TW201618374A - Antenna apparatus and wireless communication system using the same - Google Patents
Antenna apparatus and wireless communication system using the same Download PDFInfo
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Abstract
Description
本發明提出一種天線裝置,特別是一種利用3D印刷電路板整合之天線裝置及無線通訊系統。 The invention provides an antenna device, in particular to an antenna device and a wireless communication system integrated by a 3D printed circuit board.
隨著網路的普及,人們對於網路的依賴程度日益提高,也發展出越來越多行動上網裝置。先前消費者主要透過個人電腦(PC)、筆記型電腦或手機上網,演變至今,蘋果(Apple)的iPhone、iPad,與電子書(E-reader)、智慧型手機等行動上網裝置在市場各領風騷時,其背後消費者十分在意且進一步對於網路資訊的取得和網路人際間互動的方便性有所需求。 With the popularity of the Internet, people are increasingly dependent on the Internet, and more and more mobile Internet devices have been developed. Previously, consumers have mainly accessed the Internet through personal computers (PCs), notebook computers or mobile phones. Apple's iPhone, iPad, E-reader, smart phones and other mobile Internet devices are in the market. At the time of the coquettish, consumers behind it are very concerned about and further need for the accessibility of online information and the convenience of interpersonal interaction on the Internet.
因此,以穿戴式裝置之無線通訊系統的市場逐漸興起,已成為科技產業另一個矚目的新焦點。業者開始競相推出智慧手錶、運動手環、智慧眼鏡、以及個人健康偵測器等各類裝置,以帶動消費者的需求。然而,萌芽中的穿戴式應用,仍需克服諸多技術上的挑戰,才能真正地擴大市場接受度,並為產業帶來新的發展契機。 Therefore, the market for wireless communication systems with wearable devices has gradually emerged, and has become another new focus of the technology industry. The industry has begun to compete to launch smart watches, sports bracelets, smart glasses, and personal health detectors to drive consumer demand. However, the budding wearable application still needs to overcome many technical challenges to truly expand market acceptance and bring new development opportunities to the industry.
相比於電腦、平板、手機,目前穿戴式裝置更多的是形態上的變化,無論是產品實用性,還是抗衝擊、輕便柔軟舒適和互動方面,穿戴式裝置還有很長的路要走。 Compared with computers, tablets, and mobile phones, wearable devices are more morphological changes. Whether it is product practicality, impact resistance, lightness, softness, comfort and interaction, wearable devices still have a long way to go. .
本發明實施例提供一種天線裝置,包括天線模組與射頻模組。天線模組包括基板、第一金屬層、第一單極天線、第二金屬層以及第二單極天線。基板具有上表面與下表面。射頻模組耦接於天線模組之第一金屬層與第二金屬層。第一金屬層設置於基板之上表面,第一單極天線設置於基板之上表面。第二金屬層對應第一單極天線之位置設置於基板之下表面,第二單極天線設置於基板之下表面。第一單極天線具有第一饋入點連接至第一金屬層,第二單極天線具有第二饋入點連接至第二金屬層。射頻模組用以透過天線模組傳輸射頻訊號,其中射頻模組以3D印刷電路板組成。第一單極天線之第一饋入點與第二單極天線之第二饋入點的信號饋入方向互相垂直。 Embodiments of the present invention provide an antenna device including an antenna module and a radio frequency module. The antenna module includes a substrate, a first metal layer, a first monopole antenna, a second metal layer, and a second monopole antenna. The substrate has an upper surface and a lower surface. The RF module is coupled to the first metal layer and the second metal layer of the antenna module. The first metal layer is disposed on the upper surface of the substrate, and the first monopole antenna is disposed on the upper surface of the substrate. The second metal layer is disposed on the lower surface of the substrate corresponding to the position of the first monopole antenna, and the second monopole antenna is disposed on the lower surface of the substrate. The first monopole antenna has a first feed point connected to the first metal layer and the second monopole antenna has a second feed point connected to the second metal layer. The RF module is used to transmit RF signals through the antenna module, wherein the RF module is composed of a 3D printed circuit board. The signal feeding direction of the first feeding point of the first monopole antenna and the second feeding point of the second monopole antenna is perpendicular to each other.
