KR20180117333A - Method for manufacturing functional contactor - Google Patents

Abstract

A method for manufacturing a functional contactor is provided. The method for manufacturing a functional contactor according to an embodiment of the present invention includes the steps of: preparing a large area substrate on which a plurality of functional elements are arranged; forming an electrode pattern on the upper and lower surfaces of the large area substrate; forming an alignment member to limit a second region in a first region corresponding to a unit functional element on an upper electrode of the large area substrate; soldering a conductor with elasticity in the second region; and cutting the large area substrate mounting the conductor with elasticity by the unit functional element. Accordingly, the present invention can improve the precision and reliability of a product and improve manufacturing efficiency.

Description

Method for manufacturing functional contactor "

The present invention relates to a method of manufacturing a functional contactor for an electronic device such as a smart phone, and more particularly, to a method of manufacturing a functional contactor capable of stably aligning a conductor having elasticity laminated on a functional device by soldering, To a method of manufacturing a functional contactor.

In recent portable electronic devices, the adoption of a metal housing is increasing. Such a portable electronic device uses a conductive gasket or a conductive clip or the like for electrical contact between an antenna disposed in an external housing and an internal circuit board.

Here, since the metal housing has the characteristics of an electrical conductor, an external electrical impact element such as static electricity is transmitted to the built-in circuit board, or a leakage current from the AC power source is transmitted to the user due to a failure of the charger. Accordingly, the portable electronic apparatus to which the metal housing is applied is vulnerable to external electric shock and user electric shock due to leakage current.

Accordingly, there is a need for a functional contactor in which a functional element for protecting an internal circuit or a user from a static electricity or a leakage current is provided together with a conductive gasket or a conductive clip.

At this time, the functional contactor stacks the conductive gasket or the conductive clip on the electrode of the functional device by soldering. Since the soldering is performed by aligning the individual functional device through the jig, The solder paste and the conductive gasket or the conductive clip are not aligned at the correct positions due to the tolerance between the provided grooves, resulting in a large amount of defect that the position is changed.

In addition, an alignment means such as a jig for processing individual functional elements is separately required in the manufacturing process, and the cost is increased due to an increase in the number of processes in handling such as carrier taping for each device.

KR 2007-0109332A (Released Nov. 15, 2007)

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and it is an object of the present invention to provide a method of manufacturing a semiconductor device having a function capable of realizing precise alignment of a conductor having elasticity and simplification of a manufacturing process simultaneously, And a method of manufacturing a contactor.

According to an aspect of the present invention, there is provided a method of manufacturing a semiconductor device, the method comprising: preparing a large area substrate on which a plurality of functional elements are arranged; Forming an electrode pattern on upper and lower surfaces of the large-area substrate; Firing the large area substrate; Forming an alignment member to define a second region within a first region corresponding to a unit functional element on an upper surface electrode of the large-area substrate; Soldering a conductor having elasticity in the second region; And cutting the large-area substrate having the elastic conductor mounted thereon into unit functional elements. The present invention also provides a method of manufacturing a functional contactor.

According to a preferred embodiment of the present invention, in the forming of the electrode patterns, the electrodes may be formed to be spaced apart from each other by a predetermined distance.

In addition, the step of forming the alignment member may form the alignment member such that the second region is smaller than or equal to the first region.

In addition, the step of forming the alignment member may apply a nonconductive resin to all or a part of the rim of the second region.

At this time, the nonconductive resin may include any one of epoxy, polymer and nonconductive paste including overglass, epoxy, and filler.

In addition, the nonconductive resin may be pyrolyzed at a temperature higher than the melting point of the solder paste used in the soldering step.

In addition, the step of forming the alignment member may cure the nonconductive resin at 150 to 220 ° C (InfraRed).

The soldering may further include: printing a solder paste in the second area; Mounting the elastic conductor on the solder paste; And reflowing the solder paste by melting and then solidifying the solder paste.

Also, the preparing step forms the large-area substrate such that the functional devices are arranged in the first area, and the functional device is configured to prevent the leakage current of the external power source, which flows from the ground of the circuit board of the electronic device, A function of transmitting a communication signal to pass a communication signal flowing into the conductive case or from the circuit board, and an ESD protection function of passing the static electricity without causing insulation breakdown when the static electricity flows from the conductive case have.

