201128110 六、發明說明·· 【發明所屬之技術領域】 本發明係關於一種發光二極體結構及其LED燈具，尤 其一種透過一第一膠體設在一基板的凹槽與複數LED晶片 間’及一第二膠體設在該基板對接的一透鏡與第一膠體之 間的結合設計，使得有效增加整體出光效率及散熱效率的 具有增進發光及散熱效率之發光二極體結構及其led燈 • 具。 【先前技術】 近年來’隨者發光一極體(Light-emitting diode，以 下簡稱LED)新興照明產業發展迅速，使LED在亮度、功率、 壽命、耗電量、反應速率等方面已經超過或接近傳統燈泡 的節能光源，以使LED目前已漸漸開始取代傳統燈泡，其 中以大功率LED在路燈、景觀、洗牆、室内照明等領域早 已經大量廣泛應用。 ® 而目前已在市面上推出單顆大功率LED晶片的最大功 率為5瓦(W) ’而在路燈等大功率應用領域，通常是上百個 大功率LED或者上千個〇. 1瓦(W)左右低功率封裝的LE])組 合在一起形成一 LED模組，來達到所需的光通量及照度， 但相對的LED模組之尺寸需較大，且其所需的散熱結構設 计更為複雜，進而直接限制了它的應用範圍。 另外，由於單顆LED封裝熱阻可以做到小於每瓦攝氏 U度，但是因複數顆MD集成後的前述模組的熱阻卻 很難控制，使得LED模組其内各LED晶片在長時間的工作 201128110 下’因前述熱阻無法穩定的控制，以導致led晶片的結溫 超過允許範圍而損壞LE1D晶片的性能及壽命，如LED晶片 的發光效率降低、發光波長變短等。此外，由於分散的點 光源’給具體應用時的外部光學設計會帶來很大難度，所 以使得很難得到一個理想的光束分佈。 並且’由於LED燈具中係利用多顆LED晶片集成所述 LED模組作為光源得到了廣泛的關注及應用，且其雖結構 簡潔、導熱介面少、發光面小且集中及易於配光設計等優 點；但由於LED模組的熱功率密度大，科有雜的效應 難以解決，因此LED燈具需考慮LE：D模組的散熱管理，且 LED模組在各種不同的應用場合需要不同的配光，如一般 吊用的LED燈具上加裝二次配光透鏡，以讓整個哪燈具 所發出的歧滿足設計需求，可是卻延伸另—問題，即光 在LED模組外部介面及配光透鏡内部介面上反射或散射會 影響LED燈具的出光效率。 以上所述’ f知技術巾具有下狀缺點： 1.散熱不佳； 2. 出光效率不佳； 3. 散熱面積有限。 發明=:上=所:谢項缺點’本案之 從事该仃業多年之經驗，潛心研究 ==光=研發完成本件「具有增進發光及 功效增進之創Ϊ 構及其LED燈具」案，實為一具 201128110 【發明内容】 爰此’為有效解決上述之問題，本發明之主要目的， 係提供_藉由第—膠體設在一基板的凹槽與複數LED b曰片間及第—膠體設在該基板對接的一透鏡與第一膠 體之間的齡料，財效增體㈣(或發光)效率及 散熱效率的具有增進發光及散熱效率之發光二極體結構。 本發明之_人要目的’係提供—種具有增進出光效率及 提升散熱效果的LED燈具。 本發明之次要目的，係提供_種具有增加散熱面積的 LED燈具。 為達上述目的，本發_提出—種具有增進發光及散 熱效率之發光二_結構，其包括：複數⑽晶片；一基 板具有一凹槽’該凹槽容設有該LED( Light-emitting diode)晶片’並_板對接—透鏡；—第—膠體係設在該 凹槽與刚述LED晶片間；及—第二膠體貞懷在該透鏡與第 一膠體間，並所述第—顧與第二膠體及該LED晶片係包 覆在該凹彻，且與該基板及透鏡結合_體，亦此藉由本 發明之基板、透鏡、LED晶片及第一、二膠體的結合一體 设&十’使％•不但有明加散熱效率，更進而有效增加（或提 升）出光效率者。 本發明另提出一種具有增進發光及散熱效率之發光二 極體結構’該發光二極體結構包括複數LED晶片、一基板、 一第一膠體及-第二膠體，其中該基板端面設有至少一框 架’該框架彼關界定—凹槽，該凹槽係容設有前述⑽ 201128110 日日片’並且該基板對接一透鏡，而該第一夥體係設在該凹 槽内並包覆該led晶片，該第二膠細設在該透鏡與第一 賴之間，且其位在該框架與第—膠體的上方處，並所述 透鏡罩蓋4框架，以與該基板結合—體，所以藉由前述第 一、二膠體有效增進整體出光效率及散熱效率。 本發明另提出一種LE：D燈具，係包括一 LE：D模組、一 基座及一散熱模組，該LED模組包含複數LE：D晶片、一基 ^一第-膠體及-第二膠體，其中該基板具有一凹槽^ 汉複數LED晶>|，並該基板對接—透鏡，該第—膠體係設 在則述凹槽與LED晶片間，該第二膠體則設在該透鏡與第 y膠體間’而前述基座具有—容置槽，該容置槽容設有哪 模組’前述散熱模組具有複數導熱管穿接該基座，所以藉 由該第-、二膠體不僅能夠增加整體出光及散熱效率外， 又可透過該科熱管增加整體散熱面積及散熱效果者。 【實施方式】 本發明之上述目的及其結構與功能上的特性，將依據 所附圖式之較佳實施例予以說明。 凊一併參閱第1、2、3圖所示，係本發明一種具有增 進發光及散熱效率之發光二極體結構及其LED燈具，在本 發明之第一較佳實施例中，該發光二極體結構包括複數 ( Light-emitting diode，簡稱 LED)晶>} 10、一基板 11、一第一膠體41及一第二膠體42 ,前述基板Η係以純 銅材質所製成，且其具有一凹槽lu，該凹槽ln容設有 前述LED晶片1〇，一透鏡13係對接該基板u並罩蓋在該 201128110 基板11之凹槽L 士# 該透鏡13之材’與該基板11緊龍觸一起， 及亞克狀中任 膠、物旨、光學PC、破璃 一、二膠體41、^^罐13晴料小於該第 該係設在該凹槽⑴與 =見先一喊絲與透雜，錢少了光财的折射BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light-emitting diode structure and an LED lamp thereof, in particular, a first colloid disposed between a groove of a substrate and a plurality of LED chips. a second colloid is disposed on the substrate and the first colloid is coupled with the first colloid, so as to effectively increase the overall light-emitting efficiency and heat-dissipating efficiency, the LED structure and the LED lamp with improved luminous and heat dissipation efficiency . [Prior Art] In recent years, the emerging lighting industry of Light-emitting diode (LED) has developed rapidly, making LEDs have exceeded or approached in terms of brightness, power, lifetime, power consumption, and reaction rate. The energy-saving light source of traditional light bulbs