1B, the cutter 2B, and the tension reel 3B at a position facing the virtual joint surface VF1. Further, the cutting and joining unit CU2 is rotated by a rotation mechanism (not shown), and the joint position of the cutting joining unit CU1 and the suction pad 1B shown by the solid line in FIG. 10 is as shown by the two-dot chain line in FIG. The adsorption pad 1B is rotationally moved (oscillated) between the positions where the first mounting portion RS2 is opposed to the attachment position. Further, the cutting unit CU2 is moved in a direction away from/close to the virtual joint surface VF1 (that is, the cut joint unit CU1) by a moving mechanism (not shown) at the joint position. When the cutting and joining unit CU2 is at the joining position, the suction pad 1B is disposed on the downstream side (+X-axis side) of the substrate P (substrate P2) in the transport direction.

The movement of the cut-off joining units CU1, CU2 is controlled by the upper control unit CONT.

The first buffer mechanism BF1 is disposed between the processing device (processing mechanism) U1 and the first splicer portion CSa, and the substrate P transported from the first splicer portion CSa is temporarily stored in the predetermined longest storage range, and then processed to the processing device. U1 is sent out, and has a tension reel mechanism DR1 and a grip drive reel NR2.

The chucking drive reel NR2 holds the substrate P stored in the first buffer mechanism BF1 and transports it to the processing apparatus U1, and is disposed substantially the same as the nip drive reel NR1 on the downstream side in the transport direction of the substrate P by the tension reel mechanism DR1. Z-axis position.

The tension reel mechanism DR1, the plurality of upper reels RJ1 with the lifting range relatively located above and the lifting range relatively lower than the lower portion of the reel RK1 are alternately arranged in the X direction, and each of the reels RJ1, RK1 can independently go to the Z Move in the direction of the axis. The upper dead center position JU1 and the lower dead center position JD1 of the upper reel RJ1 are set at positions above the upper dead center position JU2 and the lower dead center position JD2 of the lower reel RK1. The action of the tension reel mechanisms DR1 is also controlled by the upper control unit CONT.

FIG. 11 is a view showing a schematic configuration of the second belt unit CSb and the second buffer unit BF2.

The second buffer mechanism BF2 is disposed between the processing device (processing means) Un and the second splicer portion CSb, and the substrate P transported from the processing device Un is temporarily stored in the predetermined longest storage range and then moved to the second splicer portion. The CSb is delivered with a clamping drive reel NR3 and a tension reel mechanism DR2.

The tension reel mechanism DR2, the plurality of upper reels RJ2 with the lifting range relatively located above and the lifting range are located opposite to the lower portion of the reel RK2 are arranged in the X-axis direction, and the reels RJ2, RK2 can be independently Move in the Z axis direction. Above the reel RJ2 The dead point position JU3 and the bottom dead center position JD3 are set at positions above the dead center position JU4 and the bottom dead center position JD4 of the lower stage winding RK2. The action of the tension reel mechanisms DR2 is also controlled by the upper control unit CONT.

The second splicer portion CSb is transported from the second buffer mechanism BF2 and the substrate P recovered by one of the recovery rollers RR3 and RR4 is replaced by the other of the recovery rollers RR3 and RR4, and the nip drive roller NR4 is provided. The joining units CU3, CU4 are cut.

Under the control of the upper control unit CONT, the substrate P transported from the second buffer mechanism BF2 is transported to or from the cut-and-join unit CU3, CU4, and the substrate P is transported, and the position in the Z-axis direction is placed. The position of the virtual joint surface VF2 which is substantially at the intermediate position between the third mounting portion RS3 and the fourth mounting portion RS4 and parallel to the XY plane.

The joining unit CU3 is cut, and CU4 is symmetrically arranged in the Z-axis direction around the virtual joint surface VF2. The cutting and joining unit CU3 is provided with a suction pad 1C, a cutter 2C, and a tension reel 3C at a position facing the virtual joint surface VF2. Moreover, the cutting joining unit CU3 is shown by the rotation mechanism (not shown), and the joining position of the cutting joining unit CU4 and the suction pad 1C shown by the solid line in FIG. 11 is the same as the two-dot chain line in FIG. The suction pad 1C is rotationally moved (oscillated) between the positions where the third mounting portion RS3 is opposed to the attachment position. Further, the cutting unit CU3 is moved in a direction away from/close to the virtual joint surface VF2 (that is, the cut joint unit CU4) by a moving mechanism (not shown) at the joint position.