Further, the elastic conductor includes: a clip-shaped contact portion which contacts the conductor of the electronic device; A bending portion having a predetermined curvature to impart an elastic force; And a terminal portion contacting the first electrode of the functional device.

At this time, the bent portion may be spaced apart from the terminal portion by a predetermined distance.

According to the present invention, since a conductor having elasticity can be aligned at an accurate position by mounting a conductor having elasticity on a large area substrate on which a plurality of functional elements are arranged, it is possible to prevent the conductor having elasticity from being distorted Electrical or mechanical defects can be prevented, and the precision and reliability of the product can be improved.

In addition, the present invention can simplify the manufacturing process by reducing the manufacturing cost by soldering and then cutting the conductor having elasticity on the large-area substrate, thereby improving the manufacturing efficiency.

1 is a flow chart of a method of manufacturing a functional contactor according to an embodiment of the present invention;
2 is a cross-sectional view showing a large-
FIGS. 3 and 4 are a plan view and a sectional view showing a state in which electrodes are formed on upper and lower surfaces of a large-
5 and 6 are a plan view and a sectional view showing a state in which an alignment member is formed on a large-
7 and 8 are a plan view and a sectional view showing a state in which solder paste is applied to the alignment member,
9 is a perspective view showing a state in which a conductor having elasticity is mounted on a solder paste,
10 is a perspective view of an example of a unit element manufactured by the method of manufacturing a functional contactor according to an embodiment of the present invention,
11 is a perspective view of another example of a unit element manufactured by the method of manufacturing a functional contactor according to an embodiment of the present invention.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings, which will be readily apparent to those skilled in the art to which the present invention pertains. The present invention may be embodied in many different forms and is not limited to the embodiments described herein. In order to clearly illustrate the present invention, parts not related to the description are omitted, and the same reference numerals are assigned to the same or similar components throughout the specification.

As shown in FIG. 1, a method 100 of manufacturing a functional contactor according to an exemplary embodiment of the present invention includes steps of preparing a large area substrate (S101), forming electrodes (S102), and firing S103), forming an alignment member (S104), performing soldering (S105 to S107), and cutting (S108) into unit devices.

Here, the functional contactor manufactured by the manufacturing method 100 is for electrically connecting a conductive case such as an external metal case to a circuit board or a conductive bracket electrically coupled to a circuit board at one side in a portable electronic device.

As an example of the structure of the functional contactor, the structures of Korean Patent Nos. 1638053 and 1585604 can be applied, but the present invention is not limited thereto, and at least two or more functions among the electric shock protection function, the electrostatic protection function, The present invention is not limited thereto.

First, as shown in FIG. 2, a large-area substrate 210a on which a plurality of functional elements are arranged is prepared (step S101). At this time, a large-area substrate may be formed so that the functional elements are arranged in the first regions corresponding to the unit functional elements.

Here, the functional devices arranged on the large-area substrate 210a may be in the form of a green sheet provided with the internal electrodes before the top electrodes 211 and the bottom electrodes 212 are provided. That is, the large-area substrate 210a may be in the form of a green sheet including a plurality of sheet layers, and may include a sheet layer having internal electrodes for each of the first regions.

In addition, the functional device may have a function for protecting a user or an internal circuit. In one example, the functional device may include at least one of an electric shock protection device, a varistor, a suppressor, a diode, and a capacitor. That is, the functional device has an electric shock prevention function for blocking a leakage current of an external power source flowing from a ground of a circuit board of an electronic device, a communication signal transfer function for passing a communication signal flowing into the conductive case or from the circuit board, And an ESD protection function for allowing the static electricity to pass therethrough without causing insulation breakdown when static electricity flows from the conductive case.

Next, as shown in FIGS. 3 and 4, electrode patterns are formed on the upper and lower surfaces of the large-area substrate 210a (step S102). At this time, the electrodes 211 and 212 can be formed by printing the electrode patterns at a predetermined distance from each other in the first regions corresponding to the unit functional elements. Here, the first region means a unit region defined by the regions (a, b) where the electrodes 211 and 212 are not formed.