has led LEDs to gradually replace traditional light bulbs. Among them, high-power LEDs have been widely used in street lighting, landscape, wall washing, indoor lighting and other fields. ® and currently have a single high-power LED chip with a maximum power of 5 watts (W). In high-power applications such as street lights, there are usually hundreds of high-power LEDs or thousands of watts. W) LE and low-power packages are combined to form an LED module to achieve the required luminous flux and illumination, but the size of the corresponding LED module needs to be larger, and the required heat dissipation structure design is more To be complex, it directly limits its scope of application. In addition, since the thermal resistance of a single LED package can be less than U degrees Celsius per watt, the thermal resistance of the aforementioned modules after integration of multiple MDs is difficult to control, so that the LED chips in the LED module are in a long time. Under the work 201128110, 'the above-mentioned thermal resistance cannot be stably controlled, so that the junction temperature of the led wafer exceeds the allowable range and the performance and life of the LE1D wafer are damaged, such as the luminous efficiency of the LED wafer is lowered, and the emission wavelength is shortened. In addition, due to the scattered optical source, the external optical design for a specific application can be very difficult, so that it is difficult to obtain an ideal beam distribution. And 'because LED lamps use a plurality of LED chips to integrate the LED modules as light sources, they have received extensive attention and application, and their advantages are simple structure, less thermal interface, small luminous surface, concentrated and easy light distribution design. However, due to the high thermal power density of the LED module, it is difficult to solve the complex effects of the LED. Therefore, the LED lamp needs to consider the heat management of the LE:D module, and the LED module needs different light distribution in various applications. For example, the secondary illuminating LED luminaire is equipped with a secondary illuminating lens to make the ambiguity of the whole luminaire meet the design requirements, but the other problem is extended, that is, the external interface of the LED module and the internal interface of the illuminating lens. The upper reflection or scattering affects the light extraction efficiency of the LED luminaire. The above-mentioned technical towel has the following disadvantages: 1. Poor heat dissipation; 2. Poor light output efficiency; 3. Limited heat dissipation area. Invention =:上=所:Xie's shortcomings' The experience of the company's many years of experience in this case, painstaking research ==光=R&D completed this piece of "creative and its LED lighting" In order to effectively solve the above problems, the main object of the present invention is to provide a first colloid and a plurality of LEDs and a colloidal body. The illuminating diode structure having an improved illuminating and heat dissipating efficiency between the lens and the first colloid which are butted by the