The suction pad 1C is disposed on the upstream side (the −X-axis side) of the substrate 2 in the transport direction of the substrate P when the cutting and joining unit CU3 is at the joint position.

Similarly, the position of the splicing unit CU4 facing the imaginary joint surface VF2 is cut. The adsorption pad 1D, the cutter 2D, and the tension reel 3D are provided. Moreover, the cutting joining unit CU4 is shown by the rotation mechanism (not shown), and the joining position of the cutting joining unit CU3 and the adsorption pad 1D shown by the solid line in FIG. 11 is the same as the two-dot chain line in FIG. The adsorption pad 1D is rotationally moved (oscillated) between the attachment positions of the fourth mounting portion RS4 and the attachment position. Further, the cutting unit CU4 is moved in a direction away from/close to the virtual joint surface VF2 (that is, the cut joint unit CU3) by a moving mechanism (not shown) at the joint position. The suction pad 1D is disposed on the upstream side (the −X-axis side) of the substrate 2D in the transport direction of the substrate P when the cutting and joining unit CU4 is at the joint position.

The movement of the cut-off joining units CU3, CU4 is controlled by the upper control unit CONT.

As shown in FIG. 11, the recovery drum RR3 is attached to the motor shaft MT3 in the third attachment portion RS3. The retracting spool RR4 is attached to the motor shaft MT4 in the fourth mounting portion RS4. The rotary drive of the motor shaft MT3 and the rotational drive of the motor shaft MT4 are controlled by the upper control unit CONT.

Moreover, as shown in FIG. 11, the winding sensor S3 which detects the winding state of the board|substrate P3 of the collection roll RR3 is provided in the vicinity of the 3rd mounting part RS3. The winding sensor S3 outputs an end signal to the upper control unit CONT when it is detected that the winding of the substrate P3 is completed. Similarly, a winding sensor S4 that detects the winding state of the substrate P4 of the recovery reel RR4 is provided in the vicinity of the fourth mounting portion RS4. The winding sensor S4 outputs an end signal to the upper control unit CONT when it is detected that the winding of the substrate P4 is completed.

The recovery reel RR3 and the RR4 include a lead-in introduction substrate (third substrate) PK in which the front end portion is connected to the roll core and the end portion is joined to the substrate P3 or the substrate P4 (in FIG. 11, only the substrate PK of the recovery reel RR4 is illustrated) . The substrate PK may be made of the same material as the substrate P subjected to the processing of the processing apparatuses U1 to Un, and may have substantially the same thickness and different materials as the substrate P.

The processing apparatus U5 of the present embodiment heats the substrate P transferred from the processing apparatus U4, adjusts the moisture content of the substrate P wetted by the wet process to a predetermined value, or crystallizes the applied semiconductor material or contains metal nanoparticles. A heat drying device for heat tempering (200 ° C or lower) for solvent removal of particles of ink, but detailed description thereof will be omitted. Thereafter, the substrate P that has passed through several processing apparatuses and passed through the processing apparatus Un of the last series of processes is temporarily stored in the second buffer mechanism BF2, and is appropriately replaced by the second adapter unit CSb, and wound up to the recovery roller RR3. Or recycle roller RR4.

Next, the operation of the first splicer portion CSa and the first damper mechanism BF1 in the process of the substrate P of the component manufacturing system SYS having the above configuration will be described with reference to Figs. 12 to 19 . In addition, the operations of various processing devices and components constituting the component manufacturing system SYS are controlled by the higher-level control device CONT, but in the following description, the description of the control of the higher-level control device CONT is omitted.

12, the substrate P1 drawn from the supply roller RR1 passes through the reel 3A of the cutting and joining unit CU1 and the nip drive reel NR1 as the first substrate, and is transported to the first buffer mechanism BF1, and temporarily stored in the first buffer mechanism BF1. Figure. As shown in FIG. 12, in the first buffer mechanism BF1, the upper reel RJ1 is located at the top dead center position JU1, and the lower reel RK1 is located at the bottom dead center position JD2, whereby the substrate P is stored in the first buffer mechanism BF1 to be near the longest length. .