本發明實施例提供一種無線通訊系統,包括天線裝置以及負載。天線裝置包括天線模組與射頻模組。天線模組包括基板、第一金屬層、第一單極天線、第二金屬層以及第二單極天線。基板具有上表面與下表面。射頻模組耦接於天線模組之第一金屬層與第二金屬層。負載耦接於天線裝置。第一金屬層設置於基板之上表面,第一單極天線設置於基板之上表面。第二金屬層對應第一單極天線之位置設置於基板之下表面,第二單極天線設置於基板之下表面。第一單極天線具有第一饋入點連接至第一金屬層,第二單極天線具有第二饋入點連接至第二金屬層。射頻模組用以透過天線模組傳輸射頻訊號,其中射頻模組以3D印刷電路板組成。負載透過射頻訊號與外部裝置進行通訊。在天線模組中,第一單極天線之第一饋入點與第二單極天線之第二饋入點的信號饋入方向互相垂直。 Embodiments of the present invention provide a wireless communication system including an antenna device and a load. The antenna device includes an antenna module and an RF module. The antenna module includes a substrate, a first metal layer, a first monopole antenna, a second metal layer, and a second monopole antenna. The substrate has an upper surface and a lower surface. The RF module is coupled to the first metal layer and the second metal layer of the antenna module. The load is coupled to the antenna device. The first metal layer is disposed on the upper surface of the substrate, and the first monopole antenna is disposed on the upper surface of the substrate. The second metal layer is disposed on the lower surface of the substrate corresponding to the position of the first monopole antenna, and the second monopole antenna is disposed on the lower surface of the substrate. The first monopole antenna has a first feed point connected to the first metal layer and the second monopole antenna has a second feed point connected to the second metal layer. The RF module is used to transmit RF signals through the antenna module, wherein the RF module is composed of a 3D printed circuit board. The load communicates with an external device through an RF signal. In the antenna module, the signal feeding directions of the first feeding point of the first monopole antenna and the second feeding point of the second monopole antenna are perpendicular to each other.
綜上所述,本發明實施例提出之天線裝置以及無線通訊系統能夠將天線模組與射頻模組透過3D印刷技術電路板的整合方式在電路上做精簡設計,以使整體天線裝置以及無線通訊系統的電路面積及空間布置有效率或高密度的整合。藉此,本發明實施例 之天線裝置能夠以鈕扣大小之形式實現,提供穿戴式無線通訊裝置更輕薄短小的需求。 In summary, the antenna device and the wireless communication system according to the embodiments of the present invention can simplify the design of the antenna module and the RF module through the 3D printing technology circuit board to make the overall antenna device and the wireless communication. The circuit area and space of the system are efficiently or densely integrated. Thereby, the embodiment of the invention The antenna device can be implemented in the form of a button size, which provides a lighter, thinner and shorter requirement for the wearable wireless communication device.
為使能更進一步瞭解本發明之特徵及技術內容,請參閱以下有關本發明之詳細說明與附圖,但是此等說明與所附圖式僅係用來說明本發明,而非對本發明的權利範圍作任何的限制。 The detailed description of the present invention and the accompanying drawings are to be understood by the claims The scope is subject to any restrictions.
1‧‧‧天線模組 1‧‧‧Antenna Module
2‧‧‧射頻模組 2‧‧‧RF Module
3‧‧‧天線裝置 3‧‧‧Antenna device
4‧‧‧鈕扣型殼體底部 4‧‧‧Button type housing bottom
5‧‧‧電池模組 5‧‧‧Battery module
11、61‧‧‧基板 11, 61‧‧‧ substrate
12、62‧‧‧單極天線 12, 62‧‧‧ monopole antenna
13、63‧‧‧金屬層 13, 63‧‧‧ metal layer
21‧‧‧射頻模組上部 21‧‧‧RF module upper part
22‧‧‧射頻模組下部 22‧‧‧The lower part of the RF module
23‧‧‧電路大地 23‧‧‧Circuit Earth
41‧‧‧鈕扣型殼體外圍 41‧‧‧ button-type housing periphery
131、631‧‧‧饋入點 131, 631‧‧‧Feeding points
132‧‧‧接地點 132‧‧‧ Grounding point
220‧‧‧凹槽 220‧‧‧ Groove
211‧‧‧接地面 211‧‧‧ ground plane
213、223‧‧‧接地點連接孔 213, 223‧‧‧ grounding point connection hole
212、222‧‧‧饋入點連接孔 212, 222‧‧‧Feed point connection hole
224‧‧‧晶片 224‧‧‧ wafer
圖1為本發明實施例之天線模組示意圖。 FIG. 1 is a schematic diagram of an antenna module according to an embodiment of the present invention.
圖2A與2B為本發明實施例之天線模組上下表面示意圖。 2A and 2B are schematic diagrams showing upper and lower surfaces of an antenna module according to an embodiment of the present invention.