substrate, the efficiency (4) (or illuminating) efficiency and the heat dissipating efficiency. The object of the present invention is to provide an LED lamp with improved light extraction efficiency and improved heat dissipation. A secondary object of the present invention is to provide an LED luminaire having an increased heat dissipation area. In order to achieve the above object, the present invention provides a light-emitting structure having improved light-emitting and heat-dissipating efficiency, comprising: a plurality of (10) wafers; and a substrate having a groove for accommodating the LED (Light-emitting diode) a wafer 'and_board docking-lens; - a first glue system is disposed between the groove and the just-described LED chip; and - a second gel is sandwiched between the lens and the first colloid, and the first The second colloid and the LED chip are coated on the recess and combined with the substrate and the lens, and the substrate, the lens, the LED chip and the first and second colloids of the present invention are integrally provided with the ten 'Make %• not only have the heat dissipation efficiency, but also effectively increase (or enhance) the light efficiency. The present invention further provides a light emitting diode structure having improved light-emitting and heat-dissipating efficiency. The light-emitting diode structure includes a plurality of LED chips, a substrate, a first colloid, and a second colloid, wherein the substrate end surface is provided with at least one The frame 'the frame defines a groove|the groove is provided with the above (10) 201128110 Japanese film 'and the substrate is butted with a lens, and the first body system is disposed in the groove and covers the led chip The second glue is disposed between the lens and the first lap, and is located above the frame and the first colloid, and the lens cover 4 is framed to be combined with the substrate, so The first and second colloids effectively enhance the overall light extraction efficiency and heat dissipation efficiency. The invention further provides an LE:D lamp comprising an LE:D module, a base and a heat dissipation module, the LED module comprising a plurality of LE:D chips, a base - a colloid and a second a colloid, wherein the substrate has a groove and a plurality of LED crystals, and the substrate is butted to a lens, the first glue system is disposed between the groove and the LED chip, and the second gel is disposed on the lens The pedestal has a accommodating groove, and the accommodating groove has a module. The heat dissipating module has a plurality of heat conducting tubes penetrating the pedestal, so the first and second colloids are Not only can increase the overall light and heat dissipation efficiency, but also increase the overall heat dissipation area and heat dissipation effect through the heat pipe. [Embodiment] The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings. As shown in the figures 1, 2, and 3, the present invention relates to a light-emitting diode structure having improved light-emitting and heat-dissipating efficiency, and an LED lamp thereof. In the first preferred embodiment of