In the second mounting portion RS2, after the supply roller RR2 of the substrate P2 that has been wound up after the substrate P1 of the supply roller RR1 is used up is mounted on the motor shaft MT2, the cutting engagement unit CU2 is rotated to move the adsorption pad 1B. To the placement location. The front end portion of the substrate P2 is adsorbed (connected or connected) to the adsorption pad 1B at the placement position, and then attached to the surface opposite to the adsorption side. T with both sides.

The attachment of the substrate P2 to the adsorption pad 1B and the double-sided tape is performed by an operator or by using a robot or the like.

After the adsorption and fixation of the adsorption pad 1B with the substrate P2 on both sides of the T is attached, as shown in FIG. 13, the cutting and joining unit CU2 is rotated to move the substrate P2 to the engaged position, and the rotation is performed by the motor shaft MT2. The supply roller RR2 is rotated in a direction opposite to the supply direction of the substrate P2 (counterclockwise in FIG. 13), thereby imparting a predetermined tension to the substrate P2.

On the other hand, after the supply sensor S1 detects the supply of the substrate P1 from the supply roller RR1, the driving of the chucking drive spool NR1 is stopped, and the motor shaft MT1 is rotationally driven in the opposite direction to the conveying direction of the substrate P1. This imparts a weak tension to the substrate P1 between the chuck driving reel NR1 and the supply roller RR1.

After the driving of the grip driving reel NR1 is stopped, the grip driving reel NR2 is also continuously driven. Therefore, the tension reel mechanism DR1 is actuated to appropriately lower the upper reel RJ1 and the lower reel RK1 in accordance with the driving of the nip drive reel NR2. Thereby, the substrate P stored in the first buffer mechanism BF1 is continuously transported to the processing device U1 at a constant speed by the chucking drive reel NR2.

Next, as shown in FIG. 14, the cutting joining units CU1 and CU2 are moved in the approaching direction, and the substrates P1 and P2 are pressure-bonded between the adsorption pads 1A and 1B for a predetermined period of time with the two-side tape T interposed therebetween. Thereby, the substrate P2 is cut in the subsequent step, and is bonded to the substrate P1 through the both surface tapes T at the position of the end portion of the substrate P1.

Further, during the bonding process of the substrates P1, P2, the driving drive reel is held. The NR 2 and the tension reel mechanism DR1 are also continuously driven, and the substrate P stored in the first buffer mechanism BF1 is continuously conveyed to the processing device U1 at a constant speed by the nip drive reel NR2.

After the substrate P1 is bonded to the substrate P2, the adsorption pad 1B of the cutting and joining unit CU2 is opened to the atmosphere, and then, as shown in FIG. 15, the cutting and joining unit CU2 is moved away from the cutting and joining unit CU1 (+Z axis). Direction) move. Thereby, the front end portion of the substrate P2 drawn from the supply roller RR2 is adsorbed and held by the adsorption pad 1A of the cutting and joining unit CU1 while being joined (connected or connected) to the substrate P1 by the double-sided tape T.

Thereafter, in a state where tension is applied to the substrate P1 between the cutting and joining unit CU1 and the supply roller RR1, the opposing substrate P1 is cut by the cutter 2A that cuts the joining unit CU1. As the cutter 2A, for example, a configuration in which the blade edge is slid in the width direction (Y-axis direction) of the substrate P1 to cut the substrate P1 can be employed.

While the cutting process of the substrate P1 is being performed, the pinch drive reel NR2 and the tension reel mechanism DR1 are continuously driven, and the substrate P stored in the first buffer mechanism BF1 is held by the chuck NR2 to the processing device U1. Continuous delivery at a certain speed.

After the substrate P1 is cut, the adsorption pad 1A of the cutting and joining unit CU1 is opened to the atmosphere, and then, as shown in FIG. 16, the cutting and joining unit CU1 is moved away from the cutting and joining unit CU2 (imaginary joint surface VF1). (-Z axis direction) moves. Thereby, the substrate P1 drawn from the supply roller RR1 is wound around the supply roller RR1 by rotation in a direction opposite to the conveying direction of the supply roller RR1.

