TW200615302A - Polyimide resin, laminated film, metal layer-containing laminated film and semiconductor device - Google Patents

Polyimide resin, laminated film, metal layer-containing laminated film and semiconductor device

Info

Publication number
TW200615302A
TW200615302A TW094114193A TW94114193A TW200615302A TW 200615302 A TW200615302 A TW 200615302A TW 094114193 A TW094114193 A TW 094114193A TW 94114193 A TW94114193 A TW 94114193A TW 200615302 A TW200615302 A TW 200615302A
Authority
TW
Taiwan
Prior art keywords
laminated film
polyimide resin
semiconductor device
metal layer
present
Prior art date
Application number
TW094114193A
Other languages
English (en)
Inventor
Takuo Watanabe
Original Assignee
Toray Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries filed Critical Toray Industries
Publication of TW200615302A publication Critical patent/TW200615302A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C08G73/1053—Polyimides containing oxygen in the form of ether bonds in the main chain with oxygen only in the tetracarboxylic moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/1064—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing sulfur
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Laminated Bodies (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Formation Of Insulating Films (AREA)
TW094114193A 2004-05-20 2005-05-03 Polyimide resin, laminated film, metal layer-containing laminated film and semiconductor device TW200615302A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004150222 2004-05-20

Publications (1)

Publication Number Publication Date
TW200615302A true TW200615302A (en) 2006-05-16

Family

ID=35428386

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094114193A TW200615302A (en) 2004-05-20 2005-05-03 Polyimide resin, laminated film, metal layer-containing laminated film and semiconductor device

Country Status (9)

Country Link
US (1) US20070260035A1 (zh)
EP (1) EP1739114B1 (zh)
JP (1) JPWO2005113645A1 (zh)
KR (1) KR20070013303A (zh)
CN (1) CN1954015A (zh)
AT (1) ATE417881T1 (zh)
DE (1) DE602005011778D1 (zh)
TW (1) TW200615302A (zh)
WO (1) WO2005113645A1 (zh)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080214777A1 (en) * 2005-08-02 2008-09-04 Srs Technologies Heteropolymeric Polyimide Polymer Compositions
WO2007149604A1 (en) * 2006-02-13 2007-12-27 United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Novel aromatic/aliphatic diamine derivatives for advanced compositions and polymers
KR101385856B1 (ko) 2006-05-24 2014-04-17 닛산 가가쿠 고교 가부시키 가이샤 게이트 절연막용 도포액, 게이트 절연막 및 유기 트랜지스터
CN101374386B (zh) * 2007-08-24 2011-03-23 富葵精密组件(深圳)有限公司 印刷电路板的制作方法
JP5351470B2 (ja) * 2008-09-09 2013-11-27 日立電線株式会社 絶縁電線
JP5584134B2 (ja) * 2008-11-10 2014-09-03 味の素株式会社 シロキサン含有ポリイミド樹脂
JP5583551B2 (ja) 2009-11-04 2014-09-03 三星電子株式会社 有機シリケ−ト化合物を含む組成物およびフィルム
JP5419226B2 (ja) * 2010-07-29 2014-02-19 日東電工株式会社 フリップチップ型半導体裏面用フィルム及びその用途
JP6422657B2 (ja) * 2014-02-18 2018-11-14 東京応化工業株式会社 ポリイミド樹脂の製造方法、ポリイミド膜の製造方法、ポリアミック酸溶液の製造方法、ポリイミド膜、及びポリアミック酸溶液
CN106029744B (zh) * 2014-02-26 2018-08-28 东丽株式会社 聚酰亚胺树脂、使用其的树脂组合物及层叠膜
CN106255714A (zh) * 2014-04-18 2016-12-21 长濑化成株式会社 抗蚀剂树脂及其制造方法
SG10202000399YA (en) * 2014-08-08 2020-03-30 Toray Industries Adhesive for temporary bonding, adhesive layer, method for manufacturing wafer work piece and semiconductor device using same, rework solvent, polyimide copolymer, polyimide mixed resin, and resin composition
JP5918822B2 (ja) * 2014-09-18 2016-05-18 株式会社カネカ 寸法安定性を向上させたフレキシブル金属張積層板の製造方法ならびにそれにより得られるフレキシブル金属張積層板
CN105622938B (zh) * 2016-04-06 2018-10-30 京东方科技集团股份有限公司 聚酰亚胺、其组合物及制备方法、配向膜、显示装置
TWI788288B (zh) * 2016-05-06 2023-01-01 日商三菱瓦斯化學股份有限公司 聚醯亞胺樹脂
KR102310660B1 (ko) * 2017-04-28 2021-10-07 미쓰이 가가쿠 가부시키가이샤 기판 적층체 및 기판 적층체의 제조 방법
JP7292651B2 (ja) * 2018-04-17 2023-06-19 エルジー・ケム・リミテッド 光拡散性バリアフィルム
US11898009B2 (en) * 2018-04-20 2024-02-13 Ube Corporation Polyimide, laminate, and electronic device including same
JP6996643B2 (ja) * 2019-09-06 2022-01-17 昭和電工マテリアルズ株式会社 ポリアミドイミド樹脂、樹脂組成物、及び半導体装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5094919A (en) * 1988-06-30 1992-03-10 Nippon Steel Chemical Co., Ltd. Polyimide copolymers and process for preparing the same
US4948400A (en) * 1988-06-30 1990-08-14 Nippon Steel Chemical Co., Ltd. Separation membranes and process for preparing the same
JP2643518B2 (ja) * 1989-02-10 1997-08-20 東レ株式会社 プリプレグ
US5156710A (en) * 1991-05-06 1992-10-20 International Business Machines Corporation Method of laminating polyimide to thin sheet metal
JPH0539363A (ja) * 1991-08-05 1993-02-19 Nippon Steel Corp ポリイミド樹脂成形物とその製造方法
JP2992462B2 (ja) * 1995-08-31 1999-12-20 株式会社巴川製紙所 電子部品用接着テープ及び液状接着剤
JP2949568B2 (ja) * 1995-08-31 1999-09-13 株式会社巴川製紙所 新規なポリイミド及びその製造方法
JP4045621B2 (ja) * 1997-10-15 2008-02-13 Ｊｓｒ株式会社 フッ素含有ポリイミド樹脂を含む電気絶縁材料およびそれを用いた電子部品
JP4042201B2 (ja) * 1998-04-15 2008-02-06 Ｊｓｒ株式会社 電子部品およびその製造方法
JP2004250577A (ja) * 2003-02-20 2004-09-09 Sumitomo Bakelite Co Ltd フィルム状接着剤、フィルム状接着剤付リードフレーム及び半導体装置

Also Published As

Publication number Publication date
EP1739114A1 (en) 2007-01-03
DE602005011778D1 (de) 2009-01-29
WO2005113645A1 (ja) 2005-12-01
KR20070013303A (ko) 2007-01-30
EP1739114B1 (en) 2008-12-17
US20070260035A1 (en) 2007-11-08
ATE417881T1 (de) 2009-01-15
JPWO2005113645A1 (ja) 2008-03-27
EP1739114A4 (en) 2007-03-07
CN1954015A (zh) 2007-04-25

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