圖3為本發明實施例之射頻模組示意圖。 FIG. 3 is a schematic diagram of a radio frequency module according to an embodiment of the present invention.
圖4為本發明實施例之天線裝置示意圖。 4 is a schematic diagram of an antenna device according to an embodiment of the present invention.
圖5為本發明實施例之天線裝置產生反射損耗的模擬圖。 FIG. 5 is a simulation diagram of a reflection loss generated by an antenna apparatus according to an embodiment of the present invention.
圖6為本發明實施例之天線裝置輻射效率的模擬圖。 Fig. 6 is a simulation diagram of radiation efficiency of an antenna device according to an embodiment of the present invention.
圖7A與7B為本發明另一實施例之天線模組上下表面示意圖。 7A and 7B are schematic diagrams showing upper and lower surfaces of an antenna module according to another embodiment of the present invention.
圖8為本發明另一實施例之天線裝置產生反射損耗的模擬圖。 FIG. 8 is a simulation diagram of a reflection loss generated by an antenna apparatus according to another embodiment of the present invention.
圖9為本發明另一實施例之天線裝置輻射效率的模擬圖。 Figure 9 is a simulation diagram of radiation efficiency of an antenna device according to another embodiment of the present invention.
在下文將參看隨附圖式更充分地描述各種例示性實施例,在隨附圖式中展示一些例示性實施例。然而,本發明概念可能以許多不同形式來體現,且不應解釋為限於本文中所闡述之例示性實施例。確切而言,提供此等例示性實施例使得本發明將為詳盡且完整,且將向熟習此項技術者充分傳達本發明概念的範疇。在諸圖式中,可為了清楚而誇示層及區之大小及相對大小。類似數字始終指示類似元件。 Various illustrative embodiments are described more fully hereinafter with reference to the accompanying drawings. However, the inventive concept may be embodied in many different forms and should not be construed as being limited to the illustrative embodiments set forth herein. Rather, these exemplary embodiments are provided so that this invention will be in the In the drawings, the size and relative sizes of layers and regions may be exaggerated for clarity. Similar numbers always indicate similar components.
應理解,雖然本文中可能使用術語第一、第二、第三等來描述各種元件,但此等元件不應受此等術語限制。此等術語乃用以區分一元件與另一元件。因此,下文論述之第一元件可稱為第二 元件而不偏離本發明概念之教示。如本文中所使用,術語「或」視實際情況可能包括相關聯之列出項目中之任一者或者多者之所有組合。 It will be understood that, although the terms first, second, third, etc. may be used herein to describe various elements, such elements are not limited by the terms. These terms are used to distinguish one element from another. Therefore, the first element discussed below may be referred to as the second The elements do not depart from the teachings of the inventive concept. As used herein, the term "or" may include all combinations of any one or more of the associated listed items.
請參閱圖1,圖1為本發明實施例之天線模組示意圖。天線模組1具有基板11、單極天線12以及金屬層13。基板11具有上表面以及下表面。基板11之上表面以及下表面分別具有饋入點131與接地點132。基板11之上表面以及下表面分別設置相同金屬層13以及單極天線12。基板11之上表面以及下表面的單極天線12之饋入點分別耦接於基板11之上表面以及下表面的金屬層13。在本發明實施例中,基板11之上表面與基板11之下表面的元件配置相同,兩者差異在於上表面以及下表面的單極天線12之饋入點131之信號饋入方向互相垂直,且信號相位差九十度。換句話說,基板11之上表面以及下表面之元件設置位置對應翻轉一百八十度。 Please refer to FIG. 1. FIG. 1 is a schematic diagram of an antenna module according to an embodiment of the present invention. The antenna module 1 has a substrate 11, a monopole antenna 12, and a metal layer 13. The substrate 11 has an upper surface and a lower surface. The upper surface and the lower surface of the substrate 11 have a feed point 131 and a ground point 132, respectively. The same metal layer 13 and the monopole antenna 12 are provided on the upper surface and the lower surface of the substrate 11, respectively. Feeding points of the monopole antenna 12 on the upper surface and the lower surface of the substrate 11 are respectively coupled to the metal layer 13 on the upper surface and the lower surface of the substrate 11. In the embodiment of the present invention, the upper surface of the substrate 11 and the lower surface of the substrate 11 are configured the same, and the difference is that the signal feeding directions of the feeding points 131 of the upper surface and the lower surface of the monopole antenna 12 are perpendicular to each other. And the signal phase difference is ninety degrees. In other words, the component placement positions of the upper surface and the lower surface of the substrate 11 are correspondingly flipped by one hundred and eighty degrees.