Further, regarding the supply roller RR2, the substrate P2 is on the rotating roller RR2 and the nip driving reel NR1 (and the reel 3B) by the rotational moment in the opposite direction to the conveying direction of the supply roller RR2. Tension is given between. Thereby, the substrate connected to the substrate P stored in the first buffer mechanism BF1 is switched to the substrate P2 which is the second substrate taken out from the supply roller RR2. The substrate P2 as the second substrate may have the same specifications as the substrate P1 (first substrate).

Thereafter, the grip driving reel NR1 is rotated at a slightly faster speed than the grip driving reel NR2, and the tension reel mechanism DR1, as shown in Fig. 17, corresponds to the driving of the grip driving reel NR1, and the upper portion is appropriately performed. The rise of the reel RJ1 and the lower roll RK1. Further, the motor shaft MT2 is rotationally driven in the transport direction, and the substrate P2 drawn from the supply roller RR2 is fed, and the storage length of the substrate P of the first buffer mechanism BF1 is increased.

Then, after the storage length of the substrate P of the first buffer mechanism BF1 is substantially maximized, the drive reel NR1 is held at the same speed as the nip drive reel NR2, thereby storing on the substrate P of the first buffer mechanism BF1. The length is balanced. Further, the supply roller RR1, which is substantially used up by the substrate P1, is removed (removable) from the first mounting portion RS1, and as shown in Fig. 18, the other supply roller RR5 around which the substrate P5 is wound is mounted.

After the supply roller RR5 is mounted, according to the detection result of the supply sensor S2, before the substrate P2 of the supply roller RR2 is used up, as shown in FIG. 18, the cutting engagement unit CU1 is rotated to move the adsorption pad 1A to the attachment. position. The front end portion of the substrate P5 is suction-fixed (connected or connected) to the adsorption pad 1A at the placement position, and then the double-sided tape T is attached to the surface opposite to the adsorption side.

Thereafter, the supply roller RR5 is rotated in the opposite direction to the supply direction of the substrate P5 (counterclockwise in FIG. 18) by the rotational driving of the motor shaft MT1, thereby imparting a predetermined tension to the substrate P5 while simultaneously rotating the cut-and-join unit CU1. Move, as shown in Figure 19, to the engaged position.

Next, the supply sensor S2 detects the supply of the substrate P2 at the supply roller RR2. After the completion, the driving of the grip driving reel NR1 is stopped, and the cutting and joining units CU1 and CU2 are moved in the approaching direction in the same manner as the above-described steps, and in the state in which the double-sided tape T is interposed, in the adsorption pad 1A, 1B. The substrates P2 and P5 are pressure-bonded for a predetermined period of time, and the substrate P2 is cut by the cutter 2B that cuts the joint unit CU2. Thereby, the substrate connected to the substrate P stored in the first buffer mechanism BF1 is switched to the substrate P5 drawn from the supply roller RR5.

As described above, the substrate P sequentially switched, the coating process of the photosensitive functional liquid applied to the processing apparatus U1, the heat treatment of the processing apparatus U2, the pattern exposure processing of the processing apparatus U3, the wet processing of the processing apparatus U4, and the processing apparatus After the heat drying treatment of U5, it is sequentially sent to the second buffer mechanism BF2 and the second belt receiver portion CSb, and is collected in the recovery roller RR3 or the recovery roller RR4.

Next, the operation of the second accommodator portion CSb and the second damper mechanism BF2 on the recovery roller side in the process of the substrate P of the component manufacturing system SYS having the above configuration will be described with reference to Figs. 20 to 25 .

20, the substrate P, which is a processing substrate, is transported to the second buffer mechanism BF2 through the pinch drive reel NR3, and is stored, and the substrate P that is transported (discharged) from the second buffer mechanism BF2 through the pinch drive reel NR4 passes through the cutting and joining unit. The reel 3C of the CU3 is recovered to the recovery roller RR3 attached to the third mounting portion RS3. Further, as shown in Fig. 20, in the second buffer mechanism BF2, the upper reel RJ2 is located at the bottom dead center position JD3, and the lower reel RK2 is located at the top dead center position JU4, whereby the substrate P is stored in the second shortest length. Buffer mechanism BF2.