The spaces between the electrodes 211 and 212 correspond to the regions a and b where the electrodes 211 and 212 are not formed on the upper surface and the lower surface of the large area substrate 210a. The tolerance for cutting with the device, and the area of the electrode formed in the unit functional device.

For example, when the electrodes 211 and 212 are formed on the upper and lower surfaces of the unit functional device, the regions a and b may be determined according to the cutting precision for cutting the unit functional device. As another example, when the electrodes 211 and 212 are formed on the upper surface and the lower surface of the unit functional element, the regions (a and b) are cut by the interval between the upper surface and lower surface of the unit functional element and the electrodes 211 and 212, Can be determined to be added to the accuracy.

As compared with the case where electrodes are formed for individual functional devices, alignment means and alignment means such as a jig for aligning individual functional elements and means and processes such as carrier or taping for handling individual functional elements can be omitted So that the manufacturing process can be simplified, and further, the manufacturing cost can be reduced by reducing the number of personnel to be input.

In addition, since the fabrication process is performed on one large-area substrate 210a on which a plurality of functional elements are arranged, the influence due to the tolerance between the jig and the individual functional elements It is possible to align the upper surface electrode 211 and the lower surface electrode 212 at precise positions, thereby improving the reliability of the product.

Next, the large-area substrate 210a on which the patterns of the electrodes 211 and 212 are formed on the upper and lower surfaces is fired (step S103). Here, the firing may be performed at a temperature lower than the firing performed in the process of preparing the large-area substrate 210a for firing the electrodes 211 and 212 pattern-printed on the large-area substrate 210a. For example, the firing can be performed at a temperature of 850 to 900 ° C.

Next, as shown in FIGS. 5 and 6, on the upper surface electrode 211 formed on the upper surface of the large-area substrate 210a, the alignment member 220 (Step S104).

Here, the second region corresponds to the area of the lower surface of the elastic conductor 230 mounted on the top electrode 211. That is, the alignment member 220 may be formed to surround the lower surface of the elastic conductor 230.

At this time, the alignment member 220 may be formed such that the second region is smaller than or equal to the first region. For example, when the upper surface electrode 211 of the unit functional element is formed to be larger than the lower surface area of the elastic conductor 230, the alignment member 220 may be formed inside the first region (see FIG. 6 ). As another example, when the upper surface electrode 211 of the unit functional element is formed to be substantially equal to the lower surface area of the elastic conductive member 230, the alignment member 220 can be formed on the boundary line of the first region have.

As a result, it is easy to align the solder paste 235 in the correct position in the subsequent soldering process. As a result, not only the elastic conductor 230 can be aligned on the top surface electrode 211 at an accurate position, The flow of the conductor 230 having elasticity is restrained even in the state where the solder paste 235 is melted in the subsequent reflow process, thereby preventing the elasticity of the conductor 230 having the elasticity by the liquid solder, Electrical or mechanical defects can be prevented. Therefore, it is possible to stably bond the conductor 230 having elasticity to the top surface electrode 211, thereby improving the precision and reliability of the product.

In addition, the alignment member 220 may be formed by applying a nonconductive resin to all or a part of the rim of the second region. 5 illustrates a case where the alignment member 220 is formed in a rectangular shape, but the present invention is not limited thereto. For example, the solder paste 235 and the elastic conductor 230 may be formed on the second region It can be formed in various forms for constraining.

For example, the alignment member 220 may be formed on the rim of the second region in a " C "shape (see FIG. 11) or in a corner portion facing each other.

As another example, the alignment member 220 can be formed only on all or a part of the long sides 235a and 335a or the short sides 235b and 335b of the elastic conductor 230 and 330. [ In this case, since only one side of the solder paste 235 and the elastic conductor 230 restrain the flow, the alignment member 220 may be additionally formed at a right angle.

Furthermore, the alignment member 220 may not be formed in the region where the bent portion 332 that provides the elastic force of the elastic conductor 230 is disposed (see FIG. 11). That is, since the bent portion 332 must be flowable to provide an elastic force, the alignment member 220 may not be formed at the corresponding portion so as not to be constrained by the alignment member 220.