the present invention, the light-emitting diode The polar body structure includes a plurality of light-emitting diodes (LED) crystals, a substrate 11, a first colloid 41, and a second colloid 42. The substrate is made of pure copper and has a groove lu, the groove ln is provided with the LED chip 1 〇, a lens 13 is butted to the substrate u and covered in the groove of the 201128110 substrate 11 and the material of the lens 13 and the substrate 11 Tight dragon touch together, and Yake-like glue, material purpose, optical PC, broken glass one, two colloids 41, ^^ cans 13 clear material less than the first line is set in the groove (1) and = see first shout Silk and thorough, money less refraction of light
二k化’進而有助於提升LED燈具2整體出光效率，如提 尚LED燈具2效率1〇%〜20%。 前述第二_ 42 _擇為透财膠及散熱液其中任 一，右该第二膠體42為散熱液時係用以增加發光二極體結 構整體的散熱效果，以有效降低⑽晶片1()的溫度；若該 第二膠體42為透明石夕膠時則用以改善⑽晶片1〇發出之 白光的色溫（color temperature)在不同出光角度上的分 佈均勻性，且所述透明矽膠的折射率小於丨· 43。此外，於 本較佳實施例，該第二膠體42係以透明矽膠做說明，但並 不侷限於此，合先陳明。 前述第二膠體42設在該透鏡13與第一膠體41之間， 並與該第一膠體41及該LED晶片1〇包覆在該凹槽ηι内， 進而與該基板11及透鏡13結合一體構成一 LED模組1(即 所述發光二極體結構）。 前述凹槽111更具有一第一容置部丨丨2及一第二容置 部113，該第一容置部112係容置有前述LED晶片1〇與該 第一膠體41，該第二容置部113則容置有前述第二膠體 201128110 42 ’並相對該第一容置部112;而前述透鏡13與基板η 間係設有一蓋板14，該蓋板14的一側凸伸設有一抵壓件 Hi抵壓固定在該透鏡13上’前述抵壓件141係從相對該 透鏡13方向延伸構成；前述蓋板14具有至少一穿孔142 供一固定件3(如螺絲）貫穿，並藉由該固定件3與基板η 鎖固*一起。 凊復參閱第1、2、3圖所示，前述LED燈具2包括所 述LED模組卜一基座5及一散熱模組6，該基座5係以純 銅材料所製成’其材料為純度大於99. 9%的銅，並在銅表 面鍍銀，並該基座5具有一容置槽52用以容設該LED模組 1 ’並以表面貼裝（或黏著）技術（Surfacd MountingThe second k-turning is further helpful to improve the overall light-emitting efficiency of the LED lamp 2, such as increasing the efficiency of the LED lamp 2 by 1% to 20%. The second _ 42 _ is selected as one of the permeable plastic and the heat dissipating liquid, and the right second colloid 42 is used as a heat dissipating liquid to increase the heat dissipating effect of the entire illuminating diode structure, thereby effectively reducing (10) the wafer 1 () If the second colloid 42 is a transparent gel, it is used to improve the uniformity of the color temperature of the white light emitted by the wafer 1 at different light exit angles, and the refractive index of the transparent tantalum Less than 丨·43. In addition, in the preferred embodiment, the second colloid 42 is described by a transparent silicone, but is not limited thereto. The second colloid 42 is disposed between the lens 13 and the first colloid 41, and is wrapped in the recess η1 with the first colloid 41 and the LED wafer 1 , and is integrated with the substrate 11 and the lens 13 . An LED module 1 (ie, the LED structure) is formed. The recessed portion 111 further includes a first receiving portion 丨丨2 and a second receiving portion 113. The first receiving portion 112 receives the LED chip 1 and the first colloid 41, and the second portion The accommodating portion 113 receives the second colloid 201128110 42 ′ and is opposite to the first accommodating portion 112 . The lens 13 and the substrate η are respectively provided with a cover 14 , and one side of the cover 14 is convexly extended. A pressing member Hi is pressed against the lens 13. The pressing member 141 is formed to extend from the lens 13; the cover plate 14 has at