After the winding of the recovery roller RR3 is completed in the fourth mounting portion RS4, the recovery roller RR4 for collecting the substrate P is attached to the motor shaft MT4, and then the cutting engagement unit CU4 is rotated to move the adsorption pad 1D to the attachment. position. Connecting the front end portion to the introduction substrate of the recovery roller RR4 The end portion of PK (hereinafter, simply referred to as substrate PK) is suction-fixed (connected or connected) to the adsorption pad 1D at the placement position, and then the double-sided tape T is attached to the surface opposite to the adsorption side. After the double-sided tape T is attached to the substrate PK, the cut-and-join unit CU4 is rotated to move to the joint position, and the recovery roller RR4 is returned to the substrate PK (substrate P) by the rotational driving of the motor shaft MT4 (Fig. Rotating clockwise in 20), thereby imparting a predetermined tension to the substrate PK.

Next, after the winding sensor S3 detects the recovery of the substrate P of the recovery roller RR3, the driving of the nip drive roller NR4 is stopped, and the tension reel mechanism DR2 is actuated to appropriately raise the upper and lower reels RJ2. The drop of the reel RK2. Thereby, the storage length of the second buffer mechanism BF2 is increased by a certain amount (the amount of conveyance corresponding to the conveyance speed of the substrate P at the production line) by the substrate P transported by the processing unit U5 by the chucking roller NR3. Store at the same time.

On the other hand, after the recovery of the substrate P of the recovery roll RR3 is completed, as shown in FIG. 21, the cutting and joining units CU3 and CU4 are moved in the approaching direction, and in the state in which the double-sided tape T is present, in the adsorption pad 1C, The substrates P and PK are crimped for a certain time between 1D. Thereby, the end portion of the substrate PK is bonded (joined or connected) to the substrate P through the double-sided tape T at the position of the end portion before the substrate P is cut in the subsequent step.

After the substrate P is bonded to the substrate PK, the adsorption pad 1D of the cutting and joining unit CU4 is opened to the atmosphere, and then, as shown in FIG. 22, the cutting and joining unit CU4 is moved away from the cutting and joining unit CU3 (+Z axis). Direction) move. Thereby, the front end portion of the substrate PK is adsorbed and held by the adsorption pad 1C of the cutting and joining unit CU3 while being bonded to the substrate P by the double-sided tape T.

Thereafter, in a state where tension is applied to the substrate P between the cutting and joining unit CU3 and the recovery roller RR3, the opposing substrate P is cut by cutting the cutter 2C of the joining unit CU3. Broken. After the substrate P is cut, the adsorption pad 1C of the cutting and joining unit CU3 is opened to the atmosphere, and then, as shown in FIG. 23, the cutting and joining unit CU3 is moved away from the cutting and joining unit CU4 (-Z-axis direction). mobile. Thereby, the object to be recovered of the substrate P conveyed from the second buffer mechanism BF2 (that is, the substrate P processed by the processing apparatuses U1 to Un) is switched to the recovery roller RR4.

During the joining process and the cutting process of the second nipper portion CSb, the rise of the upper reel RJ2 and the lower reel RK2 in the second damper mechanism BF2 are appropriately performed, and the processing device U5 is borrowed from the processing device U5. The substrate P conveyed by the chuck driving reel NR3 is increased in a certain amount by the storage length of the second buffer mechanism BF2 and simultaneously stored.

Then, after the switching of the object to be recovered by the substrate P of the recovery roller RR4 is completed, the chucking drive reel NR4 is rotated at a slightly faster speed than the gripping drive reel NR3, at the tension reel mechanism DR2, and the gripping drive reel NR4. In response to the drive, the lower stage reel RJ2 is lowered and the lower stage reel RK2 is raised, and the substrate P stored in the second buffer mechanism BF2 is placed during the joining process and the cutting process of the second splicer portion CSb. The length is reduced to become the initial state, that is, the storage length which is substantially the smallest (refer to Fig. 24). After the length of the substrate P stored in the second buffer mechanism BF2 is substantially minimized, the pinch drive reel NR4 is rotated at the same speed as the pinch drive reel NR3.

On the other hand, in the third mounting portion RS3 after the completion of the recovery of the substrate P, the recovery roller RR3 is removed, and as shown in FIG. 24, the introduction substrate PK2 (hereinafter, simply referred to as the substrate PK2) is connected (joined or bonded). The recovery roller RR6 at the front end is attached to the motor shaft MT3, and the end portion of the substrate PK2 is suction-fixed to the adsorption pad 1C of the cutting engagement unit CU3 which is rotated at the attachment position, and then the surface opposite to the adsorption side is attached. Set two sides with T.