At this time, the nonconductive resin may include any one of an epoxy, a polymer, and a nonconductive paste including an over glass, an epoxy, and a filler.

Here, since the nonconductive resin should function as a guide for stable positioning of the conductor 230 having elasticity on the non-metal electrode or on the plated functional element, it is preferable to use the non-conductive resin at a temperature lower than the melting temperature of the solder containing Sn as a main component Can be hardened. At this time, when the non-conductive resin is made of a high-temperature hardened resin having a melting temperature higher than the melting temperature of the solder, the structure of the electrode or plating is changed, so soldering is not easy.

Therefore, the alignment member 220 can be formed by curing the non-conductive resin at 150 to 220 ° C by IR (Infra Red).

Moreover, the nonconductive resin can be pyrolyzed at a temperature higher than the melting of the solder paste 235 so as not to be affected by the SMT process for forming the solder. That is, in the SMT process for bonding the elastic conductor 230 to the large-area substrate 210a, even when heated to the melting temperature of the solder paste 235 applied in the alignment member 220, the non- The solder paste 235 can be melted without being pyrolyzed.

Thus, it is easy to form the nonconductive resin on the upper surface electrode 211 of the large-area substrate 210a, and the soldering of the elastic conductor 230 or the soldering of the functional contactor 200 to the circuit board Even if the solder paste 235 between the elastic conductor 230 and the top electrode 211 melts and changes its state into a liquid phase, the conductor (220) 230), it is possible to prevent the conductor 230 having elasticity from being melted by the liquid solder from being shaken, so that the soldering process can be performed stably and easily.

Next, a conductor 230 having elasticity is soldered in the second region. This corresponds to the SMT process and can be divided into printing of the solder paste 235, mounting of the conductor 230 having elasticity, and reflow.

First, as shown in Figs. 7 and 8, the solder paste 235 is printed in the second area (step S105). At this time, the thickness of the solder paste 235 may be determined according to the height of the alignment member 220.

Next, as shown in Fig. 9, a conductor 230 having elasticity is mounted on the solder paste 235 (step S106), and reflow is performed to complete the soldering (step S107). At this time, the solder paste 235 is melted and solidified, whereby the elastic conductor 230 can be soldered onto the upper surface electrode 211 of the large-area substrate 210a.

By mounting the elastic conductor 230 on the large area substrate 210a in this way, mass production is possible, and a process for handling the individual functional elements can be omitted, and a jig Or alignment means is not required, the manufacturing process can be simplified and the manufacturing cost can be reduced, and thus the manufacturing efficiency can be improved.

Next, the large-area substrate 210a on which the conductor 230 having elasticity is mounted is cut into unit functional elements (step S108). At this time, as shown in FIG. 9, the large-area substrate 210a can be cut along the regions (a, b) between the top electrodes 211.

10, an exemplary functional contactor 200 manufactured by the method 100 for manufacturing a functional contactor of the present invention includes a functional element 210, an alignment member 220, And may include a conductor 230.

The functional contactor 200 may be configured such that the elastic conductor 230 is in contact with the circuit board or conductive bracket and the functional element 210 can be coupled to the conductive case, And the functional device 210 may be coupled to the circuit board.

The functional device 210 is electrically connected in series to the elastic conductor 230, and the upper surface electrode 211 and the lower surface electrode 212 are provided on at least a part of the upper surface and the lower surface, respectively.

The upper surface electrode 211 may be laminated with a conductor 230 having elasticity and the lower surface electrode 212 may be coupled to a circuit board through soldering or may be coupled to a conductor such as a conductive case through a conductive adhesive layer.

The functional device 210 may have a function for protecting a user or an internal circuit. In one example, the functional device may include at least one of an electric shock protection device, a varistor, a suppressor, a diode, and a capacitor. That is, the functional device has an electric shock prevention function for blocking a leakage current of an external power source flowing from a ground of a circuit board of an electronic device, a communication signal transfer function for passing a communication signal flowing into the conductive case or from the circuit board, And an ESD protection function for allowing the static electricity to pass therethrough without causing insulation breakdown when static electricity flows from the conductive case.