更仔細地說,請同時參閱圖1與圖2A、2B,圖2A與2B為本發明實施例之天線模組上下表面示意圖。由圖2A與2B可以看到圖2B所示之基板11之下表面與圖2A所示之基板11之上表面配置相同。於投影的角度來看,上表面以及下表面的單極天線12之饋入點131之信號饋入方向互相垂直。 More specifically, please refer to FIG. 1 and FIG. 2A and FIG. 2B simultaneously. FIGS. 2A and 2B are schematic diagrams of upper and lower surfaces of an antenna module according to an embodiment of the present invention. 2A and 2B, it can be seen that the lower surface of the substrate 11 shown in Fig. 2B is the same as the upper surface of the substrate 11 shown in Fig. 2A. From the perspective of projection, the signal feeding directions of the feeding points 131 of the monopole antenna 12 of the upper surface and the lower surface are perpendicular to each other.
在本發明實施例中,基板11係為RF4材料構成,並且為高介電系數之單層或多層印刷電路基板(Printed Circuit Board,PCB)。然而,在本領域具通常知識者應了解,所述基板11亦可使用其他材質,如軟性印刷電路板(Flexible Printed Circuit,FPC),用以提供上述金屬層13、單極天線12以及其他集成電路於一體結合佈設。值得一提的是,本發明實施例更可以圓型之結構實施,以提供整體天線裝置更有效的空間利用。 In the embodiment of the present invention, the substrate 11 is made of RF4 material and is a single-layer or multi-layer printed circuit board (PCB) with high dielectric constant. However, those skilled in the art should understand that the substrate 11 can also use other materials, such as a Flexible Printed Circuit (FPC), to provide the above metal layer 13, monopole antenna 12, and other integrations. The circuit is integrated and laid out. It is worth mentioning that the embodiment of the invention can be implemented in a round structure to provide more efficient space utilization of the overall antenna device.
在本發明實施例中,單極天線12為一輻射導體以環繞結構設置。換句話說,單極天線12為平面式倒F型單極天線(Planer Inverter-F Antenna,PIFA)。因此,由上下兩個單極天線12經由一個混和功率合成器(圖未繪示)即形成一個圓極化天線。更仔細地說,由圖2A與2B所示,單極天線12以金屬層13為中心繞圓設置於金屬層13外圍。值得注意的是,在本發明實施例之單極天線12以輻射導體環繞於金屬層13外圍的一又四分之一圈進行設置。另外,形成單極天線12之輻射導體的長度應小於等於四分之一的波長。換句話說,單極天線12之環繞結構之半徑應小於等於1/8 π的波長。單極天線12具有饋入點131連接至金屬層13,用以提供與射頻模組(圖未繪示)之訊號傳輸。然而,由於兩單極天線12作為一個雙元件(Two-element)的分集天線(Diversity Antenna),兩單極天線12的垂直擺置形成電磁場正交,而獲致極低地(Envelop correlation coefficient)。 In an embodiment of the invention, the monopole antenna 12 is a radiating conductor disposed in a surrounding configuration. In other words, the monopole antenna 12 is a planar inverted F-type monopole antenna (Planer) Inverter-F Antenna, PIFA). Therefore, a circularly polarized antenna is formed by the upper and lower two monopole antennas 12 via a hybrid power combiner (not shown). More specifically, as shown in FIGS. 2A and 2B, the monopole antenna 12 is disposed around the periphery of the metal layer 13 around the metal layer 13. It should be noted that the monopole antenna 12 in the embodiment of the present invention is disposed with a radiation conductor surrounding one quarter turn of the periphery of the metal layer 13. In addition, the length of the radiation conductor forming the monopole antenna 12 should be less than or equal to a quarter of the wavelength. In other words, the radius of the surrounding structure of the monopole antenna 12 should be less than or equal to the wavelength of 1/8 π. The monopole antenna 12 has a feed point 131 connected to the metal layer 13 for providing signal transmission with a radio frequency module (not shown). However, since the two monopole antennas 12 function as a two-element diversity antenna, the vertical arrangement of the two monopole antennas 12 forms an electromagnetic field orthogonal to an Envelop correlation coefficient.