After the double-sided tape T is attached to the substrate PK2, the cut-and-join unit CU3 is rotated to move to the joint position, and the recovery roller RR6 is driven to the recovery direction of the substrate PK2 (substrate P) by the rotational driving of the motor shaft MT3 (FIG. 25). By rotating in the clockwise direction, the predetermined tension is applied to the substrate PK2, and the winding sensor S4 waits until the recovery of the recovery roller RR3 is completed.

As described above, in the present embodiment, while the first buffer mechanism BF1 temporarily stores the substrate P and sends it to the processing apparatus U1, the substrate P2 taken out from the new supply roller RR2 takes over the substrate P and is transported to the first buffer mechanism BF1. Therefore, the roller as the supply source can be changed without stopping the respective processes of the processing devices U1 to Un. Therefore, in the present embodiment, it is possible to avoid a situation in which the substrate P which is put into the processing apparatuses U1 to Un at the time of the change of the supply roller is wasted and the cost is increased.

In the present embodiment, the substrate P transported from the processing apparatus Un is switched while the second buffer mechanism BF2 is temporarily stored. Therefore, when the object to be collected of the substrate P is changed, it is possible to avoid a situation in which the substrate P that is put into the processing devices U1 to Un at the time of the change is wasted and the cost is increased.

Further, in the present embodiment, after the new substrate is bonded to the previously used substrate in the first tape connector portion CSa and the second tape connector portion CSb, the previous substrate is cut. Therefore, in the case where the cutting is performed first, the substrate is not separated by the tension applied, and defects such as the adhesion are prevented from occurring, and the substrate processing can be stably performed.

The preferred embodiments of the present invention have been described above with reference to the drawings, but the present invention is not limited to the above examples. The shapes, combinations, and the like of the respective constituent members shown in the above-described examples are merely examples, and various modifications can be made depending on design requirements and the like without departing from the gist of the invention.

For example, in the above embodiment, the example processing means includes a plurality of processing means U1 to Un. However, the configuration is not limited thereto, and the configuration of the substrate connection/replacement mechanism may be provided in one processing device.

Moreover, in the above embodiment, the configuration further includes a recovery roller to which the introduction substrate PK is connected. However, for example, a configuration may be adopted in which a supply roller that has been used and the substrate at the front end portion is cut is used.

Further, in the above embodiment, the two roller attachment portions are provided on the supply side and the recovery side. However, it is also possible to have three or more roller attachment portions.

In the above embodiment, before the substrate supplied from one of the two supply rollers becomes the roller end, the substrate from the other roller is automatically connected, and the processing can be continued without stopping the production line. Somewhere in the production line, defects in the pattern formed on the substrate or defects in the manufacturing apparatus can cause a large number of defective products.

Therefore, it is possible to configure the following production line (factory), that is, in the production line before the completion of the final product, the majority of the steps of the process of the long substrate are divided into several blocks, and the roll-to-roll is performed in each block. The continuous processing is carried out in a unit of a roll in which a substrate for forming a semi-finished product is wound in the next step, and is attached to a predetermined mounting portion (RS1 or RS2). In this case, the substrate transfer can be continuously performed in the step block unit, and even if a problem occurs in a certain step block (pattern defect or device defect, etc.), only the step block can be temporarily stopped, and the defective product can be reduced. Produced in large quantities.

Further, in the above-described embodiment, the supply rollers RR1 and RR2 attached to each of the two mounting portions RS1 and RS2 are wound by the same length of the sheet substrate for product manufacture. Immediately before the end of the supply of the substrate of the roller RR1 (roller end), the substrate of the other supply roller RR2 is replaced, and the substrate of the supply roller RR2 is continuously processed before it is used up. However, the supply roller attached to one of the mounting portions RS1 and RS2 may be used to continuously supply the substrate to the processing devices U1 to Un while the supply roller that is the other of the roller terminals is replaced with a new one.

In this case, for example, the supply roller which is the roller end is RR2, the roller RR2 is removed from the mounting portion RS2, the new supply roller is attached to the mounting portion RS2, and the joining of the first adapter portion CSa is completed. The preparation time before the state (state of Fig. 13) is 180 seconds, during which the length of the substrate (P1) of the processing device U1 (production line) is supplied from the other supply roller RR1, and the conveying speed of the substrate during processing is set. When it is 50 mm/sec, it becomes 9 m.