least one through hole 142 for a fixing member 3 (such as a screw), and The fixing member 3 is locked together with the substrate η*. Referring to Figures 1, 2 and 3, the LED lamp 2 includes the LED module, a base 5 and a heat dissipation module 6, which is made of pure copper material. The copper has a purity of more than 99.9%, and the surface of the copper is silver plated, and the susceptor 5 has a receiving groove 52 for accommodating the LED module 1' and surface mount (or adhesive) technology (Surfacd Mounting)
Technolegy，簡稱SMT) ’令該LE：D模組1與該基座5結合 成一體。 而前述散熱模組6具有複數導熱管6卜該等導熱管61 穿接該基座5 ’以使LED模組1產生的熱量經由該基座5 傳導至該等導熱管61，再藉由該等導熱管61引導至外界 熱交換，以有效達到絕佳的散熱效果。 前述基座5更具有呈蜂窩狀之複數細孔51，該等細孔 51係形成在該容置槽52的任一側，並連通該容置槽52， 於本較佳實施例，該等細孔51設在所述容置槽52内的周 側及底側上做說明，但並不侷限於此，於本發明實際實施 時，亦可依使用需求及LED燈具2空間的設計選擇設在該 容置槽52内的周侧或底側上，或是設在該容置槽52内的 周侧及底側上。 201128110 - 該等每一導熱管61分別對接該等每一細孔51 ,且連 通各該細孔51與容置槽52 ;前述容置槽52内設有一第三 膠體（圖中未示），該第三膠體係為矽膠，其浸入至該等細 孔51及則述導熱管61之間，以使該第三膠體從該容置槽 52内的各該細孔51浸潤至各該導熱管61内，以增加該第 二膠體與該基座5的接觸面積，以有效降低LE：D模組i在 正面的散熱路徑中的有效熱阻，進而擴大傳熱面積。 • 請一併參閱第1、3圖所示，前述導熱管61更連接一 燈具忒體8，進而與前述基座5結合成一體，當前述LED 模組1發出可見光時，伴隨LED晶片1〇的光源產生熱量， 其中前述光源依序通過該第一膠體41、第二膠體42，並藉 由别述第一、二膠體41、42自身的特性，來增加發光效率， 並在前述光騎職第二賴42後，經由贿鏡13將光 源投射出去外界； δ亥等LED晶片1〇所產生的熱量，透過該容置槽52内 •㈣二膠體將前述熱量分別引導至所述導鮮61及基座5 上:使得部分熱量料_基座5上賴，但絕大部分的 熱1則藉由該等導熱管61傳導到該燈具殼體8上，以透過 較大的散熱面積來散熱，俾使有效增進·燈具2整體的 出光效率，進而達到絕佳的散熱效果者。 明參閱第4、5騎示，係本發明之第二較佳實施例， 該發光二極體結構包括複數LED( Light-emitting diode， 簡知LED)晶片1〇、一基板u、一第一膠體4i及一第二膠 體42 ’前述基板11端面設有至少-框架115由環氧樹脂 201128110 製成’雜架115彼此間界定-凹槽⑴，該凹槽办 设有前述LED晶片1G，並該基板U對接—呈波浪狀： 鏡13，該透鏡13罩蓋並包覆該基板u之框架ii5 =板11緊密貼觸-起；其中該透鏡13之材質係選擇為 膠、矽樹脂、光學PC、玻璃及亞克力其中任一。·、、、 前述第-膠體41係為石夕膠，其折射率介於143至 =間，藉由鄉的特性’除了保留原有對可見光譜的高 光率與透明性’並減少了光路中的折射率變化；該第^ 體41係採賴鑄法(随ing)的方式形成在細槽⑴ 包覆該LED晶片1〇。 該第二膠體42係為透明矽膠 一 •…夕川μ叹吾L10)晶片1〇 之白光的色溫(eQlGr temperature)在不同出光角度 上的分佈均勻性，且職透0神膠的折神小於Μ，二 應用菲簡公式計算，在正人射時，根雜 自然光的反射比由 飞 而LED膠面折射率h5〜158，空氣折射率^ 〇， 透鏡13折射率丨.48〜1. 6 ;經上述計算後，可知所述第二 膠體42的折射率„4 «1. 4。Technolegy (SMT) referred to the LE:D module 1 being integrated with the base 5. The heat dissipation module 6 has a plurality of heat-conducting tubes 6 through which the heat-conducting tubes 61 are connected to the base 5' so that heat generated by the LED module 1 is conducted to the heat-conducting tubes 61 via the base 5, and The heat transfer pipe 61 is guided to the outside heat exchange to effectively achieve an excellent heat dissipation effect. The pedestal 5 further has a plurality of pores 51 in a honeycomb shape. The pores 51 are formed on either side of the accommodating groove 52 and communicate with the accommodating groove 52. In the preferred embodiment, the susceptor 5 The pores 51 are provided on the circumferential side and the bottom side of the accommodating groove 52. However, the present invention is not limited thereto. In the actual implementation of the present invention, the design of the LED luminaire 2 space can be selected according to the needs of use. On the circumferential side or the bottom side in the accommodating groove 52, or on the circumferential side and the bottom side in the accommodating groove 52. 