金屬層13分別對應設置於基板11之上表面與下表面。更仔細地說,設置於基板11之上表面的金屬層13與設置於基板11之下表面的金屬層13相互對應。也就是說,兩者之投影位於同一位置上。值得注意的是,在本發明實施例中金屬層13雖以方型金屬層13作為實施方式,然而在其他實施例中亦可以圓型、三角型等形狀作為實施方式。本發明實施例並不以金屬層13之形狀做為限制。 The metal layers 13 are respectively disposed on the upper surface and the lower surface of the substrate 11. More specifically, the metal layer 13 provided on the upper surface of the substrate 11 and the metal layer 13 provided on the lower surface of the substrate 11 correspond to each other. In other words, the projection of the two is in the same position. It should be noted that in the embodiment of the present invention, the metal layer 13 has the square metal layer 13 as an embodiment, but in other embodiments, a circular shape, a triangular shape, or the like may be used as the embodiment. The embodiment of the invention is not limited by the shape of the metal layer 13.
接著,請參閱圖3,圖3為本發明實施例之射頻模組示意圖。射頻模組2具有至少一晶片224,晶片224例如低雜訊放大器(Low Noise Amplifier)、功率放大器(Power Amplifier)、天線開關(Antenna switch)或其他主動元件等等。另一方面,射頻模組2係為3D印刷電路板組成,用以透過天線模組1傳輸射頻訊號。在本發明實施例中,3D印刷電路板係利用低溫共高陶瓷技術(Low temperature co-fired ceramic)或高速高密度印刷電路板製程(High Density Interconnect)產生多層的印刷電路板結構。 Next, please refer to FIG. 3. FIG. 3 is a schematic diagram of a radio frequency module according to an embodiment of the present invention. The RF module 2 has at least one wafer 224 such as a Low Noise Amplifier, a Power Amplifier, an Antenna switch or other active components. On the other hand, the RF module 2 is composed of a 3D printed circuit board for transmitting RF signals through the antenna module 1. In an embodiment of the invention, the 3D printed circuit board utilizes a low temperature co-fired ceramic or a high density high density printed circuit board process (High Density Interconnect) to produce a multilayer printed circuit board structure.
更細部地說,在圖3中,射頻模組2以射頻模組上部21與射 頻模組下部22說明。在射頻模組上部21的頂面具有至少一接地面211、接地點連接孔213以及饋入點連接孔212,接地面211用以連接至天線模組1之金屬層13。接地點連接孔212以及饋入點連接孔213用以提供接地點132與饋入點131耦接。在射頻模組下部22中具有接地點連接孔222以及饋入點連接孔223。接地點連接孔222以及饋入點連接孔223分別與接地點連接孔212以及饋入點連接孔213相通。值得注意的是,由圖3可以看到射頻模組2多層印刷電路板結構中可產生中空的凹槽220,用以設置上所述晶片224。透過以3D印刷電路板的組成方式,能夠設置圓形極化天線或高度隔離度(Isolation)之天線分集所需之匹配的匹配電路。也就是用以匹配單極天線12之匹配電路。然而,在本發明實施例中,雖然以將匹配電路設置於射頻模組2中作為說明,在其他實施例中亦可以設置於天線模組1中多層的基板11進行設計,提供彈性的電路設計方式,本發明並不以匹配電路的設置位置做為限制。 More specifically, in Figure 3, the RF module 2 is mounted on the upper part of the RF module 21 The lower portion of the frequency module 22 is illustrated. The top surface of the upper portion 21 of the RF module has at least one grounding surface 211, a grounding point connecting hole 213, and a feeding point connecting hole 212. The grounding surface 211 is connected to the metal layer 13 of the antenna module 1. The grounding point connection hole 212 and the feeding point connection hole 213 are used to provide the grounding point 132 to be coupled to the feeding point 131. The radio frequency module lower portion 22 has a ground point connection hole 222 and a feed point connection hole 223. The ground point connection hole 222 and the feed point connection hole 223 are in communication with the ground point connection hole 212 and the feed point connection hole 213, respectively. It should be noted that, as can be seen from FIG. 3, a hollow recess 220 can be formed in the multilayer printed circuit board structure of the RF module 2 for arranging the wafer 224. By matching the 3D printed circuit board, it is possible to set a matching matching circuit required for circularly polarized antennas or antenna isolation with high isolation (Isolation). That is, the matching circuit for matching the monopole antenna 12. However, in the embodiment of the present invention, although the matching circuit is disposed in the radio frequency module 2 as an illustration, in other embodiments, the multi-layer substrate 11 in the antenna module 1 may be designed to provide flexible circuit design. In the manner, the present invention does not limit the setting position of the matching circuit.