Therefore, immediately after the supply of the 9 m-thick substrate (P1) from the other supply roller RR1, the substrate (P2) from the new supply roller RR2 mounted on the mounting portion RS2 is used by the first splicer portion CSa. The front end is joined (connected or connected) to a position where the supply roller RR1 is placed only on the substrate (P1) of the processing device U1 by approximately 9 m, and the substrate (P1) is cut and replaced with the substrate (P2) from the supply roller RR2. can.

In addition, as described above, the substrate (P1) from the supply roller RR1 attached to the mounting portion RS1 is used as a temporary replacement substrate (for example, about 9 m), and the processing for the substrate (P1) is performed as each processing. The conditions of the devices U1 to Un are determined or maintained for the management process, and the components formed here are not used as the final product.

Further, in the case of temporarily replacing the substrate (for example, about 9 m), the substrate (P1) is not required to be wound around the supply roller RR1 in advance, and the leaf-shaped substrate cut into a length of, for example, 10 m is folded and stored in the substrate. Box, etc., the substrate (10m) is taken out one by one from the box and supplied to the first belt unit CSa is also available.

Further, the technical scope of the present invention is not limited to the above embodiments. For example, one or more of the elements described in the above embodiments may be omitted. Further, the elements described in the above embodiments can be combined as appropriate.

BF1‧‧‧1st buffer mechanism (1st buffer part, buffer mechanism)

BF2‧‧‧2nd buffer mechanism (2nd buffer part)

CSa‧‧1 first strap unit (substrate connection replacement mechanism)

CSb‧‧‧2nd strap unit (2nd board connection replacement mechanism)

CU10‧‧‧ cutting mechanism

DR1, DR2‧‧‧ tension reel mechanism

P‧‧‧Substrate

PU10‧‧‧ joint mechanism

RR1‧‧‧Supply Roller (1st Roll)

RR2‧‧‧Supply Roller (2nd Roller)

RRA‧‧‧ supply roller

RRB11~RRB31‧‧‧ Roll

RRB12~RRB32‧‧‧ Roll

RRC‧‧‧Recycling roller

RSA, RSC‧‧‧ Roll Mounting Department

RSB11~RSB31‧‧‧Installation Department

RSB12~RSB32‧‧‧Installation Department

ST1, ST2‧‧‧Selected input institutions

UA, UB, UB1~UB3, UC‧‧‧ processing unit

8‧‧‧ Keeping Department

Claims (12)