The alignment member 220 may be formed to surround at least a portion of the elasticity-resistant conductor 230 on the top surface electrode 211 to align the position of the elasticity-imparting conductor 230 and may include a non-conductive resin.

When the conductor 230 having elasticity comes into contact with the conductor, it can be contracted toward the functional device 210 by its pressing force, and when the conductor is separated, it can be restored to its original state by its elastic force.

Here, when the elastic conductor 230 is pressed, galvanic corrosion occurs due to a potential difference between dissimilar metals when exposed to a corrosive environment. At this time, in order to minimize galvanic corrosion, it is preferable to reduce the contact area of the conductor 230 having elasticity.

The elastic conductor 230 may include a contact portion 231, a bent portion 232, a spacing portion 233, an external portion 234, and a terminal portion 235.

Here, the conductor 230 having elasticity may be a C-clip having a roughly "C" shape. Since the conductor 230 having such elasticity is in line contact or point contact, galvanic corrosion resistance can be excellent.

The contact portion 231 has a clip-like curved shape and can be in electrical contact with the conductor of the electronic device. Such a contact portion 231 may be disposed in the opening 234b provided on one side of the upper surface 234a of the covering portion 234 so that the curved portion protrudes outside the opening 234b.

The bent portion 232 extends from the contact portion 231 in a round shape and can have an elastic force. That is, the bent portion 232 may have a predetermined curvature to impart an elastic force. The bent portion 232 may be connected to the contact portion 231 at the inner side of the elastic conductor 230 at one end and may be connected to the upper surface 234a between the outer portions 234 at the other end.

The spacing portion 233 is a space formed between the lower end of the bent portion 232 and the side wall 234c of the external portion 234. The bent portion 232 can be spaced apart from the terminal portion 235 by a predetermined distance. That is, the spacing portion 233 separates the bent portion 232 from the terminal portion 235 so as not to constrain the bent portion 232 that provides the elastic force. As a result, the elastic force of the contact portion 231 and the bent portion 232 may not be affected by the terminal portion 235.

The enclosure 234 may include an upper surface 234a, an opening 234b, and a side wall 234c.

The upper surface 234a is connected to the bent portion 232 and the side wall 234c and the contact portion 231 can be arranged from the inside to the outside of the opening 234b. The opening 234b can form a space through which the contact portion 231 flows according to the elastic force of the bent portion 232. [

The side wall 234c may extend vertically from the terminal portion 235 at the long side 235a. The side wall 234c may extend vertically from the terminal portion 235 to the short side 235b where the bent portion 232 is not formed.

As a result, the external portion 234 may be in the form of a case that externally surrounds the contact portions 231 and the ends of the bent portions 232 so that the ends of the contact portions 231 and the bent portions 232 are not exposed to the outside .

As a result, the portion of the conductor 230 having elasticity can be minimized to the outside so that the influence of the external elements such as the engagement by the operator can be suppressed.

The terminal portion 235 corresponds to the lower surface of the elastic conductive member 230 and may be formed to be connected to the lower side of the covering portion 234. The terminal portion 235 may be a terminal that is in contact with the first electrode 121 of the functional device 210 and is electrically connected to the functional device 210.

The contact portion 231, the bent portion 232, the external portion 234, and the terminal portion 235 may be integrally formed of a conductive material having an elastic force.

Another exemplary functional contactor 300 manufactured by the method 100 of manufacturing a functional contactor of the present invention includes a functional element 210, an alignment member 220, Gt; 330 < / RTI >

The functional contactor 300 is the same as the functional contactor 200 of FIG. 10 except for the elastic conductor 330, and therefore, a detailed description thereof will be omitted.

The elastic conductor 330 includes a contact portion 331, a bent portion 332, a side wall 334, and a terminal portion 335.

The conductor 330 having such elasticity may be a C-clip having a roughly "C" shape. Since the conductor 330 having such elasticity is in line contact or point contact, galvanic corrosion resistance can be excellent.