請參閱圖4,圖4為本發明實施例之天線裝置示意圖。天線裝置3包括天線模組1、射頻模組2、鈕扣型殼體底部4、鈕扣型殼體外圍41與電池模組5。在本發明實施例中,天線模組1設置於天線裝置3的最上層,射頻模組2設置於天線裝置3的中間層,並於天線裝置3的底部設置電池模組5。換句話說,本發明實施例之天線裝置3可以旋扣的方式將天線模組1、射頻模組2與電池模組5組裝。更進一步地,在其他實施例中中間層亦可以多個射頻模組2堆疊設置並透過接地點連接孔以及饋入點連接孔連接置天線模組以發送射頻訊號,射頻模組2例如無線保幀(WIFI)、藍芽(Bluetooth)等不同的無線射頻模組。 Please refer to FIG. 4. FIG. 4 is a schematic diagram of an antenna apparatus according to an embodiment of the present invention. The antenna device 3 includes an antenna module 1, a radio frequency module 2, a button-type housing bottom 4, a button-type housing periphery 41, and a battery module 5. In the embodiment of the present invention, the antenna module 1 is disposed on the uppermost layer of the antenna device 3, the radio frequency module 2 is disposed in the middle layer of the antenna device 3, and the battery module 5 is disposed at the bottom of the antenna device 3. In other words, the antenna device 3 of the embodiment of the present invention can assemble the antenna module 1, the radio frequency module 2 and the battery module 5 in a manner of being screwed. Further, in other embodiments, the intermediate layer may also be stacked on the plurality of radio frequency modules 2 and connected to the antenna module through the ground point connection hole and the feed point connection hole to transmit the RF signal, and the RF module 2 is wirelessly protected. Different radio frequency modules such as frames (WIFI) and Bluetooth.
另外,在電池模組5與射頻模組2之間具有一電路大地23,使射頻模組2接收電池模組5提供之驅動電源。在本發明實施例中,電池模組5可以水銀電池作為實施,但本發明並不以此做為 限制。值得注意的是,鈕扣型殼體底部4與鈕扣型殼體外圍41可以將天線模組1、射頻模組2以及電池模組5組裝成一個鈕扣之形狀,其整體高度約為5~7微米(mm),寬度約為12微米。 In addition, a circuit ground 23 is disposed between the battery module 5 and the radio frequency module 2, so that the radio frequency module 2 receives the driving power provided by the battery module 5. In the embodiment of the present invention, the battery module 5 can be implemented as a mercury battery, but the present invention does not limit. It should be noted that the button-type housing bottom 4 and the button-type housing periphery 41 can assemble the antenna module 1, the RF module 2 and the battery module 5 into a button shape, and the overall height is about 5-7 microns. (mm), width is about 12 microns.
另一方面,雖然在本發明實施例中天線裝置3以鈕扣的形式作為實施,以能夠達到最小化的空間設置。在本領域具通常知識者應了解亦可以其他形狀作為實施方式但並不以此做為限制,本發明僅以鈕扣之圓形作為實施例說明。 On the other hand, although the antenna device 3 is implemented in the form of a button in the embodiment of the present invention, a minimized spatial setting can be achieved. It should be understood by those skilled in the art that other shapes may be used as the embodiments, but are not limited thereto. The present invention is only described by the circular shape of the button as an embodiment.
在實際應用上,天線裝置3可進一步應用於耦接於無線通訊系統,例如為穿戴式裝置(衣服、手錶、眼鏡等等)。在穿戴式裝置中具有感測器之負載(心跳、體溫、脈搏等等)以感測人體之參數,並透過耦接天線裝置3,將感測器所量測之數值傳送至其他外部裝置(例如監控裝置、伺服器等等)以進行後續應用。 In practical applications, the antenna device 3 can be further applied to a wireless communication system, such as a wearable device (clothing, watches, glasses, etc.). The wearable device has a load (heartbeat, body temperature, pulse, etc.) of the sensor to sense the parameters of the human body, and transmits the measured value of the sensor to other external devices by coupling the antenna device 3 ( For example, monitoring devices, servers, etc.) for subsequent applications.