A substrate processing method for continuously loading a long first sheet-shaped substrate into a processing apparatus along a longitudinal direction, and performing a process for forming an electronic component on the first sheet substrate by the processing apparatus, comprising: In the bonding stage, the second sheet-like substrate is joined to the end portion of the first sheet-like substrate that is the end portion in the longitudinal direction by the bonding mechanism disposed on the loading side of the first sheet substrate of the processing device; In the processing stage, the second sheet-like substrate after being bonded to the first sheet-like substrate is subjected to a guiding process while passing through the processing device with a predetermined length from the joint portion. The substrate processing method according to claim 1, wherein the guiding process is performed for condition determination or maintenance management of the processing device. The substrate processing method according to claim 1 or 2, wherein the bonding stage includes a first sheet substrate loaded into the processing device or a buffer mechanism disposed between the bonding mechanism and the processing device The second sheet-like substrate is stored in such a manner that the length in the longitudinal direction changes within a predetermined maximum storage range. The substrate processing method according to claim 3, wherein the loading of the first sheet substrate to the buffer mechanism is temporarily stopped before the bonding step, and is disposed in the buffer mechanism together with the bonding mechanism. a step of cutting the first sheet substrate in the longitudinal direction by the cutting mechanism on the loading side The second sheet substrate is joined to the end portion of the first sheet substrate after the cutting by the bonding means. The substrate processing method according to the third aspect of the invention, wherein the bonding step includes temporarily stopping loading of the first sheet substrate with respect to the buffer mechanism, and arranging on the loading side of the buffer mechanism together with the bonding mechanism. a cutting step of cutting the first sheet-like substrate in the longitudinal direction, and joining the end portions of the second sheet-like substrate to the cutting by the cutting mechanism by the joining mechanism After the portion of the first sheet-like substrate at the end portion, the cutting step is performed. A cutting or joining device for a substrate is disposed in a production line that performs a predetermined process while transporting a long sheet-like substrate in a strip direction, and cuts the sheet substrate or joins the sheet substrate. A sheet substrate comprising: a buffer mechanism disposed in the production line, and storing the transferred sheet substrate in a lengthwise direction within a predetermined maximum storage range; and cutting or joining the mechanism At least one of the cut portion in which the sheet-like substrate is cut in the longitudinal direction and the joint portion of the sheet-form substrate in the end portion of the sheet-like substrate joined to the other sheet-like substrate is along the sheet shape. The substrate is disposed in the transport direction, and may be provided on either the loading side of the sheet substrate of the buffer mechanism and the carrying-out side of the sheet substrate of the buffer mechanism. The cutting or joining device for a substrate according to the sixth aspect of the invention, further comprising: a cutting operation in the cutting portion or a joining operation in the joint portion and storage of the sheet substrate in the buffer mechanism The linkage control unit of the quantity linkage. The cutting or joining device for a substrate according to the sixth aspect of the invention, wherein the cutting portion or the joint portion is provided in a supply roller for supplying the sheet substrate to a processing device provided in the production line, and the buffer The sheet-like substrate supplied from the supply roller between the mechanisms is carried into the processing device through the buffer mechanism after passing through the cutting portion or the joint portion. The cutting or joining device for a substrate according to the sixth aspect of the invention, wherein the cutting portion or the joint portion is provided in a recovery roller for recovering the sheet substrate after being processed by the processing device provided in the production line The sheet-like substrate that has been carried out after the treatment by the processing device is transported by the recovery roller through the cutting portion or the joint portion after passing through the buffer mechanism. A cutting or joining device for a substrate, which is disposed in a sheet-shaped substrate in which a long sheet-like substrate wound around a supply roller is carried into a processing device in a longitudinal direction, and is carried out by the processing device, and is wound around a recovery roller In the production line for recycling, the sheet substrate is cut or joined, and is characterized in that a buffer mechanism is provided between the supply roller and the processing device, and the sheet substrate carried into the processing device is elongated. The way the length changes within the established maximum storage range And a cutting and joining mechanism disposed between the supply roller and the buffer mechanism, and having a cutting portion that cuts the sheet substrate in the longitudinal direction and the sheet substrate that is loaded into the buffer mechanism The portion which is the end portion in the longitudinal direction is joined to the joint portion of the other sheet substrate. A cutting or joining device for a substrate, which is disposed in a sheet-shaped substrate in which a long sheet-like substrate wound around a supply roller is carried into a processing device in a longitudinal direction, and is carried out by the processing device, and is wound around a recovery roller In the production line for recycling, the substrate is cut or joined, and is provided with a buffer mechanism disposed between the recovery roller and the processing device, and the sheet substrate carried out from the processing device is in a long direction. The length is stored in a manner that changes within a predetermined longest storage range; and the cutting and joining mechanism is disposed between the recovery roller and the buffer mechanism, and has a cutting portion that cuts the sheet substrate in the longitudinal direction, and The portion of the sheet substrate that is carried out from the buffer mechanism that is the end portion in the longitudinal direction is joined to the joint portion of the other sheet substrate. A cutting or joining device for a substrate is disposed in a production line in which a sheet substrate having a flexible strip is conveyed to a processing apparatus in a longitudinal direction and a predetermined process is applied to the sheet substrate, and the sheet is formed The substrate is cut or joined, and is provided with a buffer mechanism provided on the carry-in side or the carry-out side of the sheet substrate of the processing device. The sheet-like substrate is stored in such a manner that the length in the longitudinal direction changes within a predetermined maximum storage range; and the cutting and joining mechanism is provided on the loading side or the carrying-out side of the sheet substrate of the buffer mechanism, and has the sheet for a cutting portion that is cut in the longitudinal direction, and a joint portion that joins an end portion of the other sheet-like substrate at a portion of the sheet substrate that is in the longitudinal direction after the cutting; The cutting and joining mechanism is controlled such that the end portion of the other sheet-like substrate is bonded to the end portion of the other sheet-like substrate after the cutting, and the sheet-like substrate is cut.