201128110 - each of the heat transfer tubes 61 respectively abuts each of the fine holes 51 and communicates with each of the fine holes 51 and the accommodating groove 52. The accommodating groove 52 is provided with a third colloid (not shown). The third adhesive system is a silicone rubber which is immersed between the pores 51 and the heat transfer tube 61 so that the third gel is infiltrated from each of the pores 51 in the accommodating groove 52 to each of the heat pipes. In 61, the contact area of the second colloid with the susceptor 5 is increased to effectively reduce the effective thermal resistance of the LE:D module i in the heat dissipation path of the front surface, thereby expanding the heat transfer area. Please refer to the first and third figures. The heat pipe 61 is further connected to a lamp body 8 and integrated with the base 5. When the LED module 1 emits visible light, the LED chip is attached. The light source generates heat, wherein the light source sequentially passes through the first colloid 41 and the second colloid 42, and the luminous efficiency is increased by the characteristics of the first and second colloids 41 and 42 themselves, and the light riding is performed. After the second ray 42, the light source is projected out to the outside through the bristles 13; the heat generated by the LED wafers such as δ hai, through the accommodating groove 52, the (b) dicolloid guides the heat to the fresh guide 61, respectively. And the pedestal 5: a part of the heat material _ pedestal 5 is attached, but most of the heat 1 is conducted to the lamp housing 8 through the heat transfer tubes 61 to dissipate heat through a large heat dissipation area. In order to effectively improve the overall light output efficiency of the lamp 2, and to achieve excellent heat dissipation. In the second preferred embodiment of the present invention, the light-emitting diode structure includes a plurality of LEDs (light-emitting diodes), a substrate u, a first The colloid 4i and a second colloid 42' are provided on the end surface of the substrate 11 at least - the frame 115 is made of epoxy resin 201128110, and the sub-frames 115 are defined with each other - a groove (1), and the recess is provided with the aforementioned LED chip 1G, and The substrate U is butted in a wavy shape: a mirror 13 that covers and covers the frame ii5 of the substrate u = the plate 11 is in close contact with each other; wherein the material of the lens 13 is selected from the group consisting of glue, resin, and optical Any of PC, glass and acrylic. ·,,,,,,,,,,,,,,, - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - The refractive index change; the first body 41 is formed by a casting method (with ing) formed in the fine groove (1) to coat the LED wafer 1 . The second colloid 42 is a transparent gelatin gel....... Xichuan μ suiwu L10) The uniformity of the color temperature of the white light (eQlGr temperature) of the wafer 1 at different light exit angles, and the folding of the occupational zero god glue is smaller than Μ, the second application of the Philippine formula calculation, in the positive human shot, the reflection of the natural light is greater than the refractive index of the LED surface of the rubber surface h5~158, the refractive index of the air ^ 〇, the refractive index of the lens 13 丨.48~1. 6; After the above calculation, the refractive index of the second colloid 42 is „4 «1.4.