請參閱圖5,圖5為本發明實施例之天線裝置產生反射損耗的模擬圖。由圖5為在阻抗100歐姆下,m1與m2為各反射參數之曲線之輸入訊號與反射訊號操作於1.57GHz的頻帶之比值。由圖5可知,本發明實施例之天線裝置3操作於1.57GHz的頻帶時,其反射損耗分別在8dB與9dB左右。另外,請參閱圖6,圖6為本發明實施例之天線裝置輻射效率的模擬圖。由圖5可知,本發明實施例之天線裝置3在1.57GHz頻帶之輻射效率約為12%。 Please refer to FIG. 5. FIG. 5 is a simulation diagram of a reflection loss generated by an antenna device according to an embodiment of the present invention. Figure 5 shows the ratio of the input signal and the reflected signal operating at 1.57 GHz for each of the reflection parameters of m1 and m2 at an impedance of 100 ohms. As can be seen from FIG. 5, when the antenna device 3 of the embodiment of the present invention operates in the frequency band of 1.57 GHz, the reflection loss is about 8 dB and 9 dB, respectively. In addition, please refer to FIG. 6. FIG. 6 is a simulation diagram of radiation efficiency of an antenna device according to an embodiment of the present invention. As can be seen from FIG. 5, the antenna device 3 of the embodiment of the present invention has a radiation efficiency of about 12% in the 1.57 GHz band.
請同時參閱圖1、圖7A與7B,圖7A與7B為本發明另一實施例之天線模組上下表面示意圖。圖7A與7B示出了基板61、單極天線62、金屬層63以及饋入點631。本發明實施例與圖2A與2B實施例之差異在於,本發明之單極天線62同樣為圓極化的倒F型單極天線。然而,由圖7A與7B可以發現到單極天線62之輻射導體的長度以繞金屬層63外圍一圈作為實施方式,且其饋入點位與圖2A、2B之位置不同。在本發明實施例中,透過單極天線62的配置,能夠提升天線輻射效率。 Please refer to FIG. 1 , FIG. 7A and FIG. 7B simultaneously. FIGS. 7A and 7B are schematic diagrams of upper and lower surfaces of an antenna module according to another embodiment of the present invention. 7A and 7B show a substrate 61, a monopole antenna 62, a metal layer 63, and a feed point 631. The difference between the embodiment of the present invention and the embodiment of Figures 2A and 2B is that the monopole antenna 62 of the present invention is also a circularly polarized inverted-F monopole antenna. However, it can be seen from Figures 7A and 7B that the length of the radiating conductor of the monopole antenna 62 is around the periphery of the metal layer 63 as an embodiment, and its feeding point is different from that of Figures 2A, 2B. In the embodiment of the present invention, the antenna radiation efficiency can be improved by the configuration of the monopole antenna 62.
進一步地說,請在參閱圖8,圖8為本發明另一實施例之天線 裝置產生反射損耗的模擬圖。在同樣為阻抗100歐姆下,本發明實施例之天線裝置會產生雙頻現象,m2、m3與m1、m4分別操作於1.22GHz和1.57GHz。另外,請參閱圖9,圖9為本發明另一實施例之天線裝置輻射效率的模擬圖。由圖9可知,本發明實施例之天線裝置在1.57GHz頻帶之輻射效率提升至約43%。 Further, please refer to FIG. 8, which is an antenna according to another embodiment of the present invention. The device produces a simulation of the reflection loss. Under the same impedance of 100 ohms, the antenna device of the embodiment of the present invention generates a dual frequency phenomenon, and m2, m3 and m1, m4 operate at 1.22 GHz and 1.57 GHz, respectively. In addition, please refer to FIG. 9. FIG. 9 is a simulation diagram of radiation efficiency of an antenna device according to another embodiment of the present invention. As can be seen from FIG. 9, the radiation efficiency of the antenna device of the embodiment of the present invention is increased to about 43% in the 1.57 GHz band.
綜上所述,本發明實施例提出之天線裝置以及無線通訊系統能夠將天線模組與射頻模組透過3D印刷技術電路板的整合方式在電路上做精簡設計,以使整體天線裝置以及無線通訊系統的電路面積及空間布置有效率或高密度的整合。藉此,本發明實施例之天線裝置能夠以鈕扣大小之形式實現於穿戴式裝置之微型化天線,改善其隔離性及輻射體間配置的空間限制條件,提供穿戴式無線通訊裝置更輕薄短小的需求。 In summary, the antenna device and the wireless communication system according to the embodiments of the present invention can simplify the design of the antenna module and the RF module through the 3D printing technology circuit board to make the overall antenna device and the wireless communication. The circuit area and space of the system are efficiently or densely integrated. Therefore, the antenna device of the embodiment of the present invention can be realized in the form of a button size in the miniaturized antenna of the wearable device, improving the isolation and the space limitation condition of the configuration between the radiators, and providing the wearable wireless communication device to be lighter, thinner and shorter. demand.