The contact portion 331 has a clip-like curved shape and can be in electrical contact with the conductor of the electronic device. The contact portion 331 may be arranged to protrude outward between the side walls 334. [

The bent portion 332 extends from the contact portion 331 in a round shape and can have an elastic force. That is, the bent portion 332 may have a certain curvature to impart an elastic force. Here, the bent portion 332 may extend from the terminal portion 335. That is, the bent portion 332 may be disposed between the contact portion 331 and the terminal portion 335.

The bent portion 332 may be exposed to the outside of the side wall 334 and the exposed portion may include a top electrode 211 and an alignment member 220 on the lower side thereof so as to flow without being fixed to provide elastic force, And the solder may not be disposed.

The side wall 334 may extend vertically from the terminal portion 335 at the long side 335a. This side wall may extend to a portion 334a of the short side 215b where the bent portion 332 is not formed. That is, the side wall 334 is formed on both sides of the side wall 334 only at the short side 335b where the bent portion 332 is not formed, so that a space is formed between the portions 334a of the side wall 334 do. At this time, in the space between the portions 334a of the side wall 334, the contact portion 331 can flow by the elastic force of the bent portion 332. [

As a result, the portion of the conductor 330 having elasticity exposed to the outside can be minimized, so that it is possible to suppress the influence of the external elements such as the engagement by the operator.

The terminal portion 335 corresponds to the lower surface of the elastic conductive member 330 and may be formed to be connected to the lower side of the side wall 334. The terminal portion 335 may be a terminal connected to the upper surface electrode 211 of the functional device 210 by solder and electrically connected to the functional device 210.

The contact portion 331, the bent portion 332, the side wall 334, and the terminal portion 335 may be integrally formed of a conductive material having an elastic force.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

200, 300: Functional contactor 210a: Large area substrate
210: Functional element 211: upper surface electrode
212: lower electrode 220: alignment member
235: solder paste 230, 330: elastic conductor
231, 331: contact portion 232, 332:
233: separation part 234: outer part
234c, 334: side wall 235, 335:

Claims (11)

Preparing a large area substrate on which a plurality of functional elements are arranged;
Forming an electrode pattern on upper and lower surfaces of the large-area substrate;
Firing the large area substrate;
Forming an alignment member to define a second region within a first region corresponding to a unit functional element on an upper surface electrode of the large-area substrate;
Soldering a conductor having elasticity in the second region; And
And cutting the large-area substrate having the elastic conductor mounted thereon into unit functional devices. The method according to claim 1,
Wherein the forming of the electrode patterns comprises forming the electrodes at a predetermined distance from each other in the first regions. The method according to claim 1,
Wherein forming the alignment member forms the alignment member such that the second region is less than or equal to the first region. The method according to claim 1,
Wherein the step of forming the alignment member applies a nonconductive resin to all or a part of the rim of the second region. 5. The method of claim 4,
Wherein the nonconductive resin comprises any one of an epoxy, a polymer, and a nonconductive paste including an overglass, an epoxy, a filler, and the like. 5. The method of claim 4,
Wherein the nonconductive resin is pyrolyzed at a temperature higher than the melting point of the solder paste used in the soldering step. 5. The method of claim 4,
Wherein the step of forming the alignment member comprises curing the nonconductive resin by IR (InfraRed) at 150 to 220 ° C. The method of claim 1, wherein the soldering comprises:
Printing a solder paste within the second region;
Mounting the elastic conductor on the solder paste; And
And reflowing the solder paste by melting and then solidifying the solder paste. The method according to claim 1,
Wherein the preparing step comprises forming the large-area substrate such that the functional elements are arranged in the first region,
Wherein the functional device has an electric shock prevention function for blocking a leakage current of an external power source flowing from a ground of a circuit board of an electronic device, a communication signal transmitting function for passing a communication signal flowing into the conductive case or from the circuit board, And an ESD protection function for allowing the static electricity to pass therethrough without causing insulation breakdown during the introduction of static electricity from the ESD protection circuit. The electric connector according to claim 1,
A clip-shaped contact portion in contact with the conductor of the electronic device;
A bending portion having a predetermined curvature to impart an elastic force; And
And a terminal portion contacting the first electrode of the functional device. 11. The method of claim 10,
Wherein the bent portion is spaced apart from the terminal portion by a predetermined distance.

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