前述第二膠體42設在該透鏡13與第一膠體41之間， 並位在該框架115與第-膠體41的上核，即前述第二膠 體42係採用模鑄法(M〇lding)的方式形成在第一賴41的 上方處，且恰位於框架115的中央位置處，並前述透鏡13 罩蓋該框架115，以與該基板11結合-體，以構成- LED 201128110 模組1(即所述發光二極體結構）。 =_第4、5 _示’該透鏡13係 並具有-第-隆起部⑶及-第二隆起部132，= 與第二隆起部132之間形成一 ^ 絲财—由崎製成之基座5上，且所== 11與基座5之間的gj定方式 ； 5内埋林至少—線路56，該每—線路5 ς 連接該基板…其另-端則電連接該基座5。刀別· 所ϋΞΓ〗5容置嶋—LED燈具上（圖中未示），當 序通過該第-膠體4卜第二膠^ t時’則述光源係依 膠體4卜42的概，增加發辑，並述第一、二 第二膠體42後’藉由該透鏡13將光源投:出：:過： ^效提高㈣她溫概龜,提升出2 請參閱第4、6圖所示，係本發明之 練佳實槪物帛高輪_,1=外 贅述相同處，第三較佳會絲彻沾^占 在此不另外 具有複數散熱則53及—容置^在於:前祕座5更 谷置槽52，該等散埶鰭Κ Μ您 该基座5的周側向外延伸形成，且每—餘、 定一對流孔55，而前述容置槽52係供所述咖触^ :由=〇晶片1〇發出光源的時候伴隨熱量的產二 藉由該基座5魏前频量，並料至轉散 201128110 進而通過5靖流孔55與外面的越蹄熱交練熱令㈣ 模組1維持在較麵工作溫低(即較低的工作溫度），以有 效增進發光效率及散熱效果者。 明參閱第7圖所示’係本發明之第四較佳實施例，該 較佳實施例大致與前第二難實施_同，在此不另外費 述相同處，第吨佳實施例不_在於：前絲座5相反該 基板11的端面設有-螺紋部9 ’該螺紋部9的—端固接該 基座5，其自由端與匹配對應的一通燈具（圖中未示)相 鎖合，並且前述每-線路56的—端分別電性連接該基板 U ’其另—刺分別與該螺紋部9 —端及其另—端相電性 連接。 以上所述’本發明係一種具有增進發光及散熱效率之 發光二極體結構及其LE：D燈具，其具有下列優點： 1. 具有提升出光（或發光)效率； 2. 具有提升散熱效果； 3. 具有輸出白光的色溫及顯色係數； 4·具有增加散熱面積。 按，以上所述，僅為本發明的較佳具體實施例，惟本 發明的特徵並不侷限於此，任何熟悉該項技藝者在本發明 領域内’可輕易思及的變化或修飾，皆應涵蓋在以下本發 明的申請專利範圍中。 【圖式簡單說明】 第1圖係本發明之第一較佳實施例之剖面示意圖； 201128110 第2圖係本發明之第一較佳實施例之基座立體示意圖； 第3圖係本發明之第一較佳實施例之實施態樣示意圖； 第4圖係本發明之第二較佳實施例之刳面示意圖； 第5圖係本發明之第二較佳實施例之另一剖面示意圖； 第6圖係本發明之第三較佳實施例之基座俯視圖； 第7圖係本發明之第四較佳實施例之剖面示意圖。The second colloid 42 is disposed between the lens 13 and the first colloid 41, and is located on the upper core of the frame 115 and the first colloid 41, that is, the second colloid 42 is molded by Molding. The method is formed at a position above the first lap 41, and is located at a central position of the frame 115, and the lens 13 covers the frame 115 to be combined with the substrate 11 to constitute - LED 201128110 module 1 (ie The light emitting diode structure). =_4, 5 _ shows that the lens 13 has a - first ridge portion (3) and a second ridge portion 132, and a second ridge portion 132 is formed between the second ridge portion 132. On the seat 5, and between the == 11 and the base 5 gj fixed mode; 5 buried forest at least - line 56, the each line 5 ς connected to the substrate ... the other end is electrically connected to the base 5 . Knife, ϋΞΓ ϋΞΓ 5 5 5 LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED After the first and second second colloids 42 are described, the light source is thrown by the lens 13:::: The effect is improved (4) Her warm turtle is raised, and 2 is lifted. See Figures 4 and 6 It is the practice of the invention, the high-quality 槪 帛 high wheel _, 1 = the same place, the third best will be smeared ^ do not have additional heat dissipation 53 and - contain ^ lies in: the front seat 5, a valley trough 52, the divergent fins Μ Μ the peripheral side of the pedestal 5 extends outwardly, and each of the remaining, a pair of flow holes 55, and the accommodating groove 52 is for the coffee touch ^ : by the = 〇 wafer 1 〇 when the light source is accompanied by the heat of the second generation by the pedestal 5 Wei pre-frequency, and then transferred to the 201128110 and then through the 5 Jingliu 55 and the outside of the hoof hot heat (4) Module 1 is maintained at a relatively low working temperature (ie, a lower operating temperature) to effectively improve luminous efficiency and heat dissipation. 