更進一步地,本發明實施例之天線裝置透過低溫共高陶瓷技術可大幅降低成本,且天線模組與接地平面距離較高可提升天線輻射效率。值得一提的是,相關被動元件、主動元件皆可以低溫共高陶瓷技術的3D印刷電路板內置以達到微小化的目的。 Further, the antenna device of the embodiment of the present invention can greatly reduce the cost by using the low temperature common high ceramic technology, and the antenna module and the ground plane have a higher distance to improve the antenna radiation efficiency. It is worth mentioning that the related passive components and active components can be built in the low-temperature common ceramic technology 3D printed circuit board to achieve miniaturization.
以上所述,僅為本發明最佳之具體實施例,惟本發明之特徵並不侷限於此,任何熟悉該項技藝者在本發明之領域內,可輕易思及之變化或修飾,皆可涵蓋在以下本案之專利範圍。 The above description is only the preferred embodiment of the present invention, but the features of the present invention are not limited thereto, and any one skilled in the art can easily change or modify it in the field of the present invention. Covered in the following patent scope of this case.
1‧‧‧天線模組 1‧‧‧Antenna Module
2‧‧‧射頻模組 2‧‧‧RF Module
3‧‧‧天線裝置 3‧‧‧Antenna device
4‧‧‧鈕扣型殼體底部 4‧‧‧Button type housing bottom
5‧‧‧電池模組 5‧‧‧Battery module
23‧‧‧電路大地 23‧‧‧Circuit Earth
41‧‧‧鈕扣型殼體外圍 41‧‧‧ button-type housing periphery
131‧‧‧饋入點 131‧‧‧Feeding point
132‧‧‧接地點 132‧‧‧ Grounding point
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Cited By (5)
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CN109390681A (en) * | 2017-08-08 | 2019-02-26 | 波音公司 | Structure stacked antenna designs and manufactures |
TWI655803B (en) * | 2016-12-27 | 2019-04-01 | 宏達國際電子股份有限公司 | Mobile device and method of manufacturing same |
CN112467356A (en) * | 2019-09-09 | 2021-03-09 | 北京小米移动软件有限公司 | Antenna assembly and terminal |
CN113224515A (en) * | 2020-01-21 | 2021-08-06 | 大唐移动通信设备有限公司 | Antenna device and base station equipment |
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Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7253770B2 (en) * | 2004-11-10 | 2007-08-07 | Delphi Technologies, Inc. | Integrated GPS and SDARS antenna |
TWI268008B (en) * | 2005-09-15 | 2006-12-01 | Advanced Connectek Inc | Diversity antenna |
JP4224081B2 (en) * | 2006-06-12 | 2009-02-12 | 株式会社東芝 | Circularly polarized antenna device |
TWI359531B (en) * | 2008-07-08 | 2012-03-01 | Gemtek Technology Co Ltd | Dual-polarization planar antenna array |
TWI506855B (en) * | 2012-03-27 | 2015-11-01 | Climax Technology Co Ltd | Wireless security device |
-
2014
- 2014-11-05 TW TW103138381A patent/TWI568081B/en not_active IP Right Cessation
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TWI655803B (en) * | 2016-12-27 | 2019-04-01 | 宏達國際電子股份有限公司 | Mobile device and method of manufacturing same |
US10879588B2 (en) | 2016-12-27 | 2020-12-29 | Htc Corporation | Mobile device and manufacturing method thereof |
US11664583B2 (en) | 2016-12-27 | 2023-05-30 | Htc Corporation | Mobile device and manufacturing method thereof |
US11929547B2 (en) | 2016-12-27 | 2024-03-12 | Htc Corporation | Mobile device |
CN109390681A (en) * | 2017-08-08 | 2019-02-26 | 波音公司 | Structure stacked antenna designs and manufactures |
CN109390681B (en) * | 2017-08-08 | 2022-11-25 | 波音公司 | Structural multilayer antenna design and fabrication |
CN112467356A (en) * | 2019-09-09 | 2021-03-09 | 北京小米移动软件有限公司 | Antenna assembly and terminal |
CN112467356B (en) * | 2019-09-09 | 2024-01-02 | 北京小米移动软件有限公司 | Antenna assembly and terminal |
CN113224515A (en) * | 2020-01-21 | 2021-08-06 | 大唐移动通信设备有限公司 | Antenna device and base station equipment |
CN113224515B (en) * | 2020-01-21 | 2022-07-29 | 大唐移动通信设备有限公司 | Antenna device and base station equipment |
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