4 is a fourth preferred embodiment of the present invention. The preferred embodiment is substantially the same as the first and second hard-to-implement implementation, and the same is not described herein. The front end of the base plate 5 is opposite to the end surface of the base plate 11 and is provided with a threaded portion 9'. The end of the threaded portion 9 is fixed to the base 5, and the free end thereof is interlocked with a matching corresponding light fixture (not shown). The first end of each of the lines 56 is electrically connected to the substrate U', and the other ends are electrically connected to the end of the threaded portion 9 and the other end thereof. The invention described above is a light-emitting diode structure with improved light-emitting and heat-dissipating efficiency and its LE:D lamp, which has the following advantages: 1. It has the efficiency of lifting light (or light); 2. It has the effect of improving heat dissipation; 3. It has the color temperature and color rendering coefficient of output white light; 4. It has an increased heat dissipation area. The above description is only a preferred embodiment of the present invention, but the features of the present invention are not limited thereto, and any changes or modifications that can be easily considered by those skilled in the art in the field of the present invention are It is intended to be included in the scope of the claims of the present invention below. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic cross-sectional view of a first preferred embodiment of the present invention; 201128110 FIG. 2 is a perspective view of a base of a first preferred embodiment of the present invention; FIG. 3 is a perspective view of the present invention 4 is a schematic view of a second preferred embodiment of the present invention; FIG. 5 is a schematic cross-sectional view showing a second preferred embodiment of the present invention; 6 is a plan view of a susceptor according to a third preferred embodiment of the present invention; and FIG. 7 is a cross-sectional view showing a fourth preferred embodiment of the present invention.
【主要元件符號說明】 LED模組 ··. 1 LED晶片 .·. 10 基板 ... 11 凹槽 … 111 第一容置部… 112 第二容置部... 113 框架 ... 115 透鏡 ... 13 第一隆起部… 131 第二隆起部··· 132 凹處 … 133 蓋板 ... 14 抵壓件 ·.· 141 穿孔 ... 142 LED燈具 … 2 固定件 … 3 第一膠體 … 41 第二膠體 … 42 基座 … 5 細孔 … 51 容置槽 … 52 散熱鰭片 … 53 對流孔 … 55 線路 … 56 散熱模組 … 6 導熱管 … 61 燈具殼體 … 8 螺紋部 … 9[Main component symbol description] LED module··. 1 LED chip.·. 10 substrate... 11 groove... 111 first housing part... 112 second housing part... 113 frame... 115 lens ... 13 First ridge... 131 Second ridge...·132 132 Recess... 133 Cover... 14 Pressing parts ·.· 141 Perforation... 142 LED luminaires... 2 Fixing parts... 3 First Colloid... 41 Second colloid... 42 Base... 5 Pins... 51 Sockets... 52 Heat sink fins... 53 convection holes... 55 lines... 56 heat sinks... 6 heat pipes... 61 lamp housings... 8 threaded parts... 9